Chip Resin

Description: It is a fast curing, fast flowing liquid epoxy resin designed for capillary flow filling chip size packages, is to improve the process speed in production and design its rheological design, let it penetrate 25µm clearance, minimize induced stress, improve temperature cycling

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Specialty / Other
• Industry: Electronics
• Viscosity: 3500 to 7000 cP

Description: conductive resins, it is easy to find the right appearance, viscosity, volume resistivity, chip bonding strength, and cure time that you need for your manufacturing application. Most often used in consumer electronics, EV and fuel cell manufacturing, and in the automotive manufacturing

• Chemical / Polymer System Type: Acrylic / Polyacrylate
• Composition: Filled
• Cure Type / Technology: Anaerobic
• Features: Electrically Conductive Compound (Adhesive, Grease)

Description: Description / Abstract There is no abstract information for this document.

Description: their expertise in polyurethane materials, they offer a wide array of custom made performance oriented plastic and rubber solutions for sealing and mechanical applications. Applications include but not limited to: Capacitors High End Water Applications - Reverse Osmosis IC Chips Food and

• Elongation: 228 %
• Filler Material: Unfilled
• Industry: Automotive, Building / Construction, Industrial, Tooling / Molds
• Process Type: Molding Resin

Description: their expertise in polyurethane materials, they offer a wide array of custom made performance oriented plastic and rubber solutions for sealing and mechanical applications. Applications include but not limited to: Capacitors High End Water Applications - Reverse Osmosis IC Chips Food and

• Elongation: 152 %
• Filler Material: Unfilled
• Industry: Automotive, Building / Construction, Industrial, Tooling / Molds
• Process Type: Molding Resin

Description: their expertise in polyurethane materials, they offer a wide array of custom made performance oriented plastic and rubber solutions for sealing and mechanical applications. Applications include but not limited to: Capacitors High End Water Applications - Reverse Osmosis IC Chips Food and

• Elongation: 515 %
• Filler Material: Unfilled
• Industry: Automotive, Building / Construction, Industrial, Tooling / Molds
• Process Type: Molding Resin

Description: their expertise in polyurethane materials, they offer a wide array of custom made performance oriented plastic and rubber solutions for sealing and mechanical applications. Applications include but not limited to: Capacitors High End Water Applications - Reverse Osmosis IC Chips Food and

• Elongation: 174 %
• Filler Material: Unfilled
• Industry: Automotive, Building / Construction, Industrial, Tooling / Molds
• Process Type: Molding Resin

Description: degrees Fahrenheit. When made to ultra pure standards it is the material of choice for various items used in chip manufacturing, including encapsulation devices for quartz heaters, and the like. Food, Beverage and Pharmaceutical industries: Virgin PTFE is approved by the Food and Drug

• Chemical / Polymer System Type: Fluoropolymer (PTFE / PVDF)
• Coeff. of Thermal Expansion (CTE): 55 µin/in-F
• Compound Type: Extrusion Grade Resin
• Dielectric Constant: 2.1

Description: (Known as ABLESTIK ABLEBOND 933-1 moisture resistant chip encapsulant ) LOCTITE ECCOBOND 933 one component epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimized stress effects on components and wiring during thermal

• Industry: Electronics
• Use: Encapsulant / Potting Compound

Description: Primarily used for chip coating, glob top and die attach applications, Supreme 3HTND-2CCM is a single component chemical resistant system with low shrinkage upon curing, good thermal conductivity and sound dimensional stability. Its inherent toughness allows it to withstand the most intense

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 15 to 16.67 µin/in-F
• Composition: Single Component System, Unfilled
• Cure Type / Technology: Thermosetting / Crosslinking

Description: duplications of surface details. In addition, the Hapflex™ elastomers are virtually shock resistant and unbreakable, making them exceptionally well suited for permanent molds or parts that will not crack or chip during use or storage. A major advantage is their performance in low

• Chemical / Polymer System Type: Polyurethane
• Filler Material: Unfilled
• Industry: Industrial, Tooling / Molds
• Material Type / Grade: Elastomer / Rubber

Description: with Hapco’s RAPIDFIL or MINIFIL dispensing machines. In addition, the Hapflex™ 600 Series elastomers are virtually shock resistant and unbreakable, making them exceptionally well suited for permanent molds, parts or master patterns that will not crack or chip during use. A

• Chemical / Polymer System Type: Polyurethane
• Filler Material: Unfilled
• Industry: Industrial, Tooling / Molds
• Material Type / Grade: Elastomer / Rubber

