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Supplier: Win Source Electronics
Description: Category: IT infrastructure Memory Win Source Part Number: 1430138-LENOVO 41Y2765 - 4GB (2x2GB) DDR-2 MEMORY Manufacturer: Lenovo
- Memory Category: DRAM
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 1Gb. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, 1Gb, Memory IC and Storage Component, Memory ICs Products. This
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Supplier: Newark, An Avnet Company
Description: SDRAM, DDR3, 2GB (X16), 96FBGA; Memory Type:DRAM - Synchronous; Memory Configuration:128M x 16; Access Time:13.5ns; Memory Case Style:FBGA; No. of Pins:96; IC Interface Type:CMOS; Operating Temperature Min:0°C; Operating Temperature RoHS Compliant: Yes
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Supplier: Teledyne e2v Semiconductors
Description: DDR4 ideal Companion-chips for Space grade devices such as processors, FPGAs SiP solutions & beyond… The 4/8GB Radiation Tolerant DDR4 Memory Multi-Chip Package (MCP) is a Ultra High Density Memory Solution, targeting Space Embedded Systems & Applications. This
- Operating Temperature: -55 to 125 C
- Memory Category: DRAM
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: DDR2-800 SODIMM 256Mx64 (2GB) Product overview: 657029\2GB\128Mx8\16\chips from Elpida Memory is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers
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Supplier: Corsair Memory
Description: motherboard. Next-Generation Density for the Ultimate Power User Most Vengeance DIMMs are built with two gigabit RAM ICs. These extra-dense memory chips allow you to have 8GB of memory using only two DIMMs, or to populate your triple channel system with up to an insanely large
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Supplier: Corsair Memory
Description: motherboard. Next-Generation Density for the Ultimate Power User Most Vengeance DIMMs are built with two gigabit RAM ICs. These extra-dense memory chips allow you to have 8GB of memory using only two DIMMs, or to populate your triple channel system with up to an insanely large
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include Dual, 2GB. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Dual, 2GB, Memory IC and Storage Component, Memory -
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Supplier: Integrated Device Technology
Description: The TSE2004GB2 is a digital temperature sensor with integrated 4 Kbit EEPROM for memory modules. It features accuracy up to ±0.5°C was designed to target applications demanding highest level of temperature readout.
- Input (Supply) Voltage: 2.5 to 3.3 volts
- Operating Temperature: 0 to 70 C
- Sensor Type: Temperature Sensor
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Supplier: Utmel Electronic Limited
Description: MODULE DDR4 SDRAM 32GB 288RDIMM
- Memory Category: DRAM
- Features: Other
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Supplier: Corsair Memory
Description: Great looking, great overclocking memory at a great price Aluminum heatspreaders help dissipate heat and give Vengeance modules an aggressive look. Serious about PC memory? So are we. Like the legendary Dominator, enthusiast-grade Vengeance DRAM is designed for stability, stringently
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Supplier: Karl Kruse GmbH & Co. KG
Description: Karl Kruse is a worldwide leading franchised distributor (ISO: 9001-2008 certified). A service provider specializing in the supply and material management of electronic components, since 1951. We are an innovative company who is dedicated to collaborating with customers and partners to develop and
- Features: Other
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Supplier: Karl Kruse GmbH & Co. KG
