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Supplier: Protavic America, Inc.
Description: PTS-46323™ is a two-component ONE TO ONE MIX RATIO silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible
- Viscosity: 8,000 to 10,000 cP
- Use Temperature: -55 to 200 F
- Thermal Conductivity: 1.3 W/m-K
- Dielectric Strength: 635.0000000000014 kV/in
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Supplier: Protavic America, Inc.
Description: PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature
- Viscosity: 400 cP
- Thermal Conductivity: 0.5 W/m-K
- Coeff. of Thermal Expansion (CTE): 3,055.5555555555557 µin/in-F
- Dielectric Strength: 635.0000000000014 kV/in
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Supplier: Accuris
Description: SILICONE, ENCAPSULANT, ROOM TEMPERATURE CURING, FOR SPACE APPLICATIONS
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Supplier: Ellsworth Adhesives
Description: Dow SYLGARD™ 160 Silicone Elastomer is a two component, room temperature or heat curing encapsulant that is used for general potting applications of power supplies. It has good flowability, moderate thermal conductivity, and flame resistance. 1:1 mix ratio. 200 mL Cartridge. This is a
- Viscosity: 8,775 cP
- Thermal Conductivity: 0.62 W/m-K
- Dielectric Strength: 482.600000000001 kV/in
- Features: Electrical Power / HV, Encapsulating / Potting
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Supplier: Ellsworth Adhesives
Description: Dow SYLGARD™ 164 Silicone Elastomer Gray is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides good flowability, thermal
- Viscosity: 8,925 cP
- Thermal Conductivity: 0.64 W/m-K
- Dielectric Strength: 482.600000000001 kV/in
- Features: Electrical Power / HV, Encapsulating / Potting
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Supplier: Ellsworth Adhesives
Description: Dow SYLGARD™ 170 Silicone Elastomer is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides good flowability, moderate
- Viscosity: 3,400 cP
- Thermal Conductivity: 0.39 W/m-K
- Dielectric Strength: 482.600000000001 kV/in
- Features: Electrical Power / HV, Encapsulating / Potting
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ ME-4132 Silicone Encapsulant Black is a one component encapsulant that has high purity, excellent adhesion, low modulus of elasticity, and no byproducts during cure. It is primarily used for the micro- and optoelectronic packing industry. 453 g Bottle.
- Tensile Strength (Break): 140 psi
- Elongation: 138 %
- Dielectric Strength: 508.0000000000011 kV/in
- Features: Encapsulating / Potting
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Supplier: CHT USA Inc.
Description: CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low
- Use Temperature: -94 to 482 F
- Thermal Conductivity: 1.17 W/m-K
- Elongation: 30 %
- Tensile Strength (Break): 117.47983987932957 psi
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Encapsulants and Potting Compounds - Techsil® RTV27905 Clr Silicone Gel Encapsulant 2kg -- TESI19128Supplier: Techsil Limited
Description: Techsil® RTV27905 is a soft, adherent, clear silicone elastomer gel which is designed for the encapsulation and protection of electronic components. It is a low viscosity, 2 component system that is easily mixed in a 1:1 ratio. RTV27905 belongs to a wider family of products in a similar range
- Features: Encapsulating / Potting
- Chemical System: Rubber Based / Elastomeric, Silicone
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Encapsulants and Potting Compounds - Techsil RTV27905 Clr Silicone Gel Encapsulant 10kg -- TESI19154Supplier: Techsil Limited
Description: Techsil® RTV27905 is a soft, adherent, clear silicone elastomer gel which is designed for the encapsulation and protection of electronic components. It is a low viscosity, 2 component system that is easily mixed in a 1:1 ratio. RTV27905 belongs to a wider family of products in a similar range
- Features: Encapsulating / Potting
- Chemical System: Rubber Based / Elastomeric, Silicone
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Supplier: Henkel Corporation - Electronics
Description: (Known as E&C STYCAST 5952 A/B thermally conductive silicone encapsulant ) LOCTITE STYCAST 5952 RD PTA is a filled, addition cured, silicone encapsulant. It features good thermal conductivity, excellent electrical insulation properties. It was designed for encapsulating
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
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Supplier: Accuris
Description: ENCAPSULANT, SILICONE DIELECTRIC GEL
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Supplier: CHT USA Inc.
