Chip Resin

Description: It is a fast curing, fast flowing liquid epoxy resin designed for capillary flow filling chip size packages, is to improve the process speed in production and design its rheological design, let it penetrate 25µm clearance, minimize induced stress, improve temperature cycling

• Viscosity: 3,500 to 7,000 cP
• Features: Electronics, Specialty / Other
• Chemical System: Epoxy (EP)

Description: Electrically Conductive Resins These Electrically conductive resin can connect multiple electrical contacts simultaneously and make it possible to create an electrical connection in materials that cannot be soldered. They are electro-conductive resins made up of synthetic

• Viscosity: 3,000 cP
• Cure / Technology: Anaerobic
• Industry: Automotive, Electronics
• Features: Electrically Conductive

Description: Description / Abstract There is no abstract information for this document.

Description: RoHS/RoHS II Compliant Part LEAD (Pb) FREE Series: ASPI-0840 Application: Power Type: Wirewound (Resin Shield) Rating: N/A Inductance: 33 μH Temperature Rise Current: 2 A Saturation Current: 2 A DC Resistance Max: 110 mΩ Operating Temperature: -40°C ~ +85°C Tolerance: 20 Shielding:

• Inductance Range: 33.00000000000001 microH
• Inductance Tolerance: 20 (+/- %)
• DCR: 0.11 ohms
• Operating Temperature: -40 to 85 C

Description: RoHS/RoHS II Compliant Part LEAD (Pb) FREE Series: ASPI-2012 Application: Power Type: Wirewound (Resin Shield) Rating: N/A Inductance: 10 μH Temperature Rise Current: 0.54 A Saturation Current: 820 mA DC Resistance Max: 785 mΩ Operating Temperature: -40°C ~ +125°C Tolerance: 20 Shielding:

• Inductance Range: 10.000000000000002 microH
• Inductance Tolerance: 20 (+/- %)
• DCR: 0.785 ohms
• Operating Temperature: -40 to 125 C

Description: RoHS/RoHS II Compliant Part LEAD (Pb) FREE Series: ASPI-0645 Application: Power Type: Wirewound (Resin Shield) Rating: N/A Inductance: 15 μH Temperature Rise Current: 2.3 A Saturation Current: 2.3 A DC Resistance Max: 80 mΩ Operating Temperature: -25°C ~ +120°C Tolerance: 20 Shielding:

• Inductance Range: 15.000000000000002 microH
• Inductance Tolerance: 20 (+/- %)
• DCR: 0.08 ohms
• Operating Temperature: -25 to 120 C

Description: RoHS/RoHS II Compliant Part LEAD (Pb) FREE Series: ASPI-2010 Application: Power Type: Wirewound (Resin Shield) Rating: N/A Inductance: 680 nH Temperature Rise Current: 2.25 A Saturation Current: 2.45 A DC Resistance Max: 76 mΩ Operating Temperature: -40°C ~ +125°C Tolerance: 20 Shielding:

• Inductance Range: 0.6799999999999999 microH
• Inductance Tolerance: 20 (+/- %)
• DCR: 0.076 ohms
• Operating Temperature: -40 to 125 C

Description: Tantalum Capacitor, Resin Dipped, TAP Series, 15 F, 20%, 25 V, Radial Leaded, 5 mm RoHS Compliant: Yes

Description: Tantalum Capacitor, Resin Coated, 489D Series, 1 F, 20%, 25 V, Radial Leaded, 5 mm RoHS Compliant: Yes

Description: Tantalum Capacitor, Resin Coated, 489D Series, 10 F, 20%, 25 V, Radial Leaded, 5 mm RoHS Compliant: Yes

Description: Tantalum Capacitor, Resin Dipped, TAP Series, 1 F, 20%, 35 V, Radial Leaded, 5 mm RoHS Compliant: Yes

Description: Red Surface Mount Chip LEDs featuring AlGaInP packed with milky white diffused resin.

