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Supplier: Novagard Solutions
Description: Non-corrosive, single component oxime silicon sealant and/or adhesive
- Chemical / Polymer System Type: Silicone, Rubber Based / Elastomeric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System
- Dissimilar Substrates: Yes
- Elongation: 500 to 600 %
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Supplier: Novagard Solutions
Description: Non-corrosive, single component silicon sealant and/or adhesive
- Chemical / Polymer System Type: Silicone, Rubber Based / Elastomeric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System
- Elongation: 200 to 300 %
- Features: Electrical Insulation / Dielectric Material, Gap Filling Sealant / FIP Gasket, Grease / Paste, Non-corrosive Cure, UL Approved
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Supplier: Novagard Solutions
Description: Non-corrosive, single component alkoxy cure silicone sealant/adhesive
- Chemical / Polymer System Type: Silicone, Rubber Based / Elastomeric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System
- Elongation: 600 %
- Features: Conformal Coating, Electrical Insulation / Dielectric Material, Encapsulating / Potting Compound, Gap Filling Sealant / FIP Gasket, Glob Top / Daub, Grease / Paste, Non-corrosive Cure, UL Approved
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Supplier: Novagard Solutions
Description: Non-corrosive, single component silicone sealant, self-leveling liquid
- Chemical / Polymer System Type: Silicone, Rubber Based / Elastomeric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Reactive / Moisture Cured, Single Component System
- Elongation: 250 %
- Features: Conformal Coating, Electrical Insulation / Dielectric Material, Encapsulating / Potting Compound, Gap Filling Sealant / FIP Gasket, Non-corrosive Cure
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Supplier: Bluestar Silicones USA Corp.
Description: Stiff, Tacky Dielectric Compound Lubricant and Sealant Description Bluesil V-711 is a silica-thickened, high molecular weight dimethyl silicone compound. It is a non-curing grease-like paste with a tacky, stiff consistency. Bluesil V-711 possesses excellent dielectric
- Dielectric Constant (Relative Permittivity): 3
- Dielectric Strength: 503 kV/in
- Features: Electrical Insulation / Dielectric Material, Grease / Paste
- Use Temperature: -67 to 400 F
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Supplier: Protavic America, Inc.
Description: PNE-47207™ is an adhesive/sealant and potting compound. PNE-47207™ is designed to provide air free potting and casting of electronic devices. PNE-47207™ will bond difficult substrates such as glass, ceramics, and metals. It passes UL 94V0 for fire retardant properties,and has a convenient 1
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 4.3
- Features: Electrical Insulation / Dielectric Material, Encapsulating / Potting Compound, Flame Retardant (e.g. UL 94 Rated), Gap Filling Sealant / FIP Gasket
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Supplier: Bluestar Silicones USA Corp.
Description: Soft Dielectric Compound Lubricant/Sealant Description Bluesil V-726 is a soft, easily spreadible, silica-thickened dimethyl silicone compound. It is designed as a lubricant for rubber and plastics, rubber coated and fiber optic cables. Bluesil V-726 is also an excellent
- Applications: Electrical / Electronic, Process Equipment
- Chemistry / Constituents: Silicone, Synthetic / Semi-synthetic
- Density / Specific Gravity (@15.6°C, 60°F): 1.03 specific gravity
- Dielectric Strength: 650000 V/m
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Supplier: Bluestar Silicones USA Corp.
Description: Bluesil V-711 is a silica-thickened, high molecular weight dimethyl silicone compound. It is a non-curing grease-like paste with a tacky, stiff consistency. Bluesil V-711 possesses excellent dielectric properties and is useful for protecting and sealing electrical and mechanical equipment. It
- Applications: Automotive / Transportation, Electrical / Electronic
- Chemistry / Constituents: Silicone, Synthetic / Semi-synthetic
- Density / Specific Gravity (@15.6°C, 60°F): 1.03 specific gravity
- Features: Sealing / Barrier, Mold Release / Release Agent
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Supplier: Techsil Limited
Description: Momentive TSE322 is a heat curable silicone adhesive sealant which will bond to many substrates without the need for a primer and cures rapidly at elevated temperatures. Product Benefits Easy to use, one-component material Fast cure at elevated temperature
- Compound Type: Thermal Compound / Heat Conductive
- Features: Electrical Insulation / Dielectric Material
- Industry: Electronics
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Supplier: Techsil Limited
Description: accelerated cure Non-corrosive to metals High elongation Good dielectric properties Excellent adhesion properties Technical Properties Uncured Consistency:Flowable Colour: Translucent Cured Shore Hardness: 28 Shore A Elongation: 370% Dielectric Strength: 23kv/ mm
- Features: Electrical Insulation / Dielectric Material
- Industry: Electronics
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Supplier: Wacker Chemical Corp.
