Alumina Substrate

Description: Alumina substrate, also known as aluminum oxide substrate or ceramic substrate, is primarily composed of aluminum oxide (Al2O3). The excellent electrical, thermal, and mechanical characteristics of alumina, a well-known ceramic material, lead to its selection. The

• Density: 3.6999976648298842 g/cc
• Max Use / Curie Temperature: 1,500 to 1,650 C
• Dielectric Strength: 17,000,000 V/m
• Material Type: Alumina / Aluminum Oxide, Silicon Carbide

Description: Unipretec offers 99.6% alumina substrates. This high purity alumina substrate exhibits excellent physical, chemical, and mechanical properties, including exceptional insulating properties, high thermal conductivity, low dielectric constant, low dielectric loss, high

• Density: 3.8999975386044725 to 3.9499975070481197 g/cc
• Max Use / Curie Temperature: 1,500 to 1,650 C
• Dielectric Strength: 17,000,000 to 20,000,000 V/m
• Material Type: Alumina / Aluminum Oxide

Description: process, alumina ceramic substrate are mainly used in high-tech fields, such as metallurgy, chemical industry, electronics, national defense, aerospace and nuclear technology. Alumina Ceramic Substrate Properties Alumina Ceramic Substrate is a kind of

• Density: 3.5999977279425903 to 3.8999975386044725 g/cc
• Material Type: Alumina / Aluminum Oxide
• Shape / Form: Bar Stock, Fabricated / Custom Shape, Rod Stock
• Applications: Electronics / RF-Microwave

Description: Features Strong mechanical strength Excellent surface flatness High thermal conductivity, Superior shock resistance High surface resistivity and volume resistivity, Superior electrical insulation

• Thickness / Wall Thickness: 0.0250393836 to 0.0393701 inch
• Alumina / Aluminate Type: Alumina / Aluminum Oxide, Alumina-Zirconia
• Features: Other

Description: characteristic ● Good thermal conductivity ● Good thermal shock resistance ● Excellent surface characteristics and flatness ● High insulation performance, low dielectric constant and dielectric loss ● Excellent mechanical strength ● Stable physical and chemical properties and corrosion resistance

• Material Type: Alumina / Aluminum Oxide

Description: Advantages Of Alumina Ceramic Substrate Alumina Ceramic Substrate have the characteristics of high hardness and wear resistance, low corrosion level, high temperature resistance, corrosion resistance and biological inertness.Because of its superior performance,

• Density: 3.749997633273531 to 3.9499975070481197 g/cc
• Thermal Conductivity: 20 to 30 W/m-K
• Material Type: Alumina / Aluminum Oxide
• Applications: Electrical / HV Parts

Description: Innovacera’s 96 Alumina (Al₂O₃) Substrates combine high density, superior thermal conductivity, and excellent dielectric strength, making them an ideal choice for electronic and energy applications. With outstanding resistance to high temperature, acid, and alkali corrosion, these

• Material Type: Alumina / Aluminum Oxide
• Features: Other
• Shape / Form: Wafer / Substrate

Description: ceramic substrate inventory until needed, and we'll process your materials on a just-in-time (JIT) basis. Our ceramic alumina laser processing services include: Laser precise cutting, drilling, and scribing of ceramics from stock Laser marking alumina ceramic Delivery from stock

• Materials: Alumina (Al₂O₃), Nitride (AlN, BN)
• Services: Bonding / Assembly, Ceramic Part Fabrication, Design Assistance, Testing / Inspection
• Secondary Operations: Glazing / Coating, Lapping / Polishing
• Process: Grinding, Machining

Description: Thick Film Circuit Substrates Features Using Alumina substrates as the base material offers excellent thermal conductivity Capable of fine line patterns Capable of forming resistors and adjusting resistivity with trimming Capable of edge electrical terminals Multilayer Thick

• Alumina / Aluminate Type: Alumina / Aluminum Oxide
• Features: Other

Description: custom make : Alumina Ceramic Substrate/ Board / Sheet/ Wafer Alumina Ceramic Plate / Block Alumina Ceramic Sleeve / Bushing / Lining Alumina Ceramic Tube Rod Alumina Ceramic Screw and Nuts Alumina Ceramic Crucible Alumina Ceramic Ring

• Density: 3.5999977279425903 to 3.9399975133593905 g/cc
• Coeff. of Thermal Expansion (CTE): 8.2 to 8.4 µm/m-C
• MOR / Flexural Strength: 50,037.70957823296 to 54,968.96211637766 psi
• Compressive / Crushing Strength: 304,577.3626501137 to 377,095.7823287122 psi

Description: The most widely used and best-known fine ceramic material. Good mechanical strength, electrical insulation, high-frequency loss, thermal conductivity, and resistance to heat, wear and corrosion. Sapphire is single-crystal alumina.

