TABLE OF CONTENTS T.R.Hsu and J.Clatterbaugh
This chapter presents the working principles of both surface and wire bonding techniques that are essential to MEMS and microsystems packaging. Special attention will be given to surface bonding techniques such as eutectic and anodic bonding, and silicon fusion bonding, for their unique applications in MEMS packaging. A special section is devoted to issues associated with bonding of microsystems with proposed troubleshooting strategies and resolution. Two case studies are included to underline the importance of proper design of the bonding processes and the control of parameters that affect the quality and reliability of the products.
Bonding is one of the essential technologies for MEMS and microsystems packaging as presented in Section 1.7. It is required in the following three principal areas:
Joining one substrate to another substrate such as wafer to wafer or wafer to other supporting wafers made of glass, quartz, sapphire, ceramic and metals.
Securing micro components to support substrates such as mounting silicon dies to their constraint bases made of glass or ceramics.
Attaching wires and electrical leads to and from transducers in micro devices.
Types (1) and (2) relate to the bonding of surfaces of solids, whereas Type (3) is referred to as wire bonding. Surface bonding of mating parts is required not only to form the desired microstructures of the device, but also to serve as a hermetic seal and conduct heat and/or electricity in many other cases.
Two principal...
