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Supplier: Accuris
Description: Dielectric Embossing Pad
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Supplier: Accuris
Description: Heel Pad, Floor Carpet - Dielectric Bond Strength
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Supplier: Oak-Mitsui Technologies - FaradFlex®
Description: This material is a filled dielectric which contains a high Dk ceramic powder. The thicknesses available include 25 and 16um. Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated capacitor
- Features: Dielectric / Insulating
- Thickness: 6.30E-4 to 9.84E-4 inches
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Supplier: ValueTronics International, Inc.
Description: The 15 kV (220015) is a dielectric test set from Megger. Additional Features: Continuously variable test voltage Rugged field construction Compact and portable Air insulated, uses no oil ±2% accuracy Leakage current
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Supplier: ValueTronics International, Inc.
Description: The 5 kV (220005) is a dielectric tester set from Megger. Additional Features: Continuously variable test voltage Rugged field construction Compact and portable Air insulated, uses no oil ±2% accuracy Leakage current
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Supplier: Accuris
Description: Door and Quarter Panel Trim Pad Dielectric Tufting Felt
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Supplier: Henkel Corporation - Electronics
Description: In addition to excellent heat transfer and dielectric properties, Sil-Pad 980 is specially formulated for high resistance to crushing and cut-through typically found in high-pressure applications where surface imperfections such as burrs and dents are inherently common (e.g. heavily
- Industry: Electronics
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Supplier: Henkel Corporation - Electronics
Description: Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding aerospace and commercial applications. Sil-Pad 2000 is a silicone elastomer formulated to maximize the thermal and dielectric performance of the filler/binder matrix. The result is a grease
- Industry: Electronics
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Supplier: Fujipoly® America Corp.
Description: Silicone Gap Filler Pad for Absorption of Electromagnetic Wave Features Effective to absorb and damp a wide range of electromagnetic waves. Also effective as a high performance thermal interface material. Easily filling small gaps of IC chip surface
- Applied Thickness / Gap Fill: 0.0197 to 0.0984 inch
- Chemical / Polymer System Type: Silicone
- Features: Electrical Insulation / Dielectric
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Eaton Cooper Power Systems
Description: -temperature insulation system approach — comprised of thermally upgraded kraft paper, Envirotemp™ FR3™ dielectric fluid, and an optimized core and coil design — a 75 °C Average Winding Rise (AWR) PEAK transformer results in a smaller footprint and a lighter unit capable of
- Cooling Method: Oil Filled
- Mounting / Form Factor: Pad-Mounted
- Other Transformer Types / Applications: High-Voltage Transformer, Power Transformer
- Output Voltage: AC
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Supplier: Eaton Cooper Power Systems
Description: -temperature insulation system approach — comprised of thermally upgraded kraft paper, Envirotemp™ FR3™ dielectric fluid, and an optimized core and coil design — a 75 °C Average Winding Rise (AWR) PEAK transformer results in a smaller footprint and a lighter unit capable of
- Cooling Method: Oil Filled
- Maximum Primary Voltage Rating: 2400 to 46000 volts
- Maximum Secondary Voltage Rating: 120 to 14400 volts
- Mounting / Form Factor: Pad-Mounted
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Supplier: Shenzhen You-San Technology Co., Ltd.
