Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: Accuris
Description: Dielectric Embossing Pad
-
Supplier: Accuris
Description: Heel Pad, Floor Carpet - Dielectric Bond Strength
-
Supplier: Accuris
Description: Door and Quarter Panel Trim Pad Dielectric Tufting Felt
-
-
Supplier: ValueTronics International, Inc.
Description: guard circuit for highly accurate measurements Accessories: Ground connection cable, 10 ft [3 m] kV/MΩ test record graph paper (100-sheet pad) Power cord, Cat. No. 220015 Instruction manual, Cat. No. 220005 Instruction manual, Cat. No. 220015 Applications: Megger portable dc dielectric
-
Supplier: Henkel Corporation - Electronics
Description: Sil-Pad K-4 uses a specially developed film which has high thermal conductivity, high dielectric strength and is very durable. Sil-Pad K-4 combines the thermal transfer properties of well-known Sil-Pad rubber with the physical properties of a film. Sil-Pad K-4 is a
- Industry: Electronics
-
Supplier: Henkel Corporation - Electronics
Description: Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding aerospace and commercial applications. Sil-Pad 2000 is a silicone elastomer formulated to maximize the thermal and dielectric performance of the filler/binder matrix. The result is a
- Industry: Electronics
-
Supplier: Henkel Corporation - Electronics
Description: In addition to excellent heat transfer and dielectric properties, Sil-Pad 980 is specially formulated for high resistance to crushing and cut-through typically found in high-pressure applications where surface imperfections such as burrs and dents are inherently common (e.g.
- Industry: Electronics
-
Supplier: Henkel Corporation - Electronics
Description: Poly-Pad K-4 is a composite of film coated with a polyester resin. The material is an economical insulator and the film carrier provides excellent dielectric and physical strength. Polyester-based, thermally conductive insulators from Bergquist provide a complete family of material for
- Features: Electrically Conductive, Thermally Conductive
- Industry: Electronics
-
Supplier: Oak-Mitsui Technologies - FaradFlex®
Description: This material is a filled dielectric which contains a high Dk ceramic powder. The thicknesses available include 25 and 16um. Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated capacitor foils, and materials for
- Thickness: 0.0006299212598425197 to 0.000984251968503937 inches
- Features: Dielectric / Insulating
-
Supplier: Eaton Cooper Power Systems
Description: insulation system approach — comprised of thermally upgraded kraft paper, Envirotemp™ FR3™ dielectric fluid, and an optimized core and coil design — a 75 °C Average Winding Rise (AWR) PEAK transformer results in a smaller footprint and a lighter unit capable of the same ratings as a
- Power Rating (VA): 10,000 to 167,000 VA
- Output Type: AC
- Transformer Type: High-Voltage Transformer, Power Transformer, Single Phase Transformer
- Cooling Method: Oil Filled
-
Supplier: Eaton Cooper Power Systems
Description: insulation system approach — comprised of thermally upgraded kraft paper, Envirotemp™ FR3™ dielectric fluid, and an optimized core and coil design — a 75 °C Average Winding Rise (AWR) PEAK transformer results in a smaller footprint and a lighter unit capable of the same ratings as a
- Maximum Primary Voltage Rating: 2,400 to 46,000 volts
- Maximum Secondary Voltage Rating: 120 to 14,400 volts
- Power Rating (VA): 45,000 to 12,000,000 VA
- Output Type: AC
-
Supplier: Shenzhen You-San Technology Co., Ltd.
