TABLE OF CONTENTS The following sources (other than those cited in the references) appear useful for gaining additional information on MEMS packaging:
Micromechanics and MEMS, classic and seminal papers to 1990, edited by William S.Trimmer, IEEE Press, New York, ISBN 0 7803 1085 3, 1997
The MEMS Handbook, edited by Mohamed Gad-el-Hak, ISBN 0 8493 0077 0, CRC Press, Roca Raton, 2002
Journal of Microelectromechanical Systems , a joint IEEE and ASME publication, IEEE, 445 Hoes Lane, P.O. Box 1331, Piscataway, NJ 08855 1331, USA
This section introduces major journals that publish robotics research results on microassembly. Several research groups that work on microassembly are also listed. This list is not intended to be exhaustive.
Journal of Micromechatronics (VSP)
IEEE Transactions on Robotics (formerly, IEEE Transactions on Robotics and Automation) (IEEE Press)
International Journal of Robotics Research (Sage)
Journal of Intelligent and Robotic Systems (Kluwer)
Journal of Robotic Systems (Wiley)
IEEE/ASME Transactions on Mechatronics (IEEE Press)
International Mechanical Engineering Congress and Exposition (IMECE) of ASME (sessions on MEMS track), annual meeting held in November in a US city.
InterPack (MEMS packaging) organised by ASME and JSME, convening in June once every two years in a US city
SPIE s International Symposium on Microelectronics, MEMS, and Nanotechnology
The International Conference on Solid-State Sensors and Actuators
IEEE MTT-S International Microwave Symposium (IMS)
European Microwave Week (organised by the European Microwave Association (www.eumwa.org))
European Conference on Optical Communication (ECOC) (www.i-leos.org)
Topical conferences by the IEEE Lasers and Electro-Optics Soceity (www.i-leos.org)
Symposium on Design, Test, Integration & Packaging of...
