TABLE OF CONTENTS | Acronym | Chapter | Meaning |
|---|---|---|
| ADC | 8 | analogue-to-digital converter |
| AF | 3 | acceleration factor |
| ASIC | 4 | application-specific integrated circuit |
| ATC | 9 | assembly test chip |
| BSA | 7 | bovine serum albumin |
| CAD | 5, 9 | computer-aided design |
| CCD | 5, 9 | charge-coupled device |
| CMOS | 3, 5, 6, 9 | complementary metal oxide semiconductor |
| CMP | 3 | chemical-mechanical polishing |
| CPW | 8 | co-planar waveguide |
| CTE | 2, 8 | coefficient of thermal expansion |
| CVD | 2, 8 | chemical vapour deposition |
| DI | 3 | de-ionised |
| DIP | 4, 7 9 | dual-inline package |
| DLP | 8 | digital light processor |
| DMD | 8 | deformable mirror device |
| DMD | 9 | digital micromirror array |
| DOF | 5 | degree of freedom |
| DRIE | 1, 5 | deep reactive ion etching |
| EMDIP | 4 | electro-microfluidic dual in-line package |
| ESCA | 2 | electron spectroscopy chemical analysis |
| FEM | 8 | finite element method |
| FPA | 8 | focal plane array |
| FPGA | 5, 9 | field programmable gate array |
| FPID | 9 | field programmable interconnect device |
| GLV | 8 | grating light valve |
| HDI | 9 | high density interconnect |
| HIPP | 9 | highly integrated packaging and procssing |
| HTCC | 8 | high temperature co-fired ceramics |
| IC | 1 5, 8, 9 | integrated circuit |
| IPMA | 9 | in-package micro-aligner |
| IR | 7, 8 | infrared |
| LAN | 8 | local area network |
| LCP | 4 | liquid crystal polymer |
| LED | 4, 8 | light emitting diode |
| LEO | 9 | low-earth orbit |
| LNA | 8 | low-noise amplifier |
| LOC | 7 | lab-on-a-chip |
| LPCVD | 3 | low pressure chemical vapour deposition |
| LTCC | 4, 8 | low temperature co-fired ceramic |
| MCM | 8, 9 | multichip module |
| MEMS | 1 9 | microelectromechanical systems |
| MLE | 3 | maximum likelihood estimator |
| MOEMS | 5, 9 | micro... |
