-
Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONATHANE EN-2550 Polyurethane Encapsulant is a two-component polyurethane potting system. It is used for potting and encapsulation of electronic components, circuit boards, and related devices. It has low stress cure for protection of sensitive components and
- Viscosity: 1,200 to 3,000 cP
- Thermal Conductivity: 0.5 W/m-K
- Tensile Strength (Break): 1,850 psi
- Elongation: 32 %
-
Supplier: Epoxies Etc...
Description: This series of polyurethane systems is engineered for electronic potting, encapsulating, and casting applications. They are low in viscosity, low in toxicity and available in the popular TriggerBond® dual barrel cartridge dispensing system. These elastomeric systems are suitable for a variety
- Viscosity: 1,700 to 4,500 cP
- Use Temperature: -22 to 257 F
- Thermal Conductivity: 0.297109474 W/m-K
- Coeff. of Thermal Expansion (CTE): 111.11111111111111 µin/in-F
-
Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL STYCAST U2535 Polyurethane Encapsulant ) LOCTITE STYCAST U 2535 PTB two component flexible polyurethane encapsulant designed for transformer, PCB's and other insulation applications. It allows complete impregnation of either small slightly wound coils or
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
-
-
Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONAP DS-1832 Polyurethane Encapsulant Black is used in electrical potting, casting, or encapsulation. It has high compatibility with most epoxy and urethane systems, heat-stable pigments, and improved heat and light resistance. 1 gal Can.
- Features: Encapsulating / Potting
- Chemical System: Polyurethane (PU, PUR)
- Cure / Technology: Single Component System
-
Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONATHANE EN-14 Polyurethane Elastomer System is a two component, unfilled polyurethane that is used for encapsulation and potting of electrical and heat sensitive assemblies. It offers flexibility, low viscosity, fast curing, fast gelling, and resistance to water and
- Viscosity: 1,200 cP
- Tensile Strength (Break): 700 psi
- Elongation: 110 %
- Dielectric Strength: 500.00000000000006 kV/in
-
Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONATHANE EN-12 Polyurethane Encapsulant Amber is a two-component polyurethane system. It is used for cable and connector potting and molding. It offers thermal shock resistance, has superior hydrolytic stability, and a low dissipation factor. Part B, 1 gal Can.
- Viscosity: 6,000 cP
- Tensile Strength (Break): 400 psi
- Elongation: 350 %
- Dielectric Strength: 600 kV/in
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST U 2500 TEM, Flexible, Polyurethane, Encapsulant LOCTITE® STYCAST U 2500 TEM flexible polyurethane encapsulant is formulated to have low viscosity and excellent wetting properties allowing complete impregnation of either small slightly wound coils or large
- Viscosity: 6,000 cP
- Use Temperature: 40 to 257 F
- Thermal Conductivity: 0.6 W/m-K
- Tensile Strength (Break): 507 psi
-
Supplier: Protavic America, Inc.
Description: PNU 46220™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and
- Viscosity: 1,500 cP
- Use Temperature: -55 to 125 F
- Dielectric Constant (Relative Permittivity): 4.41 to 4.63
- Features: Ceramic / Glass, Electrical Insulation / Dielectric Material, Electrical Power / HV, Electronics, Encapsulanting / Potting, Filled / Reinforced, Flexible / Dampening, Liquid, Metal, Paper / Paperboard, Plastic, UV / Radiation Cured (EB, Light)
-
Encapsulants and Potting Compounds - Techsil® PU23930 Pearl Polyurethane Twinpack 250gm -- TEEP14087Supplier: Techsil Limited
Description: Techsil® PU23930 is a two-part, flexible, room temperature curing polyurethane resin designed for the potting and encapsulation of LED arrays and lighting equipment. Product Features Excellent long term UV stability Scratch and mark resistant Non-toxic High mechanical strength Easy to mix and
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
- Chemical System: Polyurethane (PU, PUR)
-
Supplier: Protavic America, Inc.
