Appendix 1: Glossary

3D Packaging: A packaged assembly involving multiple components in a non-planar arrangement, most commonly based on stacking planar components or substrates containing components.
Accelerated testing: Test of the devices in a high stress environment, such as a high humidity and high temperature environment.
AE8 (AP8): Model developed by NASA Gaddard to calculate the omni-directional trapped electron (trapped proton) environment using various data sets measured by various satellites. The number 8 refers to the version number.
Alumina: Aluminium oxide.
Anodic bonding: A type of bonding process for wafers of different materials by applying high voltage electrical field across the bonding surfaces.
APT: An abbreviation of assembly , packaging and testing .
Arrhenius equation: Approximates a thermally excited reaction.
ATC: Assembly Test Chip. A special component used to examine the reliability and effects of an assembly process on packaged components, usually through the convenience of electrical measurements made in situ on terminals connected from within to the packages being tested.

Beryllia: Beryllium oxide.
Bosch holes: Holes through silicon wafers made using the Bosch etch process.
Bosch-etched: The Bosch etch is a patented plasma etch process to create high-aspect ratio features in silicon.
Bulk micromachining: A micromachining method where part of the substrate is removed to make the MEMS device.

Cap wafer: A wafer that is designated as the covering wafer that encapsulates devices.
Ceramic: An inorganic, nonmetallic material whose characteristics are produced by its high temperature production.
ChipSeal: A type of die-level passivating sealant used to protect an integrated circuit...

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