Products & Services
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Supplier: MacDermid Alpha Electronics Solutions
Description: . It offers typical Argomax reliability while enabling lower temperature and pressure lamination, which results in faster processing and accommodates larger DTF component sizes. This product is compatible with leading bonders for die attach film and supports both spacers and
- Applications: Electronics / Microelectronics
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Supplier: MacDermid Alpha Electronics Solutions
Description: Die Transfer Film (DTF) processes, it supports a wide range of surfaces and is customized for fast, easy die and clip lamination. The film forms a pure silver bond line that provides high thermal and electrical conductivity. Designed for low-pressure sintering, it
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Supplier: MacDermid Alpha Electronics Solutions
Description: printing, dispensing, and drying process steps. Specifically developed for die attachment using a low-pressure sintering process, it is designed to meet the needs of high-volume manufacturing. Formulated with highly engineered silver particles, the film delivers consistent bond
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Supplier: Master Bond, Inc.
Description: Master Bond FL901S Polymer System is a high performance silver filled unsupported epoxy resin based adhesive film which offers outstanding performance characteristics and does not require refrigerated storage although refrigeration is recommended to maximize the shelf life. This
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 3.33E-5 to 1.11E-4 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Description: LOCTITE® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. Thin, uniform bondline control Provides RF/EMI shielding Electrically conductive in x, y, z axes Excellent electrical
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry: OEM / Industrial
- Thermal Conductivity: 6.5 W/m-K
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Supplier: Mactac
Description: Double coated film that provides high tack and peel to a wide variety of substrates. Tight release for small die-cut parts or narrow rolls.
- Adhesive: Specialty / Other
- Carrier / Backing Material: Rubber
- Width: 54 inches
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Supplier: DuPont Electronics & Imaging
Description: DuPont™ Pyralux® FR products are acrylic-based flame retardant copper clad laminates, coverlays, bonpdplys and sheet adhesives for products requiring UL rating. Features: High bond strength High thermal resistance No refrigeration required
- Chemical / Polymer System Type: Specialty / Other, Acrylic / Polyacrylate
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
- Industry Applications: OEM / Industrial
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Supplier: DuPont Electronics & Imaging
Description: High bond strength High thermal resistance Halogen-free Low outgassing, NASA data available No refrigeration required for storage Able to withstand multiple lamination cycles without degradation Two-year product performance warranty
- Chemical / Polymer System Type: Specialty / Other, Acrylic / Polyacrylate
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
- Industry Applications: OEM / Industrial
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Supplier: Can-Do National Tape
Description: 3M 9824 Clear Double Sided Film 3M 9824 Double Coated Tape is a 6.3 mil tape with 340 High Tack Acrylic Adhesive and a 0.5 mil Clear Polyester Film (PET) carrier on a 3.2 mil White 55# Densified Kraft Paper (DK) liner. High tack Excellent bonding to foam and
- Adhesive: Pressure Sensitive (PSA)
- Type: Double-Sided Adhesive
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Supplier: Boyd
Description: Screen display technologies require supporting components that enable them to function or enhance performance. From screen bonding systems to vibration management, optically clear adhesive (OCA), window tape, barrier film and thermal management, LCD and/or OLED display technologies
- Enhancement / Function: Anti-static / ESD Control, Dielectric / Insulating, EMI / RFI Shielding
- Features: Hard Coat / Thin Film, Moisture / Vapor Barrier, Thermally Insulating / Insulative, Transparent
- Film Material: PET / Polyester, Acrylic / Acrylate
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Supplier: Electro Optical Components, Inc.
Description: trinamiX bare chip infrared detectors are protected by a thin-film encapsulation. They can be directly wire-bonded to printed circuit boards. Bare chip solutions enable small, flexible and very efficient devices. Bare chip New encapsulation technology (patent pending) Fully wire
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Supplier: Phelps Industrial Products
Description: Novaphit SSTC is made of high quality, expanded graphite and an expanded metal insert made from acid-proof-stainless steel AISI 304 - 1.4404, mesh (3 mm wide). Under high pressure the expanded graphite particles are compressed to films without adding any binders or fillers. The expanded
- Gasket Type: Sheet / Die-cut
- Material: Graphite
- Thickness: 0.0200 to 0.0790 inch
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Supplier: Sauereisen, Inc.
