Dielectric Potting Compounds

Description: INSTAbond® 808 A two-component general purpose potting compound for electrical components. Properties include enhancement of mecahnical strength, low dielectrics, vibration and shock resistance of assembled components.

• Features: Encapsulant / Potting Compound
• Chemical System: Epoxy (EP)
• Cure / Technology: Two Component System

Description: 20-2175 is a two-component and dielectric potting and encapsulating compound. This product has unique flow and rheology characteristics that allows filling of cavities with small holes where traditional materials would leak. 20-2175 was formulated for use in potting cable

• Viscosity: 500 to 3,000 cP
• Thermal Conductivity: 0.297109474 W/m-K
• Dielectric Strength: 400.000000000001 to 609.9999999999997 kV/in
• Dielectric Constant (Relative Permittivity): 6.63

Description: 20-3205 is a two part room temperature curing epoxy system. It provides a low mixed viscosity and excellent electrical insulation properties.

• Thermal Conductivity: 0.37499254 W/m-K
• Dielectric Strength: 454.99999999999955 kV/in
• Dielectric Constant (Relative Permittivity): 4.3
• Viscosity: 30 to 20,000 cP

Description: is ideal for meter mix and dispense equipment. This system is a good choice for potting applications containing surface mount components. It can be cured at room temperature or with mild heat. The flame retardant & thermally conductive version of this product is 20-2366 FR.

• Viscosity: 150 to 6,000 cP
• Use Temperature: -85 to 275 F
• Thermal Conductivity: 0.50479765 W/m-K
• Coeff. of Thermal Expansion (CTE): 90 µin/in-F

Description: 10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion.

• Viscosity: 800 to 2,000 cP
• Use Temperature: -58 to 302 F
• Thermal Conductivity: 0.4326837 W/m-K
• Tensile Strength (Break): 10,500 psi

Description: CHT's QSil 216 is a 2-part, platinum cure, optically clear silicone encapsulant designed for optical applications. QSil 216 features a 10:1 mix ratio by weight and its low viscosity profile enables excellent flow around components and is excellent for potting complex parts. The chemical

• Use Temperature: -67 to 399.2 F
• Thermal Conductivity: 0.18 W/m-K
• Elongation: 100 %
• Tensile Strength (Break): 749.8404594767085 psi

Description: Product Overview UR5118 is a highly water-resistant, RF polyurethane resin developed as an ultra-high-performance encapsulation and potting compound, offering a high level of protection in various operating environments while delivering excellent electrical properties. With high

• Use Temperature: -76 to 257 F
• Thermal Conductivity: 0.2 W/m-K
• Dielectric Strength: 457.20000000000095 kV/in
• Dielectric Constant (Relative Permittivity): 3.1

Description: CHT's QSil 223 is a 2-part, platinum cure, optically clear silicone encapsulant and is designed for optical applications. It features a convenient 1:1 mix ratio by weight and its low viscosity profile enables excellent flow around components and is ideal for potting complex parts. The

• Use Temperature: -67 to 399.2 F
• Thermal Conductivity: 0.18 W/m-K
• Dielectric Strength: 500.00000000000006 kV/in
• Index of Refraction: 1.405

Description: CHT's QSil 214 is a 2-part, platinum cure, optically clear silicone encapsulant and is designed for optical applications. It features a convenient 1:1 mix ratio by weight and its viscosity profile enables excellent flow around components and is ideal for potting complex parts. The chemical

• Use Temperature: -67 to 399.2 F
• Thermal Conductivity: 0.18 W/m-K
• Elongation: 100 %
• Tensile Strength (Break): 600.4525149387956 psi

Description: Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient of thermal expansion.

• Applied Thickness / Gap Fill: 0.003 to 0.006 inch
• Viscosity: 40,000 to 80,000 cP
• Use Temperature: -100 to 400 F
• Coeff. of Thermal Expansion (CTE): 7,222,222.222222222 to 8,888,888.888888888 µin/in-F

Description: 3M Scotch-Weld™ Epoxy Potting Compound-Adhesives Black opaque highly filled epoxy used for potting and encapsulating electronic circuits. Use to environmentally protect or conceal circuits. This product is excellent when used with GC Chassis Boxes. Working Time (Pott Life): 1

Description: Sauereisen Thermal Potting Cement No. 11 is primarily used where high electrical insulation and thermal conductivity are desired. No. 11 is a chemical-setting cement ideal for potting applications subject to high temperature and thermal shock. Thermal Potting Cement No. 11 is

• Use Temperature: 2,200 F
• Thermal Conductivity: 0.70671671 W/m-K
• Coeff. of Thermal Expansion (CTE): 3.4 µin/in-F
• Tensile Strength (Break): 100 psi

Description: Sauereisen Zircon Potting Cement No. 13 is primarily used where high electrical insulation and thermal conductivity are desired. No. 13 cures by a chemical-set and is ideal for potting applications subject to high temperature and/or thermal shock. Formulated as an economical,

• Use Temperature: 2,600 F
• Thermal Conductivity: 1.1538232 to 1.5865069 W/m-K
• Coeff. of Thermal Expansion (CTE): 2.5999999999999996 µin/in-F
• Tensile Strength (Break): 740 psi

Description: Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds.