• Peak Wavelength: 620 nm
• Forward Voltage: 1.8 volts
• Luminous Intensity: 6 milliCandela
• Optical Power Output: 44 milliwatts

Description: Decorative floor system, 3 component, epoxy resin polymer vinyl chip media

• Cure / Dry Temperature: 70 F
• Industry: Automotive, Food and Beverage, OEM / Industrial
• Type: Base Coat, Clear Coat / Top Coat, Primer
• Features: Chemical / Oil Resistant, Coating, Corrosion Inhibiting / Rust Preventive, Other

Description: will contribute total cost reduction, weight saving and thinning. Adhere the metal chip & dust that is generated by fastening · Prevent falling of metal chip & dust Reduce the friction with workpiece by coating applied · Reduce the torque to form female thread and realize fastening by

• Chemistry: Alkyd / Oil Based, Resin Base / Polymer Binder
• Industry: Electronics
• Features: Other

Description: Yellow surface mount LEDs featuring AlGaInP packed with milky white diffused resin

• Peak Wavelength: 590 nm
• Forward Voltage: 2.1 volts
• Forward Current: 30 milliamps
• Luminous Intensity: 200 milliCandela

Description: Yellow surface mount LEDs featuring AlGaInP packed with milky white diffused resin

• Peak Wavelength: 587 nm
• Forward Voltage: 2.1 volts
• Forward Current: 30 milliamps
• Luminous Intensity: 180 milliCandela

Description: The TRPM chip seal marker revolutionized temporary road markings when it was first introduced in 1984. Used worldwide today, the TRPM marker still leads the way as the most reliable product for this retaining the original lane line location in bituminous surface treatments. TRPM Chip

Description: elastomers are virtually shock resistant and unbreakable, making them exceptionally well suited for permanent molds or parts that will not crack or chip during use or storage. A major advantage is their performance in low temperatures. Precision tracing patterns, instrument grips, gaskets,

• Viscosity: 2,250 cP
• Features: Casting Resin, Molding Resin, Unfilled
• Type: Elastomer / Rubber
• Industry: Industrial, Tooling / Molds

Description: 3M 3748 B Hot Melt Off-White, formerly known as Jet-Melt, is a 100% solids thermoplastic resin designed for low surface energy coatings and plastics such as polyolefins. Includes high temperature stability, thermal shock resistance, and quick bond strength. 22 lb Case.

• Viscosity: 5,000 cP
• Substrate Compatibility: Plastic, Textiles / Fabrics, Wood / Wood Product
• Cure / Technology: Single Component System, Thermoplastic / Hot Melt

Description: (Known as ABLESTIK ABLEBOND 933-1 moisture resistant chip encapsulant ) LOCTITE ECCOBOND 933 one component epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimized stress effects on components and wiring during thermal

• Industry: Electronics (PCB / SMT Assembly)
• Features: Encapsulant / Potting Compound

Description: General Polymers CHIP RESISTANT HIGH BUILD HANGAR INDUSTRIAL FLOOR is designed for interior concrete floors that requires an impact resistant, high gloss, easy to maintain finish. This 35 mil system is resistant to staining and chemical attack from certain common acids, alkalies, fuels,

• Operating / Use Temperature: 50 to 90 F
• Dispensing Method: Brush / Roll-on, Sprayable
• Features: Chemical / Oil Resistant, Coating, Other, Protective, Wear Resistant (Abrasion / Erosion)
• Substrate: Concrete / Masonry, Wood

Description: ultra pure standards it is the material of choice for various items used in chip manufacturing, including encapsulation devices for quartz heaters, and the like. Food, Beverage and Pharmaceutical industries: Virgin PTFE is approved by the Food and Drug Administration for use in the food,

• Use Temperature: 250 F
• Thermal Conductivity: 0.24518743 W/m-K
• Coeff. of Thermal Expansion (CTE): 55 µin/in-F
• Tensile Strength (Break): 1,500 to 3,000 psi

Description: polyurethane materials, they offer a wide array of custom made performance oriented plastic and rubber solutions for sealing and mechanical applications. Applications include but not limited to: Capacitors High End Water Applications - Reverse Osmosis IC Chips Food and Beverage Pharmaceutical

• Tensile Strength (Break): 1,665 psi
• Elongation: 156 %
• Industry: Automotive, Building / Construction, Industrial, Tooling / Molds
• Type: Elastomer / Rubber

