InP Wafer

Description: InGaAs/InP Epitaxial Wafers With 'SuperLong' Wavelengths from 1.7µm - 2.6µMarktech Optoelectronics offers the highest purity InGaAs/InP Epitaxial Wafers in the industry today. Sophisticated manufacturing processes have been put in place to customize and produce high

Description: Rigaku's WaferX 300 represents the culmination of 25 years of experience in the X-ray fluorescence analysis of thin films on silicon wafers. Specifically developed as an in-process metrology tool, the system incorporates "bridge tool" technology — servicing 6", 8", as well as the latest 12"

• Maximum Wafer / Part Size: 150.00000000000003 to 300.00000000000006 mm
• Measurements: Composition, Thickness - Film / Layer
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument

Description: EL-CAT Inc. is a stocking distributor of Silicon Wafers, Compound Semiconductors and other Crystal Materials for use in electronics.

Description: Fast scribing speeds; high yield rates; high production capacity Produces high-quality results with no residue or melt-back Fully-automatic processing; integrated coating application, wafer cutting, and cleaning functions Laser type: DPSS 355nm ultraviolet laser Laser power: ≥5W Cooling

• Laser Output Power: 0 to 5 watts
• Type: Complete / Turnkey System
• Laser Operation: Laser Cutting
• Options / Components: Laser Head / Focusing Unit, Laser Optics / Beam Delivery, Laser System Enclosure, Monitoring Sensors / System

Description: The FTI-1000 is a purpose-built ATE system designed for high-coverage wafer-level testing of power discrete devices, wide-bandgap components, and gate-driver-integrated power ICs. Suitable for both engineering characterization and high-volume wafer sort, the system integrates

• Form Factor: Monitor / Instrument
• Applications: Semiconductor Wafers

Description: The FTI-1000 is a purpose-built ATE system designed for high-coverage wafer-level testing of power discrete devices, wide-bandgap components, and gate-driver-integrated power ICs. Suitable for both engineering characterization and high-volume wafer sort, the system integrates

• Form Factor: Monitor / Instrument
• Applications: Semiconductor Wafers

Description: Wafer Carriers for Use in Cleanrooms

Description: Wide bandgap SiC technology is opening up a whole new generation of high voltage power products for applications in transport, power transmission and green energy. M2 Wafer edition tests these upto 10kV on wafer before singulation, identifying defective product early and saving the

• Form Factor: Monitor / Instrument
• Applications: Semiconductor Wafers

Description: Wide bandgap SiC technology is opening up a whole new generation of high voltage power products for applications in transport, power transmission and green energy. M2 Wafer edition tests these upto 10kV on wafer before singulation, identifying defective product early and saving the

• Form Factor: Monitor / Instrument
• Applications: Semiconductor Wafers

Description: The XE-WAFER is a fully automated industrial AFM designed specifically to address surface roughness, trench width, depth, and angle measurements on 200mm & 300mm wafers in a production environment. The system provides superior accuracy and precision nanometrology over any other system

• Measurements: Critical Dimension / Trench Geometry, Defects / ADC, Roughness / Waviness
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument
• Features: Non-contact, Non-destructive

Description: point-like structure on the surface to provide better adsorption and stability. Prealigner chuck are widely used in semiconductor production equipment to absorb, fix, transfer and handle silicon wafers, wafers and various workpieces and materials.

• Materials: Ceramic
• Chuck Type: Electrostatic Chuck, Wafer Chuck
• Jaws: None / NA
• Features: Other / Specialty Chuck

Description: WAFER ASSY FR/LK .100IN

Description: EL-CAT Inc. is a stocking distributor of Silicon Wafers, Compound Semiconductors and other Crystal Materials for use in electronics.

Description: EL-CAT Inc. is a stocking distributor of Silicon Wafers, Compound Semiconductors and other Crystal Materials for use in electronics.

Description: The wafer surface inspection system LS series can detect defects on unpatterned wafers with a mirror-finished surface. Applied technology of laser scattering achieves high sensitivity and high throughput detection of small contaminants and various types of defects on wafer

• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Wafer Probing System

Description: EL-CAT Inc. is a stocking distributor of Silicon Wafers, Compound Semiconductors and other Crystal Materials for use in electronics.

Description: The Excelta Three Star wafer tweezers is another quality product from Excelta. Offers a stainless steel wafer tip with a stainless steel body. Among all the other aspects of this product it offers the following resistant properties: anti-magnetic. The overall length measures 7 in.

• Tool Type: Tweezers

Description: The wafer edge grinders are designed to grind edge and circumference of a wide variety of wafers including silicon, compound semiconductors, such as, SiC, GaN, GaAs, and InP, oxide wafers, such as sapphire, quartz, LT, and LN, and glass, at high precision through

• Maximum Wafer / Part Size: 50.799972568014816 to 203.19989027205926 mm
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument
• Applications: Semiconductor Wafers

Description: DETECTION OF OXIDATION INDUCED DEFECTS IN POLISHED SILICON WAFERS

Description: The NWL200 series is the first lineup of wafer loaders for inspection microscopes capable of loading 100 micron thin wafers. Thanks to a new chuck system, the NWL200 series achieves highly reliable loading suitable for inspection of next-generation semiconductors. Improved

