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  • High Strength Alumina Substrate
    Enhanced thermal shock resistance of 96% upgrade of alumina substrates
  • AMB Alumina Copper-Clad Plate
    Compared with traditional DBC substrate, ceramic substrate prepared by AMB technology not only has higher thermal conductivity, better copper layer bonding, but also has the advantages of lower thermal resistance, higher reliability. Alumina base plate is the most cost-effective AMB ceramic base
  • Characteristics and Application of 96% Alumina Ceramic Substrate
    96% alumina ceramic substrates are mainly used in high-power circuit substrates such as copper clad laminates, printers, LED lighting, communications, automobile chips and other electronic components.
  • Alumina Ceramic Substrate
    Ceramic substrates are the future of the power electronics industry, mainly due to the fact that utilization of ceramic substrates is part of ultimate solution to the increasingly serious heat dissipation and hermetic sealing problems of polymeric packaging materials.
  • Alumina-Zirconia Ceramic Substrates for Power Device Applications
    Substrates can be thinner by taking advantage of the High Strength, High Toughness properties of the material. With thinner substrates, thermal resistance in the thickness direction is less
  • 96% Alumina Multi-Layer Circuit Ceramic Substrate
    Features - Benefits of 96% Alumina + Pt Conductor. Very low Dielectric Loss compared to existing material. High Thermal Conductivity compared to existing material
  • Why Polish Ceramic Substrates?
    Alumina Oxide is one of the most cost-effective and widely used substrate materials in microelectronic applications. While many customers will be satisfied with an as-fired surface for their applications, there are four major benefits of ceramic substrate polishing
  • Market Trend Of Thin Film Ceramic Substrates
    ) or three-dimensional are considered thin-film ceramic substrates. They can be manufactured from a variety of materials, including Silicon Nitride, Aluminum Nitride, Beryllium Oxide, and Alumina. Because of thin-film ceramics' ability to transfer heat, electronics can use them as heat sinks.

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