Description: CHT's QSil 58 is a 2-part, condensation cure, high temperature, self-leveling, silicone elastomer primarily used for electronic potting applications to provide protection from moisture, debris, vibration and shock. The two applicable catalysts are 0.5% DBT by weight and 10% Deep Section
- Use Temperature: -65.2 to 500 F
- Thermal Conductivity: 0.31 W/m-K
- Dielectric Strength: 353.06000000000074 kV/in
- Viscosity: 9,000 cP
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Supplier: Accuris
Description: ENCAPSULANT, SILICONE DIELECTRIC GEL, THIXOTROPIC
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Supplier: CHT USA Inc.
Description: CHT's QSil 216 is a 2-part, platinum cure, optically clear silicone encapsulant designed for optical applications. QSil 216 features a 10:1 mix ratio by weight and its low viscosity profile enables excellent flow around components and is excellent for potting complex parts. The
- Use Temperature: -67 to 399.2 F
- Thermal Conductivity: 0.18 W/m-K
- Elongation: 100 %
- Tensile Strength (Break): 749.8404594767085 psi
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Supplier: CHT USA Inc.
Description: CHT’s TufGel 336 is a 2-part, tough, black silicone gel designed for electronic potting applications to provide protection from moisture, vibration and thermal or mechanical shock. TufGel 336 can also function as a contrast enhancement material in LED applications. TufGel 336 is also flame
- Viscosity: 390 cP
- Use Temperature: -67 to 399.2 F
- Dielectric Strength: 450.00000000000006 kV/in
- Industry: Automotive, OEM / Industrial
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Supplier: Wacker Chemical Corp.
Description: WACKER SilGel® 611 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a soft silicone gel. WACKER SilGel® 611 A/B is a white colored modification of WACKER SilGel® 612 with higher hardness and reactivity. Special features two-part, 1 : 1
- Viscosity: 1,000 cP
- Features: Electronics, Encapsulating / Potting, Liquid, RTV / Room Temperature Curing
- Chemical System: Rubber Based / Elastomeric, Silicone
- Cure / Technology: Single Component System, Thermosetting / Crosslinking
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Supplier: Accuris
Description: ENCAPSULANT, SILICONE GEL, ONE COMPONENT PLATINUM CURE
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 4640, Silicone, Flexible, Potting or Encapsulant LOCTITE® STYCAST 4640 RTV condensation cure silicone rubber syntactic foam is engineered to yield a flexible, low density material with a low dielectric constant and dissipation factor. It is designed for airborne
- Viscosity: 45,000 cP
- Use Temperature: 85 to 500 F
- Tensile Strength (Break): 200 psi
- Features: Caulk / Grout
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Supplier: Bluestar Silicones USA Corp.
Description: Potting, encapsulant elastomer Properties Viscosity 3500 Hardness Sha 48 Description a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL™ ESA 7252 QC A & B is supplied as a viscous liquid which is
- Viscosity: 3,000 to 3,500 cP
- Thermal Conductivity: 0.42 W/m-K
- Coeff. of Thermal Expansion (CTE): 4.444444444444445 µin/in-F
- Tensile Strength (Break): 333.584730521553 psi
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Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL STYCAST U2535 Polyurethane Encapsulant ) LOCTITE STYCAST U 2535 PTB two component flexible polyurethane encapsulant designed for transformer, PCB's and other insulation applications. It allows complete impregnation of either small slightly wound coils or large castings.
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
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Supplier: Allied Electronics, Inc.
Description: MG Chemicals offers a comprehensive portfolio of silicone solutions to help meet a broad array of handling and performance needs in electronic components and assemblies. Selection of the appropriate type of RTV depends upon the required manufacturing process, handling requirements, curing
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Supplier: Chemence Inc.
Description: KSC2040 is a thermally conductive silicone RTV adhesive rubber developed for heat sink applications. KSC2040 is a 1-part silicone that when applied to the substrate enables adhesion to parts and heat transfer of the bonded assembly within minutes. When cured, the elastomer resists
- Viscosity: 600,000 cP
- Form / Function: Die Bonding Adhesive / Compound
- Features: Electronics, Grease / Paste, Metal, Plastic
- Chemical System: Silicone
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Supplier: Allied Electronics, Inc.
Description: Potting⁄Encapsulating Compound, 120% Elongation, 1.05 Specific Gravity, Optical Clear Color Offering higher performance qualities over conventional RTV silicones. MG Chemicals sealants will bond to many clean surfaces without the aid of primers. Many of these one-part RTV silicone
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Supplier: Wacker Chemical Corp.
Description: relatively poor thermal conductivity. By coating the contact surfaces with WACKER® SILICONE PASTE P 12, the thermally insulating air is replaced by the heat sink silicone paste when the semiconductor is screwed on. The thermal conductivity of WACKER® SILICONE PASTE P 12 is about
- Thermal Conductivity: 0.81 W/m-K
- Dielectric Strength: 254.00000000000054 kV/in
- Dielectric Constant (Relative Permittivity): 3.5
- Type: Electrical Insulation / Dielectric
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Supplier: Chemence Inc.