Description: -Free, and REACH environmental and safety standards. ?Applications? ? CPU/GPU Chips ? Capacitors ? Memory/VRAM particles ? Control boards ? Splitters ? Relays

• Dielectric Constant (Relative Permittivity): 4
• Features: Thermal Compound / Interface (Thermally Conductive)
• Form: Pad
• Industry: Electronics

Description: 40824-B is recommended as Set-Top Box (STB) makers to prevent chip detaching. Used alone, the PROTAVIC® PNE 40824-A and PROTAVIC® PNE 40824-B exhibits excellent mechanical properties up to 300°C. It also may be used in combination with epoxy or fiberglass covers in order to obtain an almost

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 83.33 to 88.89 µin/in-F
• Composition: Two Component System, Filled
• Cure Type / Technology: Thermosetting / Crosslinking

Description: Elecolit® 323 is a silver filled two part epoxy adhesive specially developed for bonding open chip components. This semiconducting grade has passed the autoclave test (1000h) and is suitable for use on semi conductors, it has no effect on bond wire adhesion. It can cured at either

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking
• Features: Electrically Conductive Compound (Adhesive, Grease)
• Industry: Electronics

Description: Decorative floor system, 3 component, epoxy resin polymer vinyl chip media

• Chemistry: Resin Base / Polymer Binder, Epoxy, Vinyl
• Cure / Dry Temperature: 70 F
• Industry: Automotive, Food and Beverage, OEM / Industrial
• Type: Coating

Description: 3M 3748 B Hot Melt Off-White, formerly known as Jet-Melt, is a 100% solids thermoplastic resin designed for low surface energy coatings and plastics such as polyolefins. Includes high temperature stability, thermal shock resistance, and quick bond strength. 22 lb Case.

• Cure Type / Technology: Thermoplastic / Hot Melt, Single Component System
• Substrate / Material Compatibility: Plastic, Textiles / Fabrics, Wood / Wood Product
• Viscosity: 5000 cP

Description: The oil based viscous liquid which is enclosed in a microcapsule is applied on the screw point (self-tapping screw, machine screw, bolt, etc.) We term these applied screws “CP-GRIP.” Self-tapping had been thought unfit to the circuit board due to a problem of metal chips but

• Chemistry: Alkyd / Oil Based, Resin Base / Polymer Binder
• Form: Other
• Industry: Electronics

Description: prevent delamination failures of molded packages due to moisture and reflow sensitivity. Improved Adhesion Performance in Modern Chip Packages The PackageBond process roughens copper alloy leadframes to maximize resin and encapsulation adhesion and deposits a thin adhesion

• Industry: Semiconductors / IC Packaging, Electronics

Description: (Known as Hysol MG52F-99B NXP ) LOCTITE HYSOL MG52F-99B NXP high productivity modling compound, designed for high volume encapsulation of surface mount devices. It is designed to provide much improved moisture performance after preconditioning. It is applicable for devices having chip

• Industry: Electronics

Description: dielectric gel especially designed to seal, protect and preserve the electrical characteristics of delicate electronic components (e.g. bonded chips on hybrid components which are exposed to extreme external influences).

• Chemical / Polymer System Type: Silicone
• Composition: Single Component System
• Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
• Dielectric Constant (Relative Permittivity): 2.5

Description: Green Surface Mount Chip LEDs featuring InGaN packed with milky white diffused resin.

• Color: Green
• Forward Voltage: 3 volts
• Luminous Intensity: 110 milliCandela
• Optical Power Output: 34 milliwatts

Description: Master Bond Polymer System UV15X-2GT is a new, easily processable, one component, UV curable glob top, featuring exceptional durability and chemical resistance. UV15X-2GT is a thixotropic paste that handles well when encapsulating selected components and chips on circuit boards. The cured

• Coeff. of Thermal Expansion (CTE): 47 to 50 µin/in-F
• Dissimilar Substrates: Yes
• Elongation: Over 20 %
• Features: Thermal / Heat Insulating, Electrical Insulation / Dielectric, Non-corrosive Cure

Description: Yellow surface mount LEDs featuring AlGaInP packed with milky white diffused resin

• Color: Yellow
• Forward Current: 30 milliamps
• Forward Voltage: 2.1 volts
• Luminous Intensity: 180 milliCandela

Description: General Polymers CHIP RESISTANT HIGH BUILD HANGAR INDUSTRIAL FLOOR is designed for interior concrete floors that requires an impact resistant, high gloss, easy to maintain finish. This 35 mil system is resistant to staining and chemical attack from certain common acids, alkalies, fuels,

