Products & Services
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Supplier: DigiKey
Description: AMPLIFIER HEAT SINK FOR RF POWER
- Mounting: Adhesive / Tape
- Device: Passive Heat Sink
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Supplier: Fairview Microwave Inc.
Description: Fairview Microwave is a leading provider of high-quality RF and microwave components including adapters, connectors, attenuators, coaxial cables, terminations, and much more. Specializing in immediate product needs, we offer same-day shipping on thousands of in-stock items with no minimum
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Supplier: Fairview Microwave Inc.
Description: Fairview Microwave is a leading provider of high-quality RF and microwave components including adapters, connectors, attenuators, coaxial cables, terminations, and much more. Specializing in immediate product needs, we offer same-day shipping on thousands of in-stock items with no minimum
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Supplier: USUSTK LIMITED
Description: Application: Radio Frequency Power Amplifier
- Material: Aluminum
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Supplier: Fairview Microwave Inc.
Description: Fairview Microwave is a leading provider of high-quality RF and microwave components including adapters, connectors, attenuators, coaxial cables, terminations, and much more. Specializing in immediate product needs, we offer same-day shipping on thousands of in-stock items with no minimum
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Supplier: Fairview Microwave Inc.
Description: Fairview Microwave is a leading provider of high-quality RF and microwave components including adapters, connectors, attenuators, coaxial cables, terminations, and much more. Specializing in immediate product needs, we offer same-day shipping on thousands of in-stock items with no minimum
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Supplier: Richardson RFPD
Description: EMPHS is Richardson RFPD’s alternative solution to the Empower heatsink 8900-0414. This heatsink is designed to work with several Empower power amplifiers that can be found below.
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Supplier: Utmel Electronic Limited
Description: 3 CHANNEL, VIDEO AMPLIFIER, PSFM11, HEAT SINK, PLASTIC, TO-220, 11 PIN
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Supplier: Takachi Electronics Enclosure Co., Ltd.
Description: Aluminum enclosure equipped with a highly efficient heat-sink top cover. Suitable to be used as a fanless PC, power amplifier, power supply etc. where heat dissipation is required. Grooves for M3 sliding nut are built into the heat-sink top cover and bottom
- Length / Height: 2.362206 to 7.3622087 inch
- Width/Diameter: 3.17323006 to 5.5511841 inch
- Depth: 1.20866207 to 3.58661611 inch
- Material: Aluminum
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Supplier: Takachi Electronics Enclosure Co., Ltd.
Description: Equipped with flanged bracket for easy wall mounting. Aluminum enclosure equipped with a highly efficient heat-sink top cover. Suitable to be used as a fanless PC, embedded pc, amplifier, power supply etc. where heat dissipation is required. Available in 64 different
- Length / Height: 4.9212625 to 13.1102433 inch
- Width/Diameter: 7.34252365 to 9.1338632 inch
- Depth: 1.781497025 to 4.261813325 inch
- Material: Aluminum
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Supplier: Takachi Electronics Enclosure Co., Ltd.
Description: Aluminum enclosure equipped with a highly efficient heat-sink top cover. EMC shielding is achieved by having the unfinished internal parts of the enclosure, as well as the fabric-over-foam gasket, in contact with one another. Equipped with flanged bracket for easy wall mounting.
- Length / Height: 1.29133928 to 5.068900375 inch
- Width/Diameter: 3.17323006 to 11.31890375 inch
- Depth: 2.362206 to 15.1181184 inch
- Material: Aluminum
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Supplier: Quarktwin Technology Ltd.
Description: RF Amplifier IC CATV 40MHz ~ 1GHz 7-Pin Special with Heat Sink
- Features: Other
- Standards and Certifications: RoHS Compliant
- Package Type: SOT
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Supplier: Plansee SE
Description: conductivity and appropriate thermal expansion properties to dissipate heat reliably in electronic components. The diagram shows the generic structure of a hermetically sealed electronic package. We have the ideal material. Our MoCu and WCu composites and Mo/Cu laminates reliably dissipate
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Supplier: Biamp Systems, Ltd.
