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Supplier: TE Connectivity
Description: : 1 Form C SPDT-CO Contact Number of Poles : 1 Relay Options : Power Switching Contact Features Contact Material : Silver Palladium (AgPd) Alloy Contact Plating Material
- Coil Nominal DC Power: 0.4460 watts
- Coil Resistance: 56 ohms
- DC Coil Voltage: 5 volts
- Maximum AC Switching Voltage: 125 volts
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Supplier: TE Connectivity
Description: : 1 Form C SPDT-CO Contact Number of Poles : 1 Relay Options : Power Switching Contact Features Contact Material : Silver Palladium (AgPd) Alloy Contact Plating Material
- Coil Nominal DC Power: 0.2060 watts
- Coil Resistance: 700 ohms
- DC Coil Voltage: 12 volts
- Maximum AC Switching Voltage: 125 volts
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Supplier: TE Connectivity
Description: Palladium (AgPd) Alloy Contact Plating Material : Gold Dimensions Product Height : 11.5 MM [.452 INCH ] Product Length : 15.4 MM [.606 INCH
- Coil Nominal DC Power: 0.2060 watts
- Coil Resistance: 2800 ohms
- DC Coil Voltage: 24 volts
- Maximum AC Switching Voltage: 125 volts
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Supplier: TE Connectivity
Description: : 1 Form C SPDT-CO Contact Number of Poles : 1 Relay Options : Power Switching Contact Features Contact Material : Silver Palladium (AgPd) Alloy Contact Plating Material
- Coil Nominal DC Power: 0.2000 watts
- Coil Resistance: 20 ohms
- DC Coil Voltage: 3 volts
- Maximum AC Switching Voltage: 125 volts
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Supplier: Win Source Electronics
Description: Base Product Number: ARA200 Mounting Type: Surface Mount HTSUS: 8536.41.0020 ECCN: EAR99 Contact Material: Silver Palladium (AgPd), Gold (Au) Termination Style: Gull Wing Coil Voltage: 5VDC Contact Form: DPDT (2 Form C) Contact Rating (Current): 1 A Switching
- Coil Resistance: 178 ohms
- Mounting: PC Board, Other
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1316108-JMACD-26XM Category: Relays>Signal Relays, Up to 2 Amps Series: Military, MIL-R-39016/15, MAD, CII Termination Style: PC Pin Features: Diode Package: Bulk Contact Form: DPDT (2 Form C) Contact Material: Silver Palladium (AgPd), Gold
- Coil Resistance: 1560 ohms
- Mounting: PC Board, Other
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1315085-V23101D 101B201 Category: Relays>Signal Relays, Up to 2 Amps Series: V23101, AXICOM Termination Style: PC Pin Package: Tube Contact Form: SPDT (1 Form C) Contact Material: Silver Palladium (AgPd), Gold (Au) Coil Resistance: 12 Ohms
- Coil Resistance: 12 ohms
- Mounting: PC Board, Other
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Supplier: Win Source Electronics
Description: ) Contact Material: Silver Palladium (AgPd), Gold (Au) Coil Resistance: 400 Ohms Coil Current: 30mA Operate Time: 7ms Relay Type: General Coil Type: Non Latching Coil Voltage: 12VDC Contact Rating (Current): 1A Switching Voltage: 250VAC, 220VDC - Max Release Time
- Coil Resistance: 400 ohms
- Mounting: PC Board, Other
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Contact Behavior of Telephone Relays and Connectors in Various Aggressive Environments
Figs. 4-6 present the results of contact-resistance measure- ments for AgAu, AgCu, and AgPd contact materials .
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Panasonic - AGN20024 - Sensors, Switches & Relays - Relays - Allied Electronics
AgPd + Au Clad (stationary), AgPd (movable) contact material .
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Panasonic - AGQ20024 - Sensors, Switches & Relays - Relays - Allied Electronics
AgPd + Au Clad (stationary), AgPd (movable) contact material .
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Spring-Hard Precious Metal Alloys with Good Tarnishing Behavior for Electrical Contacts
Due to their favorable price, AgPd -alloys play an important role as contact materials in the telecommunication industry.
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Reliability of electrically conductive adhesive joints for surface mount applications: a summary of the state of the art
Drift in joint resistance for R 1206 ( AgPd ) jumpers adhesively bonded to FR-4, with different contact pad material , after damp heat testing (85 C/85%RH, 1000 h).
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Mechanical, electrical, and thermal expansion properties of carbon nanotube-based silver and silver-palladium alloy composites
By virtue of the tradeoff between mechanical and electrical properties of AgPd alloys, it is considered a promising can- didate for use as a contact material in telecommunication and high end electronic applications [12].
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Encyclopedia of Tribology
The most commonly used contact materials include Au, Ag, Cu, Al, Ag Oxide, C, AgW, AgC, AgNi, AgPd , AgWC, and CuCr.
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The influence of kinetic parameters on failure mechanisms caused by material transfer
Contact Material : AgPd .
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Microanalytical and metallographic characterization of interactions between YBaCuO superconductors and various substrates
For various technical applications AgPd , SnO2 and Pt substrates have been contacted with YBa2Cu3Oy films. … are important to understand the reliability and function of structures in which those materials are in contact …
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SEM and EDXS analysis of the reaction products of compounds Ax M6 X8 (A = Tl, K; M = V, Ti; X = S, Se) with I2 /CH3 CN and H2 O
For various technical applications AgPd , SnO2 and Pt substrates have been contacted with YBa2Cu3Oy films. … are important to understand the reliability and function of structures in which those materials are in contact …