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Supplier: Intel Corporation
Description: The Intel® 5000P server chipsets for the Intel® Xeon® processor 5000 series enables Intel® dual-processor (DP) balanced server platforms that are efficient, dependable, and responsive. Intel® dual-core processor-based platforms help businesses better utilize assets with effective
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Supplier: Intel Corporation
Description: For a smarter PC experience, look for the 2nd generation Intel® Core™ processor family and the Intel® P67 Express Chipset. This new PC platform features improved adaptive performance that adds speed when you need it for a better PC experience. We call that smart performance at its best. You
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Supplier: Texas Instruments
Description: ADSL Chipset 208-QFP
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Supplier: Utmel Electronic Limited
Description: XFRMR FOR LINEAR TECH CHIPSET
- Operating Temperature: -40 C
- Category: Signal / RF Transformer
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Supplier: QUALCOMM, Incorporated
Description: power consumption, delivering a superior user experience in crowded scenarios. QCA6290 specs Wi-Fi Wi-Fi Standards 802.11ax 802.11ac Wave 2 802.11n 802.11a/b/g Wi-Fi Spectral Bands 2.4 GHz 5 GHz Peak Speed 1.775 Gbps Channel Utilization 20/40/80 MHz MIMO Configuration 2x2
- Data Rate: 1,775,000 kbps
- Technology: Wi-Fi / WiMAX / Wi-Mesh
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Supplier: VAST STOCK CO., LIMITED
Description: WiFi Modules (802.11) 802.11bgn with CPU Chipset:Marvel MW300
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Supplier: Newark, An Avnet Company
Description: HEAT SINK, CHIPSET, 11.38 DEG C/W; Thermal Resistance:11.38°C/W; Packages Cooled:-; External Width - Metric:27mm; External Height - Metric:11.61mm; External Length - Metric:27mm; External Diameter - Metric:-; Product Range:- RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: HEAT SINK, CHIPSET, 11.1 DEG C/W; Thermal Resistance:11.1°C/W; Packages Cooled:-; External Width - Metric:35mm; External Height - Metric:11.61mm; External Length - Metric:35mm; External Diameter - Metric:-; Product Range:- RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: HEAT SINK, CHIPSET, 11.63 DEG C/W; Thermal Resistance:11.63°C/W; Packages Cooled:-; External Width - Metric:21mm; External Height - Metric:22.61mm; External Length - Metric:21mm; External Diameter - Metric:-; Product Range:- RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: HEAT SINK, CHIPSET, 11.98 DEG C/W; Thermal Resistance:11.98°C/W; Packages Cooled:-; External Width - Metric:19mm; External Height - Metric:22.61mm; External Length - Metric:19mm; External Diameter - Metric:-; Product Range:- RoHS Compliant: Yes
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Supplier: Xoxide
Description: When it comes to cooling down your system, there's no doubt that this Thermalright HR-05 IFX Chipset Cooler is a blazingly hot deal. Now why did we make such a lame pun? Simple. IFX stands for "Infernal Fire eXtinguisher", and even features flame-shaped aluminum fins, so there's simply no way
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Supplier: Allied Electronics, Inc.
Description: Crystek Crystals Corporation has worked with Chipset manufactures to develop crystal and oscillator solutions that are compatible with their specific Chipsets. Some of the applications for these Chipsets are as follows: Bluetooth DSP Digital Radio USB IEEE 1394 (FireWire®) PDA
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Supplier: Xoxide
Description: When it comes to cooling down your system, there's no doubt that this Thermalright HR-05 SLI/IFX Chipset Cooler is a scorchingly hot deal. IFX stands for "Infernal Fire eXtinguisher", and even features flame-shaped aluminum fins, so there's simply no way we could resist the temptation to make
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Supplier: Global American, Inc.
Description: The LP-171-G PICO-ITX motherboard based on the Embedded Fanless Intel Atom processor Z510P is power-optimized and delivers robust performance-per-watt for cost-effective embedded solutions. The board offers an excellent solution for the embedded market such as digital signage, kiosks, POS, thin
- Max Speed: 0.4 GHz
- Memory Capacity: 2 GB
- LAN / Networking: 1
- USB: 2
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Supplier: Global American, Inc.