Description: Thermally conductive silicone pad is a kind of thermally conductive medium, which is used to reduce the contact thermal resistance between the surface of the heat source and the contact surface of the heat dissipation device. It is specially produced for the design scheme of using the gap to
- Carrier / Backing Material: Plastic / Polymer, Silicone
- Features: Anti-static / ESD Control, Dielectric / Insulating, Electrically Conductive, Other
- Temperature Resistance: -40 to 200 C
- Thickness: 0.0118 to 0.2362 inches
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice
- Chemical / Polymer System Type: Silicone
- Dielectric Strength: 12 kV/in
- Elongation: 81 %
- Features: Electrical Insulation / Dielectric Material, Thermal Compound / Interface (Thermally Conductive), UL Approved
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice
- Chemical / Polymer System Type: Silicone
- Dielectric Strength: 15 kV/in
- Elongation: 76 %
- Features: Electrical Insulation / Dielectric Material, Thermal Compound / Interface (Thermally Conductive), UL Approved
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Supplier: Henkel Corporation - Electronics
Description: Sil-Pad K-4 uses a specially developed film which has high thermal conductivity, high dielectric strength and is very durable. Sil-Pad K-4 combines the thermal transfer properties of well-known Sil-Pad rubber with the physical properties of a film. Sil-Pad K-4 is a
- Industry: Electronics
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Supplier: Henkel Corporation - Electronics
Description: Sil-Pad K-6 is a medium performance, film-based thermally conductive insulator. The film is coated with a silicone elastomer to deliver high performance and provide a continuous, physically strong dielectric barrier against “cut-through” and resultant assembly failures
- Industry: Electronics
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and
- Chemical / Polymer System Type: Silicone
- Dielectric Strength: 4 to 6 kV/in
- Features: Electrical Insulation / Dielectric Material, Thermal Compound / Interface (Thermally Conductive), UL Approved
- Form: Film / Sheet, Pad, Specialty / Other
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY T-top99-s offers outstanding thermal conductivity at 24.0 W/m*K and extremely low thermal resistance under minimal force.T-top99-s offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat.
- Chemical / Polymer System Type: Silicone
- Dielectric Strength: 8 kV/in
- Features: Electrical Insulation / Dielectric Material, Thermal Compound / Interface (Thermally Conductive), UL Approved
- Form: Film / Sheet, Pad, Specialty / Other
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Description: applies to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 1, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for
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Description: applies to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 2, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST SIL PAD TSP K900, The Original, Thermally Conductive, Polyimide-Based Insulator BERGQUIST® SIL PAD® TSP K900 uses a specially developed film which has high thermal conductivity, high dielectric strength and is very durable. BERGQUIST SIL PAD TSP K900 combines
- Dielectric Constant (Relative Permittivity): 0.0050
- Features: Leveling / Filling Compound, Thermal / Heat Conductive
- Thermal Conductivity: 0.9000 W/m-K
- Use Temperature: 140 to 356 F
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Description: applicable to fixed surface mount capacitors for direct current, with metallized electrodes and polyethylene naphthalate dielectric for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted directly onto
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST SIL PAD TSP 1500, Electrically Insulating, Thermally Conductive Elastomeric Material BERGQUIST® SIL PAD TSP 1500 is a silicone elastomer formulated to maximize the thermal and dielectric performance of the filler/binder matrix. The result is a grease-free, conformable
- Thermal Conductivity: 0.2000 W/m-K
- Use Temperature: 76 to 392 F
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Description: Is applicable to fixed surface mount capacitors for direct current, with metallized electrodes and polyphenylene sulfide dielectric for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted directly onto
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST SIL PAD TSP K1300, High Performance, Film reinforced, Silicone based Insulator BERGQUIST®SIL PAD TSP K1300 is a high performance insulator. It combines special film with a filled silicone rubber. The result is a product with good cut-through properties and excellent thermal
- Use Temperature: 76 to 356 F
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST SIL PAD TSP K1100, Thermally Conductive, The Medium Performance Polyimide-Based Insulator BERGQUIST® SIL PAD® TSP K1100 is a medium performance, film-based thermally conductive insulator. The film is coated with a silicone elastomer to deliver high performance and
- Dielectric Constant (Relative Permittivity): 0.0040
- Features: Leveling / Filling Compound
- Thermal Conductivity: 1.1 W/m-K
- Use Temperature: 140 to 356 F
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Supplier: 3X Ceramic Parts Company Limited
Description: discs for valves, heat-sinks for lighting systems, protection tubes in thermal processes or catalyst carriers for the chemicals industry. Alumina Ceramic Insulator Key properties: Hard, wear-resistant Excellent dielectric properties from DC to GHz frequencies
- Coeff. of Thermal Expansion (CTE): 8.2 to 8.4 µm/m-C
- Dielectric Constant (Relative Permittivity): 9 to 9.8 #
- Loss Tangent (tan δ ): 2.00E-4 to 0.0011 #
- Material Type: Alumina / Aluminum Oxide
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Supplier: Ellsworth Adhesives
Description: Bergquist Poly-Pad K-10 Thermally Conductive Polyimide Pad with a ceramic-filled polyester resin, is used for silicone sensitive applications and devices such as power supplies, semiconductors, and motor controls. It offers excellent thermal performance and dielectric strength.