• Max Use / Curie Temperature: 800 to 1,000 C
• Thermal Conductivity: 18 W/m-K
• MOR / Flexural Strength: 17,404.4207228636 to 58,014.7357428788 psi
• Compressive / Crushing Strength: 313,279.573011546 to 340,836.572489413 psi

Description: Full glazed substrates are available. Also available are Edge Processed substrates, such as R Edge substrates, C Edge substrates, and partially etched glazed substrates.

• Alumina / Aluminate Type: Alumina / Aluminum Oxide
• Features: Other

Description: With high efficiency, low cost and pollution-free ceramic substrate casting technology, the product length and width can each reach 7.5 inches. It can also produce ultra-thin substrates with thickness of 0.1mm and 0.15mm. Products with special specifications can be customized according

• Thickness / Wall Thickness: 0.05905515 inch
• Material Type: Alumina / Aluminum Oxide

Description: Alumina (Aluminum oxide) is extremely hard and has a very high melting point. Alumina ceramic is the most common and traditional technical material. High purity alumina has excellent electrical insulation properties, as well as high chemical resistance and low thermal expansion.

• Oxide Type: Alumina / Aluminum Oxide

Description: While Gavish is NOT a provider of high volume commodity type substrates for LED’s and SOS applications, we are a producer of custom sapphire substrates and sapphire dummy wafers oriented and finished per customer specifications Specialty sapphire substrates for electronic

• Length: 2 inch
• Width / O.D.: 2 to 7.87402 inch
• Thickness / Wall Thickness: 0.01 to 0.02 inch
• Features: Dielectric Ceramics / Materials, Optics / Optical Grade

Description: Materion Microelectronics & Services offers metalized substrates developed from Beryllium Oxide (BeO) or alumina (Al2O3). The metallization can be thick film MoMn followed by plating, or direct bond copper (DBCu).

• Material Type: Alumina / Aluminum Oxide, Beryllia / Beryllium Oxide
• Shape / Form: Bar Stock

Description: Features A thick film circuit substrate with through hole vias filled with Silver based conductor material Capable of creating a thermal bypass to the back side as thermal vias when used for COB assemblies and SMT assemblies that require thermal dissipation Capable of creating Pad on Via for

• Alumina / Aluminate Type: Alumina / Aluminum Oxide
• Features: Other

Description: Aluminum Oxide is more commonly known as alumina (Al2O3). It is a tough technical ceramic with an excellent combination of mechanical and electrical properties. It is suitable for a wide variety of industrial applications. High hardness, wear resistance, low erosion levels, high temperature

• Oxide Type: Alumina / Aluminum Oxide

Description: Aluminum Oxide is more commonly known as alumina (Al2O3). It is a tough technical ceramic with an excellent combination of mechanical and electrical properties. It is suitable for a wide variety of industrial applications. High hardness, wear resistance, low erosion levels, high temperature

• Oxide Type: Alumina / Aluminum Oxide

Description: thin-film process. CoorsTek substrates are available in "as-fired" and finished form, and in both standard and resistor grades. ADS-996 THIN-FILM SUBSTRATES CoorsTek ADS-996 alumina substrates are a workhorse for most thin-film electronics applications.

• Thermal Conductivity: 26.6 W/m-K
• Coeff. of Thermal Expansion (CTE): 7 to 8.3 µm/m-C
• MOR / Flexural Strength: 85,861.8088994606 psi
• Modulus of Elasticity: 53,953,704.2408773 psi

Description: High-K substrates are used for circuit miniaturization. DLI offers complete fabrication services!

• Length: 1 to 4 inch
• Width / O.D.: 1 to 4 inch
• Thickness / Wall Thickness: 0.025 inch
• Coeff. of Thermal Expansion (CTE): 0.55 to 10.1 µm/m-C

Description: CoorsTek developed the standards for thick-film ceramic substrates and continues to provide economical yet durable substrates for hybrid integrated circuits, surface mount devices, sensors, and other thick-film electronics. Why Ceramic Thick-Film Substrates? Alumina is

• Thermal Conductivity: 13 W/m-K
• Coeff. of Thermal Expansion (CTE): 6.4 to 8.4 µm/m-C
• MOR / Flexural Strength: 52,938.4463653769 psi
• Modulus of Elasticity: 44,961,420.2007311 psi

Description: DBC (Direct Bonded Copper) is comprised of an insulating layer of ceramic substrate such as Al2O3 (aluminum oxide) and AlN (aluminum nitride) and copper connections to ensure electrical conductivity at high temperatures. For maximum reliability and performance, modules must exhibit excellent

• Features: Alumina / Aluminum Oxide, Specialty Ceramic
• Specialty Ceramic Type: Aluminum Nitride
• Applications: Battery / Fuel Cell, Construction & Building / Architectural, Electrical / HV Parts, Electronics / RF-Microwave
• Performance Features: Metallized / Silvered (Electrode, Mirror)

Description: Ceramic substrates have following advantages: High thermal conductivity Excellent insulation properties High mechanical strength Excellent chemical stability Aluminum nitride ceramic substrates: Thermal conductivity > 200 W/m·K, thermal expansion coefficient matches that of silicon.

