Products & Services
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Supplier: Infineon Technologies AG
Description: Smart Payment Accessory ready-to-use solution for wearables and stickers
- Type: Contactless
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Supplier: Infineon Technologies AG
Description: dual interface module 6 contacts
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Supplier: Infineon Technologies AG
Description: dual interface module 8 contacts
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Supplier: Infineon Technologies AG
Description: ultrathin contactless module with inductive coupling
- Type: Contactless
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Supplier: Associated Pacific Machine Corp.
Description: extraction Numerically controlled 3-axis dispensor system for precision dosing glue on milled cavity Dot test using a CCD camera for the glue Automatic chip module spooler, puncher and handler Implanting of the chip module in the cavity Bonding of the chip to the
- Number of Axes: 3-axis
- Features: Machine Enclosure / Guarding, Multiple Spindles, Other
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Supplier: TOP-electronics USA
Description: Quectel SC20-A Multi-mode Smart LTE Module with Wi-Fi and Bluetooth, 8GB memory SC20 is Quectel's new generation of multi-mode Smart LTE Cat 4 module with built-in Android OS. It contains seven variants: SC20-CE, SC20-E, SC20-A, SC20-AU, SC20-J, SC20-EU* and Wi-Fi & BT
- Technology: Bluetooth
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Supplier: Quarktwin Technology Ltd.
Description: IC MOA4, Smart Card Module
- Features: Other, RoHS Compliant
- Device Type: Receiver
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Supplier: DigiKey
Description: RFID Transponder IC 13.56MHz MOA8, Smart Card Module
- Frequency: 13,560,000 Hz
- Operating Temperature: -25 to 70 C
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Supplier: Win Source Electronics
Description: Manufacturer: Linear Technology Win Source Part Number: 020668-LTC4555EUD#PBF Packaging: Tube/Rail RF Type: Cellular Secondary Attributes: SIM and Smart Card Interface Categories: RF/IF and RFID Status: Active Case / Package: 16-QFN-EP (3x3) Purpose: Power Management, Signal Level
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Supplier: Win Source Electronics
Description: Manufacturer: Linear Technology Win Source Part Number: 117299-LTC4555EUD#TRPBF Packaging: Reel - TR RF Type: Cellular Secondary Attributes: SIM and Smart Card Interface Categories: RF/IF and RFID Status: Active Case / Package: 16-QFN-EP (3x3) Purpose: Power Management, Signal Level
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Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL EO7021 ) LOCTITE EO7021 is an encapsulant for use in smart card chip module applications. It is also suitable for die attach automated reel-to-reel processing.
- Industry: Electronics (PCB / SMT Assembly)
- Form / Function: Glob Top / Daub
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Supplier: Telit IoT Solutions, Inc.
Description: The CE910-SC is a single-band 800MHz CDMA 1xRTT wireless module. It is specifically designed for the Chinese CDMA market and other APAC networks requiring R-UIM card technology. Its compact LGA form factor is pin-to-pin compatible with the xE910 family, allowing re-use of the
- Operating Frequency: 800 MHz
- Data Rate: 153.6 kbps
- Bias / Operating Current: 1.1 to 750 mA
- TJ: -40 to 85 C
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Supplier: Win Source Electronics
Description: Manufacturer: Linear Technology Win Source Part Number: 747013-LTC4558EUD#PBF Packaging: Tube Package: 20-WFQFN Exposed Pad Function: Power Management, Signal Level Translation RF Type: Cellular, 3G, GSM Secondary Attributes: SIM and Smart Card Interface Family Name: LTC4558
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Supplier: TOP-electronics USA
Description: Quectel BG96-GG, LTE Cat.M1/NB1 and EGPRS Mini PCIe Module with embedded GNSS BG96 is a series of LTE Cat M1/Cat NB1/EGPRS module offering a maximum data rate of 375Kbps downlink and 375Kbps uplink. The BG96-GG Mini PCIe is in the standard PCI Express® MiniCard form factor (miniPCIe)
- Technology: Ethernet
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Supplier: 4D Systems Pty. Ltd.
Description: display module powered by PIXXI-44 240 x 240 Resolution, RGB 65K TFT Screen Capacitive Touch Panel (pixxiLCD-20P2CT-CLB) 32KB of Flash memory for user application code. 30KB of SRAM for user variables. Selectable 16MB Serial Flash memory chip for multimedia storage, data files, fonts,
- Display Type: Graphic Display
- Technology: Thin Film Transistor (TFT)
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Supplier: 4D Systems Pty. Ltd.
