Advanced Interconnections Corp. has extended its line of Mezza-pede^® SMT Connectors with a new lower profile header (model DHAL) which reduces board stack height by 15%. The innovative design features an ultrathin insulator, at only 0.025 inch (0.63mm) – half the thickness of the original header design. When paired with mating socket model DHS, a z-axis stack height of 0.132 in. (3.4mm) is achievable. This newest Mezza-pede^® connector facilitates a reduction in package height and a shorter signal path in applications ranging from tunable laser power connectors in optical transceivers to hand-held medical electronic devices.

Mezza-pede^® SMT Connectors are ideal for 1.0mm pitch board-to-board and cable-to-board interconnections in high density electronic designs, where space is at a premium. The new model DHAL is currently available with 14 positions and features Advanced’s proprietary SMT lead frame and pin design, combining high reliability screw-machined terminals with a unique over-molded lead frame in a precision-molded LCP insulator.

Typical applications include telecommunications, military, medical, and anywhere a high reliability surface mount connector is needed in a high density package. Mezza-pede^® SMT Connectors with 30 microinches (µin) gold plating pass the 20-day mixed flowing gas (MFG) test, often required by the world’s most demanding telecommunications applications. The Mezza-pede connector line, including the new model DHAL, is RoHS compliant, usable at operating temperatures from -55 to +125°C, and can handle as much as 1.1 A current at +80°C.

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