Products & Services
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® 808 A two-component general purpose potting compound for electrical components. Properties include enhancement of mecahnical strength, low dielectrics, vibration and shock resistance of assembled components.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
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Supplier: Epoxies Etc...
Description: 20-2175 is a two-component and dielectric potting and encapsulating compound. This product has unique flow and rheology characteristics that allows filling of cavities with small holes where traditional materials would leak. 20-2175 was formulated for use in potting cable
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 6.63
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Supplier: Protavic America, Inc.
Description: PNE-47207™ is an adhesive/sealant and potting compound. PNE-47207™ is designed to provide air free potting and casting of electronic devices. PNE-47207™ will bond difficult substrates such as glass, ceramics, and metals. It passes UL 94V0 for fire retardant properties,and has a
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Epoxies Etc...
Description: and is ideal for meter mix and dispense equipment. This system is a good choice for potting applications containing surface mount components. It can be cured at room temperature or with mild heat. The flame retardant & thermally conductive version of this product is 20-2366 FR.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 90 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
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Supplier: Epoxies Etc...
Description: 20-3205 is a two part room temperature curing epoxy system. It provides a low mixed viscosity and excellent electrical insulation properties.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Epoxies Etc...
Description: 20-3006 is a unique two component, electronic grade, flexible epoxy potting compound. This system was engineered to provide electrical insulation, chemical protection, and thermal shock resistance. The flexibility of 20-3006 provides low stress on surface mount and other delicate
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Hapco, Inc.
Description: Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds.
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 1.67 to 1.73
- Dielectric Strength: 390 kV/in
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Supplier: Hapco, Inc.
Description: A tough, REPAIRABLE, shock resistant potting compound for short and long run productions. DI-PAK E-4568 has excellent insulating properties, a very low moisture vapor transmission rate, can be operated from -60°C to +100°C, and performs in both wet and dry environments. It can be
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 1.3
- Dielectric Strength: 710 kV/in
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Supplier: Techsil Limited
Description: Offers self-adhesion properties Non-corrosive to metals and sensitive substrates No cure-by products Low linear shrinkage Outstanding performance over a wide thermal range Technical Properties Uncured Consistency: Flowable self-levelling Colour: White Cured Shore Hardness: 12 Shore A Elongation:
- Chemical / Polymer System Type: Silicone
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Supplier: Hapco, Inc.
Description: High performance, flexible potting systems designed to be in constant water immersion while maintaining electrical and physical properties. DI-PAK E-4888 & E-4889 were designed to meet Naval underwater applications.
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 2.4 to 2.6
- Dielectric Strength: 358 kV/in
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Supplier: Techsil Limited
Description: RTV615 is crystal clear potting silicone from Momentive Performance materials which is widely known for its optical clarity benefits. Ideal for evaluation in applications such as potting solar cells for maximum light transmission and on electronic assemblies where component
- Chemical / Polymer System Type: Silicone
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
- Use Temperature: -60 to 204 F
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Supplier: Techsil Limited
Description: TSE3331 is a two part, heat curing silicone from Momentive Performance Materials designed for potting and encapsulation where flammability and/or thermal conductivity is of concern. It provides excellent flame retardant properties and very stable dielectric properties over a broad
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermal Compound / Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Hapco, Inc.
Description: DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity) Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 4.2 to 4.5
- Dielectric Strength: 565 kV/in
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Encapsulants and Potting Compounds - Momentive RTV627 Grey Potting Silicone 2lb / 908gm -- MOSI17149Supplier: Techsil Limited
Description: RTV627 is a two part silicone rubber compound from Momentive Performance Materials designed for potting and encapsulation applications. It is especially favoured where flammability is of concern. Supplied in a matched kit which is designed for use at a 1:1 ratio by weight or volume
- Chemical / Polymer System Type: Silicone
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Supplier: Sauereisen, Inc.
Description: Sauereisen Thermal Potting Cement No. 11 is primarily used where high electrical insulation and thermal conductivity are desired. No. 11 is a chemical-setting cement ideal for potting applications subject to high temperature and thermal shock. Thermal Potting Cement No. 11 is
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 3.4 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Sauereisen, Inc.
Description: Sauereisen Zircon Potting Cement No. 13 is primarily used where high electrical insulation and thermal conductivity are desired. No. 13 cures by a chemical-set and is ideal for potting applications subject to high temperature and/or thermal shock. Formulated as an economical, zircon
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 2.6 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: CHT USA Inc.
Description: CHT's QSil 216 is a 2-part, platinum cure, optically clear silicone encapsulant designed for optical applications. QSil 216 features a 10:1 mix ratio by weight and its low viscosity profile enables excellent flow around components and is excellent for potting complex parts. The chemical
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Two Component System, Specialty / Other
- Dielectric Strength: 500 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: CHT USA Inc.