Description: good candidate for those applications where an inorganic bond is required between component parts and only small clearances are available. No. 2 exhibits good coating properties. Thin film sections have shown exceptional flexural and tensile strength for a ceramic adhesive. Sauereisen
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Composition: Unfilled
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 962 TC A/B is a shear-thinning, easydispensing, non-slump, addition-curing, two part silicone rubber that cures at room temperature to a soft, flexible and tacky rubber with excellent thermal conductivity.
- Chemical / Polymer System Type: Silicone
- Composition: Two Component System
- Cure Type / Technology: Air Setting / Film Drying, Thermosetting / Crosslinking
- Dielectric Strength: 178 kV/in
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK ECF 561E, Rubberized Epoxy, Assembly, Electrically Conductive Die Attach Adhesive LOCTITE® ABLESTIK ECF 561E electrically conductive die attach adhesive is designed for bonding materials with severely mismatched coefficients of thermal expansion. When used for
- Adhesive: Epoxy
- Backing: Specialty / Other
- Thickness: 1.00E-3 inches
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Supplier: MacDermid Alpha Electronics Solutions
Description: Aluminum nitride-filled thermoplastic film for electronics, offering strong bonding for MCMs and reworkability. Product Overview STAYSTIK 682 Thermoplastic Adhesive Film is designed for a variety of electronic applications and delivers excellent bonding performance. It is
- Applications: Electronics / Microelectronics
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Supplier: Budnick Converting, Inc.
Description: and pressure is applied over a certain period of time. After curing, tesa® HAF 8405 reaches a very high bonding strength, high temperature stability and excellent chemical resistance. Because of the rubber components tesa® HAF 8405 remains flexible and elastic. tesa® HAF 8405 is supplied with
- Adhesive: Specialty / Other
- Thickness: 0.0012 inches
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Supplier: Budnick Converting, Inc.
Description: application, heat and pressure is applied over a certain period of time. After curing, tesa® HAF 8402 reaches a very high bonding strength, high temperature stability and excellent chemical resistance. Because of the rubber components, tesa® HAF 8402 remains flexible and elastic. tesa® HAF
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Supplier: Epoxies Etc...
Description: 40-3920 is a one component electrically conductive ink. 40-3920 is a silver filled polymer system which exhibits outstanding adhesion to a variety of substrates, such as kapton, mylar, glass, polyester, ceramic, etc. This thick film ink provides excellent conductivity for many electronic
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Single Component System, Filled
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
- Features: Electrically Conductive Compound (Adhesive, Grease)
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Supplier: Epoxies Etc...
Description: 40-3914 is a one component electrically conductive ink. This Polymer system was developed to provide a good balance of low cost and high conductivity. This thick film ink provides conductivity for many electronic and industrial applications. 40-3914 exhibits outstanding adhesion to a variety
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Single Component System, Filled
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
- Features: Electrically Conductive Compound (Adhesive, Grease)
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors), Optoelectronics / Photonics, Semiconductors / IC Packaging
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Supplier: Redwood Plastics
Description: Extruded Profiles Rubber Lining Fabricated Parts Molded Parts Rubber to Metal Bonding Die Cut Specialty Gaskets SPECIALTY ROLLER COVERING Pulp Mill rollers with a full range of hardness’s. Glue Spreaders, Paper Rolls, Winders and every
- Chemical / Polymer System Type: Specialty / Other
- Filler Material: Unfilled
- Industry: General Industrial
- Overall Length: 2.5 to 300 inch
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Supplier: Redwood Plastics
Description: Extruded Profiles Rubber Lining Fabricated Parts Molded Parts Rubber to Metal Bonding Die Cut Specialty Gaskets SPECIALTY ROLLER COVERING Pulp Mill rollers with a full range of hardness’s. Glue Spreaders, Paper Rolls, Winders and every
- Chemical / Polymer System Type: Isoprene, Specialty / Other
- Filler Material: Unfilled
- Industry: General Industrial
- Overall Length: 2.5 to 300 inch
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Supplier: Redwood Plastics