Description: KS130 is a fast curing silicone RTV adhesive rubber developed for the bonding of "difficult to bond" plastics like Tygon™.KS130 is a one part silicone that when applied to the substrate enables handling of the bonded assembly within an hour. When cured, the elastomer resists
- Viscosity: 400,000 cP
- Form / Function: Die Bonding Adhesive / Compound
- Industry: OEM / Industrial
- Features: Plastic
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Supplier: Allied Electronics, Inc.
Description: CONFORMAL COATING PEN - SILICONE, UL RECOGNIZED; 0.16 OZ
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Supplier: Epoxies Etc...
Description: 20-1615 is a two component, room temperature curing silicone rubber compound. This silicone system is clear, odorless, and low in viscosity. 20-1615 is an excellent choice for potting electronic assemblies that require shock and vibration resistance. It also protects assemblies from
- Viscosity: 6,000 cP
- Use Temperature: -175 to 401 F
- Thermal Conductivity: 0.207688176 W/m-K
- Coeff. of Thermal Expansion (CTE): 182.99999999999997 µin/in-F
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Supplier: Bluestar Silicones USA Corp.
Description: Two-Component, Medium Viscosity, Addition Cure, Potting/Encapsulating Silicone Compound Properties Viscosity 44000 Hardness Sha 29 Description Bluesil V-217 is a clear, two component, medium viscosity, addition cure silicone compound. It is designed for potting and encapsulating
- Viscosity: 44,000 cP
- Form / Function: Conformal / Encapsulating Coating
- Features: Electronics, Encapsulating / Potting, Grease / Paste
- Chemical System: Silicone
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Supplier: Allied Electronics, Inc.
Description: 2-Part Potting⁄Encapsulating RTV Silicon Compound, White Color Offering higher performance qualities over conventional RTV silicones. MG Chemicals sealants will bond to many clean surfaces without the aid of primers. Many of these one-part RTV silicone adhesive sealants are suitable
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Supplier: Bluestar Silicones USA Corp.
Description: Silicone Elastomer for encapsulating applications Properties Viscosity 7500 Hardness Sha 55 Description Bluesil V-1010 is a medium strength, two-component, tin catalyzed, room temperature cure silicone rubber. It is designed as a low viscosity, very flowable material for use as a
- Use Temperature: -65 to 400 F
- Tensile Strength (Break): 400 psi
- Elongation: 105 %
- Form / Function: Conformal / Encapsulating Coating
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 960 CLEAR is a RTV-1 amine cure silicone rubber dispersion that cures on contact with moisture in the air. Special features Rapid cure Excellent electrical properties Excellent adhesion to many substrates Available in clear or red Application SEMICOSIL® 960 CLEAR is a conformal
- Viscosity: 4,000 cP
- Dielectric Strength: 457.20000000000095 kV/in
- Dielectric Constant (Relative Permittivity): 2.7
- Form / Function: Conformal / Encapsulating Coating
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Supplier: Techsil Limited
Description: TC-5120 from BJB is a room temperature, 20 Shore A, addition/platinum curing silicone rubber designed for part making or mould making. Can be easily pigmented, encapsulating products, making flexible moulds and creating parts and skins. Product Specifications 20 Shore A 40 Minute Work Time 24
- Features: Encapsulant / Potting Compound
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Supplier: Master Bond, Inc.
Description: MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation.
