TABLE OF CONTENTS A.D.Oliver and J.S.Custer
This chapter discusses the testing of MEMS devices as well as the techniques and structures that enable testing. The chapter begins with a discussion of the need for testing which is related to the reality of imperfect fabrication and packaging processes. Parametric test structures encompassing a wide variety of MEMS technologies are discussed because they provide a means to monitor the fabrication and packaging process. Self testing techniques and test points provide a means to evaluate the performance of a device. During the packaging and assembly process, devices are often tested and then modified by trimming. After assembly, burn-in and reliability testing are often performed. These tests are often dependent on acceleration factors such as those described in the Arrhenius model. The chapter concludes with a discussion of testing of packaged MEMS devices in the field.
MEMS testing is one of the more challenging aspects of the MEMS field. One reason is that MEMS devices are combinations of electrical, mechanical, optical and/or chemical devices. MEMS devices may also have an input or output that is not an electrical signal. The input and output of a MEMS device could include force, displacement, inertia, pressure, flow, chemical and optical signals. These are different from those used in integrated circuits and this necessitates different test equipment. Furthermore, the connections between the test equipment and the MEMS device are sometimes difficult. These difficulties make it important to design with an eye towards testing. This chapter will...