Description: Extruded Profiles Rubber Lining Fabricated Parts Molded Parts Rubber to Metal Bonding Die Cut Specialty Gaskets SPECIALTY ROLLER COVERING Pulp Mill rollers with a full range of hardness’s. Glue Spreaders, Paper Rolls, Winders and every
- Chemical / Polymer System Type: Specialty / Other
- Filler Material: Unfilled
- Industry: General Industrial
- Overall Length: 2.5 to 300 inch
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Supplier: Redwood Plastics
Description: Extruded Profiles Rubber Lining Fabricated Parts Molded Parts Rubber to Metal Bonding Die Cut Specialty Gaskets SPECIALTY ROLLER COVERING Pulp Mill rollers with a full range of hardness’s. Glue Spreaders, Paper Rolls, Winders and every
- Chemical / Polymer System Type: Specialty / Other
- Filler Material: Unfilled
- Industry: General Industrial
- Overall Length: 2.5 to 300 inch
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Supplier: Boyd
Description: , cleanliness and complex material combination needs. Boyd has the ability to join and bond plastics and specific parts by ultrasonic welding or RF welding, depending on the source material. Efficient Rotary Die-Cutter Our advanced rotary die cut converting core competencies
- Capabilities: Adhesives / Tape, EMI / RFI Shielding, Insulation, Seals / Gasketing, Sheet / Film
- Location: North America, United States Only, Southwest US Only, Midwest US Only
- Materials: Foam / Porous Materials, Plastic, Rubber / Elastomer, Specialty / Other
- Services: Assembly, Die Cutting, Laminating, Specialty / Other
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Supplier: Plansee SE
Description: compacting of the metal powder through to the forming, machining and bonding of our targets: including the development of new materials to optimize your coating processes and films. And naturally we also verify the quality of our targets using state-of-the-art measuring methods. You
- Type: Sputtering Target
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Supplier: JBC Technologies, Inc.
Description: Flexible Materials Converting JBC Technologies is a flexible materials converter that provides innovative die-cut solutions to leading manufacturers. Customers benefit from our diverse processing capabilities that include precision die-cutting, laminating, slitting, surface
- Capabilities: Adhesives / Tape, EMI / RFI Shielding, Insulation, Seals / Gasketing, Sheet / Film
- Location: North America, United States Only, Northeast US Only, Midwest US Only
- Materials: Ceramic / Glass, Foam / Porous Materials, Laminate / Composite, Plastic, Rubber / Elastomer, Textile / Fabrics, Specialty / Other
- Services: Assembly, Cutting, Die Cutting, Heat Sealing, Laminating, Sheeting, Slitting, Rewinding
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Supplier: Bemis Manufacturing Company
Description: Injection Technology Have you heard the terms co-injection, over-molding, two-shot/two-color, soft touch, insert, gas-assisted, endothermic foam core, rotating die technology, in-mold decorating, 2-position or 2-component molding? How about multi-drop gate sequencing, 3-plate
- Location: North America, United States Only, Midwest US Only
- Molding Type: Film Insert Molding (FIM), Gas Injection Molding (GIM), Thermoplastic Injection Molding
- Services Offered: Clean Room Molding, Insert Molding / Overmolding, Large Part Molding, Two-shot Injection Molding, High Volume Production (Long Runs), Assembly Services, Bonding, Design Assistance, Graphics, Hot Stamping Services, Just-In-Time Capability, Packaging / Shipping, Other
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Supplier: Crown Plastics Co., Inc.
Description: . Thin-gauge (.020" / 0.508mm) and corona treated with a matte-finish bonding side, the MABS/TPU mix gives the material excellent abrasion resistance, elasticity, and shear strength. The high-gloss surface enhances and protects printed and die cut graphics and is perfect for clear
- Chemical / Polymer System Type: Polyurethane (PU), Specialty / Other, ABS
- Elongation: 300 %
- Industry: General Industrial, Other
- Overall Thickness: 0.0200 inch
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Supplier: U.S. Plastic Corporation
Description: . It die-cuts and punches easily, and can be bonded or fastened with adhesives, ultrasonic welding, or rivets. In addition, Vivak is easily decorated by painting, silk screening, or hot stamping. Easy to fabricate, form, bond, and decorate, Vivak PETG sheet products are well suited for
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Supplier: Cymbet Corporation
Description: EnerChip CBC001-BDC is a 1uAh (Lifecycle Capacity = .5mAh) rechargeable 1.375mm x0.85mm x 200 microns thick solid state battery bare die to be co-packaged using wire bond attachment with other integrated circuits in a single package or multi-chip module.
