1.1 CHAPTER SCOPE

This chapter intends to set the tone for several subsequent chapters in the book. It begins with an overview of MEMS and microsystems and their representative products that are available in the current marketplace. The authors offer their views on why the packaging and assembly of these products have become major cost factors in the production of MEMS and microsystems. Major challenging issues related to MEMS and microsystems packaging will be outlined. In the authors view, research institutions and industries have not effectively dealt with some of these issues, such as assembly tolerances and product testing. A generic packaging process flow is offered to provide readers with a perspective on the extent of the tasks involved in this important stage of production.

1.2 MEMS AND MICROSYSTEMS

The term MEMS is an abbreviation of microelectromechanical system. Any human-made device that contains parts or components of size ranging from 1 m to 1 mm that perform an engineering function or functions by electromechanical means is classified as MEMS [1].

Microsystems involve MEMS, which include micro sensors, actuators of all kinds, and the auxiliary integrated circuits for device function controls and signal transductions, conditioning and processing, function control systems, etc. Microsystems are expected to perform complex engineering functions, which may not necessarily be limited to those of an electromechanical nature. Typical MEMS and microsystems products are presented in this chapter [1].