Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: SAE International
Description: This document contains information and guidance on the use of Pb-free ball grid arrays (BGAs) in an aerospace, defense, and high performance (ADHP) product, or other products which demand a high reliability.
-
Supplier: Accuris
Description: Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder
-
Description: IEC TS 62647-4:2018(E) defines the requirements for replacing solder balls on ball grid array (BGA) component packages in the context of an electronic components management plan (ECMP) for aerospace, defence and high reliability products. The intent of this
-
-
Supplier: Accuris
Description: Process management for avionics \x96 Aerospace and defence electronic systems containing lead-free solder Part 4: Ball grid array (BGA) re-balling
-
Supplier: Accuris
Description: Process management for avionics \x96 Aerospace and defence electronic systems containing lead-free solder \x96 Part 4: Ball grid array (BGA) re-balling
-
Supplier: CSA Group
Description: IEC TS 62647-4:2018(E) defines the requirements for replacing solder balls on ball grid array (BGA) component packages in the context of an electronic components management plan (ECMP) for aerospace, defence and high reliability products. The intent of this
-
Supplier: Indium Corporation
Description: Features Suitable for Pin-Grid Array and standard Ball Grid Array applications Airless Packaging Excellent solderability to all common surface metallizations No-clean residue Can be used for printing, dipping, and pin transfer deposition
- Approvals / Conformance: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
-
Supplier: Indium Corporation
Description: Features Halogen-free, no-clean residue Suitable for pin-grid array and standard ball-grid array applications Airless packaging Excellent solderability to all common surface metallizations Can be used for printing, dipping, pin transfer deposition
- Approvals / Conformance: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
-
Supplier: Henkel Corporation - Industrial
Description: cavity or potting dam is required for flow control. LOCTITE ECCOBOND FP4802 is suitable for bare chip protection of a variety of advanced packages, such as Ball Grid Arrays (BGA’s), Chip Scale Packages (CSP’s), Plastic Ball Grid Arrays (PBGA’s), and full
- Coeff. of Thermal Expansion (CTE): 11.11 µin/in-F
- Viscosity: 80000 cP
-
Supplier: Boyd
Description: Aavid provides the broadest product line of heat sinks and thermal solutions for cooling integrated circuits such as Field Programmable Grid Arrays (FPGAs) and the surface mount packaging used for integrated circuits like Ball Grid Arrays (BGAs). Choose from a
- Device: Active Heat Sink
-
Supplier: Cal Quality Electronics, Inc.
Description: the following SMT assembly capabilities: AOI (Automated Optical Inspection) BGA (Ball Grid Array) X-Ray Inspection Micro BGA X-Ray Inspection 0201 Chip Placement Fine Pitch Selective Soldering Through Hole Assembly
- Location: North America, United States Only, Southwest US Only
- Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, Optoelectronic Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
- Material Acquisition: Customer Supplied, Vendor Supplied
- Production Capabilities: Prototype / Low Volume, Mid Volume, High Volume, Quick Turn, Cabling
-
Supplier: RS Components, Ltd.
Description: The Gig-Array® connector is a high speed BGA mezzanine system designed to meet the needs of up to 10 Gb/s. Ball Grid Array (BGA) termination for process friendly attachment. 1mm x 0.65 mm BGA interface pitch optimizes routing and electrical performance. Stack heights
- Current Rating: 1 amps
- Gender: Female / Jack
- Geometry: Straight
- Voltage Rating: 500 volts
-
Supplier: Cal Quality Electronics, Inc.