Description: CHT's QSil 223 is a 2-part, platinum cure, optically clear silicone encapsulant and is designed for optical applications. It features a convenient 1:1 mix ratio by weight and its low viscosity profile enables excellent flow around components and is ideal for potting complex parts. The
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Two Component System, Specialty / Other
- Dielectric Strength: 500 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: CHT USA Inc.
Description: CHT's QSil 214 is a 2-part, platinum cure, optically clear silicone encapsulant and is designed for optical applications. It features a convenient 1:1 mix ratio by weight and its viscosity profile enables excellent flow around components and is ideal for potting complex parts. The chemical
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Two Component System, Specialty / Other
- Dielectric Strength: 500 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Master Bond, Inc.
Description: Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation with a free flowing viscosity.
- Applied Thickness / Gap Fill: 0.0030 to 0.0050 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Master Bond, Inc.
Description: Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient of thermal expansion.
- Applied Thickness / Gap Fill: 0.0030 to 0.0060 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 7.22E6 to 8.89E6 µin/in-F
- Composition: Unfilled
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Supplier: Dupont Molykote
Description: Silicone-based compound, heavy consistency APPLICATIONS Lubrication for control and pressure plug valves, water softener and faucet valves. Sealant for vacuum and pressure systems. Sealant for outdoor equipment (also shipboard) subject to washing and
- Applications: Automotive / Transportation, Electrical / Electronic, Marine, Food Grade / Contact (FDA H1)
- Chemistry / Constituents: Silicone, Synthetic / Semi-synthetic
- Density / Specific Gravity (@15.6°C, 60°F): 1 specific gravity
- Dielectric Strength: 1.77E7 V/m
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Supplier: Henkel Corporation - Industrial
Description: resistance of 0.2°C-in2/W as well as excellent dielectric strength. Polyester- based, thermally conductive insulators from Henkel provide a complete family of materials for silicone-sensitive applications. SIL PADS are ideally suited for applications requiring conformal coatings or
- Dielectric Constant (Relative Permittivity): 0.0037
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 1.3 W/m-K
- Use Temperature: 68 to 302 F
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Supplier: Bluestar Silicones USA Corp.
Description: Potting, encapsulant elastomer Properties Viscosity 3500 Hardness Sha 48 Description a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL™ ESA 7252 QC A & B is supplied as a viscous liquid which is
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 4.44 µin/in-F
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C,
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Single Component System
- Dielectric Strength: 533 kV/in
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 3-4150 Dielectric Gel Clear-Green is a two component, fast room temperature curing, silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers flexibility, stress relief, and offers excellent
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Two Component System
- Dielectric Strength: 381 kV/in
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Supplier: Wacker Chemical Corp.
Description: dielectric gel especially designed to seal, protect and preserve the electrical characteristics of delicate electronic components (e.g. bonded chips on hybrid components which are exposed to extreme external influences).
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System
- Dielectric Constant (Relative Permittivity): 2.5
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 3-4222 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has excellent
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Two Component System
- Dielectric Strength: 350 kV/in
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Supplier: Ellsworth Adhesives
Description: Dow SYLGARD™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. 0.9 kg Kit.
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Two Component System
- Dielectric Strength: 425 kV/in
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Supplier: OMEGA Engineering, Inc.
Description: products. OMEGABOND and OMEGATHERM products are compounded and packaged for convenient, easy mixing and application. Each formulation exhibits important characteristics necessary for accurate, fast, reliable temperature measurement. These are: good adhesion and strength, high temperature
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System
- Form / Function: Encapsulant / Potting Compound
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Supplier: DuPont Electronics & Imaging
Description: polyimide film for high speed digital and high frequency flexible circuit applications. Its use in flex interconnect applications provide exceptional electrical performance. Copper Clad Features: Certified to IPC 4203A/13 Available in dielectric thicknesses of 2, 3, and
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Electrical Insulation / Dielectric
- Dielectric Constant (Relative Permittivity): 2.3 to 2.6
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Aremco Products, Inc.
Description: High dielectric, use in apps to 2600 °F, moisture & acid resistant
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following industries
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 20.56 to 83.89 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Novagard Solutions
Description: Non-corrosive, single component silicone coating & encapsulating compound
- Chemical / Polymer System Type: Silicone
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Reactive / Moisture Cured, Single Component System
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Supplier: RS Components, Ltd.