Description: CoorsTek developed the standards for thick-film ceramic substrates and continues to provide economical yet durable substrates for hybrid integrated circuits, surface mount devices, sensors, and other thick-film electronics. Why Ceramic Thick-Film Substrates? Alumina is

• Thermal Conductivity: 26 W/m-K
• Coeff. of Thermal Expansion (CTE): 6.4 to 8.2 µm/m-C
• MOR / Flexural Strength: 58,014.7357428788 psi
• Modulus of Elasticity: 48,007,193.8272322 psi

Description: Al2O3 substrates are now the most established ceramic substrates in terms of manufacturing and processing technology. Unipretec provides al2o3 substrates with alumina concentration of 96%. Due to their exceptional electrical, mechanical, and chemical properties, they are

• Density: 3.6999976648298842 g/cc
• Max Use / Curie Temperature: 1,500 to 1,650 C
• Dielectric Strength: 17,000,000 to 20,000,000 V/m
• Material Type: Alumina / Aluminum Oxide

Description: While the same design features common to alumina ceramics; blind holes, threads etc. are easily produced in Zirconia the grinding time required is about fifty percent more. The post-grinding surface finish is significantly better than a comparable feature in most aluminas. Zirconia is

• Density: 4.01 g/cc
• Max Use / Curie Temperature: 1,500 C
• Thermal Conductivity: 27 W/m-K
• Coeff. of Thermal Expansion (CTE): 8.3 µm/m-C

Description: Alumina is one of the most cost-effective and widely used engineering ceramic materials. The raw materials used to manufacture this high performance technical grade ceramic are readily available and reasonably priced, resulting in good value for money in fabricated alumina shapes. It

• Oxide Type: Alumina / Aluminum Oxide

Description: solutions. Good chemical stability of alumina leads to high corrosion resistance. 8. We support a variety of customized alumina ceramic parts base on customer's drawing, sample, or reference parameters The description of alumina ceramic pin : Alumina ceramic is one of

• Compressive / Crushing Strength: 362,592.0983929925 psi
• Material Type: Alumina / Aluminum Oxide
• Shape / Form: Rod Stock

Description: For our stock lengths of 24". Ceramic tubes and rods can be cut to shorter lengths. A dash number with the length is added to the above numbers to represent a cut length. (Ex. 960300-12 represents a 3/16" diameter x 12" long rod.)

• Length: 24 inch
• Diameter: 0.25 inch
• Width / O.D.: 0.25 inch
• Material Type: Alumina / Aluminum Oxide

Description: For our stock lengths of 24". Ceramic tubes and rods can be cut to shorter lengths. A dash number with the length is added to the above numbers to represent a cut length. (Ex. 960300-12 represents a 3/16" diameter x 12" long rod.)

• Bore Diameter (I.D.): 0.125 inch
• Length: 24 inch
• Diameter: 0.5 inch
• Width / O.D.: 0.5 inch

Description: substrate in China's market continues to rise. With its excellent performance, the market share of silicon nitride ceramic substrate is increasing. (1) Compared with alumina substrate or aluminum nitride substrate, it has more than twice the bending strength. (2)

• Density: 3.1999979803934133 g/cc
• Thermal Conductivity: 15 to 20 W/m-K
• MOR / Flexural Strength: 87,022.1036143182 psi
• Compressive / Crushing Strength: 362,592.0983929925 psi

Description: CoorsTek developed the standards for thick-film ceramic substrates and continues to provide economical yet durable substrates for hybrid integrated circuits, surface mount devices, sensors, and other thick-film electronics. Why Ceramic Thick-Film Substrates? Alumina is

• Thermal Conductivity: 31 W/m-K
• Coeff. of Thermal Expansion (CTE): 6.4 to 8 µm/m-C
• MOR / Flexural Strength: 63,816.2093171667 psi
• Modulus of Elasticity: 54,968,962.1163777 psi

Description: Benefits Stronger Bond Higher Precision at a Lower Cost Reduced Substrate Deformation Structure Great Ceramic has rich experience in milling, grinding and polishing precision (Advanced) ceramics and firing ceramics, which enables us to achieve: Provide customized service for surface

• Material Type: Alumina / Aluminum Oxide
• Applications: Electrical / HV Parts

Description: Rod Tolerance: 1/4" to 1":+1/16",-.000, Over 1": +1/8",-.000, Length: +1/4",-.000.

• Length: 12 inch
• Diameter: 1 inch
• Width / O.D.: 1 inch
• Material Type: Alumina / Aluminum Oxide