Description: channels and amplifiers: Device-to-Device 1:1 Dual 3:1 (VFOM-1 module required) 7:1 (VFOM-1 module required) LED Indication: Amplifier failure Clip present Fan stuck-rotor Heat sink temperature fault Signal peak Signal present Local non-volatile storage of emergency
- Power: 2,400.000000000002 watts
- Number of Channels: 8 #
- Type: Amplifier
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Supplier: Power Amp Design
Description: insulating substrate mounted to an integral heat sink and fan assembly. The resulting module is a small, high performance turn-key solution for many industrial applications. The PAD119-1 model is available without the heat sink and fan assembly for custom heat
- Supply Voltage (VS): 15 to 100 volts
- Input Offset Voltage (VOS): 1 to 5 millivolts
- Input Bias Current (IBIAS): 0.0001 µA
- Quiescent Current (IQ): 26,000 to 30,000 microamps
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Supplier: Radwell International
Description: DISCONTINUED BY MANUFACTURER, X-RAY DRIVER MODULE, PCB POWER AMPLIFIER, W/ HEAT SINK. FREE 2 YEAR RADWELL WARRANTY
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Supplier: Power Amp Design
Description: available without the heat sink and fan. LOW COST HIGH VOLTAGE- 500 VOLTS HIGH OUTPUT CURRENT- 1.5A 29 WATT DISSIPATION CAPABILITY 96 WATT OUTPUT CAPABILITY WIDE SUPPLY RANGE - ±15V - ±250V INTEGRATED HEAT SINK & FAN TEMPERATURE REPORTING OVER-TEMP SHUTDOWN RoHS COMPLIANT
- Supply Voltage (VS): 40 to 250 volts
- Input Offset Voltage (VOS): 1 to 3 millivolts
- Input Bias Current (IBIAS): 0.0001 µA
- Quiescent Current (IQ): 10,000 to 11,500 microamps
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Supplier: Power Amp Design
Description: a thermally conductive but electrically insulating metal substrate mounted to an integrated heat sink and fan assembly. No BeO is used in the PAD20. The PAD20-1 is also available without the integrated heat sink and fan for custom applications. LOW COST SMALL SIZE- 40mm
- Supply Voltage (VS): 15 to 75 volts
- Input Offset Voltage (VOS): 1 to 5 millivolts
- Input Bias Current (IBIAS): 0.0001 µA
- Quiescent Current (IQ): 10,000 to 12,000 microamps
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Supplier: Power Amp Design
Description: expensive hybrid components. Integrated passive heat sink cooling is included. User selectable external compensation tailors the amplifier’s response to the application requirements. A single resistor programs the current limit feature. The PAD196 is built on a thermally
- Supply Voltage (VS): 50 to 1,025 volts
- Input Offset Voltage (VOS): 0.5 to 3 millivolts
- Input Bias Current (IBIAS): 0.0001 µA
- Quiescent Current (IQ): 1,000.0000000000001 to 1,200 microamps
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Supplier: TRM International Ltd.
Description: TRM has a range of high quality amplifiers. TRM Amplifiers work in current mode (torque mode) where the input command voltage controls the output current (torque). The amplifier will adjust duty cycle to maintain the commanded current. This is the most common mode when an
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Supplier: TMP Pro Distribution
Description: The RMX Series amplifiers give you clean, dynamic power with the legendary QSC sound quality and reliability that pros depend on. The RMX Series deliver unmatched performance at a breakthrough price. The power supply is the heart of an amplifier, converting raw AC power from the wall
- Type: Amplifier
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Supplier: Richardson RFPD
Description: requiring 31 dBm of efficient PSAT.The ADPA7008 requires 1500 mA from a 5 V supply voltage (VDD).The RF input and outputs are internally matched and dc blocked forease of integration into higher level assemblies. The ADPA7008 ishoused in a 7 mm x 7 mm, ceramic leadless package with heat
- Frequency Range: 20,000 to 54,000 MHz
- Maximum Gain: 17.5 dB
- Output Power( P1dB): 30 dBm
- Minimum Operating Voltage: 5 volts
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Supplier: Visual Sound, Inc.