• Chemistry: Epoxy, Polyurethane, Resin Base / Polymer Binder, Vinyl
• Features: Brush / Roll-on, Chemical / Oil Resistant, Protective, Sprayable, Wear Resistant (Abrasion / Erosion)
• Form: Water Based
• Industry: OEM / Industrial, Other

Description: Prolongs battery life, won't crack, chip, or peel, dries quickly

• Chemistry: Resin Base / Polymer Binder, Acrylic / Latex, Alkyd / Oil Based, Solvent Based
• Cure / Dry Temperature: 50 to 100 F
• Industry: Automotive, Marine
• Type: Coating

Description: INDUSTRIAL ENAMEL is a medium oil/alkyd all-purpose enamel with a durable color pigment system. Designed for interior and exterior use. Dries fast and allows equipment to be placed back in service quickly Chip and flake resistant High gloss makes it resistant to

• Chemistry: Resin Base / Polymer Binder, Alkyd / Oil Based
• Cure / Dry Temperature: 50 to 110 F
• Industry: Machine Tools, OEM / Industrial
• Operating / Use Temperature: 40 to 120 F

Description: Single and twin secondary windings for series or parallel connection. Vacuum resin moulded to UL94-V0 rating. Low inter-winding capacitance. Low radiated noise. 100% electrical and flash tested. Extra fixing points for secure board mounting (25 VA and 36 VA) Secondary Voltage Rating = 18V ac

• Maximum Primary Voltage Rating: 230 volts
• Maximum Secondary Voltage Rating: 18 volts
• Mounting / Form Factor: Chip Transformer
• Power Rating (VA): 36 VA

Description: General use wire wound and resin molded chip inductor. Recommended for AV equipment, wireless communications and general electronic equipment Inductance = 47 μH Maximum DC Current = 75mA Package/Case = 1210 Length = 3.2mm Depth = 2.5mm Height = 2.2mm Dimensions = 3.2 x 2.5 x 2.2mm

• DCR: 7 ohms
• Inductance Range: 47 microH
• Inductance Tolerance: -10 to 10 (+/- %)
• Rated DC Current: 75 milliamps

Description: Vishay MKT1817 series are metallized polyester film capacitors designed for mounting on printed-circuit boards. The MKT1817 have a flame retardant plastic case and are epoxy resin sealed, suitable for various applications. Tinned wire leads. Flame retardant. Epoxy resin sealed

• Capacitance Range: 0.0220 microF
• Capacitance Tolerance: 10 (+/- %)
• Electrostatic Capacitors: Polyester
• Technology: Film Capacitors

Description: Features Thick film resistor protected by liquid crystal polymer resin Excellent heat cycle characteristics Encapsulated with flame retardant resin molding. (UL94 V-0) High operating temperature range up to 180°C Products meet EU RoHS requirements. EU RoHS regulation is not intended

• Power Rating: 1 watts
• Resistance Range: 0.3010 to 1.00E6 ohms
• Standard and Compliances: RoHS Compliant
• Temperature Coefficient (TCR): 100 ±ppm/°C

Description: Resistant to mild and moderate environments, will not chip or peel

• Chemistry: Resin Base / Polymer Binder, Solvent Based
• Coverage: 450 to 900 ft²
• Cure / Dry Temperature: 50 to 90 F
• Features: Exterior, Interior, Weather / UV Resistant

Description: . â?¢ Industry standard 0â?¢1in. grid spacing. â?¢ Resin encapsulated in glass filled nylon case. â?¢ Foil interwinding screen. â?¢ Optional Mu-metal, a nickel-iron alloy, screening can (stock no. 210-6469) Primary Impedance = 600

• Mounting / Form Factor: Chip Transformer
• Power Rating: 0.1000 watts
• Transformer Types / Applications: Audio Transformer

Description: PACKAGE Radial FEATURE •Designed to be compact, small and light-weight. •Coating epoxy resin ensures the humidity resistance for long life.

• Applications: General Purpose
• DCR: 473 ohms
• Inductance Range: 0.1000 to 39000 microH
• Molded Case: Yes

Description: Manufacturer: 3M Win Source Part Number: 900570-EM15TP-010-1 Series: EM15TP Operating Temperature Range: -25°C ~ 90°C Features: RF EMI Absorbing Sheet series Polymer Resin, Metal Flakes Non-Conductive, Single Sided - X - X Package: Box Family Name: EM15TP

• Operating Temperature: -25 to 90 C