Description: ELASTOSIL® N198 BLACK US is a non-slump, RTV-1 oxime cure silicone rubber that cures on contact with moisture in the air. Special features Neutral cure Solvent-free Primerless adhesion to most substrates Available in Black or Gray Application ELASTOSIL® N198 BLACK US is intended for sealing and
- Coeff. of Thermal Expansion (CTE): 1.39 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing, Reactive / Moisture Cured
- Dielectric Constant (Relative Permittivity): 3.2
- Dielectric Strength: 584 kV/in
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Supplier: Wacker Chemical Corp.
Description: ELASTOSIL® N 198 GREY US is a non-slump, RTV-1 oxime cure silicone rubber that cures on contact with moisture in the air. Special features Neutral cure Solvent-free Primerless adhesion to most substrates Available in Black or Gray Application ELASTOSIL® N 198 GREY US is intended for sealing and
- Coeff. of Thermal Expansion (CTE): 1.39 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing, Reactive / Moisture Cured
- Dielectric Constant (Relative Permittivity): 3.2
- Dielectric Strength: 584 kV/in
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Supplier: Epoxies Etc...
Description: 20-2162 is a unique high performance two component urethane system. The 20-2162 is engineered for demanding applications where flow control is necessary to limit mold leaking, seeping around cable entries and substrate wicking. This product offers outstanding durability and adhesion to a variety of
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 3.4
- Dielectric Strength: 550 kV/in
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Supplier: Epoxies Etc...
Description: 20-2182 is a unique high performance two component urethane system. The 20-2182 is engineered for demanding applications where flow control is necessary to limit mold leaking, seeping around cable entries and substrate wicking. This product offers outstanding durability and adhesion to a variety of
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 3.4
- Dielectric Strength: 550 kV/in
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Supplier: Techsil Limited
Description: Momentive RTV102 is a versatile, ready to use adhesive sealant which cures to a tough, durable resilient silicone rubber. Uncured, this general purpose sealant has a paste consistency which can be applied to vertical and overhead surfaces where pourable/self- levelling sealants
- Chemical / Polymer System Type: Silicone, Rubber Based / Elastomeric
- Industry: Medical / Food (Sanitary / FDA)
- Use Temperature: -60 to 204 F
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Supplier: Techsil Limited
Description: Momentive RTV103 is a versatile, ready to use adhesive sealant which cures to a tough, durable resilient silicone rubber. Uncured, this general purpose sealant has a paste consistency which can be applied to vertical and overhead surfaces where pourable/self- levelling sealants
- Chemical / Polymer System Type: Silicone, Rubber Based / Elastomeric
- Industry: Medical / Food (Sanitary / FDA)
- Use Temperature: -60 to 204 F
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Supplier: Master Bond, Inc.
Description: Master Bond Supreme 10HTCL features a unique blend of performance properties including both high shear and peel strengths along with convenient handling. This one component system is formulated to cure at elevated temperatures, e.g. 60-75 minutes at 250°F, shorter times can be achieved at higher
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 25 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Elongation: 4.2 %
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Supplier: Gelest, Inc.
Description: Safety
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Supplier: Gelest, Inc.
Description: Safety
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Supplier: Gelest, Inc.
Description: Safety
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C, low
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Dielectric Strength: 533 kV/in
- Features: Electrical Insulation / Dielectric Material, Encapsulating / Potting Compound
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Supplier: Wacker Chemical Corp.
Description: dielectric gel especially designed to seal, protect and preserve the electrical characteristics of delicate electronic components (e.g. bonded chips on hybrid components which are exposed to extreme external influences).
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System
- Dielectric Constant (Relative Permittivity): 2.5
- Dielectric Strength: 559 kV/in
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Description: providing shock absorption. ? High electrical insulation, with dielectric strength up to 8 kV/mm. ? Excellent flame resistance, achieving a UL94 V-0 rating. ? Curing time adjustable based on temperature. ? Two-component structure for easy storage. ? Can
- Compound Type: Thermal Compound / Heat Conductive
- Dielectric Constant (Relative Permittivity): 6.5
- Industry: Electronics
- Thermal Conductivity: 3 W/m-K
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Supplier: Wacker Chemical Corp.
Description: ELASTOSIL® RT 2100 is a room temperature vulcanizing silicone rubber. It is especially useful for electrical insulation applications such as potting, encapsulating, embedding, sealing and environmental protection. ELASTOSIL® RT 2100 is simple to handle and offers a balanced property profile.
