Liquid fluid thermally conductive sealing glue
Featured Product from Shiu Li Technology Co., Ltd
Two-Part Thermal Conductive Sealing Glue
LiPOLY’s TPS series is a two-part compound sealing glue that can be cured at room temperature or high temperature. The sealing glue is a liquid fluid thermally conductive adhesive that can fill the gaps in the air space around electronic devices. After curing, it will interact with heating electronic components and radiators, so that electronic products can run at high power for heat conduction. It’s a nice gap filler material with thermal conductivity 0.8~2.0W/m*K.
Shiu Li Technology Co., LTD
Shiu Li Technology Co., LTD has established itself as a world-leading thermal management manufacturer, developing high-performance thermal solutions for product designers around the globe. Selling under its brand LiPOLY, Shi Li Technology Co. LTD has heavily invested in the development of advanced thermal conductive products for high powered modules. In 2018, Shiu Li Technology LLC was established in the United States to better serve customers in North America and Europe.
Shiu Li Technology has served more than 2000 customers worldwide, delivering thermal solutions in computer manufacturing, data communication, consumer electronics, data centers, military equipment, automotive equipment, lighting, power conversion, and more.