Description: 3.5" Fanless Embedded Controller with the Intel Atom Z510P/Z510PT or Intel Z520PT processor and US15WP Chipset WIDE TEMPERATURE OPTIONS AVAILABLE
- RAM: 2,000 MB
- Operating Temperature: 32 to 140 F
- Operating Humidity: 10 to 90 %
- Features: CompactFlashTM, Real Clock Timer
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Supplier: Renesas Electronics Corporation
Description: The ISL6410, ISL6410A are synchronous current-mode PWM regulators designed to provide a total DC-DC solution for microcontrollers, microprocessors, CPLDs, FPGAs, core processors/BBP/MAC, and ASICs. The ISL6410 should be selected for applications using 3.3V ±10% as an input voltage and the ISL6410A
- Regulated Output Voltage (Volt): 1.2 to 3.3 volts
- Output Current (IOUT): 0.6 amps
- Quiescent Current (IQ): 0.0023 amps
- Input Voltage (VIN): 4.5 to 5.5 volts
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Wireless Network Components - Integrated 802.11abgn (Wi-Fi 4) Dual-Band Modules -- AIRETOS E94 ClassSupplier: VOXMICRO
Description: greatly-reduced impact on the battery life of mobile devices. With World level Regulatory Compliance and full compatibility with the latest industry standards like 802.11d/h regulatory adaptability, Wi-Fi Protected Setup™ via PIN and Push-Button (PBC), Passpoint™ and Voice protocols, E94
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Supplier: Intelligraphics, Inc.
Description: 802.11ac WEC7 SoftAP Key Features USB2.0 WLAN adapter based on 802.11ac (Wi-Fi 5) that support for both 2.4GHz and 5 GHz bands. 802.11a, b, g, n and 11ac 1×1 stream configuration. Support for 20MHz, 40MHz and 80MHz wide channel widths Supports Open and WPA2-PSK (AES) security
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Supplier: Intelligraphics, Inc.
Description: The IGX-UACF1-9379b7-BT is a highly integrated Wireless Local Area Network (WLAN) system-on-chip (SOC) for 5GHZ 802.11ac, or 2.4/5GHz 802.11n WLAN applications. Dual-stream spatial multiplexing up to 867Mbps data rate is featured. It is based on the Qualcomm Atheros QCA9379
- Sensitivity: -92 to -74 dBm
- Output Power: 11.00000000000001 to 15.000000000000002 dBm
- Operating Frequency: 2,400 to 5,845 MHz
- Operating Temperature: 0 to 70 C
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Supplier: VOXMICRO
Description: AIRETOS® E98 Class - Series H: High-class 802.11ac (Wi-Fi 5) powerful Dual-Band Modules up to industrial-grade for demanding home and enterprise networks. Key Features IEEE 802.11ac Dual Band (backwards compatible with 802.11abgn) Up to Industrial operating temperature grade
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Supplier: Radicom Research, Inc.
Description: Radicom Research's RW8200 Embedded WiFi Module supports Serial, SPI and optional USB interfaces. It integrates an ARM Cortex-M3 host processor, Broadcom's Wireless Internet Connectivity for Embedded Devices (WICED) supported WiFi chipset, RF front end, clocks and on- board antennas or U.FL
- Form Factor: Board
- Network Equipment: Modem
- Features: Radio Modem
- Network Media: Wireless
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Supplier: Intelligraphics, Inc.
Description: IGX-PACAF1-9880a1 is a IEEE 802.11ac wireless adapter that operates in 2.4GHz and 5 GHz bands, available in PCIe mini card form factor. Featuring QCA9880 chipset, the IGX-PACAF1-9880a1 dramatically increases the overall throughput up to 1.3Gbps with 3 x 3 MIMO techniques. Leveraging
- Frequency Band: 5,850 MHz
- Data Rate: 1.3 Gbps
- Network Equipment: Modem
- Features: Radio Modem
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Supplier: VOXMICRO
Description: Miracast® Modular World Regulatory Certification (50+ domains) Technical Summary Form Factor Half-mini PCIe Chipset Qualcomm-Atheros AR9462-BL3A Standard IEEE 802.11abgn Wi-Fi + Bluetooth v4.2 Data Transfer Rates Up to 300Mbps (dynamic) Industrial Reference Qualcomm Atheros reference
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Supplier: VOXMICRO
Description: AIRETOS® E63 Class - Series B: First fully featured 802.11ax (Wi-Fi 6) modules for the computing, enterprise, and industrial markets Key Features Fully featured Wi-Fi 6 for the computing, enterprise and industrial markets Dual Band Simultaneous (DBS) with dual MAC Bluetooth 5.1 on a dedicated
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Supplier: Intelligraphics, Inc.
Description: The IGX-SACF1-9379a3-BT is a single-die Wireless Local Area Network (WLAN) and Bluetooth (BT) combo module. It supports 2×2 MIMO with two spatial streams. It features IEEE 802.11 a/b/g/n/ac WLAN standards and BT v4.2+HS. Based on the Qualcomm QCA9379-3 chipset it enables seamless
- Sensitivity: -94 dBm
- Output Power: 1.9999999999999905 to 4 dBm
- Operating Frequency: 2,400 to 5,850 MHz
- Supply Voltage: 3.3 volts
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Supplier: ODG (Origin Data Global)
Description: AR9590 CHIPSET: (802.11N: PEACOC
- Device Type: Transceiver
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Supplier: Quarktwin Technology Ltd.
