Products & Services
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Supplier: DigiKey
Description: AMPLIFIER HEAT SINK FOR MOST RF
- Device: Passive Heat Sink
- Mounting: Adhesive / Tape
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Supplier: DigiKey
Description: AMPLIFIER HEAT SINK FOR RF POWER
- Device: Passive Heat Sink
- Mounting: Adhesive / Tape
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Supplier: DigiKey
Description: AMPLIFIER HEAT SINK WITH FAN FOR
- Device: Passive Heat Sink
- Mounting: Mounting Holes, Adhesive / Tape
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Supplier: Plansee SE
Description: and Mo/Cu laminates reliably dissipate heat in electronic components and provide cooling of components such as high-power transistors, for instance IGBT modules or RF amplifiers, as well as LED chips. Our materials combine the low thermal expansion of molybdenum and tungsten with the
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Supplier: DigiKey
Description: HEATSINK FOR AMPLIFIER MODELS FM
- Device: Passive Heat Sink
- Material: Aluminum
- Mounting: Mounting Holes
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Supplier: Richardson RFPD
Description: EMPHS is Richardson RFPD’s alternative solution to the Empower heatsink 8900-0414. This heatsink is designed to work with several Empower power amplifiers that can be found below.
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Supplier: Fairview Microwave Inc.
Description: Fairview Microwave is a leading provider of high-quality RF and microwave components including adapters, connectors, attenuators, coaxial cables, terminations, and much more. Specializing in immediate product needs, we offer same-day shipping on thousands of in-stock items with no minimum purchasing
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Supplier: Fairview Microwave Inc.
Description: Fairview Microwave is a leading provider of high-quality RF and microwave components including adapters, connectors, attenuators, coaxial cables, terminations, and much more. Specializing in immediate product needs, we offer same-day shipping on thousands of in-stock items with no minimum purchasing
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Supplier: Fairview Microwave Inc.
Description: Fairview Microwave is a leading provider of high-quality RF and microwave components including adapters, connectors, attenuators, coaxial cables, terminations, and much more. Specializing in immediate product needs, we offer same-day shipping on thousands of in-stock items with no minimum purchasing
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Supplier: Fairview Microwave Inc.
Description: Fairview Microwave is a leading provider of high-quality RF and microwave components including adapters, connectors, attenuators, coaxial cables, terminations, and much more. Specializing in immediate product needs, we offer same-day shipping on thousands of in-stock items with no minimum purchasing
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Supplier: Utmel Electronic Limited
Description: 3 CHANNEL, VIDEO AMPLIFIER, PSFM11, HEAT SINK, PLASTIC, TO-220, 11 PIN
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Supplier: Takachi Electronics Enclosure Co., Ltd.
Description: Aluminum enclosure equipped with a highly efficient heat-sink top cover. Suitable to be used as a fan less PC, embedded pc, power amplifier, power supply etc. where heat dissipation is required. Grooves for M3 sliding nut are built into the heat-sink top cover and bottom
- Depth: 1.21 to 3.59 inch
- Length / Height: 2.36 to 7.36 inch
- Material: Aluminum
- Mounting Type: Desktop
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Supplier: Takachi Electronics Enclosure Co., Ltd.
Description: Equipped with flanged bracket for easy wall mounting. Enclosure equipped with a highly efficient heat-sink top cover. Suitable to be used as a fan less PC, embedded pc, amplifier, power supply etc. where heat dissipation is required. Available in 28 different sizes and 4 color
- Depth: 1.78 to 4.26 inch
- Length / Height: 4.92 to 13.11 inch
- Material: Aluminum
- Mounting Type: Wall Mount
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Supplier: Takachi Electronics Enclosure Co., Ltd.
Description: Aluminum case with heat dissipating heat-sink cover for superior cooling effect. Manufactured with mounting flange for easy attachment onto walls and other surfaces. Suitable for audio amplifiers, power supply units, or embedded systems, etc. 3 different sizes in silver and
- Depth: 1.99 inch
- Length / Height: 6.3 to 11.81 inch
- Material: Aluminum
- Mounting: Wall Mount
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Supplier: Biamp Systems, Ltd.