- Capacity, Amp Hours (AH): 1.00E-6 ampere-hr
- Specialty Cells: Thin Film
- Standard Battery Sizes: Other
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 5025E, Epoxy Film, Die attach LOCTITE® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. Thin, uniform bondline control Provides RF/EMI shielding
- Chemical / Polymer System Type: Epoxy (EP)
- Features: Thermal / Heat Conductive
- Industry: Military / Government (MIL-SPEC / GG)
- Thermal Conductivity: 6.5 W/m-K
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Description: Dupont(TM) Surlyn Film with acrylic pressure sensitive adhesive and 92lb liner. Applications Surface protection. Paintline hanger tab for automotive plastic parts. Automotive squeak and rattle protection. Features & Benefits Tough and durable. Transparent. High bond strength. Excellent
- Adhesive: Acrylic
- Features: Protective Tape, Transparent
- Peel Strength / Adhesion: 5.62 lbs/in
- Temperature Resistance: -40 to 28.33 C
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Supplier: Season Group
Description: Services include: Design and Engineering Electronic Circuit Card Assembly Cable and Harness Assembly Plastic Injection Moldiing Mold and Die Manufacturing Sheetmetal Forming Thermoforming Turnkey Box-Build Our
- Industry: Automotive, Consumer, Electrical / Electronics, General Industrial, Medical, Military / Law Enforcement, Telecommunications
- Location: North America, United States Only, Northeast US Only, Southern US Only, Southwest US Only, Northwest US Only, Midwest US Only, Canada Only, South / Central America Only, South Asia Only, Near East Only, East Asia / Pacific Only
- Molding Type: Film Insert Molding (FIM), Gas Injection Molding (GIM), Structural Foam Molding, Thermoplastic Injection Molding, Thermoforming (Vacuum or Pressure), Vacuum Forming
- Services Offered: Clean Room Molding, Insert Molding / Overmolding, Large Part Molding, Micro Molding, Two-shot Injection Molding, Prototype / Market Entry Molding, Low Volume Production (Short Runs), High Volume Production (Long Runs), Assembly Services, Tool / Mold Making, Bonding, Design Assistance,
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Supplier: Argent International, Inc.
Description: We make sure you get the most from your die-cut product. With the capability to produce unlimited part configurations and the largest available selection of products, features, and finishing options, we'll produce a self-adhesive solution optimized for both your application and assembly
- Cutting: CNC Cutting, Laser Cutting, Other
- Location: North America, United States Only, Southern US Only, Midwest US Only, Other
- Materials: Metals, Plastics, Rubber, Composites, Foam, Other
- Services Offered: CAD / CAM Support, Design Assistance, Prototype Services, Low Volume Production, High Volume Production, Inspection / Quality Control
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Supplier: Materion Corporation
Description: of adhesive strength between the thick film and ceramic substrate. The Ni plating provides a surface that is compatible with brazing (e.g., with CuAg eutectic braze) or subsequent plating. A gold plating atop the Ni provides a surface compatible with Au or Al wire bonding, and
- Applications: Dielectric / Electrical Insulation
- Material Type: Alumina / Aluminum Oxide, Beryllia / Beryllium Oxide
- Shape / Form: Bar Stock
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Supplier: APITech
Description: and wire bonded bare die. Cavities can be configured in an LTCC substrate to provide controlled-impedance wire bond connections and high-reliability packaging solutions. Contact us today for implementation guidance for selecting the appropriate substrate and component technology for
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Description: converting processes. Provides printable film reinforcement for EKG top cover designs. The liner provides good die cut ability and ease of removability to expose adhesive.