Description: 82865PE/82865P CHIPSET MEMORY CO
- Features: Other
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Supplier: VAST STOCK CO., LIMITED
Description: Panel PCs 17 350 cd/m2 SXGA Panel PC with Intel H81 chipset, Intel Pentium Processor G3420 (3M Cache, 3.20 GHz), TDP 53W, 2GB RAM*2, support iRIS-2400, black color, PSU ACE-A622B, resistive touch window, R11
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Supplier: Lingto Electronic Limited
Description: 82865PE/82865P CHIPSET MEMORY CO
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Supplier: Advantech
Description: 11th Gen. Intel® Core U-series i7/i5/i3/Celeron Pico-ITX SBC Intel® Tiger Lake-UP3 (10nm++) Series, On-board LPDDR4x-4266 up to 32G with IBECC Dual independent display: eDP/MIPI-DSI, DP up to 8K Rich I/O interface with GbE x 2, USB 3.2, COM Port, DIO SMBus, TPM2.0 Flexible expansion to IoT
- CPU Speed: 1,250 MHz
- Operating Temperature: 32 to 140 F
- Chipset: Intel® Chipset
- Features: Other, RJ-45 Connectors
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Description: 82865PE/82865P CHIPSET MEMORY CO
- Features: Other
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Supplier: Advantech
Description: 11th Gen. Intel® Core U-series i7/i5/i3/Celeron 3.5" SBC w/ MIOe 11th Gen. Intel® Core™ Processor with Quad/Dual Cores, TDP 15W/ 28W Dual Channel DDR4-3200 up to 64GB 4 simultaneous displays: LVDS/ eDP*, HDMI, DP, USB Type-C 2 GbE, 4 USB3.1, CAN Bus, DC-in 12-24V Expansion: M.2 E-Key/B-Key/M-Key
- CPU Speed: 400 MHz
- Chipset: Intel® Chipset
- Features: Other
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Supplier: Rochester Electronics
Description: 5000 Series Chipset, Blackford
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Supplier: Lingto Electronic Limited
Description: XWAY WAV300 WI-FI CHIPSET
- Device Type: Sensor Interface
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Supplier: Lingto Electronic Limited
Description: 5000 SERIES CHIPSET, BLACKFORD
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The PRM2144X is a complete wireless adapter module supporting the IEEE 802.11ad standard with advanced features for long range, outdoor applications. It utilizes the Peraso X720 IEEE 802.11ad 60 GHz phased array chipset which includes a baseband processor and a high-power mmWave beamforming (read more)
Browse RF Transceivers Datasheets for Richardson RFPD -
, Inc. Advanced Linear Devices, Inc. (ALD) is a design innovation leader in analog semiconductors specializing in the development and manufacture of precision CMOS linear integrated circuits, including analog switches, A/D converters and chipsets, voltage comparators, operational (read more)
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Vehicle Safety Communications: Protocols, Security, and Privacy
IEEE 802 . 11p chipsets without the high costs associated with the development of new radio chipsets.
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Report on Rail Conference and Wireless Communications [VTS News]
Magnus Jonsson from Halmstad University gave a presentation titled ‘‘Field Trials in Various Road Settings Using CALM M5-Based V2V Commu- nication,’’ on the findings from mea- surements conducted using 802 . 11p chipsets , with hardware from the European CVIS project.
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ADAS Semiconductor Market Tracker - H1 2015
– Race for development of DSRC (IEEE 802 . 11p ) technology chipsets for V2X .
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ADAS Semiconductor Market Tracker - H2 2014
– Race for development of DSRC (IEEE 802 . 11p ) technology chipsets for V2X .
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A Case for Leveraging 802.11p for Direct Phone-to-Phone Communications
Thus, when we implement the digital baseband processor Figure 3: Proposed interfacing of the 802.11p LEES single-die solution with existing phones’ WiFi chipset . for 802 . 11p , we can use 802.11a WiFi hardware as is, but run it at half…
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Experimental characterization of DSRC signal strength drops
vehicle is equipped with a Wireless Safety Unit (WSU) provided by Denso with integrated 802 . 11p -based WAVE radio Atheros chipset , an omni-directional roof-mounted Nippon DSRC antenna with average gain at horizon of 0 dBi, a Novatel Global Positioning System…
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Implementation and field test of a small-scale WAVE system in IEEE 802.11p V2R/V2V environments
Ho K Y et al. [4] modified an 802.11a chipset in order to make it compliant with the 802 . 11p standards.
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Communication Technologies for Vehicles
One major difference with standard architecture for 802.11 systems, is that the IEEE 802 . 11p driver does not link to the SDR chipset directly, but rather to a soft-modem via netlink sockets.
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DONC: Delay-based Opportunistic Network Coding Protocol
However in the 802.11p context, benefits are partly mitigated by the convolutional coding (FEC) of 802 . 11p , and SLNC may require some radio chipset support.
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Performance evaluation of 802.11p WAVE system on embedded board
This network card is based on Atheros AR5414 wireless chipset which are made to support the radio operations under 802 . 11p protocol: it can support radio between 5.89GHz – 5.92GHz with seven 10MHz bands.