• Use Temperature: 176 F
• Thermal Conductivity: 0.21634185 W/m-K
• Elongation: 41 %
• Tensile Strength (Break): 460 psi

Description: PNE-47207™ is an adhesive/sealant and potting compound. PNE-47207™ is designed to provide air free potting and casting of electronic devices. PNE-47207™ will bond difficult substrates such as glass, ceramics, and metals. It passes UL 94V0 for fire retardant properties,and has a

• Viscosity: 20,000 cP
• Use Temperature: -55 to 150 F
• Dielectric Constant (Relative Permittivity): 4.3
• Features: Ceramic / Glass, Electrical Insulating / Dielectric, Electrical Power / HV, Electronics, Encapsulating / Potting, Flame Retardant (e.g. UL 94 Rated), Gap Filling Sealant / FIP Gasket, Liquid, Metal

Description: Dow DOWSIL™ EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C,

• Viscosity: 690 cP
• Dielectric Strength: 533 kV/in
• Features: Electrical Insulation / Dielectric Material, Electronics, Encapsulating / Potting Compound
• Industry: Semiconductors / IC Packaging

Description: DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity) Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is

• Use Temperature: 248 F
• Thermal Conductivity: 0.21634185 W/m-K
• Elongation: 9.5 %
• Tensile Strength (Break): 6,370 psi

Description: TSE3331 is a two part, heat curing silicone from Momentive Performance Materials designed for potting and encapsulation where flammability and/or thermal conductivity is of concern. It provides excellent flame retardant properties and very stable dielectric properties over a broad

• Use Temperature: -55 to 200 F
• Features: Electronics, Encapsulating / Potting, Thermal Compound / Heat Conductive
• Chemical System: Rubber Based / Elastomeric, Silicone

Description: Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness’s from 20 A to 80 A .

• Use Temperature: 158 F
• Thermal Conductivity: 0.21634185 W/m-K
• Elongation: 1,000 %
• Tensile Strength (Break): 450 psi

Description: Shore 90-95 A, elastomeric coatings that have been specifically designed to reproduce exact surface details. DI-COAT E-4599 is excellent for electrical insulation applications requiring non or low sag materials. DI-COAT E-4599 are formulated to withstand high wear continuous service.

• Use Temperature: 194 F
• Elongation: 325 %
• Tensile Strength (Break): 2,500 psi
• Dielectric Strength: 350.0000000000002 kV/in

Description: Silicone-based compound, heavy consistency APPLICATIONS Lubrication for control and pressure plug valves, water softener and faucet valves. Sealant for vacuum and pressure systems. Sealant for outdoor equipment (also shipboard) subject to washing and harsh environmental exposure: meters,

• Operating / Use Temperature: -40 to 399.2 F
• Dielectric Strength: 17,716,535.4330708 V/m
• Density / Specific Gravity (@15.6°C, 60°F): 1 specific gravity
• Industry Applications: Automotive / Transportation, Electrical / Electronic, Food Grade / Contact (FDA H1), Marine

Description: SEMICOSIL® 925 is a high purity, one-component addition curing RTV-2 silicone gel. Special features Low ion content Low volatile content Low viscosity Good mechanical damping properties Application SEMICOSIL® 925 is a dielectric gel especially designed to seal, protect and preserve the

• Viscosity: 700 cP
• Dielectric Strength: 558.8000000000012 kV/in
• Dielectric Constant (Relative Permittivity): 2.5
• Features: Electrical Insulation / Dielectric Material, Electronics, Encapsulating / Potting Compound, Flexible / Dampening, Liquid

Description: Potting, encapsulant elastomer Properties Viscosity 3500 Hardness Sha 48 Description a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL™ ESA 7252 QC A & B is supplied as a viscous liquid which is

• Viscosity: 3,000 to 3,500 cP
• Thermal Conductivity: 0.42 W/m-K
• Coeff. of Thermal Expansion (CTE): 4.444444444444445 µin/in-F
• Tensile Strength (Break): 333.584730521553 psi