- Adhesive: Rubber
- Carrier / Backing Material: PET / Polyester, Plastic / Polymer
- Type: Single-Sided Adhesive
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Supplier: Skyworks Solutions, Inc.
Description: The ATN3590 family of fixed resistive attenuators are integrated circuits comprising thin film resistors and through-die vias that provide excellent attenuation flatness from low frequency to 40 GHz or higher. These attenuators are available from 0 to 30 dB. The ATN3590 attenuator
- Attenuation: 30 dB
- Attenuator Type: Fixed
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Supplier: Skyworks Solutions, Inc.
Description: The ATN3590 family of fixed resistive attenuators are integrated circuits comprising thin film resistors and through-die vias that provide excellent attenuation flatness from low frequency to 40 GHz or higher. These attenuators are available from 0 to 30 dB. The ATN3590 attenuator
- Attenuation: 4 dB
- Attenuator Type: Fixed
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Supplier: Skyworks Solutions, Inc.
Description: The ATN3590 family of fixed resistive attenuators are integrated circuits comprising thin film resistors and through-die vias that provide excellent attenuation flatness from low frequency to 40 GHz or higher. These attenuators are available from 0 to 30 dB. The ATN3590 attenuator
- Attenuation: 8 dB
- Attenuator Type: Fixed
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Supplier: Skyworks Solutions, Inc.
Description: The ATN3590 family of fixed resistive attenuators are integrated circuits comprising thin film resistors and through-die vias that provide excellent attenuation flatness from low frequency to 40 GHz or higher. These attenuators are available from 0 to 30 dB. The ATN3590 attenuator
- Attenuation: 20 dB
- Attenuator Type: Fixed
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Supplier: Can-Do National Tape
Description: surfaces, including low surface energy (LSE) plastics like polypropylene and powder-coated paints. The 2.8 mil acrylic adhesive also provides adhesion to machine parts or other surfaces lightly contaminated with oil. The film carrier on this tape provides excellent slitting and
- Adhesive: Pressure Sensitive (PSA)
- Type: Double-Sided Adhesive
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Supplier: VPT, Inc.
Description: applications. The HTD Series utilizes thick film hybrid microcircuit technology that provides superior reliability in high temperature applications. Bare semiconductor die are integrated with passive components using thick film conductors on a ceramic substrate. Component attach
- DC Input Voltage: 14 to 40 volts
- DC Output Current: 0.0 to 300 amps
- DC Output Power: 1.5 watts
- DC Output Voltage: 5 to 12 volts
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Supplier: Vicone High Performance Rubber Inc.
Description: product design or simply choosing the best suited material for your specific application. It™s our goal to help you reach your performance objectives so you can be at your best. Capabilities Lathe Cutting Die Cutting Water Jet Cutting Slitting
- Cutting: Abrasive Jet Machining (AJM), Abrasive Wheel Cutting, CNC Cutting, Router, Water Jet Cutting
- Location: North America, Canada Only, East Asia / Pacific Only
- Materials: Plastics, Rubber, Composites, Foam
- Services Offered: CAD / CAM Support, Design Assistance, Prototype Services, Low Volume Production, High Volume Production, Inspection / Quality Control
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Supplier: Custom Fabricating & Supplies
Description: commonly sought for die cutting applications. With its stand-out color and thick backing, the tape leaves highly visible cut lines. The tape's acrylic adhesive provides a strong bond on many surfaces including metal, glass, wood and many plastic Product Features Operates at
- Adhesive: Acrylic
- Peel Strength / Adhesion: 1.44 lbs/in
- Width: 1 to 3 inches
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Supplier: Custom Fabricating & Supplies
Description: 3M™ Anodization Masking Tape 8985L has a tough polyester carrier to stand up to chromic acid anodization baths (Type I anodization). It features a non-silicone rubber adhesive to minimize the risk of silicone contamination that could impact downstream processes such as bonding or paint
- Adhesive: Rubber
- Carrier / Backing Material: PET / Polyester, Plastic / Polymer, Specialty / Other
- Features: Transparent
- Width: 0.5000 to 48 inches
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Supplier: Haida International Equipment Co., Ltd.