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Electrical / Electronics Applications: Semiconductors / IC Packaging
- Elongation: 40 %
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Supplier: Ellsworth Adhesives
Description: Bergquist Poly-Pad K-4 Thermally Conductive Polyimide Pad with a ceramic-filled polyester resin, is used for silicone sensitive applications and devices such as power supplies, semiconductors, and motor controls. It offers excellent physical and dielectric strength. 12 in x 12
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Electrical / Electronics Applications: Semiconductors / IC Packaging
- Elongation: 40 %
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Supplier: RS Components, Ltd.
Description: Aavid Thermalloy In-Sil-8 series thermal interface pads provide thermal conductance and electrical isolation in one package. In-Sil-8 pads are silicone-based insulators that come with thermally conductive fillers to isolate up to 6000 volts AC. In-Sil-8 pads withstand the rigors
- Chemical / Polymer System Type: Silicone
- Material Type: Pad
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Supplier: RS Components, Ltd.
Description: Aavid Thermalloy In-Sil-8 series thermal interface pads provide thermal conductance and electrical isolation in one package. In-Sil-8 pads are silicone-based insulators that come with thermally conductive fillers to isolate up to 6000 volts AC. In-Sil-8 pads withstand the rigors
- Chemical / Polymer System Type: Silicone
- Material Type: Pad
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Supplier: RS Components, Ltd.
Description: Aavid Thermalloy In-Sil-8 series thermal interface pads provide thermal conductance and electrical isolation in one package. In-Sil-8 pads are silicone-based insulators that come with thermally conductive fillers to isolate up to 6000 volts AC. In-Sil-8 pads withstand the rigors
- Chemical / Polymer System Type: Silicone
- Material Type: Pad
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Supplier: RS Components, Ltd.
Description: Aavid Thermalloy In-Sil-8 series thermal interface pads provide thermal conductance and electrical isolation in one package. In-Sil-8 pads are silicone-based insulators that come with thermally conductive fillers to isolate up to 6000 volts AC. In-Sil-8 pads withstand the rigors
- Chemical / Polymer System Type: Silicone
- Material Type: Pad
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Supplier: CSA Group
Description: IEC 60384-20:2015 applies to fixed surface mount capacitors for direct current, with metallized electrodes and polyphenylene sulfide dielectric for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted directly
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Description: additives may be added to individual layers to customize performance. Available in slit widths to 1”, supplied in pad rolls; minimum quantities apply
- Chemical / Polymer System Type: Fluoropolymer (PTFE / PVDF)
- Elongation: 400 %
- Filler Material: Unfilled
- Industry: General Industrial
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Featured Products Top
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pads are ceramic materials with outstanding properties such as high thermal conductivity and high electrical resistance. In addition, it features advantages such as high hardness, corrosion resistance, low dielectric constant and dielectric loss, and low CTE. Aluminum nitride (read more)
Browse Aluminum Oxide and Alumina Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
providing electrical insulation.They feature high dielectric breakdown strength,good thermal conductivity,tear resistance,and more.These properties help prevent accidents such as leakage or breakdowns.Additionally,silicone insulator pads are highly temperature-resistant,preventing degradation or aging (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
. This self-adhesive thermal pad combines excellent compressibility with high dielectric strength of over 8 kV/mm, helping battery designers protect sensitive cells and nearby components in demanding high-voltage environments. Its soft (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
As electric vehicles become more prevalent, wireless charging technology has garnered widespread attention. However, the persistent issue of heat generation during wireless charging has long troubled the industry. Thermal conductive silicone pads, with their superior thermal conductivity and (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
Designing thermal management for a coffee-machine heater means balancing three practical constraints: the pad must shrink predictably during processing, conduct heat efficiently away from the heater, and—where applicable—provide high dielectric (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
overcome space issues resulting from high I/O, fine pitch components. To achieve the density required in HDI designs, line width, spacing, hole diameters and pad sizes must all shrink. Reducing copper foil thickness on inner layers, reducing dielectric spacing to maintain low drill aspect ratios (read more)