Description: PNU-56200™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and
- Viscosity: 5,000 cP
- Use Temperature: -55 to 120 F
- Tensile Strength (Break): 2,000 psi
- Dielectric Constant (Relative Permittivity): 4.41 to 4.63
-
Supplier: Techsil Limited
Description: Techsil® VT2420LV is a crystal clear two-part, low viscosity room temperature curing polyurethane resin with high shore hardness. VT2420LV offers excellent outdoor weathering properties, due to the incorporation of both UV resistant base materials and the addition of UV stabilizers and
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
- Chemical System: Polyurethane (PU, PUR)
-
Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview Electrolube® PUC Polyurethane Conformal Coating is a tough, abrasion-resistant coating with excellent mechanical and dielectric properties, while maintaining the flexibility needed to protect delicate components. It can be sprayed, dipped, or brushed. The thickness of the
- Form / Function: Conformal / Encapsulating Coating
- Industry: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Chemical System: Polyurethane (PU, PUR)
-
Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview UR5645 High Performance Polyurethane Resin has been specially developed for the encapsulation and potting of electronics, such as the next generation of automotive electronics. It exhibits excellent chemical resistance to a wide variety of chemicals, even after prolonged
- Use Temperature: 320 F
- Industry: Automotive, Semiconductors / IC Packaging
- Features: Electronics, Encapsulating / Potting, Marine
- Chemical System: Polyurethane (PU, PUR)
-
Supplier: Henkel Corporation - Electronics
Description: (Known as Hysol US0154 ) Encapsulant potting urethane.
- Viscosity: 55 cP
- Coeff. of Thermal Expansion (CTE): 5.555555555555555 µin/in-F
- Elongation: 50 %
- Industry: Electronics (PCB / SMT Assembly)
-
Supplier: Newark, An Avnet Company
Description: High Temperature Rigid Polyurethane Potting and Encapsulating Compound / 3 kg, 2.55 L Kit
-
Supplier: TE Connectivity
Description: Can Product Volume (L) : 6.01 Product Availability Product Availability : Australia, New Zealand & Pacific Islands, Europe, Middle East & Africa, China, Americas, Asia Product Type Features Material System : Two-Part Polyurethane Potting Resin Product Type : Casting Material Usage Conditions
- Features: Encapsulant / Potting Compound, Specialty / Other
- Chemical System: Polyurethane (PU, PUR)
-
Supplier: ACCRAbond, Inc.
Description: CONATHANES® EN-2541 and EN-2543 are filled, flame resistant polyurethane resins, specially formulated for general purpose electrical/electronic potting, casting and encapsulation. When tested in accordance with UL-94, flame resistance ratings of 94V-O are obtained. EN-2541 and EN-2543 have
- Features: Encapsulating / Potting
- Chemical System: Polyurethane (PU, PUR)
-
Supplier: R. S. Hughes Company, Inc.
Description: Loctite 3145 potting & encapsulating compound is compatible with polyurethane materials.
- Features: Encapsulant / Potting Compound
-
Supplier: R. S. Hughes Company, Inc.
Description: Loctite 3145 potting & encapsulating compound is compatible with polyurethane materials.
- Features: Encapsulant / Potting Compound
-
Supplier: ACCRAbond, Inc.
Description: CONATHANE® CE-1175 is a single-component water based polyurethane conformal coating that meets the requirements of MIL-I-46058-C Type UR.
- Form / Function: Conformal / Encapsulating Coating
- Chemical System: Polyurethane (PU, PUR)
- Cure / Technology: Single Component System
-
Supplier: Henkel Corporation - Electronics
Description: HYSOL US1150 is an extended polybutadiene/MDI base, mineral filled, medium hardness, ambient cure urethane encapsulant/sealant. This material can be used for potting electronics or devices for protection against environmental hazards. It exhibits very little hardness increase when cooled to
- Viscosity: 3,500 cP
- Use Temperature: -85 to 257 F
- Thermal Conductivity: 0.486 W/m-K
- Industry: Electronics (PCB / SMT Assembly)
-
Supplier: Henkel Corporation - Electronics
Description: (Known as Hysol US2050 ) LOCTITE STYCAST US 2050 is a quick set, optically clear polyurethane compound that exhibits excellent ultraviolet resistance. The excellent electrical properties also suggest its use for electrical and electronic component encapsulation.
- Viscosity: 1,200 cP
- Use Temperature: -40 to 257 F
- Thermal Conductivity: 0.18 W/m-K
- Industry: Electronics (PCB / SMT Assembly)
-
Supplier: RS Components, Ltd.
Description: RS PRO ERUR5640RP250G Potting Compound
- Features: Encapsulating / Potting Compound, Specialty / Other
- Chemical System: Polyurethane (PU, PUR)
-
Supplier: Protavic America, Inc.