Description: Thermally conductive silicone pad is a kind of thermally conductive medium, which is used to reduce the contact thermal resistance between the surface of the heat source and the contact surface of the heat dissipation device. It is specially produced for the design scheme of using the gap to
- Thickness: 0.011811023622047244 to 0.47244094488188976 inches
- Temperature Resistance: -40 to 200 C
- Features: Anti-static / ESD Control, Dielectric / Insulating, Electrical, Electrically Conductive, Other
- Backing: Plastic / Polymer
-
Supplier: Henkel Corporation - Industrial
Description: BERGQUIST SIL PAD TSP 1500, Electrically Insulating, Thermally Conductive Elastomeric Material BERGQUIST® SIL PAD TSP 1500 is a silicone elastomer formulated to maximize the thermal and dielectric performance of the filler/binder matrix. The result is a grease-free, conformable
- Use Temperature: 76 to 392 F
- Thermal Conductivity: 0.2 W/m-K
-
Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best
- Applied Thickness / Gap Fill: 0.01968505 to 0.393701 inch
- Use Temperature: -76 to 392 F
- Thermal Conductivity: 2.2 W/m-K
- Tensile Strength (Break): 108.77762951789775 psi
-
Supplier: Newark, An Avnet Company
Description: THERMAL PAD; Insulator Body Material:PI (Polyimide) Film; Thermal Conductivity:1.3W/m.K; Breakdown Voltage Vbr:6kV; Thickness:0.152mm; Volume Resistivity:10ohm-m; Thermal Impedance:0.86°C/W; Dielectric Strength:-; Product Range:- RoHS Compliant: Yes
-
Supplier: Newark, An Avnet Company
Description: GAP PAD, 2MM; Thermal Conductivity:0.8W/m.K; Conductive Material:Filled Silicone Polymer; Thickness:2mm; Thermal Impedance:-; Dielectric Strength:-; External Length:-; External Width:-; Product Range:-; Breakdown Voltage Vbr:6kV RoHS Compliant: Yes
-
Supplier: Newark, An Avnet Company
Description: GAP PAD, VO SOFT; Thermal Conductivity:0.8W/m.K; Conductive Material:Filled Silicone Polymer; Thickness:5.08mm; Thermal Impedance:-; Dielectric Strength:-; External Length:-; External Width:100mm; Product Range:-; Overall Width:100mmRoHS Compliant: Yes
-
Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and
- Applied Thickness / Gap Fill: 0.009842525 to 0.017716545 inch
- Use Temperature: -76 to 356 F
- Thermal Conductivity: 4.5 W/m-K
- Dielectric Strength: 4 to 6 kV/in
-
Supplier: Newark, An Avnet Company
Description: THERMAL PAD, TO-220; Thermal Conductivity:1.3W/m.K; Thickness:0.152mm; Thermal Impedance:0.86°C/W; Dielectric Strength:-; Product Range:-; Breakdown Voltage Vbr:6kV; Insulator Body Material:PI (Polyimide) Film; Packages Cooled:TO-220RoHS Compliant: Yes
-
Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY T-top99-s offers outstanding thermal conductivity at 24.0 W/m*K and extremely low thermal resistance under minimal force.T-top99-s offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat.
- Applied Thickness / Gap Fill: 0.01968505 to 0.393701 inch
- Use Temperature: -76 to 302 F
- Thermal Conductivity: 24 W/m-K
- Dielectric Strength: 8 kV/in
-
Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY TEM96D is a thermally conductive absorber based upon soft magnetic materials dispersed in a polymeric resin. It has a thermalconductivity of 5.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues.
- Applied Thickness / Gap Fill: 0.01968505 to 0.393701 inch
- Use Temperature: -76 to 356 F
- Thermal Conductivity: 5 W/m-K
- Features: Aerospace, Automotive, EMI / RFI Shielding Material, Electrical Insulation / Dielectric, Laminating Adhesive / Composite Resin, Marine, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other, Specialty / Other, Thermal Compound / Interface (Thermally Conductive), Tooling / Mold Material, UL
-
Supplier: IPC International, Inc.