Description: working bands, club owners and churches. Design Focus: All CC Series amplifiers are built with tunnel-cooled heat sinks, variable-speed DC fans and extensive protection circuitry for superior efficiency into difficult loads and power conditions. In the Crest Audio tradition,
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Supplier: TMP Pro Distribution
Description: consumption without sacrificing sound quality. In fact, you get approximately 50% lower power consumption than conventional class-AB amplifiers while still benefiting from class-AB sound quality. This improved efficiency is also the key to reduced heat generation, longer component
- Type: Amplifier
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Supplier: TMP Pro Distribution
Description: consumption without sacrificing sound quality. In fact, you get approximately 50% lower power consumption than conventional class-AB amplifiers while still benefiting from class-AB sound quality. This improved efficiency is also the key to reduced heat generation, longer component
- Type: Amplifier
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Supplier: TMP Pro Distribution
Description: Connector, (Ch 1+2, 3+4, 5+6, 7+8) Output: Two 8-pin Euro-style detachable terminal blocks Cooling: Variable speed fan, rear-to-front airflow through tunnel heat sink Controls Front: AC switch, Ch 1, 2, 3, 4, 5, 6, 7 & 8 gain knobs Rear: DIP switches for Ch.1 - Ch.8, clip limiter
- Type: Amplifier
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Supplier: ROHM Semiconductor USA, LLC
Description: Inaddition, the IC is packaged in a compact reverse heatradiation type power package to achieve low powerconsumption and low heat generation and eliminatesnecessity of external heat-sink up to a total output powerof 30W. This product satisfies both needs for drasticdownsizing,
- Output Gain: 26 dB
- Power: 15.000000000000002 watts
- Type: Amplifier
- Amplifier Class: Class D
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Supplier: ROHM Semiconductor GmbH
Description: high efficiency. In addition, the IC is packaged in a compact back-surface heat-sink type power package to achieve low power consumption and low heat generation and to eliminate need for external heat-sink. With this package, total output power is only 34W as
- Output Gain: 26 dB
- Power: 16.999999999999968 watts
- Type: Amplifier
- Amplifier Class: Class D
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Supplier: ROHM Semiconductor USA, LLC
Description: high efficiency. In addition, the IC is packaged in a compact back-surface heat-sink type power package to achieve low power consumption and low heat generation and to eliminate need for external heat-sink. With this package, total output power is only 34W as
- Power: 20 watts
- Type: Amplifier
- Amplifier Class: Class D
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Supplier: NuWaves Ltd.
Description: The NuPower™ 12A01A L- & S-Band Power Amplifier is a small, highly efficient solid-state power amplifier module that provides 4 watts of linear RF power to boost performance of data links and transmitters. Based on the latest gallium nitride (GaN) technology, this broadband linear RF
- Frequency Range: 1,000 to 2,500 MHz
- Minimum Gain: 40 dB
- Maximum Gain: 40 dB
- Output Power( P1dB): 36.020599913279625 dBm
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Supplier: Krohn-Hite Corporation
Description: variable from 0V to ±200V; an optional meter package that provides a meter for displaying the heat sink temperature in °C, output peak voltage and average output current.
- Maximum Output: 141 volts
- Input Impedance: 1 Mohms
- Common Mode Rejection Ratio: 80 dB
- Operating Temperature: 32 to 113 F
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Supplier: Performance Motion Devices
Description: Atlas® Amplifier Developer Kits are hardware boards that allow designers to connect Atlas amplifiers to PMD Magellan motion control IC developer kits such as the DK58113 or DK58420 developer kits, or to user-designed boards with Magellan ICs or with a motion controller of their own
- Category: Development Suite / Kit
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Supplier: Mini-Circuits
Description: This ruggedized High Power Amplifier is capable of delivering 30W output signals across its entire operating bandwidth, from 0.1-200 MHz. Extensive safety features to prevent amplifier damage include over-temperature protection and the ability to handle short and open loads. The
- Operating Temperature: -10 to 50 C
- Nominal Impedance: 50 Ohms
- Package Type: Connectorized
- Amplifier Type: Power Amplifier
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Supplier: Wolfspeed
Description: in a small footprint. Available in die and a screw-down package featuring a copper-tungsten heat sink.