Description: PNU-46203™ is an electronics grade, two-component polyurethane adhesive or encapsulant for high temperature resistance. PNU-46203™ is designed for the encapsulation by casting of completed circuit boards. Cured PNU-46203™ is expected to meet the flammability requirements of UL 94, V-0
- Viscosity: 15,000 cP
- Use Temperature: -55 to 125 F
- Dielectric Constant (Relative Permittivity): 6.89 to 7.01
- Features: Ceramic / Glass, Electrical Insulation / Dielectric Material, Electrical Power / HV, Electronics, Encapsulanting / Potting, Filled / Reinforced, Flame Retardant (e.g. UL 94 Rated), Flexible / Dampening, Liquid, Metal, Paper / Paperboard, Plastic
-
Supplier: ELANTAS North America LLC
Description: The smart meter market, encompassing electric, water, and gas sectors, is pivotal in shaping a sustainable and connected future. As these meters become integral to our utilities, they face multifaceted challenges. From fluctuating environmental conditions to potential electronic interference, the
- Viscosity: 8,500 cP
- Use Temperature: 266 F
- Industry: Aerospace, Electronics (PCB / SMT Assembly), Military / Government (MIL-SPEC / GG)
- Features: Encapsulant / Potting Compound, Liquid
-
Supplier: Hapco, Inc.
Description: Filter-bond™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond R-Series is manufactured to ultra-high quality standards and has been used by customers to pass FDA approval. Filter-bond™ R-30-6
- Viscosity: 6,000 to 11,000 cP
- Features: Encapsulating / Potting Compound, Medical / Food (Sanitary / FDA)
- Chemical System: Polyurethane (PU, PUR)
- Cure / Technology: Two Component System
-
Supplier: RS Components, Ltd.
Description: Urethane Clear 250ml
- Form / Function: Conformal / Encapsulating Coating
- Features: Other, Specialty / Other, Tooling / Mold Material
- Chemical System: Polyurethane (PU, PUR)
-
Supplier: ELANTAS North America LLC
Description: The smart meter market, encompassing electric, water, and gas sectors, is pivotal in shaping a sustainable and connected future. As these meters become integral to our utilities, they face multifaceted challenges. From fluctuating environmental conditions to potential electronic interference, the
- Viscosity: 6,000 cP
- Industry: Aerospace, Electronics (PCB / SMT Assembly), Military / Government (MIL-SPEC / GG)
- Features: Encapsulant / Potting Compound, Liquid
- Chemical System: Polyurethane (PU, PUR)
-
Supplier: Techsil Limited
Description: high-voltage arcing, shorts and static discharges. 4223 Polyurethane meets UL 94V-1 flammability rating and offers excellent chemical and abrasion resistance along with good fungus resistance. Transparent in appearance, this clear amber coat lets you see problems if they occur Product
- Form / Function: Conformal / Encapsulating Coating
- Industry: Electronics (PCB / SMT Assembly)
- Chemical System: Polyurethane (PU, PUR)
-
Supplier: DigiKey
Description: BLACK RIGID POLYURETHANE POTTING
- Features: Encapsulating / Potting
-
Supplier: ELANTAS North America LLC
Description: ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of
- Viscosity: 2,000 to 3,000 cP
- Use Temperature: 266 F
- Thermal Conductivity: 0.2 to 0.25 W/m-K
- Coeff. of Thermal Expansion (CTE): 75 to 155.55555555555554 µin/in-F
-
Supplier: GS Polymers, Inc.
Description: No Description Provided
- Features: Ceramic / Glass, Composites, Concrete / Masonry, Dissimilar Substrates, Encapsulating / Potting, Metal, Paper / Paperboard, Porous Surfaces, Room Temperature Curing
- Industry: OEM / Industrial
- Chemical System: Polyurethane (PU, PUR), Rubber Based / Elastomeric
- Cure / Technology: Thermosetting / Crosslinking, Two Component System
-
Encapsulants and Potting Compounds - Filter-bond™ Elastomeric Casting and Potting Compound -- E-3505Supplier: Hapco, Inc.