Description: Karl Kruse is a worldwide leading franchised distributor (ISO: 9001-2008 certified). A service provider specializing in the supply and material management of electronic components, since 1951. We are an innovative company who is dedicated to collaborating with customers and partners to develop and
- Memory Category: DRAM
- Features: Other
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Supplier: Karl Kruse GmbH & Co. KG
Description: Karl Kruse is a worldwide leading franchised distributor (ISO: 9001-2008 certified). A service provider specializing in the supply and material management of electronic components, since 1951. We are an innovative company who is dedicated to collaborating with customers and partners to develop and
- Features: Other
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Supplier: DigiKey
Description: SDRAM - DDR4 Memory IC 8Gb (2G x 4) Parallel 1.2GHz 78-FBGA (8x12)
- Operating Temperature: 0 to 95 C
- Memory Category: DRAM
- Features: Other
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Supplier: Radwell International
Description: MEMORY MODULE, 2GB, DDR3, . FREE 2 YEAR RADWELL WARRANTY
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Supplier: Newark, An Avnet Company
Description: UMCP560GB(2XNANDB16ATLC256GBEXT+4XDRAMLPDDR4Z2BM12GB, TRAY ROHS COMPLIANT: YES
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Supplier: Acme Chip Technology Co., Limited
Description: DDR5 32GB RDIMM VFBGA
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Description: extended temperature support Memory 48 GB of DDR4 ECC SDRAM in three channels 32 GB of SLC NAND flash 64 MB NOR boot flash 64 kB EEPROM Security and Management Microsemi® PolarFire™ SoC FPGA with 256 MB SPI flash Designed with SecureCOTS™ technology to support enhanced security
- RAM: 48,000 MB
- Communication Networks: Ethernet
- Processor / CPU: Intel® Xeon®
- Features: Other
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Supplier: Lingto Electronic Limited
Description: IC SDRAM 16GB DDR4 FBGA
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Description: Xeon®-class cores in a single, power-efficient SoC package SKUs available with native extended temperature support Memory 48 GB of DDR4 ECC SDRAM in three channels Up to 256 GB of NAND flash 64 MB NOR boot flash 64 kB EEPROM Security and Management Microsemi® PolarFire™ SoC FPGA
- RAM: 48,000 MB
- Communication Networks: Ethernet
- Processor / CPU: Intel® Xeon®
- Features: Other
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Description: cores in a single, power-efficient SoC package SKUs available with native extended temperature support Memory 64 GB of DDR4 ECC SDRAM in four channels Up to 256 GB of NAND flash 64 MB NOR boot flash 64 kB EEPROM Security and Management Microsemi® PolarFire™ SoC FPGA with 256 MB
- RAM: 64,000 MB
- Communication Networks: Ethernet
- Processor / CPU: Intel® Xeon®
- Features: Other
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Description: IC SDRAM 16GB DDR4 FBGA
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Supplier: ODG (Origin Data Global)
Description: 16Gb DDR4 3200 2Gx8 (0~95C)
- Density: 16,000,000 kbits
- Data Rate: 1,600 MHz
- Features: Other
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Supplier: Aaeon Systems Inc.
Description: Applications Healthcare Retail & Advertising Test & Measurement Gaming & Entertainment Industrial Automation Security Defense & Government Digital Signage Features Onboard Intel® Atom™ Z530/Z510 Processors Intel® System Controller Hub US15W Onboard DDR2 533 Memory Chip, Max. 1
- Operating Temperature: 32 to 140 F
- Operating Humidity: 0 to 90 %
- Memory Type: DDR2
- Processor / CPU: Intel® AtomTM
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Supplier: RS Components, Ltd.
Description: 2Gb SDRAM DDR2 400Mhz FBGA-84
- Access Time: 2.5 ns
- Operating Temperature: -40 C
- Memory Category: DRAM
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Supplier: Aaeon Systems Inc.