Description: in the vicinity of the solder joints. This document provides test methods to evaluate the susceptibility of printed board assembly (PBA) materials and designs to cohesive dielectric failure underneath surface mount technology (SMT) attach pads. The test methods, which include pin-pull,
-
Description: applies to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 1, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for
-
Description: applies to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 2, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for
-
Supplier: CSA Group
Description: IEC 60384-23:2015 is applicable to fixed surface mount capacitors for direct current, with metallized electrodes and polyethylene naphthalate dielectric for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted
-
Supplier: CSA Group
Description: IEC 60384-20:2015 applies to fixed surface mount capacitors for direct current, with metallized electrodes and polyphenylene sulfide dielectric for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted directly
-
Description: IEC 60384-22:2019 is applicable to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 2, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or
-
Description: IEC 60384-20:2015 applies to fixed surface mount capacitors for direct current, with metallized electrodes and polyphenylene sulfide dielectric for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted directly
-
Supplier: CSA Group
Description: IEC 60384-21:2011 is applicable to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 1, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or
-
Supplier: Safety Glasses USA
Description: comfort. Dielectric. NRR 26db
-
Supplier: 3X Ceramic Parts Company Limited
Description: Specific Heat j/kg*K 880 880 880 Thermal Shock Resistance °C 250 200 200 Max UseTemperature °C 1700 1700 1750 Electrical Dielectric Strength ac-kv/mm 8.3 8.7 8.7 Dielectric Constant / 9 9.6 9.8 Loss Tangent / 0.0011 0.0002 0.0002 Volume Resistivity ohm•cm >1014 >1014 >1014
- Density: 3.5999977279425903 to 3.9399975133593905 g/cc
- Coeff. of Thermal Expansion (CTE): 8.2 to 8.4 µm/m-C
- MOR / Flexural Strength: 50,037.70957823296 to 54,968.96211637766 psi
- Compressive / Crushing Strength: 304,577.3626501137 to 377,095.7823287122 psi
-
Supplier: Eaton Cooper Power Systems
Description: Envirotran™ transformers are the industry’s first transformers to use an edible vegetable oil-based, high-fire-point dielectric coolant. This technological and environmental design breakthrough is the result of years of research and development in dielectric fluids and their use in
- Output Type: AC
- Transformer Type: High-Voltage Transformer, Power Transformer, Substation Transformer
- Mounting: Pad-Mounted
- Features: Power / Power System / Distribution Transformer
Find Suppliers by Category Top
Featured Products Top
-
pads are ceramic materials with outstanding properties such as high thermal conductivity and high electrical resistance. In addition, it features advantages such as high hardness, corrosion resistance, low dielectric constant and dielectric loss, and low CTE. Aluminum nitride (read more)
Browse Aluminum Oxide and Alumina Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
providing electrical insulation.They feature high dielectric breakdown strength,good thermal conductivity,tear resistance,and more.These properties help prevent accidents such as leakage or breakdowns.Additionally,silicone insulator pads are highly temperature-resistant,preventing degradation or aging (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
. This self-adhesive thermal pad combines excellent compressibility with high dielectric strength of over 8 kV/mm, helping battery designers protect sensitive cells and nearby components in demanding high-voltage environments. Its soft (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
As electric vehicles become more prevalent, wireless charging technology has garnered widespread attention. However, the persistent issue of heat generation during wireless charging has long troubled the industry. Thermal conductive silicone pads, with their superior thermal conductivity and (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
Designing thermal management for a coffee-machine heater means balancing three practical constraints: the pad must shrink predictably during processing, conduct heat efficiently away from the heater, and—where applicable—provide high dielectric (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
overcome space issues resulting from high I/O, fine pitch components. To achieve the density required in HDI designs, line width, spacing, hole diameters and pad sizes must all shrink. Reducing copper foil thickness on inner layers, reducing dielectric spacing to maintain low drill aspect ratios (read more)
Browse Electrical and Electromechanical Assembly Services Datasheets for Summit Interconnect -
, enhanced production reliability, and extended maintenance intervals..Benefits: Long contact life, low wear, tested to over 500K insertions ? Provides reliable and consistent contact for Matte Tin or NiPdAu pads, low contact (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
resistance. Unlike conventional pastes or pads, it then chemically cures into a resilient solid, eliminating pump-out and providing permanent dielectric bonding between heatsink and processor. Key benefits include sustained low thermal resistance under continuous power and thermal cycling (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
. This expansion includes a comprehensive range of thermally conductive gap filling, pads, one-part thermal gels, and thin dielectric sheets, aimed at further advancing our integrated solutions offering. Visit Macdermid Alpha to learn more about our products and solutions. (read more)
Browse Filler Alloys and Consumables Datasheets for MacDermid Alpha Electronics Solutions -
and survive tight clamping and automated handling. Previous insulating films either failed dielectric testing, tore during assembly, or created hot spots that limited system reliability. We supplied SC900FG for trial — a high-performance elastomer insulating sheet built on a (read more)
Browse Thermal Insulating Tapes Datasheets for Dongguan Sheen Electronic Technology Co., Ltd.