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 3.8 to 4
- Dielectric Strength: 515 kV/in
- Elongation: 130 %
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ Q3-6575 Dielectric Gel Clear is a two component, heat curing, low temperature, silicone gel that is used for protecting and sealing electronic devices from high voltages, moisture, mechanical and thermal shock. 1:1 mix ratio by weight or volume. 0.9 kg Kit.This is a Dow product
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Dielectric Strength: 457 kV/in
- Features: Electrical Insulation / Dielectric Material, Encapsulating / Potting Compound
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Supplier: Master Bond, Inc.
Description: Master Bond FLM36 is a very special film adhesive featuring incomparable strength properties, high temperature resistance and first class thermal conductivity and electrical insulation properties. It differs from other heat resistant epoxies due to its toughness. FLM36 retains very high physical
- Coeff. of Thermal Expansion (CTE): 41.67 to 47.22 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.1
- Dielectric Strength: 400 to 450 kV/in
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Industrial Sealants - Dow DOWSIL™ 734 Flowable Sealant Clear 18 kg Pail -- 734-FLW/BLE PLUS CLR 18KGSupplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 734 Flowable Sealant Clear is a one component, silicone liquid that is used for bonding and sealing industrial applications that require a flowable material and water tight seal. It offers easy application, acetoxy cure system, flexibility, self-leveling, and good
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Dielectric Strength: 432 kV/in
- Elongation: 315 %
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 3-4222 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System
- Dielectric Strength: 350 kV/in
- Features: Electrical Insulation / Dielectric Material
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Supplier: Aremco Products, Inc.
Description: Dielectric, moisture resistant, thermocouples
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 4 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking
- Dielectric Strength: 250 kV/in
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Supplier: Aremco Products, Inc.
Description: Dielectric, high strength, heaters, sensors
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 4.5 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking
- Dielectric Strength: 200 kV/in
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Supplier: Waytek, Inc.
Description: Dielectric Strength: 300VDC/mil Seals high-voltage cables and accessories Built-in vinyl backing for fast application and abrasion resistance Use for moisture-sealing electrical connections on automotive applications Excellent resistance to abrasion
- Industry: Electronics
- Use Temperature: 0.0 to 176 F
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK A 304-6, Epoxy, Adhesive and Sealant LOCTITE® ABLESTIK A 304-6 epoxy adhesive and sealant is designed for high throughput assembly operations. Non-conductive One component Readily pourable Fast cure Good toughness Excellent chemical resistance
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Single Component System
- Features: Electrical Insulation / Dielectric Material
- Viscosity: 21500 cP
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP21D is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 22 to 33 µin/in-F
- Composition: Two Component System
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
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Supplier: DigiKey
Description: SEALING & DIELECTRIC COMPOUND
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Supplier: ELANTAS North America LLC
Description: ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dissimilar Substrates: Yes
- Features: Electrical Insulation / Dielectric Material, Gap Filling Sealant / FIP Gasket, Laminating Adhesive / Composite Resin, Non-corrosive Cure
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have excellent adhesion to many common substrates, as well as good dielectric properties and resistance to extreme temperatures (from -55C to 200C). They are designed to provide flexible bonding in electronic assembly, sealing modules and housings, as well as assembly of components. At room (read more)
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Metal-Dielectric Interfaces in Gigascale Electronics
Two types of dielectric sealants are desirable.
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ZASMHBA0003048
Dielectric sealants are used to protect relays and contacts.
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Near Surface External Casing Corrosion in Alaska: Cause and Mitigation
The primary cement top is brought to the surface, leaving approximately 3-feet of void for application of dielectric sealant material; c.
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Fundamental characteristics of electrostatic wafer chuck with insulating sealant
The experimental results and discussions about the influence of dielectric sealant on the characteristics of the electric static chuck are presented.
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Advanced Materials for Thermal Management of Electronic Packaging
Electrical resins and electronic-grade polymers and elastomers are used in potting or encapsulating compounds, conductive adhesives, and dielectric sea- lants .
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Radiofrequency temperature-independent measurements of the density of liquefied hydrocarbon gases
Primarily, this structural element is a pressure-seal feed-through having a metal body with dielectric sealant .
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Handbook of Environmental Data on Organic Chemicals Volume 4
dielectric sealants ; .
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Cryptographic Hardware and Embedded Systems - CHES 2007
The wires are integrated into a single object using a transparent dielectric sealant illustrated in Figure 1.
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Thermosets and Thermoset Materials
Thermoset electrical resins and electronic-grade products are used in potting or encapsulating compounds, conductive adhesives, and dielectric sealants .
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Design and development of an optical path difference scan mechanism for Fourier transform spectrometers using high-displacement RAINBOW actuators
Copper tabs (0.1 millimeters thick) with soldered leads were then attached to the RAiNBOWs, and the parts were coated with a dielectric sealant (GC Electronics, EL-5012 polyester resin).