Description: Indication: Amplifier failure Clip present Fan stuck-rotor Heat sink temperature fault Signal peak Signal present Local non-volatile storage of emergency messages Software
- Number of Channels: 8 #
- Power: 2400 watts
- Type: Amplifier
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Supplier: Takachi Electronics Enclosure Co., Ltd.
Description: Extruded aluminum enclosure with heat-sink sides. Silver anodized end panels makes for a luxurious finish. Conductivity is achieved by utilizing the contact between the unfinished end panels side, and the unfinished ends of the frame. PCB or mounting plate can be horizontally mounted
- Depth: 1.26 to 3.23 inch
- Length / Height: 2.09 to 11.57 inch
- Material: Aluminum
- Mounting Type: Desktop
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Supplier: Biamp Systems, Ltd.
Description: Clip present Fan stuck-rotor Heat sink temperature fault Signal peak Signal present Local non-volatile storage of emergency messages Software Monitoring Features: Amplifier failure
- Number of Channels: 8 #
- Power: 2400 watts
- Type: Amplifier
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Supplier: TMP Pro Distribution
Description: , and EEEngine technology further reduces power consumption without sacrificing sound quality. In fact, you get approximately 50% lower power consumption than conventional class-AB amplifiers while still benefiting from class-AB sound quality. This improved efficiency is also the key to
- Type: Amplifier
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Supplier: TMP Pro Distribution
Description: , and EEEngine technology further reduces power consumption without sacrificing sound quality. In fact, you get approximately 50% lower power consumption than conventional class-AB amplifiers while still benefiting from class-AB sound quality. This improved efficiency is also the key to
- Type: Amplifier
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Supplier: TMP Pro Distribution
Description: ohm speaker loads. RMX amplifiers deliver true studio-quality sound. A full complementary output circuit using the highest-grade linear output devices delivers ultra-low distortion (<0.05% THD) and a ruler-flat frequency response. SMT (Surface Mount Technology) triples small-signal component
- Type: Amplifier
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Supplier: TMP Pro Distribution
Description: ohm speaker loads. RMX amplifiers deliver true studio-quality sound. A full complementary output circuit using the highest-grade linear output devices delivers ultra-low distortion (<0.05% THD) and a ruler-flat frequency response. SMT (Surface Mount Technology) triples small-signal component
- Type: Amplifier
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Supplier: ROHM Semiconductor USA, LLC
Description: heat generation and eliminates necessity of external heat-sink up to a total output power of 40W. This product satisfies both needs for drastic downsizing, low-profile structures and many function, high quality playback of sound system.
- Power: 20 watts
- Type: Amplifier
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Supplier: ROHM Semiconductor GmbH
Description: back surface heatsink type power package to attain low power consumption, low heat generation without external heatsink. The package Max output power is only 17W+17W (When RL=8O) as compared to 20W+20W (When RL=8O) Max output power of package with external heat-sink. The product
- Power: 20 watts
- Type: Amplifier
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Supplier: ROHM Semiconductor USA, LLC
Description: surface heatsink type power package to attain low power consumption, low heat generation without external heatsink. The package Max output power is only 17W+17W (When RL=8O) as compared to 20W+20W (When RL=8O) Max output power of package with external heat-sink. The product satisfies
- Power: 20 watts
- Type: Amplifier
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Supplier: Richardson RFPD
Description: The MAMG-100227-010C0L is a broadband two-stage GaN-on-Si hybrid power amplifier module in an air-cavity laminate package. A gold-plated copper heat sink is attached to the bottom side of the laminate substrate. The package can be accessed from the top or the bottom allowing for
- Amplifier Type: Power Amplifier
- Frequency Range: 225 to 2600 MHz
- Maximum Gain: 23 dB
- Maximum Operating Voltage: 28 volts
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Supplier: Quarktwin Technology Ltd.
Description: RF Amplifier IC CATV 40MHz ~ 870MHz 7-Pin Special with Heat Sink
- Package Type: SOT, Other
- RoHS Compliant: Yes
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Supplier: Quarktwin Technology Ltd.