- Applied Thickness / Gap Fill: 1 inch
- Viscosity: 1,000 cP
- Use Temperature: -67 to 392 F
- Dielectric Strength: 500.00000000000006 kV/in
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Supplier: Novagard Solutions
Description: No Description Provided
- Tensile Strength (Break): 200 to 240 psi
- Elongation: 600 %
- Features: Ceramic / Glass, Composites, Conformal Coating, Electrical Insulation / Dielectric Material, Electronics, Encapsulanting / Potting, Gap Filling Sealant / FIP Gasket, Grease / Paste, Metal, Non-corrosive Cure, Plastic, UL Approved
- Form / Function: Die Bonding Adhesive / Compound, Glob Top / Daub
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Silicones for Electronic Protection and Long-term Performance Electronics function in many different applications. However, there is a common requirement to protect sensitive components and systems from (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
and premature failure such as vibration, shock, and stress caused by temperature fluctuation during thermal cycling. Material options for electronic protection include silicones, epoxies, polyurethanes, and other various polymers. Silicones are extremely durable and feature important and (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
In the transportation sector, designing lighter weight components has widely become a key trend especially to reduce energy consumption and maximize the range of electric vehicles. CHT’s advanced Silicone Foam is designed to reduce weight – as well as mitigate thermal (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
Silicone gels are two-component, addition (platinum) cure chemistry and most are designed with a one-to-one mix ratio system. Silicone gels will cure at either room temperature or can be heat cured for faster processing and can be either automatically or hand dispensed. Specialty gels can also (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
CoolTherm® SC-320 silicone encapsulant is a two component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications while retaining desirable properties associated with silicones. (read more)
Browse Silicone Adhesives and Sealants Datasheets for Ellsworth Adhesives -
sensitive components (Bectron®, CONAP®). Epoxy and silicone potting materials that provide protection for high temperature applications (Epoxylite®, (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
potting materials are based on epoxy, polyurethane, polybutadiene and silicone and are especially designed for areas in demanding electrical and electronic applications. Additional properties such as improved heat dissipation, much greater mechanical stability at high vibrational forces, noise reduction (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
Why are silicones used in LED & Lighting applications? Silicones have become widely used by LED design engineers to provide improved light performance, environmental protection and extended product life (read more)
Browse Datasheets for CHT USA Inc. -
applications? Silicones have become widely used by LED design engineers to provide improved light performance, environmental protection and extended product life. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants (read more)
Browse Datasheets for CHT USA Inc. -
applications? Silicones have become widely used by LED design engineers to provide improved light performance, environmental protection and extended product life. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants (read more)
Browse Industrial Adhesives Datasheets for CHT USA Inc.
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Industries Association named Naoyuki Akikusa, chairman of Fujitsu Ltd., as its new chairman, at a time when the Japanese electronics industry is growing strongly. Dow Corning sees LED makers transitioning to silicones Dow Corning has launched an expanded family of silicone materials for the light emitting
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
transitioning to silicones Dow Corning has launched an expanded family of silicone materials for the light emitting diode market, including three new LED-protecting encapsulants and a moldable resin. Siano launches chipset for mobile digital TV Mobile digital television (MDTV) chip developer Siano
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Optical Transmission Properties of Adhesives
700nm to 1 mm, you have "infrared light", (IR) which can be further broken down into near infrared (0.75-2 µm), middle infrared (2-15 µm), and far infrared 15 µm to 1mm. Most optically clear epoxies, polysulfides, and silicones exhibit excellent light transmission across the visible, and near IR
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LED Package-use Encapsulation Material Report - 2013
LED silicone encapsulant market to nearly double in size by 2017 compared to 2012 .
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http://dspace.mit.edu/bitstream/handle/1721.1/32693/43319679-MIT.pdf?sequence=2
portion of wire which penetrated the silicone encapsulation and entered the surrounding fluid .
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Miniaturization of package for an implantable heart monitoring device
Fig. 5 Left model of the silicone encapsulation .
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Corrosion of silicon integrated circuits and lifetime predictions in implantable electronic devices
This statistical approach is the same as that already used for the validation of the silicone encapsulation .
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Solid State Lighting Reliability
Delam- ination can either occur between the die and silicone encapsulant [15], between the encapsulant and packaging lead frame [145], or between the LED die and die attach [146, 147], as shown in Fig. 3.25.
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Comparison of effect of epoxy and silicone adhesive on the lifetime of plastic LED package
From TTF data, statistical analysis was performed and reliability parameters such as acceleration factor (AF) and B10 lifetime at 40°C were estimated according to types of bonding adhesive and silicone encapsulant in plastic LED packages, with 90% confidence.
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Materials for Advanced Packaging
As shown in Fig. 18.4(a), a typical high power white LED package structure is comprised of a leadframe with a reflector cup, an LED die, a die attach adhesive, gold wires, and a silicone encapsulant mixed with phosphor material.
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High Performance Packaging Solutions for Low Cost, Reliable PV Modules: Final Subcontract Report, 26 May 2005 - 30 November 2008
2 Figure 1 – Silicone Encapsulation Concepts .................................................................................................
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Encapsulation process development for flexible-circuit based chip scale packages
… will eliminate the die attach voids, the under filling process between the nubbins and under the die is extremely slow, addi- tionally, encapsulation voids under the die can be spotted even under vacuum environment due to the high viscosity silicone encapsulant used.
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Volume structuring of high power LED encapsulates by femtosecond laser direct writing
which was subsequently trickled with respect to the frame surface, yielding silicone encapsulation layers of 45 µm thickness (with respect to the top of the sapphire substrate) after curing at a temperature of 80◦C for 4 hours.