• Maximum Wafer / Part Size: 200 mm
• Measurements: Defects / ADC
• Mounting / Loading: Floor Mounted / Stand-alone
• Features: Non-contact, Non-destructive, Other

Description: Wafers and blanks are produced from crystals grown using the Kyropoulos method. Advantages of our wafers: high material purity: > 99.997%; low impurity content Ti: < 1 ppm; low dislocation density: < 103 cm-2; orientation tolerance: up to ± 0.05 degrees. Sapphire wafers for

• Thickness / Wall Thickness: 0.005905515 to 0.0393701 inch
• Diameter: 2 to 10 inch
• Width / O.D.: 2 to 10 inch
• Features: Dielectric Ceramics / Materials

Description: WAFER ASSY FR/LK .100IN 6 CKT

Description: Product Features: 300mm wafer size/ 200mm wafer size 300mm wafer cassette is made of PEEK material to prevent patricle generation Precise wafer access and reliable operation in equipment Identifiaction options: cardholders, RFID, bare code labels, laser marking.

Description: Temptronic ThermoChucks are conductive heating and cooling systems for wafer testing at temperature. Its primary use is for wafer testing in Probe Stations, as well as Laser Trim and Wafer Burn-in. A few specialized applications include Low leakage probing (fA level), and High

• Actuation: Electric
• Chuck Type: Wafer Chuck

Description: A ceramic wafer chuck is a specialized tool employed in the semiconductor industry to hold wafers in a secure position. It functions as a stable platform that guarantees consistent contact and precise positioning of the wafer during many procedures, including lithography,

• Features: Alumina / Aluminum Oxide, Specialty Ceramic
• Applications: Chemical / Materials Processing, Electrical / HV Parts
• Specialty Ceramic Type: Silicon Carbide, Silicon Nitride, Tungsten Carbide (WC)
• Shape / Form: Wafer Carrier / Holder

Description: The Excelta Three Star wafer tweezers is another quality product from Excelta. Offers a stainless steel wafer tip with a stainless steel body. Among all the other aspects of this product it offers the following resistant properties: anti-magnetic. The overall length measures 7 in.

• Tool Type: Tweezers

Description: Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the

Description: 1x4P 4P 1 1mm 4 -25℃~+70℃ 1A Standing paste SMD,P=1mm Wire To Board Connector ROHS

Description: Innovacera standard aluminum nitride wafer diameters are from 50.8 mm (2 inch) to 200 mm (8 inch) ; mostly use are 6" aluminum nitride wafers and 8" AlN wafer substrates . AlN Wafers can be produced in various thicknesses from 0.125mm to 1mm with polished or lapped sides,

• Specialty Ceramic Type: Aluminum Nitride
• Features: Other, Specialty / Other, Specialty Ceramic
• Shape / Form: Wafer / Substrate

Description: sori, site and global flatness. User-defined and ASTM/SEMI compliant scan patterns are used to generate full 3-dimensional (3D) wafer images. Customized data reports are available for viewing tabular data of each wafer measured with quick, easy export to your spreadsheet program.

• Maximum Wafer / Part Size: 300.00000000000006 mm
• Measurements: Area Mapping, Roughness / Waviness, Shape / Flatness, Thickness - Wafer / Disc (TTV)
• Technology: Capacitance / EM Gage
• Mounting / Loading: Manual Loading

Description: Ceramic wafer clamps are indispensible tools in semiconductor processing. They can be manufactured of high-purity alumina, zirconia, or silicon carbide, making them suited for high-temperature and corrosive environments.

• Features: Alumina / Aluminum Oxide, Specialty Ceramic
• Applications: Electrical / HV Parts
• Specialty Ceramic Type: Silicon Carbide, Tungsten Carbide (WC), Zirconia
• Shape / Form: Wafer Carrier / Holder

Description: SECS/GEM communication. Automated calibration. Options Wafer prealigner HISCAN for Roughness and structures measurement Applications QA and QC of small size wafers, SiC, Sapphire, Glass, InP, etc…

• Maximum Wafer / Part Size: 50 to 100 mm
• Mounting / Loading: Manual Loading
• Form Factor: Monitor / Instrument
• Technology: Optical / Imaging System

Description: Couplings Bellows Couplings Spider Couplings Absorbathane Couplings Oldham Couplings Universal Joint Couplings Wafer Spring and Disc Couplings Sleeve Couplings Neo-Flex Couplings Universal Lateral Couplings Flex-Thane Couplings Telescopic Universal Joint Couplings

• Bore Diameter: 0.3125 to 0.375 inch
• Coupling Diameter: 1.5 inch
• Coupling Length: 1.82 inch
• Angular Misalignment: 8 degrees

Description: The Erem wafer tweezers is another quality product from Erem. Tip has a width of 1.181 in and thickness of 0.315 in. The overall length measures 5.906 in.

• Tool Type: Tweezers

Description: The VMMK-3413 is a small and easy-to-use, broadband, directional detector operating in various frequency bands from 25 to 45 GHz with typical insertion loss of 0.8 dB. It is housed in the Avago Technologies' industry-leading and revolutionary sub-miniature WaferCap chip scale package (GaAsCap

• Input Frequency Range: 25,000 to 45,000 MHz
• Maximum DC Output Voltage: 674 millivolts
• Maximum DC Offset Output Voltage: 63 millivolts
• Package Type: Surface Mount Technology (SMT)