Description: polyurethane materials, they offer a wide array of custom made performance oriented plastic and rubber solutions for sealing and mechanical applications. Applications include but not limited to: Capacitors High End Water Applications - Reverse Osmosis IC Chips Food and Beverage Pharmaceutical

• Tensile Strength (Break): 1,682 psi
• Tensile Modulus: 0.714 ksi
• Elongation: 307 %
• Industry: Automotive, Building / Construction, Industrial, Tooling / Molds

Description: polyurethane materials, they offer a wide array of custom made performance oriented plastic and rubber solutions for sealing and mechanical applications. Applications include but not limited to: Capacitors High End Water Applications - Reverse Osmosis IC Chips Food and Beverage Pharmaceutical

• Tensile Strength (Break): 1,649 psi
• Elongation: 515 %
• Industry: Automotive, Building / Construction, Industrial, Tooling / Molds
• Type: Elastomer / Rubber

Description: polyurethane materials, they offer a wide array of custom made performance oriented plastic and rubber solutions for sealing and mechanical applications. Applications include but not limited to: Capacitors High End Water Applications - Reverse Osmosis IC Chips Food and Beverage Pharmaceutical

• Tensile Strength (Break): 2,360 psi
• Tensile Modulus: 0.54 ksi
• Elongation: 295 %
• Industry: Automotive, Building / Construction, Industrial, Tooling / Molds

Description: RESIN-MOLDED, RADIAL-LEAD SOLID

• Packing Method: Bulk Pack
• Electrolytic Capacitors: Tantalum Oxide

Description: Primarily used for chip coating, glob top and die attach applications, Supreme 3HTND-2CCM is a single component chemical resistant system with low shrinkage upon curing, good thermal conductivity and sound dimensional stability. Its inherent toughness allows it to withstand the most intense

• Use Temperature: -100 to 400 F
• Thermal Conductivity: 1.44 to 1.59 W/m-K
• Coeff. of Thermal Expansion (CTE): 15 to 16.669999999999998 µin/in-F
• Tensile Strength (Break): 6,000 to 7,500 psi

Description: millimeter wave transceiver and an on-chip antenna. Then, the chip package is made of plastic resin without use of expensive ceramic. Finally, a tiny dome-shaped resin lens is attached to the chip to collimate waves. These technologies enable the sensor to measure

Description: (Known as Hysol MG52F-99B NXP ) LOCTITE HYSOL MG52F-99B NXP high productivity modling compound, designed for high volume encapsulation of surface mount devices. It is designed to provide much improved moisture performance after preconditioning. It is applicable for devices having chip

• Industry: Electronics

Description: Tantalum Capacitors - Polymer SMD 35V 47uF Blk Resin ESR=100Ohms

Description: High purity, flip-chip underfill, high Pb and no-Pb applications

• Viscosity: 40,000 cP
• Coeff. of Thermal Expansion (CTE): 13.88888888888889 µin/in-F
• Industry: Electronics

Description: (Known as ABLESTIK ABLEBOND 3005 ) LOCTITE ECCOBOND 3005 adhesive is designed for lid attach in flip chip BGA applications. The combination of product features result in superior flip chip BGA reliability.

• Viscosity: 37,000 cP
• Thermal Conductivity: 0.5 W/m-K
• Industry: Electronics

Description: Features Thick film resistor protected by liquid crystal polymer resin Excellent heat cycle characteristics Encapsulated with flame retardant resin molding. (UL94 V-0) High operating temperature range up to 180°C Products meet EU RoHS requirements. EU RoHS regulation is not intended

• Resistance Range: 0.301 to 1,000,000 ohms
• Tolerance: 0.5 to 5 +/- %
• Temperature Coefficient (TCR): 100 ±ppm/°C
• Power Rating: 1 watts

Description: Bostik H284-332 Hot Melt Adhesive Amber has an excellent pick-up bond that cools to a brittle bond. Its 100% solid resin consistency makes it safe, clean and easy to use with no wasted powder or chips. 35 lb Case.

• Viscosity: 525 cP
• Cure / Technology: Single Component System, Thermoplastic / Hot Melt