Description: RF Amplifier IC CATV 40MHz ~ 1GHz 7-Pin Special with Heat Sink
- Package Type: SOT, Other
- RoHS Compliant: Yes
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Supplier: Richardson RFPD
Description: thermal conductivity. GaN HEMTs also offer greater power density and wider bandwidths compared to Si and GaAs transistors. This MMIC employs a distributed (traveling-wave) amplifier design approach, enabling extremely wide bandwidths to be achieved in a small footprint screw-down package
- Amplifier Type: Power Amplifier
- Frequency Range: 20 to 6000 MHz
- Maximum Gain: 17 dB
- Maximum Operating Voltage: 28 volts
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Supplier: Richardson RFPD
Description: thermal conductivity. GaN HEMTs also offer greater power density and wider bandwidths compared to Si and GaAs transistors. This MMIC contains a two-stage reactively matched amplifier enabling very wide bandwidths to be achieved in a small footprint screw-down package featuring a
- Amplifier Type: Power Amplifier
- Frequency Range: 2000 to 6000 MHz
- Maximum Gain: 28.8 dB
- Maximum Operating Voltage: 32 volts
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Supplier: Power Amp Design
Description: expensive hybrid components. Integrated passive heat sink cooling is included. User selectable external compensation tailors the amplifier’s response to the application requirements. A single resistor programs the current limit feature. The PAD196 is built on a thermally
- Device Type: Operational Amplifiers, Power Operational Amplifiers
- Operating Range: Commercial, Industrial, Medical
- RoHS Compliant: Yes
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Supplier: Power Amp Design
Description: outperforms the more expensive hybrid amplifiers. Integrated heat sink and fan cooling is included. User selectable external compensation tailors the amplifier’s response to application requirements. The PAD183 is built on a thermally conductive but electrically
- Device Type: Operational Amplifiers, Power Operational Amplifiers
- Operating Range: Commercial, Industrial, Medical
- RoHS Compliant: Yes
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Supplier: Power Amp Design
Description: electrically insulating substrate mounted to an integrated heat sink and fan assembly. No BeO is used in the amplifier. The resulting module is a small, high performance turn-key solution for many industrial applications. LOW COST RAIL TO RAIL INPUT & OUTPUT (RRIO)
- Device Type: Operational Amplifiers, Power Operational Amplifiers
- Operating Range: Commercial, Industrial, Medical
- RoHS Compliant: Yes
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Supplier: Power Amp Design
Description: insulating substrate mounted to an integral heat sink and fan assembly. The resulting module is a small, high performance turn-key solution for many industrial applications. The PAD119-1 model is available without the heat sink and fan assembly for custom heat
- Device Type: Operational Amplifiers, Power Operational Amplifiers
- Operating Range: Commercial, Industrial, Medical
- RoHS Compliant: Yes
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Supplier: Radwell International
Description: DISCONTINUED BY MANUFACTURER, X-RAY DRIVER MODULE, PCB POWER AMPLIFIER, W/ HEAT SINK. FREE 2 YEAR RADWELL WARRANTY
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Supplier: Visual Sound, Inc.
Description: mobile DJs, working bands, club owners and churches. Design Focus: All CC Series amplifiers are built with tunnel-cooled heat sinks, variable-speed DC fans and extensive protection circuitry for superior efficiency into difficult loads and power conditions. In the Crest Audio
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For efficient cooling of your electronic CPU, amplifier boards, and routing components, opt for our custom aluminum heat sink. The integrated thermal paste and aluminum block ensure superior heat dissipation, protecting your devices from overheating. Whether you need a specific size, shape, or configuration, our heat sink can be tailored to your unique requirements. Trust our customizable solution for long-lasting thermal management. (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
-generating components and heat sinks, reducing air pockets and improving heat transfer efficiency. In AI smart speakers, they help manage heat from chips, amplifiers, and memory modules in tight internal spaces. In (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
required to power operational amplifiers and related circuits. They may be mounted directly on printed circuit board assemblies, simplifying system layout and minimizing the connectors and wiring required. May be used in series.No derating or heat sinking required.Short circuit protected. 6. Mini (read more)
Browse Linear Power Supplies Datasheets for Acopian Power Supplies -
due to their outstanding thermal conductivity and protective properties. Enhancement of Thermal Conductivity Efficiency Thermal potting compounds are primarily used to fill the gap between the chip and the heat sink in RF modules. These compounds create a (read more)
Browse Silicone Adhesives and Sealants Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
. Size and Weight Linear Power Supplies: Larger and heavier due to the bulky transformers and heat sinks needed to dissipate heat. Switching Power Supplies: Smaller and lighter because they use high (read more)
