Die Bonding Film

Description: Product Overview ALPHA Argomax 8021 Film offers a ready-to-laminate solution that removes the need for printing, dispensing, and drying process steps. Optimized for use in Die Transfer Film (DTF) processes, it supports a wide range of surfaces and is customized for fast, easy

• Thick Film Type: Conductor
• Applications: Die Bonding, Electronics / Microelectronics
• Material: Silver / Silver Alloy

Description: LOCTITE® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. Thin, uniform bondline control Provides RF/EMI shielding Electrically conductive in x, y, z axes Excellent electrical

• Thermal Conductivity: 6.5 W/m-K
• Chemical System: Epoxy (EP)
• Industry: OEM / Industrial
• Cure / Technology: Thermosetting / Crosslinking

Description: production and demonstrates controlled grain-growth at post-processing temperatures. D2D, D2W and W2W Bonding This system enables high-quality and high-reliability interconnects for Die-to-Die (D2D), Die-to-Wafer (D2W) and Wafer-to-Wafer (W2W) bonding.

• Chemical / Composition: Copper Plating, Tin Plating

Description: Pin-point rework areas on printed circuit boards with Brady's inspection arrows. The vinyl cloth material provides a tight bond, yet may be easily removed without leaving an adhesive residue.

Description: Product Overview ATROX® CD 560-1 offers excellent substrate compatibility and low Resin Bleed-Out (RBO), ensuring reliable bonding to Pre-Plated Frame (PPF) and copper lead frames. It provides a long pot life of over 24 hours at room temperature and maintains a 12-month shelf life when stored

• Features: Die Bonding Adhesive / Compound, Electrically Conductive Compound (Adhesive, Grease), Film / Sheet, Grease / Paste
• Industry: Electronics, Semiconductors / IC Packaging
• Cure / Technology: Thermosetting / Crosslinking

Description: Double coated film that provides high tack and peel to a wide variety of substrates. Tight release for small die-cut parts or narrow rolls.

• Width: 54 inches
• Adhesive: Rubber
• Features: Specialty / Other

Description: LOCTITE ABLESTIK ECF 561E, Rubberized Epoxy, Assembly, Electrically Conductive Die Attach Adhesive LOCTITE® ABLESTIK ECF 561E electrically conductive die attach adhesive is designed for bonding materials with severely mismatched coefficients of thermal expansion. When used for

• Thickness: 0.001 inches
• Adhesive: Epoxy
• Features: Specialty / Other

Description: Screen display technologies require supporting components that enable them to function or enhance performance. From screen bonding systems to vibration management, optically clear adhesive (OCA), window tape, barrier film and thermal management, LCD and/or OLED display technologies

• Materials: Acrylic / Acrylate, PET / Polyester
• Enhancement / Features: Anti-static / ESD Control, Dielectric / Insulating, EMI / RFI Shielding, Hard Coat / Thin Film, Moisture / Vapor Barrier, Thermally Insulating / Insulative, Transparent

Description: temperatures e.g. 1 hour at 250°F (125°C) or 30-40 minutes at 300°F (150°C). The standard thickness is 3 mils, although other thicknesses are available. The film processes very easily and squeeze out during bonding is minimal. Master Bond FL901S has excellent electrical conductivity

• Use Temperature: -100 to 400 F
• Thermal Conductivity: 1.442279 W/m-K
• Coeff. of Thermal Expansion (CTE): 0.00011111111111111112 to 0.000033333333333333335 µin/in-F
• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Marine, OEM / Industrial, Optical Grade / Material, Semiconductors / IC Packaging, Tooling / Mold Material

Description: tesa® HAF 8405 is a double-sided thermosetting brown adhesive film without backing, that is based on phenolic resin and nitrile rubber. At room temperature tesa® HAF 8405 is not tacky. It is activated for pre-lamination by heat and becomes tacky at 194 °F. In its application, heat and

• Thickness: 0.0012000000000000001 inches
• Features: Specialty / Other

Description: DuPont™ Pyralux® LF-B is DuPont™ Kapton® B black polyimide film coated with acrylic ideal for products where uniform matte black appearance is desired. The coverlay is made with the leading DuPont™ Kapton® brand black polyimide film for high performance applications where matte-black

• Chemical System: Acrylic / Polyacrylate
• Industry: Automotive, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
• Features: Die Bonding Adhesive / Compound, Electrical Insulation / Dielectric Material, Film / Sheet, Specialty / Other

Description: 3M 9824 Clear Double Sided Film 3M 9824 Double Coated Tape is a 6.3 mil tape with 340 High Tack Acrylic Adhesive and a 0.5 mil Clear Polyester Film (PET) carrier on a 3.2 mil White 55# Densified Kraft Paper (DK) liner. High tack Excellent bonding to foam and other substrates

• Features: Double-Sided Adhesive
• Adhesive: Pressure Sensitive (PSA)

