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Supplier: Teledyne e2v Semiconductors
Description: DDR4 ideal Companion-chips for Space grade devices such as processors, FPGAs SiP solutions & beyond… The 4/8GB Radiation Tolerant DDR4 Memory Multi-Chip Package (MCP) is a Ultra High Density Memory Solution, targeting Space Embedded Systems &
- Memory Category: DRAM
- Operating Temperature: -55 to 125 C
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Supplier: Win Source Electronics
Description: Category: IT infrastructure Memory Win Source Part Number: 1419548-IBM 8199 - 16GB 2X8GB RDIMMS DDR3 MEMORY Manufacturer: IBM
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Supplier: Win Source Electronics
Description: Category: IT infrastructure Memory Win Source Part Number: 1430114-LENOVO 41Y2777 - 2GB DDR2 Memory Manufacturer: Lenovo
- Memory Category: DRAM
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Supplier: Win Source Electronics
Description: Category: IT infrastructure Memory Win Source Part Number: 1419845-IBM 31E2 - 64 GB DDR-3 Memory Manufacturer: IBM
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Supplier: Win Source Electronics
Description: Category: IT infrastructure Memory Win Source Part Number: 1419659-IBM 5694 - IBM 0/8GB DDR2 MEMORY Manufacturer: IBM
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Supplier: Utmel Electronic Limited
Description: MODULE DDR4 SDRAM 32GB 288RDIMM
- IC Package Type: Other
- Memory Category: DRAM, Other
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Supplier: Integrated Device Technology
Description: The TSE2004GB2 is a digital temperature sensor with integrated 4 Kbit EEPROM for memory modules. It features accuracy up to ±0.5°C was designed to target applications demanding highest level of temperature readout.
- Input (Supply) Voltage: 2.5 to 3.3 volts
- Operating Temperature: 0.0 to 70 C
- Sensor Type: Temperature Sensor
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Supplier: Corsair Memory
Description: want Attractively low price World famous Corsair reliability and performance Package Contents Two 2GB memory modules System Requirements Designed for use with all DDR3 motherboards with two memory channels
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Supplier: Advantech
Description: SQRAM is Industrial Grade DRAM memory. All SQRAM are designed with original IC chip and adopt a rigorous test program to ensure durable and reliable quality. SQRAM are fixed IC generation for quality and compatibility controlled. Original Samsung/Micron IC chips adapted
- Capacity: 16000 MB
- DRAM Type: Other
- Form Factor: SO DIMM, Other
- Operating Temperature: 32 to 185 F
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Supplier: Radwell International
Description: MEMORY RAM, 1GB, 200-PIN, DDR2, SO-DIMM, DDR2, 533. FREE 2 YEAR RADWELL WARRANTY
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Supplier: Karl Kruse GmbH & Co. KG
Description: Karl Kruse is a worldwide leading franchised distributor (ISO: 9001-2008 certified). A service provider specializing in the supply and material management of electronic components, since 1951. We are an innovative company who is dedicated to collaborating with customers and partners to develop and
- IC Package Type: Other
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Supplier: Radwell International
Description: DISCONTINUED BY MANUFACTURER, MEMORY CARD, 1GB, 184 PIN, DDR, SDRAM. FREE 2 YEAR RADWELL WARRANTY
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Supplier: Radwell International
Description: MEMORY MODULE, 8GB, DDR3, SRAM, PC3-12800, CL11, 240 PIN. FREE 2 YEAR RADWELL WARRANTY
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Supplier: DigiKey
Description: SDRAM - DDR4 Memory IC 8Gb (2G x 4) Parallel 1.2GHz 78-FBGA (8x12)
- IC Package Type: Other
- Memory Category: DRAM
- Operating Temperature: 0.0 to 95 C
- Supply Voltage: Other
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Supplier: Acme Chip Technology Co., Limited
Description: DDR5 32GB RDIMM VFBGA
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Supplier: Lingto Electronic Limited
Description: 1GB, DDR2-1066, X8
- Access Time: 0.3500 ns
- Density: 1.00E6 kbits
- Memory Category: DRAM, Other
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Description: IC SDRAM 16GB DDR4 FBGA
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Supplier: ODG (Origin Data Global)
Description: 16Gb DDR4 3200 2Gx8 (0~95C)
- Data Rate: 1600 MHz
- Density: 1.60E7 kbits
- IC Package Type: Other
- Memory Category: Other
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Supplier: Acme Chip Technology Co., Limited
Description: NDB26PFC-4DIT: DDR2 2GB X16 FBGA
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Description: 2GB DDR3 SDRAM, X8, 1066MHZ, IND
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Supplier: QUALCOMM, Incorporated
Description: WAPI TKIP AES-GCMP AES-CCMP WEP WPA WPS WPA2 802.11i security PRNG Memory RAM 1 GB RAM Memory Type DDR3L Interface Supported
- Data Rate: 1.73E6 kbps
- IC Package Type: BGA
- Interface: I2C, PCI Express, USB
- Technology: Wi-Fi / WiMAX / Wi-Mesh
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Supplier: Aaeon Systems Inc.