Description: A hard and tough black polyurethane potting compound, with excellent adhesion properties to difficult substrates.Applicati ons include potting intricate components, radio transmitters, PCBs. Excellent dielectric characteristics. Good water and chemical resistance. Cure
- Form / Function: Specialty / Other, Encapsulant / Potting Compound
- Thermal Conductivity: 0.2450 W/m-K
- Use Temperature: -58 to 257 F
Find Suppliers by Category Top
Featured Products Top
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NASA low outgassing approved epoxy, Master Bond Supreme 121AO, may be used for bonding, sealing and potting applications.
(read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
-component polyurethanes that assure consistent cure and performance even in small “shot-size” potting applications (Bectron® PK materials). Dielectric gels that provide outstanding electronic protection with very low stress on (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
ELANTAS PDG, Inc. manufactures custom encapsulants and potting compounds to match your specifications. (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
resilience not only ensures accurate billing but also plays a role in resource conservation and efficient energy management. With a rich legacy of pioneering solutions, ELANTAS PDG is at the forefront of developing exceptional conformal coatings and potting solutions tailored for the smart meter (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
Casting & Potting Materials ELANTAS PDG, Inc. offers a wide range of high performance casting resins and potting resins. Our 2-component casting and (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
QSil-553 2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to (read more)
Browse Conductive Compounds Datasheets for CHT USA Inc. -
Ellsworth Adhesives offers low pressure molding services of Mold-Man® Machines.
(read more)
Browse Encapsulants and Potting Compounds Datasheets for Ellsworth Adhesives -
working life Multi functional, for bonding, sealing, coating, potting Outstanding chemical resistance Optically opaque, black color (read more)
Browse Specialty Adhesives, Sealants, and Compounds Datasheets for Master Bond, Inc. -
“EP21AC withstood over 150 arcs without igniting and therefore was assigned the highest PLC (Performance Level Category) of 0 under the UL746A High Amp Arc Ignition test,” says Rohit Ramnath, Senior Product Engineer. “The compound is also flame retardant, as per the UL94 (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
cures upon exposure to LED light at 405 nm. It will cure rapidly and fully without any oxygen inhibition. It is a low viscosity system that may be used for small potting and encapsulation applications assuming that there are no shadows or concealed areas. (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc.
Conduct Research Top
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Selecting the Right Potting Compound for Your Application
Many questions arise when trying to select an appropriate potting compound. An experienced materials expert can help identify the primary concerns, recommend materials, provide testing of the materials, and offer information on dielectric strength, adhesive. characteristics, thermal conductivity
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Dielectric Materials for Use in Radomes
low dielectric constants, useful in radio and microwave frequencies. This makes them ideal for applications such as in conformal antennas, where the material must be applied around a radius. Microelectronics - Non-foamed polyurethanes are often used as "potting compounds" in electronics, where
More Information Top
Indicates content that may require registration and/or purchase.
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CR4 - Thread: High Voltage Potting Compounds and Related Machines
Normally vacuum system, high dielectric potting compounds of high heat conducting capability and with little or no dimension distortion is required.
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The uosatmma and u.h.f. data beacons and antenna system
The inner conductors of the cables were then soldered and, before assembly of the junction, a thin layer of low-loss dielectric potting compound was applied to the PTFE insert to ensure proper support.
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CR4 - Thread: LED display Potting Material
Or why not just google your question. www.google.com ---- search for "Black Dielectric electronic potting compound manufacturers".
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The Mechanical and Electrical Properties of Polymers:An Elementary Molecular Approach
It is generally undersirable to throw away electrical energy as heat in electronic circuits, and materials where the dielectric loss factor is very low are therefore much sought after as materials for capacitor dielectrics , potting compounds , wire insulation, and the like.
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Insulation and dielectric breakdown design considerations in sub-atmospheric environments
Both thermal cycling and chronological aging diminish the dielectric and tensile strengths of dielectric materials and potted compounds .
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Bakelite Strain Gages for Temperatures Between −320 and 450 F.
Effective protection from moisture absorption can be attained by coating the gage installation with a potting compound of high dielectric strength.
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CR4 - Thread: Epoxy Potting RF Components
One option I'm looking at is potting the entire unit, but I know that the dielectric properties of the potting compound will screw up the RF components by shifting filter and transmit frequencies, etc.
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Dielectric behaviour of epoxy and polyester laminates in moisture and electronic packaging exhalates
Epoxies and polyesters have been used in electronics as insulators, dielectrics , sub- strates, potting compounds , embedding materials and conformal coatings.
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Electrical properties of montmorillonite nanoclay reinforced unsaturated polyester nanocomposite
Epoxies and polyesters have been used in electronics as insulators, dielectrics , substrates, potting compounds , embedding materials and conformal coatings [10].
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New Mooring Design for a Telemetering Offshore Oceanographic Buoy
The internal side of the receptacles within the junction boxes are potted with a dielectric urethanepotting compound in keepingwith the system designphilosophy of providing redundantseals.