Description: constructed of DuPont™ Kapton® polyimide film, coated on one side (both sides) with a proprietary B-staged acrylic adhesive. They are used to encapsulate etched details in flexible and rigid-flex multilayer constructions. Construction and Certification for Coverlay and Polyimide thickness:

• Chemical System: Acrylic / Polyacrylate
• Features: Die Bonding Adhesive / Compound, Encapsulating / Potting, Film / Sheet, Specialty / Other
• Industry: Electronics, OEM / Industrial

Description: Aluminum Nitride-filled Thermally Enhanced Film Product Overview STAYSTIK 682 thermoplastic adhesive film is designed for use in a variety of electronic applications, and is characterized by excellent bonding. This film can be used for die attach and/or substrate

• Industry: Electronics, Semiconductors / ICs
• Form / Shape: Film / Sheet
• Features: Thermoplastic

Description: Product Description DuPont™ Pyralux® GPL epoxy-based adhesive is part of our FPC total solution featuring low loss properties designed for high speed & high frequency applications in consumer electronics. With good processability and high thermal resistivity, Pyralux® GPL adhesive is ideal for high

• Coeff. of Thermal Expansion (CTE): 58.33333333333333 µin/in-F
• Tensile Strength (Break): 1,595.40523292917 psi
• Elongation: 222 %
• Dielectric Strength: 3,124.2000000000066 kV/in

Description: Novaphit SSTC is made of high quality, expanded graphite and an expanded metal insert made from acid-proof-stainless steel AISI 304 - 1.4404, mesh (3 mm wide). Under high pressure the expanded graphite particles are compressed to films without adding any binders or fillers. The expanded metal

• Thickness: 0.02 to 0.079 inch
• Material: Graphite
• Gasket Type: Sheet / Die-cut

Description: Dupont(TM) Surlyn Film with acrylic pressure sensitive adhesive and 92lb liner. Applications Surface protection. Paintline hanger tab for automotive plastic parts. Automotive squeak and rattle protection. Features & Benefits Tough and durable. Transparent. High bond strength. Excellent aging

• Width: 0.25 to 24 inches
• Thickness: 0.012 inches
• Peel Strength / Adhesion: 5.625 lbs/in
• Temperature Resistance: -40 to 28.333333333333332 C

Description: LOCTITE ABLESTIK 5025E, Epoxy Film, Die attach LOCTITE® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. Thin, uniform bondline control Provides RF/EMI shielding

• Thermal Conductivity: 6.5 W/m-K
• Chemical System: Epoxy (EP)
• Industry: Military / Government (MIL-SPEC / GG)
• Features: Thermal / Heat Conductive

Description: candidate for those applications where an inorganic bond is required between component parts and only small clearances are available. No. 2 exhibits good coating properties. Thin film sections have shown exceptional flexural and tensile strength for a ceramic adhesive. Sauereisen No. 2 is

• Use Temperature: 3,000 F
• Dielectric Strength: 50.800000000000104 kV/in
• Dielectric Constant (Relative Permittivity): 107.2
• Cure / Technology: Air Setting / Film Drying, Single Component System

Description: Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete

• Use Temperature: 1,800 F
• Cure / Technology: Air Setting / Film Drying, Single Component System
• Substrate Compatibility: Ceramic / Glass, Concrete / Masonry, Dissimilar Substrates, Metal, Porous Surfaces, Textiles / Fabrics, Wood / Wood Product
• Chemical System: Ceramic / Inorganic Cement

Description: EnerChip CBC001-BDC is a 1uAh (Lifecycle Capacity = .5mAh) rechargeable 1.375mm x0.85mm x 200 microns thick solid state battery bare die to be co-packaged using wire bond attachment with other integrated circuits in a single package or multi-chip module.

• Capacity, Amp Hours (AH): 0.000001 ampere-hr
• Features: Other, Rechargeable (Secondary) Batteries
• Specialty Cells: Thin Film

Description: SEMICOSIL® 962 TC A/B is a shear-thinning, easydispensing, non-slump, addition-curing, two part silicone rubber that cures at room temperature to a soft, flexible and tacky rubber with excellent thermal conductivity.

• Viscosity: 150,000 cP
• Dielectric Strength: 177.80000000000038 kV/in
• Cure / Technology: Air Setting / Film Drying, Thermosetting / Crosslinking, Two Component System
• Features: Die Bonding Adhesive / Compound, Gap Filling Sealant / FIP Gasket, Gel

Description: weight. EP39-2 is very fast curing, even in very thing sections. Films as thin as 5 mil become tack free at ambient temperatures in only 3 hours and fully cure in 6-10 hours. The aforementioned film will even become tack-free at 40°F within 9 hours. Other desirable characteristics

• Viscosity: 2,000 to 3,000 cP
• Use Temperature: -60 to 300 F
• Tensile Strength (Break): 8,400 psi
• Elongation: 8 %

Description: converting processes. Provides printable film reinforcement for EKG top cover designs. The liner provides good die cut ability and ease of removability to expose adhesive.