Description: Intel® Atom? Z530/Z510 Processors Intel® System Controller Hub US15W Onboard DDR2 533 Memory Chip, Max. 1 GB Gigabit Ethernet Up To 24-bit LVDS LCD, SDVO Connector x 1 High Definition Audio Interface PATA SSD (Up To 4 GB) x 1, SATA 3.0Gb
- Features: Watchdog Timer
- Memory Type: DDR2
- Operating Humidity: 0.0 to 90 %
- Operating Temperature: 32 to 140 F
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Supplier: ODG (Origin Data Global)
Description: 2GB DDR3L 1.35V SDRAM, X16, INDU
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Description: provides incredible speed with one 100GBASE-KR4, up to two 10GBASE-KR, and one 10/100/1000BASE-T Ethernet ports. It accommodates up to 64 GB of DDR4 ECC SDRAM in four channels and up to 32 GB of onboard SLC NAND flash in addition to numerous I/O ports, including USB 2.0,
- Communication Networks: Ethernet
- I/O Bus Specifications: USB, VPX, Other
- Ports: Serial Ports, USB
- Processor / CPU Type: Intel® Xeon®
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Supplier: Critical Link, LLC
Description: core and is combined with a NEON coprocessor with double-precision FPU (one per core). The MitySOM-5CSx combines a Cyclone V with up to 2GB of DDR3 CPU/FPGA RAM with ECC, 512MB of dedicated DDR3 FPGA RAM (optional) and up to 48MB of QSPI NOR Flash creating a
- Capacity: 2000 MB
- Form Factor: Other
- Memory Type: DDR3
- Operating Temperature: -40 to 185 F
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Supplier: Microchip Technology, Inc.
Description: resources. Advanced ECC enables current and future architectures with next-generation NAND technologies, and programmable architecture enables SSD product differentiation through firmware customization. Up to 16 GB of DDR4 with 8 Gb components is supported and controllers
- Memory Category: Flash
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Supplier: Advantech
Description: Intel® Atom® C3000 System On Chip up to 16 cores Processor with QAT DDR4 2400 ECC registered memory up to 64GB Optimized LAN Port Extension Maximized storage options TPM 1.2 Advanced Platform Reliability and Serviceability
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Supplier: AAEON Electronics, Inc.
Description: COM Express CPU Module With Onboard Intel® Atom™ Z530/Z510 Processors Main Feature Onboard Intel® Atom™ Z530/Z510 Processors Intel® System Controller Hub US15W Onboard DDR2 533 Memory Chip, Max. 1 GB
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Supplier: Advanced Micro Devices, Inc.
Description: between processors to improve multi-processor systems On-die integrated DDR2 memory controller offers available memory bandwidth up to 12.8GB/s (with DDR2-800) per processor Hardware assisted AMD Virtualization™ technology in AMD Opteron processors
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Supplier: ELMA Electronic Inc.
Description: VMEbus 1.267 GHz MPC7457 PowerPC® processor 128-bit AltiVecT coprocessor for parallel processing, ideal for data-intensive applications Up to 2GB of on-board DDR ECC memory and 128MB of Flash memory for demanding applications Two 33/66/100 MHz PMC-X sites allow
- CPU Speed: 1267 MHz
- Communication Networks: Ethernet
- Flash Memory (RAM): 128000 KB
- I/O Bus Specifications: PMC
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Supplier: Aaeon Systems Inc.