Description: integration of a full color HMI into any application or product. Starter Kits available for first time users. See product description below for more details. Information about the Display Module Powerful 2.0” Intelligent LCD-TFT display module powered by PIXXI-28 176 x 220 Resolution,
- Display Type: Graphic Display
- Technology: Thin Film Transistor (TFT)
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Supplier: 4D Systems Pty. Ltd.
Description: Smart Home Automation display panels. Consumer appliance devices. Security and Access control panels. Air conditioner control panels. Lighting control panels. Vending machine panels. Power meter panels. Gaming equipment. And much more. 3.9", 480x128 pixel, Intelligent Display Module
- Display Type: Graphic Display
- Technology: Thin Film Transistor (TFT)
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Supplier: Hagiwara Sys-Com Co., Ltd.
Description: Evolution of the CompactFlash® Interface The CFast™ Storage Card contains a single chip controller and flash memory module(s) in a matchbook-sized package with a 7+17-pin connector consisting of a SATA compatible 7-pin signal connector and a 17-pin power and control connector.
- Memory Size: 2 to 16 GB
- Memory Type: CompactFlash®
- Standards and Certifications: RoHS Compliant
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: 8Mb PCMCIA Card 2.1 Product overview: SG9F0083P3205 from Smart Module is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: Memory Card Connectors Smart Card Product overview: CCM033505LFTR122 from C&K Aerospace is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers
- Features: Other
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: 128MB Smart Media Card Product overview: SM-0128M from SAMSUNG is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets,
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: 64MB Smart Media Card Product overview: SM-0064M from SAMSUNG is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets,
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Supplier: Win Source Electronics
Description: Manufacturer: NXP Win Source Part Number: 772315-MF3MOD4101DA8/05,1 Series: MIFARE Packaging: Bulk Type: RFID Transponder Operating Temperature Range: -25°C ~ 70°C Package: MOA8, Smart Card Module Frequency: 13.56MHz Interface: UART Standards: ISO 14443, MIFARE Categories: RF/IF
- Operating Temperature: -25 to 70 C
- Output Options: Inverting
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Supplier: Telit IoT Solutions, Inc.
Description: Application processor running Java J9 Virtual Machine for simple portability and creation, Dedicated processor for Real-Time and connection to system via CAN, USB, Ethernet, UART, ADC, SmartMX smartcard CPU with Java card JCOP OS for security, NFC for short range communication, e.g. for
- Bias / Operating Current: 3 mA
- TJ: -40 to 85 C
- Technology: GPRS, GPS, GSM
- Interface: I2C, USB
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Supplier: ToneCooling Technology Co., Ltd
Description: consoles. Data Centers: Server CPUs/GPUs, AI accelerator cards, switch chip cooling. Telecommunications: 5G base station power amplifiers, optical modules, router core chips. Automotive Electronics: Autonomous driving domain controllers, in-vehicle infotainment systems,
- Device: Thermo-Electric Cooler, Vapor Cooler
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Featured Products Top
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Eteily Technologies is pleased to announce its complete SIM Card Connector Series, which is designed for dependable SIM card interface across mobile, IoT, telematics, and communication devices. Our product line comprises Standard, Micro, Nano, and (read more)
Browse Electrical Connectors Datasheets for Eteily Technologies India Pvt. Ltd. -
For datacenter, AI and networking applications to function properly, you’ve got to get the timing right. That can be a challenge as data proliferates and workloads continue to increase. For example, in the datacenter, data travels through switches, active cables and SmartNIC cards to (read more)
Browse Network Synchronization Products Datasheets for SiTime Corporation -
. High-Speed Connectivity: 16 GTX transceivers (up to 12.5 Gbps per lane) enable fast serial communication for CPRI/eCPRI boards, optical modules, and switch cards (read more)
Browse Field-Programmable Gate Arrays (FPGA) Datasheets for Win Source Electronics -
MEMs (micro-mechanical chip) sensors. Circuit cards and flex-circuits usually support these devices and offer a wide range of applications. When needed, the sensor cards can activate plungers to open and or close devices, move flaps, turn on cooling devices and alert of oil level problems Read More or Connect with Omnetics (read more)
Browse Micro Connectors and Nano Connectors Datasheets for Omnetics Connector Corporation -
module, and Card media with GBDriver to the market, providing high-speed access while securing high reliability. Features In-house designated controller Power fail data safety (read more)
Browse Memory Chips Datasheets for DigiKey -
-high-frequency oscillators to match the timing requirements of server SoCs, GPU/TPU accelerator cards, and memory controllers. These devices provide low-jitter references for high-speed SerDes, PCIe 5.0/6.0, CXL, and high-bandwidth memory interfaces. SmartNICs and High-Speed Switches: 312.5MHz (read more)