• Backing: PET / Polyester, Plastic / Polymer
• Adhesive: Rubber
• Features: Single-Sided Adhesive

Description: 40-3920 is a one component electrically conductive ink. 40-3920 is a silver filled polymer system which exhibits outstanding adhesion to a variety of substrates, such as kapton, mylar, glass, polyester, ceramic, etc. This thick film ink provides excellent conductivity for many electronic

• Viscosity: 9,000 cP
• Use Temperature: -4 to 284 F
• Substrate Compatibility: Ceramic / Glass, Plastic
• Features: Die Bonding Adhesive / Compound, Electrically Conductive, Filled, Flexible / Dampening, Liquid, Room Temperature Curing

Description: 40-3914 is a one component electrically conductive ink. This Polymer system was developed to provide a good balance of low cost and high conductivity. This thick film ink provides conductivity for many electronic and industrial applications. 40-3914 exhibits outstanding adhesion to a variety

• Viscosity: 14,000 cP
• Use Temperature: -4 to 275 F
• Substrate Compatibility: Ceramic / Glass, Plastic
• Features: Die Bonding Adhesive / Compound, Electrically Conductive, Filled, Liquid, Room Temperature Curing

Description: Transparent, thermoplastic sheet used widely in the point of purchase industry. Products offer superior impact strength over acrylic and cost effectiveness compared to polycarbonate, and offers deep draws, complex die-cuts, and precise molded-in details without sacrificing structural

• Form / Shape: Film / Sheet

Description: Sauereisen Insa-Lute Adhesive Cement No. 1 is specified throughout the automotive, appliance and assembly industries for bonding, insulating, and encapsulating applications. A thermally conductive and electrically insulating cement paste, the material bonds well to metal, ceramics and glass.

• Use Temperature: 1,800 F
• Tensile Strength (Break): 410 psi
• Dielectric Strength: 1.2954000000000028 to 50.800000000000104 kV/in
• Dielectric Constant (Relative Permittivity): 3.5 to 6

Description: The ATN3590 family of fixed resistive attenuators are integrated circuits comprising thin film resistors and through-die vias that provide excellent attenuation flatness from low frequency to 40 GHz or higher. These attenuators are available from 0 to 30 dB. The ATN3590 attenuator

• Attenuation: 20 dB
• Attenuator Type: Fixed

Description: competencies in a wide variety of traditional and innovative die cutting technologies. Conventional die cutting capabilities include manual flatbed die cut, automated flatbed die-cut and high speed flatbed die-cut, laser prototyping, laminating, water jet

• Applications: Adhesives / Tape, EMI / RFI Shielding, Insulation, Seals / Gasketing, Sheet / Film
• Processes: Assembly, Die Cutting, Laminating, Specialty / Other
• Materials: Foam / Porous Materials, Plastic, Rubber / Elastomer
• Features: Midwest US Only, North America, Southwest US Only, United States Only

Description: bonding. High Vacuum Furnace Applications MEMS Package Sealing Infrared Sensor Package Sealing Crystal Oscillator Package Sealing Hermetic Package Sealing Wafer Level Packaging Void-Free Eutectic Die Attach Low Moisture Package Sealing Nobel Gas Miniature Lamp Sealing Military

• Type: Factory / Free Standing
• Vacuum / Pressure Range: High Vacuum (< 10-3, >10-8 torr)
• Features: Integral Process Controller, MEMS, Other

Description: API Technologies' LTCC is an alternative glass-ceramic multilayer substrate medium that incorporates conventional thick-film-material metal systems, providing a rugged, cost competitive substrate that can incorporate embedded passive components, along with more advanced devices such as

Description: 0.508mm) and corona treated with a matte-finish bonding side, the MABS/TPU mix gives the material excellent abrasion resistance, elasticity, and shear strength. The high-gloss surface enhances and protects printed and die cut graphics and is perfect for clear coating and silkscreen

• Overall Thickness: 0.02 inch
• Overall Width: 13 inch
• Tensile Strength (Break): 5,656.43673493068 psi
• Tensile Modulus: 72.51841967859849 ksi

Description: between the thick film and ceramic substrate. The Ni plating provides a surface that is compatible with brazing (e.g., with CuAg eutectic braze) or subsequent plating. A gold plating atop the Ni provides a surface compatible with Au or Al wire bonding, and die attach with AuSi

• Material Type: Alumina / Aluminum Oxide, Beryllia / Beryllium Oxide
• Shape / Form: Bar Stock
• Features: Dielectric Ceramic

Description: Parts Rubber to Metal Bonding Die Cut Specialty Gaskets SPECIALTY ROLLER COVERING Pulp Mill rollers with a full range of hardness’s. Glue Spreaders, Paper Rolls, Winders and every other type of industrial rollers of all descriptions from 2″ long up to 25 feet long. Your roller covering

• Overall Thickness: 0.03125 to 1 inch
• Overall Length: 2.5 to 300 inch
• Form / Shape: Extruded Profile, Film / Sheet
• Industry: General Industrial