Description: EPIC-9456 accommodates socket 478-based Intel® Core? 2 Duo/ Core? Duo/ Celeron® M (65nm) processor that is up to 2.16GHz and the Front Side Bus is 533/667MHz. This model features 200-pin DDR2 SODIMM and system memory is up to 2GB. Moreover, EPIC-9456
- Chipset Type: Intel® Chipset
- Features: Watchdog Timer?, RJ-45 Connectors?
- Operating Humidity: 0.0 to 90 %
- Operating Temperature: 32 to 140 F
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Supplier: Acromag, Inc.
Description: FPGA-based VME to PCIe bridge Up to 2.4GHz CPU Up to 16GB DDR3L ECC RAM 1 - 32GB Flash Dual PMC/XMC Sites The XVME-6510 will add 7 to 10 years of life to your system with modern technology. This high-performance SBC features a FPGA
- CPU Speed: 2400 MHz
- Cache Memory (L1 & L2): 6000 KB
- Chipset Type: Intel® Chipset
- Communication Networks: Ethernet
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Supplier: Aaeon Systems Inc.
Description: / socket co-lay), and two 200-pin DDRII 400 SODIMM system memory (up to 2 GB). The Intel® 910GMLE + Intel® 82801FBM (ICH6M) chipset replaces the Intel® 852GM giving it higher performance at a lower cost. The FWS-7300 deploys an Intel 82574
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Supplier: Aitech Defense Systems, Inc.
Description: Two (2) GB of DDR ECC SDRAM 128 MB of User Flash Memory ANSI VME64 Compliant 2eSST Support with Legacy VME Backward Compatibility Two (2) GB Ethernet Interfaces (10/100/1000Mbps) Two (2) Asynchronous Serial Interfaces Four (4) 32-bit Timers
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Supplier: Advantech
Description: dual slot wide (8HP) version of the blade offers additional network connectivity by increasing Gigabit Ethernet port count from two to four. Supports Intel® Atom™ E38xx, Celeron N2930 and J1900 processors, up to quad-core at 2 GHz Up to 8GB of 1333MHz DDR3L memory
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Early evaluation of IBM BlueGene/P
The cores also share DDR-2 memory controllers that access 2 GB of DDR - 2 memory , which is off- chip .
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http://etna.math.kent.edu/vol.21.2005/pp81-106.dir/pp81-106.pdf
This machine has 2 GB of main memory (dual-channel with DDR memory chips ).
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Optimal chip-package codesign for high-performance DSP
The chip set contains 1 GB of memory distributed among 128 64 Mb DDR - 2 DRAM chips , and four custom 1 cm microaccelerator chips.
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An Overview of the BlueGene/L Supercomputer
Each node can support up to 2 GB of local memory ; our current plan calls for 9 SDRAM- DDR memory chips with 256 MB of memory per node.
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Wireless VoIP phone architecture and hardware requirements
…multiplexed address with smaller rows and has both faster cycle times and lower access latency than standard DDR Implementation of the DDR interface will be able to support 2GB memory systems using the current generation memory chips (512 MB) but allows…
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The global unified parallel file system (GUPFS) project: FY 2002 activities and results
The test host is a Linux platform with the following configuration: • SuperMicro P4DP6 motherboard Intel E7500 chip o two Intel P4- 2 .2GHz Xeon processors o 2 GB DDR PC2100 ECC memory o two 64-bit 100 MHz PCI-X o…
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Sell MicroSD SDHC SD Memory Card
• DDR / DDR2 LODIMM Memory Module Capacity : 256MB / 512MB / 1 GB / 2 GB HIgh Performance Well Branded Memory Chip ECC / Non ECC gold leads unbuffered...
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Implementation of a third-generation 1.1-GHz 64-bit microprocessor
The on- chip memory controller supports 266-MHz DDR -1 SDRAM with 256-MB–16- GB memory space and provides Fig. 2 .
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Euro-Par 2010 - Parallel Processing
- On- chip memory interface controllers (MIC) connect GDB and memory, pro- viding up to 25.6 GB /s each (4x 6.4 GB/s Multi-channel DDR - 2 modules).
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Scalable multicore architectures for long DNA sequence comparison
• On- chip memory interface controllers (MIC) connect GDB and memory, providing up to 25.6 GB s−1 each (4×6.4 GB s−1 multi-channel DDR - 2 modules).