Description: Dow DOWSIL™ 3-4150 Dielectric Gel Clear-Green is a two component, fast room temperature curing, silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers flexibility, stress relief, and offers excellent

• Viscosity: 480 cP
• Dielectric Strength: 381.0000000000008 kV/in
• Features: Electrical Insulation / Dielectric Material, Encapsulating / Potting Compound
• Chemical System: Silicone

Description: Dow DOWSIL™ Q3-6575 Dielectric Gel Clear is a two component, heat curing, low temperature, silicone gel that is used for protecting and sealing electronic devices from high voltages, moisture, mechanical and thermal shock. 1:1 mix ratio by weight or volume. 0.9 kg Kit.This is a Dow product

• Viscosity: 750 cP
• Dielectric Strength: 457.20000000000095 kV/in
• Features: Electrical Insulation / Dielectric Material, Encapsulating / Potting Compound
• Chemical System: Silicone

Description: Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber

• Use Temperature: -54 to 260 F
• Features: Electronics, Encapsulating / Potting
• Chemical System: Rubber Based / Elastomeric, Silicone

Description: Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber

• Use Temperature: -54 to 260 F
• Features: Electronics, Encapsulating / Potting
• Chemical System: Rubber Based / Elastomeric, Silicone

Description: RTV615 is crystal clear potting silicone from Momentive Performance materials which is widely known for its optical clarity benefits. Ideal for evaluation in applications such as potting solar cells for maximum light transmission and on electronic assemblies where component

• Use Temperature: -60 to 204 F
• Features: Encapsulating / Potting, Medical / Food (Sanitary / FDA)
• Chemical System: Rubber Based / Elastomeric, Silicone

Description: 20 durometer, designed for use in special effects applications, skin contact grade Properties Viscosity 50000 Hardness Sha 25 Description Bluesil V-1022 is a medium hardness, self-bonding, room temperature curing silicone rubber compound. It is designed as a potting and encapsulating

• Use Temperature: -65 to 400 F
• Thermal Conductivity: 0.184611712 W/m-K
• Tensile Strength (Break): 150 psi
• Elongation: 150 %

Description: Master Bond Supreme 112 is a two part epoxy for bonding, sealing, potting, and impregnation applications with a high glass transition temperature of 190-195°C and very low viscosity.

• Applied Thickness / Gap Fill: 0.003 to 0.005 inch
• Viscosity: 50 to 200 cP
• Use Temperature: -80 to 550 F
• Tensile Strength (Break): 11,000 to 12,000 psi

Description: Dow DOWSIL™ Q3-6575 Dielectric Gel Clear is a two component, heat curing, low temperature, silicone gel that is used for protecting and sealing electronic devices from high voltages, moisture, mechanical and thermal shock. 1:1 mix ratio by weight or volume. 35 kg Kit.

• Viscosity: 750 cP
• Elongation: 300 %
• Dielectric Strength: 457.20000000000095 kV/in
• Features: Electrical Insulation / Dielectric Material, Encapsulating / Potting Compound

Description: Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting.

• Applied Thickness / Gap Fill: 0.003 to 0.006 inch
• Viscosity: 800 to 1,200 cP
• Use Temperature: -452.47 to 250 F
• Coeff. of Thermal Expansion (CTE): 38,888,888.88888889 to 44,444,444.44444444 µin/in-F

Description: RTV-2 for protective potting, coating and encapsulation Properties Viscosity 150000 Hardness Sha 60 Description RTV Elastomer - Two components addition cure for encapsulation/protection of electronical systems and production of moulding parts Good heat stability in confined environments

• Use Temperature: -94 to 572 F
• Thermal Conductivity: 0.31 W/m-K
• Coeff. of Thermal Expansion (CTE): 5 µin/in-F
• Tensile Strength (Break): 507.628937750189 to 870.221036143182 psi

Description: as well as excellent dielectric strength. Polyester- based, thermally conductive insulators from Henkel provide a complete family of materials for silicone-sensitive applications. SIL PADS are ideally suited for applications requiring conformal coatings or applications where silicone

• Use Temperature: 68 to 302 F
• Thermal Conductivity: 1.3 W/m-K
• Dielectric Constant (Relative Permittivity): 0.0037
• Features: Encapsulant / Potting Compound

Description: well to a wide variety of substrates including metals, composites, ceramics and glass along with many plastic and rubber materials. EP41S-LO is a highly reliable electrical insulator and is particularly well suited for use in small sized potting applications. Most importantly, it has minimal

• Viscosity: 3,000 to 15,000 cP
• Use Temperature: -60 to 250 F
• Tensile Strength (Break): 300,000 to 350,000 psi
• Industry: Aerospace, OEM / Industrial, Semiconductors / IC Packaging