Description: information. This tape universal test equipment can do tensile test, tear test, peel test, bond test with different clamps main for all kind of tape and paper, film,High-temperatur e tape, double-sided tape, insulating tape, special tape, pressure sensitive tape, die-cutting
- Application Software: Yes
- Display / Interface: Computer Interface
- Force / Load Capacity: 4.41 to 55.12 lbs
- Mechanical Test: Universal
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Supplier: Can-Do National Tape
Description: roll gapping to incorporate heat into the laminating process. The nip roll allows for the lamination of products of different thicknesses. This state-of-the-art heating system ensures a consistent bond across the web. Additionally, Can-Do possesses two and three roll rewind stations and take
- Capabilities: Production Low Volume, Production - High Volume
- Industry: Aerospace, Appliances, Automotive, Electrical / Electronics, General Industrial, Medical, Packaging, Other
- Location: North America, United States Only, Southern US Only
- Materials: Other
Find Suppliers by Category Top
Featured Products Top
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for die-to-die (D2D), die-to-wafer (D2W) and wafer-to-wafer (W2W) bonding. Learn more about product features and applications. (read more)
Browse Plating Chemicals and Anodizing Chemicals Datasheets for MacDermid Alpha Electronics Solutions -
specialty, and can be machined into the structures. Nanometer-Level Flatness/Thickness Control, and Sub-Arcsec Geometry Tolerances Our production experts can control global flatness, local (die-level) flatness, and total thickness variation (TTV) down to nanometer level (read more)
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Conduct Research Top
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Failure Analysis of Die Bond Adhesion Failures Caused by Silicone Contamination
This paper presents a case history of a failure analysis performed on a die bond adhesion failures. Silicone contamination caused intermittent adhesive failures at the die back metallization/conductive epoxy interface. The source of the silicone contamination was identified as the adhesive film
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Multichip packaging technology with laser-patterned interconnects
The thin- film die bond provides very efficient heat transfer from the chips to the substrate.
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Movie magic | In-depth | The Engineer
… effects are part and parcel of big-budget film-making, as seen in this autumn's imminent top box-office releases Lord of the Rings: the TwoTowers, Harry Potter and the Chamber of Secrets and the new James Bond film Die Another Day.
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As worn by 007 | Optician
The last Bond film Die Another Day raised a record £44m from product placement.
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Materials for Advanced Packaging
S. Takeda, T. Masuko, M. Yusa, Y. Miyadera, ‘‘ Die Bonding Adhesive Film ’’, Hitachi Chemical Technical Report, No. 24, 25 (Jan. 1995) 24.
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Low-Temperature Pressure-Less Silver Direct Bonding
In the normal production process of LED, back faces of small LED dies are attached on an adhesive layer of a die - bonding film , which has an adhesive layer only on the surface, to handle many dies at one time.
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Innovations in thermoplastic die attach adhesives for microelectronic packaging
Bonding Equipment Die Bonding using film , ribbon or, preforms, can be accommodated on a number of current and readily available die bonding systems.
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Film chip interconnect systems prepared by wet chemical metallization
Substrate Preparation And Die Bonding Polyimide films (Kapton) with a thickness of 50 pin were used as basic material in the investigations.
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Integration of intra chip stack fluidic cooling using thin-layer solder bonding
[11] Madhour, Y., Brunschwiler, T., El Kazzi, M., Thome, J.R., Michel, B., “Patterned die-to- die thin film bonding for 3D chip stacks with integrated microfluidic cooling”, International Conference on Electronic Packaging Technology and High Density Packaging, 2012.
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Lead Bonding Techniques and Physics of Failure Considerations
A problem more diffi- cult to detect relates to the presence of voids in the die - bond film , or (for high power devices) in the film attaching the die-bond metal plate to a (usually copper) heat dissi- pator.
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The practical weft hand detection The PVAL- method in comparison with triggers with film
In North Rhine-Westphalia for example the procedure of the country criminal office (LKA) is set: first, the Tape-lift blotted becomes the thumb-index finger region with a pin sample carrier so-called ( dies with adhesive film for the scanning electron …
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