Browse Power Supplies Datasheets for Uni-Trend US -
Higher heat dissipation, may need Heat Sinks Lower heat dissipation, more efficient overall Size Compact, suitable for small, low-power devices (read more)
Browse General Purpose Diodes Datasheets for ODG (Origin Data Global)
Conduct Research Top
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AN-14 Cooling Power Op Amps
The article outlines the advantages of active cooling as compared to passive heat sinks in reducing the volume and weight of power op amps in industrial applications. The relative reliability of passive vs. active cooling is summarized. The advantages of pre-assembled amplifier and heat sink
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Cooling Power Op Amps
The article outlines the advantages of active cooling as compared to passive heat sinks in reducing the volume and weight of power op amps in industrial applications. The relative reliability of passive vs. active cooling is summarized. The advantages of pre-assembled amplifier and heat sink
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Air Cooled Heat Pipe Assembly (.pdf)
The following photos of a complex heat sink assembly demonstrate a wide variety of high technology cooling solutions. This cooler for an RF power amplifier is capable of dissipating many hundreds of Watts of power at a thermal resistance of less than 0.02 C/W in high-speed, forced airflow. It uses
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AN-20 Beginner's Guide to PAD Power
The article provides a step by step guide for beginners using the PAD Power spread sheet, based on Excel, for analyzing power amplifier. application circuits for reliability in terms of output transistor junction temperature and heat sink temperature. Some knowledge of the Excel spread sheet
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Electrical Considerations of Fan Cooling
The article covers the electrical considerations for connecting the cooling fan of Power Amp Design power op amps to the signal circuits. All of the power op amps currently produced by Power Amp Design rely on an integrated heat sink and fan to provide adequate cooling for the amplifier
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Beginner's Guide to PAD Power
The article provides a step by step guide for beginners using the PAD Power spread sheet, based on Excel, for analyzing power amplifier application circuits for reliability in terms of output transistor junction temperature and heat sink temperature. Some knowledge of the Excel spread sheet
More Information Top
Indicates content that may require registration and/or purchase.
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Uncooled mini-DIL module for 980-nm pump lasers
Traditionally, laser modules are mounted to amplifier heat sinks using mechanical fasteners to sandwich a thermal interface material between the package base and the heat sink.
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Cooling problems and thermal issues in high power electronics - a multi faceted design approach
Numerical evaluation of high power amplifier heat sink design options", Proc .
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MAARSY: The new MST radar on Andøya—System description and first results
In addition to those items mentioned previously, additional information such as high voltage sta- tus, power amplifier heat sink temperature, load impedance, fuse status, and DDS “lock” status are all collated and logged.
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http://dspace.mit.edu/bitstream/handle/1721.1/36714/77561330-MIT.pdf?sequence=2
The amplifier heat sink was first cut to size with a bandsaw and finished with an endmill.
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Preflight cross-calibration radiometer for EOS AM-1 platform visible and near-IR sources
The data from the radiometer include the analog output voltage from the amplifier, the analog temperature outputs from the sensors mounted to the detector and the amplifier heat sink , the "instrument" temperature, and the temperature of the filter housing.
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Lighting&Sound America Volume 12 Issue 2 February 2015
Other than a computer, all that’s needed is a wired or wireless Ethernet connection: SystemVUE provides the ability to monitor the amplifier heat sink temperature, limiting and protection as well as provid- ing alerts to fault conditions.
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HANDBOOK OF BIOMEDICAL INSTRUMENTATION, THIRD EDITION > Instruments for Surgery
A thermostat is sometimes mounted on the power amplifier heat sink .
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On the class‐F power amplifier design
… the drain voltage waveform is near zero and no drain current flows for high drain voltages: in this way the dissipated power on the device is efficiently minimized, allowing a reduction in the size and weight of the power- amplifier heat sinks .
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http://dspace.mit.edu/bitstream/handle/1721.1/61204/701106859-MIT.pdf?sequence=2
Put the amplifier heat sinks in the box so they don't radiate around the whole room.
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http://dspace.mit.edu/bitstream/handle/1721.1/42699/38043426-MIT.pdf?sequence=2
This board lies between the analog controller circuit boards and the actual power amplifier heat sinks at the back.