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Supplier: Mini-Circuits
Description: ZVA-183W-S+ is a Class-A, four stage, unconditionally stable amplifier. It features a ruggedized case, available with and without a heat sink/fan, and has the capability to withstand accidental open or short at output and is protected against reverse bias protection for added
- Minimum Operating Voltage: 18 volts
- Maximum Operating Voltage: 18 volts
- Operating Temperature: -55 to 85 C
- Nominal Impedance: 50 Ohms
Find Suppliers by Category Top
Featured Products Top
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-generating components and heat sinks, reducing air pockets and improving heat transfer efficiency. In AI smart speakers, they help manage heat from chips, amplifiers, and memory modules in tight internal spaces. In (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
required to power operational amplifiers and related circuits. They may be mounted directly on printed circuit board assemblies, simplifying system layout and minimizing the connectors and wiring required. May be used in series.No derating or heat sinking required.Short circuit protected. 6. Mini (read more)
Browse Linear Power Supplies Datasheets for Acopian Power Supplies -
due to their outstanding thermal conductivity and protective properties. Enhancement of Thermal Conductivity Efficiency Thermal potting compounds are primarily used to fill the gap between the chip and the heat sink in RF modules. These compounds create a (read more)
Browse Silicone Adhesives and Sealants Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
. Size and Weight Linear Power Supplies: Larger and heavier due to the bulky transformers and heat sinks needed to dissipate heat. Switching Power Supplies: Smaller and lighter because they use high (read more)
Browse Power Supplies Datasheets for Uni-Trend US
Conduct Research Top
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AN-14 Cooling Power Op Amps
The article outlines the advantages of active cooling as compared to passive heat sinks in reducing the volume and weight of power op amps in industrial applications. The relative reliability of passive vs. active cooling is summarized. The advantages of pre-assembled amplifier and heat sink
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Cooling Power Op Amps
The article outlines the advantages of active cooling as compared to passive heat sinks in reducing the volume and weight of power op amps in industrial applications. The relative reliability of passive vs. active cooling is summarized. The advantages of pre-assembled amplifier and heat sink
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Air Cooled Heat Pipe Assembly (.pdf)
The following photos of a complex heat sink assembly demonstrate a wide variety of high technology cooling solutions. This cooler for an RF power amplifier is capable of dissipating many hundreds of Watts of power at a thermal resistance of less than 0.02 C/W in high-speed, forced airflow. It uses
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AN-20 Beginner's Guide to PAD Power
The article provides a step by step guide for beginners using the PAD Power spread sheet, based on Excel, for analyzing power amplifier. application circuits for reliability in terms of output transistor junction temperature and heat sink temperature. Some knowledge of the Excel spread sheet
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Electrical Considerations of Fan Cooling
The article covers the electrical considerations for connecting the cooling fan of Power Amp Design power op amps to the signal circuits. All of the power op amps currently produced by Power Amp Design rely on an integrated heat sink and fan to provide adequate cooling for the amplifier
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Beginner's Guide to PAD Power
The article provides a step by step guide for beginners using the PAD Power spread sheet, based on Excel, for analyzing power amplifier application circuits for reliability in terms of output transistor junction temperature and heat sink temperature. Some knowledge of the Excel spread sheet
More Information Top
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Uncooled mini-DIL module for 980-nm pump lasers
Traditionally, laser modules are mounted to amplifier heat sinks using mechanical fasteners to sandwich a thermal interface material between the package base and the heat sink.
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Cooling problems and thermal issues in high power electronics - a multi faceted design approach
Numerical evaluation of high power amplifier heat sink design options", Proc .
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MAARSY: The new MST radar on Andøya—System description and first results
In addition to those items mentioned previously, additional information such as high voltage sta- tus, power amplifier heat sink temperature, load impedance, fuse status, and DDS “lock” status are all collated and logged.
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http://dspace.mit.edu/bitstream/handle/1721.1/36714/77561330-MIT.pdf?sequence=2
The amplifier heat sink was first cut to size with a bandsaw and finished with an endmill.
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Preflight cross-calibration radiometer for EOS AM-1 platform visible and near-IR sources
The data from the radiometer include the analog output voltage from the amplifier, the analog temperature outputs from the sensors mounted to the detector and the amplifier heat sink , the "instrument" temperature, and the temperature of the filter housing.
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Lighting&Sound America Volume 12 Issue 2 February 2015
Other than a computer, all that’s needed is a wired or wireless Ethernet connection: SystemVUE provides the ability to monitor the amplifier heat sink temperature, limiting and protection as well as provid- ing alerts to fault conditions.
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HANDBOOK OF BIOMEDICAL INSTRUMENTATION, THIRD EDITION > Instruments for Surgery
A thermostat is sometimes mounted on the power amplifier heat sink .
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On the class‐F power amplifier design
… the drain voltage waveform is near zero and no drain current flows for high drain voltages: in this way the dissipated power on the device is efficiently minimized, allowing a reduction in the size and weight of the power- amplifier heat sinks .
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http://dspace.mit.edu/bitstream/handle/1721.1/61204/701106859-MIT.pdf?sequence=2
Put the amplifier heat sinks in the box so they don't radiate around the whole room.
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http://dspace.mit.edu/bitstream/handle/1721.1/42699/38043426-MIT.pdf?sequence=2
This board lies between the analog controller circuit boards and the actual power amplifier heat sinks at the back.
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