Browse Oscillators Datasheets for Interquip Electronics Co., Ltd. -
controller demands. They accommodate various payment systems, including traditional tokens, contactless smart cards, and mobile payments, ensuring compatibility with advanced payment sensors through upgraded COM 1 and 2 ports operating at baud rates of 921600 for efficient data transmission (read more)
Browse Data Input Modules Datasheets for Advantech -
-generating components and heat sinks, reducing air pockets and improving heat transfer efficiency. In AI smart speakers, they help manage heat from chips, amplifiers, and memory modules in tight internal spaces. In (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
FaradaIC® has developed a solid electrolyte that can be connected directly with a chip for the first time. The 2x2x1 cm O2 (Oxygen) sensor electronics use patented algorithms to determine the exact (read more)
Browse Gas Sensors Datasheets for Electro Optical Components, Inc. -
with where and how the return-drain wire is connected to the driving circuit board. The main circuit card that supports chips, storage and processors will have some critical layout considerations. Signal routing on the board and especially ground lines can be critical elements and will (read more)
Browse Micro Connectors and Nano Connectors Datasheets for Omnetics Connector Corporation
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Smart Computing Article - Electronic Jacks-Of-All-Trades
card terminals when they come in contact with them. Smart cards contain an 8-bit microprocessor and/or a memory module under a gold contact pad on the front-left side of the card. These embedded computer chips can hold many times more information than a magnetic strip. Therefore, smart cards may
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
OpenAccess-to-OASIS translator Startup OASIS Tooling Inc. will offer its new OpenAccess-to-OASIS bidirectional translator to customers until June 2005. Matsushita blends FeRAM technology with smart cards Matsushita has added contactless smart card capabilities to its SD memory card using FeRAM
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
by year's end, the Ministry of Information Industry (MII) said. Visa launches European smart-card incentives Visa International has launched a European cash incentive program worth about $150 million to promote the use of credit cards with embedded silicon chips and readers instead of magnetic stripe
More Information Top
Indicates content that may require registration and/or purchase.
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Impacting electronic package design by validated simulations
We were interested in evaluating a variety of designs fbr flip chip smart card modules .
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Smart Card Handbook 4th Edition Complete Document
Figures 3.35 and 3.36 on the following page illustrate the use of TAB technology for chip modules in smart cards .
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Lead-free Electronics
Dr. Lin’s experience includes flip chip bumping, assembly, chip scale package, multi- chip module , smart card , MEMS, MRAM, RF power amplifier, RF module, lead-free solders, under bump metallurgies, conductive adhesives, thin films, and magnetic materials.
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Credence, Fico and Amkor Partner to Create New Method for Production Testing Flash Memory
It also features solutions for BGA, matrix leadframes, chip modules for SMART cards , ultra thin packages and other package types.
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An approach to testing of planar integrated antennas in frequency range of 5–7 GHz
… joint project dedicated to creation a high-tech production with the participation of Russian higher educational institutions “The organization of production of microelectronic products through the establishment of basic technologies for manufacturing the chip modules for smart card identification and payment systems …
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Survey on the effect of technological metallization and slotting on integrated antenna characteristics
… joint project dedicated to creation a high- tech production with the participation of Russian higher educational institutions “The organization of production of microelectronic products through the establishment of basic technologies for manufacturing the chip modules for smart card identification and payment systems …
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Numerical Investigations of Smart Card Module: Parametric Analysis and Design Optimization
ANSYS software is used to analyze a single ultrathin die package in a smart card under four-point bending with the aim of developing flexible smart card modules using chips with thickness below 50 μm.
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Security Trends for FPGAS
Examples of single chip cryptographic modules include smart cards with a single IC chip.
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State of the Art in Applied Cryptography
This includes assessment of the security aspects of PIN Pads, single chip security modules and smart cards .
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Secure Smart Embedded Devices, Platforms and Applications
Not that DSPs generally do not have the attack resistant capabilities found in security modules (such as smart card chips ).