Description: Atom™ E620/E640/E660/E680 Processors Intel® EG20T PCH Onboard DDR2 667 Memory Chip, Max. 1 GB Gigabit Ethernet Up to 24-bit LVDS LCD High Definition Audio Interface SATA SSD (4G) x 1, SATA 3.0Gb/s x 1 USB2.0 x 7 PCI-Express [x1] x 2 Wide DC Input Range, +4.75V to +14.7V
- Operating Temperature: 32 to 140 F
- Operating Humidity: 0 to 90 %
- Memory Type: DDR2
- Processor / CPU: Intel® AtomTM
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Supplier: QUALCOMM, Incorporated
Description: Wave-2 802.11ac SoC for Routers, Gateways and Access Points The IPQ4019 was the industry’s first single-chip Wi-Fi system-on-chip (SoC) to bring Wave-2 802.11ac features to a variety of home and enterprise networking products. The highly-integrated, single-chip
- Data Rate: 1,733,000 kbps
- Package Type: BGA
- Interface: I2C, PCI Express, USB
- Features: PCM, SPI, UART
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Supplier: Critical Link, LLC
Description: Chip (SoC), memory subsystems and onboard power supplies. The MitySOM-5CSx provides a complete and flexible CPU and FPGA infrastructure for highly-integrated embedded systems. This SOM features a Hard Processor System (HPS) providing up to 4,000 MIPS at speeds of up to 925 MHz per core
- Capacity: 2,000 MB
- Operating Temperature: -40 to 185 F
- Memory Type: DDR3
- Ports / Buses: I2C, PCI Express, SPI, USB
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Supplier: Microchip Technology, Inc.
Description: ECC enables current and future architectures with next-generation NAND technologies, and programmable architecture enables SSD product differentiation through firmware customization. Up to 16 GB of DDR4 with 8 Gb components is supported and controllers support the popular 2.5"
- Memory Category: Flash
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Supplier: AAEON Electronics, Inc.
Description: COM Express CPU Module With Onboard Intel® Atom™ Z530/Z510 Processors Main Feature Onboard Intel® Atom™ Z530/Z510 Processors Intel® System Controller Hub US15W Onboard DDR2 533 Memory Chip, Max. 1 GB Gigabit Ethernet Up To 24-bit LVDS LCD, SDVO Connector x 1 High Definition
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Early evaluation of IBM BlueGene/P
The cores also share DDR-2 memory controllers that access 2 GB of DDR - 2 memory , which is off- chip .
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http://etna.math.kent.edu/vol.21.2005/pp81-106.dir/pp81-106.pdf
This machine has 2 GB of main memory (dual-channel with DDR memory chips ).
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Optimal chip-package codesign for high-performance DSP
The chip set contains 1 GB of memory distributed among 128 64 Mb DDR - 2 DRAM chips , and four custom 1 cm microaccelerator chips.
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An Overview of the BlueGene/L Supercomputer
Each node can support up to 2 GB of local memory ; our current plan calls for 9 SDRAM- DDR memory chips with 256 MB of memory per node.
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Wireless VoIP phone architecture and hardware requirements
…multiplexed address with smaller rows and has both faster cycle times and lower access latency than standard DDR Implementation of the DDR interface will be able to support 2GB memory systems using the current generation memory chips (512 MB) but allows…
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The global unified parallel file system (GUPFS) project: FY 2002 activities and results
The test host is a Linux platform with the following configuration: • SuperMicro P4DP6 motherboard Intel E7500 chip o two Intel P4- 2 .2GHz Xeon processors o 2 GB DDR PC2100 ECC memory o two 64-bit 100 MHz PCI-X o…
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Sell MicroSD SDHC SD Memory Card
• DDR / DDR2 LODIMM Memory Module Capacity : 256MB / 512MB / 1 GB / 2 GB HIgh Performance Well Branded Memory Chip ECC / Non ECC gold leads unbuffered...
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Implementation of a third-generation 1.1-GHz 64-bit microprocessor
The on- chip memory controller supports 266-MHz DDR -1 SDRAM with 256-MB–16- GB memory space and provides Fig. 2 .
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Euro-Par 2010 - Parallel Processing
- On- chip memory interface controllers (MIC) connect GDB and memory, pro- viding up to 25.6 GB /s each (4x 6.4 GB/s Multi-channel DDR - 2 modules).
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Scalable multicore architectures for long DNA sequence comparison
• On- chip memory interface controllers (MIC) connect GDB and memory, providing up to 25.6 GB s−1 each (4×6.4 GB s−1 multi-channel DDR - 2 modules).