Conduct Research Top
-
Silicone Rubber Thermal Interface Materials: Applications and Performance Considerations
Simple composits of silicone rubber, extending filler, and fiberglass offer an attractive combination of thermal, physical, and electric properties that make these materials an ideal choice for use as thermal interface materials. Good dielectric strength and low thermal impedance that is relatively
-
Layout and Physical Design Guidelines for Capacitive Sensing
AN1102 Layout and Physical Design Guidelines for Capacitive Sensing FIGURE 1: EXAMPLE PAD SIZES AND Author: Tom Perme SHAPE Microchip Technology Inc. 0.500 x 0.500 INTRODUCTION (12,7 x 12,7) This application note describes the layout and physical design guidelines used for the capacitive sensing
-
Using FIB for Wafer Lot acceptance and Design Verification
The capabilities of modern FIB machines utterly overshadow the primitive capabilities I so revered from the 80s. In the current era of System-on-Chip (SoC) designs with 10 and 11 metal layers, copper metallizations, exotic dielectric materials, and the use of area pads scattered across the entire
-
Introduction to Capacitive Sensing
a frequency or duty cycle which is changed by the intro- CREATING A GOOD SENSOR duction of additional capacitance from a person's finger A quick background on the natural capacitance of a to ground. Some other methods use charge balancing PCB pad, and the process that occurs when pressing a or rise
More Information Top
Indicates content that may require registration and/or purchase.
-
Electrophotography
ladene of Ti02-Bindemittel-Schicht,aufgetragen on a dielectric document rnit metallic Riickseite, rnit is exposed an image pattern and then quickly rnit a positively prestressed, Burste developed " by leitfahigem magnetic toner that loosely adheres to a magnetic Wake (Abb. 17).
-
IV. Specific scope of application
The electrochemical determination of the Zusarnmensetzung and the thickness of ferromagnetic bel ~ ige on dielectric documents .
-
High permittivity pads reduce specific absorption rate, improve B 1 homogeneity, and increase contrast‐to‐noise ratio for functional cardiac MRI at 3 T
Methods Two high permittivity dielectric pads on the anterior and posterior sides of the thorax were numerically designed and implemented using an aqueous suspension of barium titanate.
-
Quantitative assessment of the effects of high‐permittivity pads in 7 Tesla MRI of the brain
… of the brain close to the pads exhibit significant increases (>100%) in transmit field efficiency, but areas further away show a less pronounced (∼10%) decrease due to the homogenization of the transmit field and the loss introduced by the dielectric pads .
-
Reducing SAR and enhancing cerebral signal‐to‐noise ratio with high permittivity padding at 3 T
Abstract Previous works have shown that placement of a high‐ dielectric pad can improve image intensity in a region adjacent to the pad, or that placement of dielectric pads around a large surface of the head can improve image homogeneity on …
-
Dielectric materials in magnetic resonance
A photograph of such ‘‘ dielectric pads ’’ is shown in Figure 1(b).