Description: the following SMT assembly capabilities: AOI (Automated Optical Inspection) BGA (Ball Grid Array) X-Ray Inspection Micro BGA X-Ray Inspection 0201 Chip Placement Fine Pitch Selective Soldering Through Hole Assembly
- Capabilities: Total Manufacturing, Testing and Evaluation, Prototyping, Just-In-Time Capability
- Industry Served: Aerospace / Military, Automotive, Commercial, Computer / Networking, Consumer Electronics / Appliances, Industrial Automation, Medical, Telecommunications
- Location: North America, United States Only, Southwest US Only
-
Supplier: Samsung Electro-Mechanics
Description: Grid Array 3) FCBGA : Flip Chip BGA Quality Has durability against repetitive flexing Folder Type: 100,000 times Slider Type: 200,000 times Ideal assembly process with high reliability Able to perform continuous production. Folder Type: 100,000 times Slider Type: 200,000 times
Find Suppliers by Category Top
Featured Products Top
-
performance - achieving IPC Class III voiding on ball grid arrays (BGAs) and less than 10% average voiding on bottom-terminated components, enhancing thermal and electrical integrity in demanding assembly environments. Thermal and Environmental Protection for Demanding (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
to process a single wafer or are looking for a source to provide recurring production services, Micross AIT has a wide array of WLP technologies. WLCSP ball place, electroplated C4, and Cu pillar bumping with bump diameters as small as 25 microns Bump-on-pad and (read more)
Browse IC Interfaces Datasheets for Micross Components, Inc. -
ball grid array (BGA) package of the AD4854 includes all critical power supply and reference bypass capacitors, minimizing the full solution footprint and component count, as well as reducing sensitivity to the application printed circuit board (PCB) layout. The AD4854 operates over an extended (read more)
Browse Analog-to-Digital Converter (ADC) Chips Datasheets for DigiKey -
(CDIP) -Ceramic Flat Pack /Ceramic Quad Flat Pack (CFP/CQFP) -Ceramic Quad Flat Non -leded Package?CQFN) -Ceramic Pin Grid Array (CPGA) -Ceramic Small Outline Package (CSOP) -Ceramic Leadless Chip Carrier (CLCC) Technical advantages (read more)
Browse Glass Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd.
Conduct Research Top
-
Unique Application of Solder Ball Technology on QFP Pads Improves Processing Reliability
challenges associated with QFP packages such as non-coplanar leads "lifting" after reflow, opened the door for newer, high density packages, such as Ball Grid Array (BGA), that are ultimately more cost effective and process friendly.
More Information Top
Indicates content that may require registration and/or purchase.
-
Structural Dynamics of Electronic and Photonic Systems
Wong, T. E., Palmieri, F. W., and Kachatorian, L. A., “Experimentally Validated Vibration Fatigue Life Prediction Model for Ball Grid Array Solder Joint,” in G. J. Kowalski et al (Eds.), Packaging of Electronic and Photonic Devices , EEP-Vol.
-
Finite element analysis and simulation of adhesive bonding, soldering and brazing—an addendum: a bibliography (1996–2002)
Austin, 1996) pp 129–35 Jung W et al 1996 Nonlinear analysis of full-matrix and perimeter plastic ball grid array solder joints 1996 ASME Int.
-
Lead-free Solders: Materials Reliability for Electronics
(2004) Quantitative metallography of b-Sn dendrites in Sn-3.8Ag-0.7Cu ball grid array solder balls via electron backscatter diffraction and polarized light microscopy.
-
Reliability of RoHS-Compliant 2D and 3D IC Interconnects > Notes on Failure Criteria
Lau, J. H., “Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints,” ASME Transactions, Journal of Electronic Packaging, September 1997, pp. 163–170.
-
2010 Index IEEE Transactions on Device and Materials Reliability Vol. 10
Ball Grid Array Solder Joint Relia- bility Under System-Level Compressive Load; TDMR Sept. 2010 324-337 Christian, B., see Varkey, B., TDMR Sept. 2010 353-359 Chuvilin, A., see Maier, D., TDMR Dec. 2010 427-436 Claeys, C., see Griffoni, A …
-
Soldering: Understanding the Basics
Khan, Ball Grid Array Soldering , Assembly, Jan 25, 2008, p 4–9, http://www.assemblymag.com/articles/print/85323-ball-grid-array- soldering, accessed June 27, 2013 .
-
Reliability behavior of lead-free solder joints in electronic components
Shin [131] predicted the thermal fatigue life of a lBGA (Micro Ball Grid Array ) solder joints based on Engelmaier fatigue life equation.
-
Effect of chip dimension and substrate thickness on the solder joint reliability of plastic ball grid array packages - HKUST Institutional Repository
• Design for plastic ball grid array solder joint reliability .