Browse Electrical and Electromechanical Assembly Services Datasheets for Summit Interconnect -
, enhanced production reliability, and extended maintenance intervals..Benefits: Long contact life, low wear, tested to over 500K insertions ? Provides reliable and consistent contact for Matte Tin or NiPdAu pads, low contact (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
resistance. Unlike conventional pastes or pads, it then chemically cures into a resilient solid, eliminating pump-out and providing permanent dielectric bonding between heatsink and processor. Key benefits include sustained low thermal resistance under continuous power and thermal cycling (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
. This expansion includes a comprehensive range of thermally conductive gap filling, pads, one-part thermal gels, and thin dielectric sheets, aimed at further advancing our integrated solutions offering. Visit Macdermid Alpha to learn more about our products and solutions. (read more)
Browse Filler Alloys and Consumables Datasheets for MacDermid Alpha Electronics Solutions -
and survive tight clamping and automated handling. Previous insulating films either failed dielectric testing, tore during assembly, or created hot spots that limited system reliability. We supplied SC900FG for trial — a high-performance elastomer insulating sheet built on a (read more)
Browse Thermal Insulating Tapes Datasheets for Dongguan Sheen Electronic Technology Co., Ltd.
Conduct Research Top
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Silicone Rubber Thermal Interface Materials: Applications and Performance Considerations
Simple composits of silicone rubber, extending filler, and fiberglass offer an attractive combination of thermal, physical, and electric properties that make these materials an ideal choice for use as thermal interface materials. Good dielectric strength and low thermal impedance that is relatively
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Layout and Physical Design Guidelines for Capacitive Sensing
AN1102 Layout and Physical Design Guidelines for Capacitive Sensing FIGURE 1: EXAMPLE PAD SIZES AND Author: Tom Perme SHAPE Microchip Technology Inc. 0.500 x 0.500 INTRODUCTION (12,7 x 12,7) This application note describes the layout and physical design guidelines used for the capacitive sensing
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Using FIB for Wafer Lot acceptance and Design Verification
The capabilities of modern FIB machines utterly overshadow the primitive capabilities I so revered from the 80s. In the current era of System-on-Chip (SoC) designs with 10 and 11 metal layers, copper metallizations, exotic dielectric materials, and the use of area pads scattered across the entire
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Introduction to Capacitive Sensing
a frequency or duty cycle which is changed by the intro- CREATING A GOOD SENSOR duction of additional capacitance from a person's finger A quick background on the natural capacitance of a to ground. Some other methods use charge balancing PCB pad, and the process that occurs when pressing a or rise
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Electrophotography
ladene of Ti02-Bindemittel-Schicht,aufgetragen on a dielectric document rnit metallic Riickseite, rnit is exposed an image pattern and then quickly rnit a positively prestressed, Burste developed " by leitfahigem magnetic toner that loosely adheres to a magnetic Wake (Abb. 17).
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IV. Specific scope of application
The electrochemical determination of the Zusarnmensetzung and the thickness of ferromagnetic bel ~ ige on dielectric documents .
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High permittivity pads reduce specific absorption rate, improve B 1 homogeneity, and increase contrast‐to‐noise ratio for functional cardiac MRI at 3 T
Methods Two high permittivity dielectric pads on the anterior and posterior sides of the thorax were numerically designed and implemented using an aqueous suspension of barium titanate.
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Quantitative assessment of the effects of high‐permittivity pads in 7 Tesla MRI of the brain
… of the brain close to the pads exhibit significant increases (>100%) in transmit field efficiency, but areas further away show a less pronounced (∼10%) decrease due to the homogenization of the transmit field and the loss introduced by the dielectric pads .
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Reducing SAR and enhancing cerebral signal‐to‐noise ratio with high permittivity padding at 3 T
Abstract Previous works have shown that placement of a high‐ dielectric pad can improve image intensity in a region adjacent to the pad, or that placement of dielectric pads around a large surface of the head can improve image homogeneity on …
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Dielectric materials in magnetic resonance
A photograph of such ‘‘ dielectric pads ’’ is shown in Figure 1(b).