Description: Filter-bond™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond™ E-Series is manufactured to ultra-high quality standards and has been used by customers to pass FDA approval. Filter-bond™ E-3264
- Viscosity: 43,000 to 57,000 cP
- Features: Encapsulating / Potting Compound, Medical / Food (Sanitary / FDA)
- Chemical System: Polyurethane (PU, PUR), Rubber Based / Elastomeric
- Cure / Technology: Two Component System
Find Suppliers by Category Top
Featured Products Top
-
and premature failure such as vibration, shock, and stress caused by temperature fluctuation during thermal cycling. Material options for electronic protection include silicones, epoxies, polyurethanes, and other various polymers. Silicones are extremely durable and feature important and (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
. State of the art polyurethane materials with UL Relative Thermal Index (RTI) ratings up to 130°C and higher (Conapoxy®, CONAP®, ELAN-Tron®). Unique, one (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
potting materials are based on epoxy, polyurethane, polybutadiene and silicone and are especially designed for areas in demanding electrical and electronic applications. Additional properties such as improved heat dissipation, much greater mechanical stability at high vibrational forces, noise reduction (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
defense industry. We have proudly worked with every branch of the military, fulfilling a wide array of applications. Our flexible, polyurethane open-cell foams are formulated to absorb large amounts of impact energy at controlled rates while cushioning payloads from high G-stress levels. They (read more)
Browse Fabricated Plastic Parts and Semi-Finished Shapes Datasheets for General Plastics Manufacturing Co. -
defense industry. We have proudly worked with every branch of the military, fulfilling a wide array of applications. Our flexible, polyurethane open-cell foams are formulated to absorb large amounts of impact energy at controlled rates while cushioning payloads from high G-stress levels. They (read more)
Browse Armor and Ballistic Shielding Datasheets for General Plastics Manufacturing Co. -
have proudly worked with every branch of the military, fulfilling a wide array of applications. Our flexible, polyurethane open-cell foams are formulated to absorb large amounts of impact energy at controlled rates while cushioning payloads from high G-stress levels. They have been used (read more)
Browse Armor and Ballistic Shielding Datasheets for General Plastics Manufacturing Co. -
have proudly worked with every branch of the military, fulfilling a wide array of applications. Our flexible, polyurethane open-cell foams are formulated to absorb large amounts of impact energy at controlled rates while cushioning payloads from high G-stress levels. They have been used (read more)
Browse Armor and Ballistic Shielding Datasheets for General Plastics Manufacturing Co. -
, which can cause malfunction and premature failure such as vibration, shock, and stress caused by temperature fluctuation during thermal cycling. Material options for electronic protection include silicones, epoxies, polyurethanes, and other various polymers. Silicones are extremely durable (read more)
Browse Conformal Coatings Datasheets for CHT USA Inc. -
Master Bond LED401 is a breakthrough system based on LED technology. This adhesive, sealant, coating and encapsulant cures tack-free upon exposure to a 405 nm wavelength light source, without any oxygen inhibition (read more)
Browse Specialty Adhesives, Sealants, and Compounds Datasheets for Master Bond, Inc. -
NASA low outgassing approved epoxy, Master Bond Supreme 121AO, may be used for bonding, sealing and potting applications.
(read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc.
More Information Top
Indicates content that may require registration and/or purchase.
-
ES&H development activities for the W89 warhead
Polvumt bane Encapsulant and Polyurethanee Sleeving Polyurethane encapsulant and sleeving are used as insulation material in high voltage areas of the firing set.
-
NUWC XP-1 polyurethane-urea: a new, "acoustically transparent" encapsulant for underwater transducers and hydrophones
In the Navy materials community, there is no consensus or formal guidance as to what the maximum allowable amount of water absorption by a polyurethane encapsulant should be because applications are generally unpredictable.
-
25th PolyMAC Conference, June 13-15, 1995
Abstract The processing and physical properties requirements for a polyurethane encapsulating foam are much different from the requirements of a stnrctural foam.
-
http://www.dtic.mil/cgi-bin/GetTRDoc?AD=ADA294555&Location=U2&doc=GetTRDoc.pdf
For MSI's initial subscale 100 mm transducers, the electrical cable was simply attached at the mid-point of one edge, with a relatively short length of cable contained within the outer polyurethane encapsulation .
-
Stretchable electronic systems for wearable and textile applications
In the next process step the components and the copper foil are laminated into a polyurethane encapsulation , see figure 4.
-
Integrated Environmental Modeling: Pollutant Transport, Fate, and Risk in the Environment
To address this concern, a more efficient polycondensation catalyst, tetrakis(acetoxydibutyltinoxy)silane (Si[OSn(n-C4 H9 )2 OOCCH3 ]4 , TKAS), was synthesized, encapsulated using the polyurethane encapsulation procedure described above and used in self-healing experiments instead of DMDNT.
-
Ruggedized Fiber Optic Cables For Army Communication Systems
The two parallel KEVLARR -49 strength members are embedded in the polyurethane encapsulant during the extrusion process.
-
Energy Materials Coordinating Committee (EMaCC): Annual technical report, fiscal year 1993
Toluene Diisocyanate-Free Rigid Polyurethane Encapsulation Foams .
-
Pinellas Plant Environmental Baseline Report
methylene dianiline(MDA) polyurethane encapsulant .
-
An investigation into the durability of screen-printed conductive tracks on textiles
A cross-sectional micrograph of a typical silver polymer conductive track with polyurethane encapsulation is shown in figure 1. .