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Supplier: Twilight Technology Inc.
Description: and memory module solutions. Our customers benefit from our broad experience and expertise in design, IC packaging, component reliability, and quality testing. With 25 years of design experience, our engineering staff solves problems with footprint conversions, RoHS, BGA and flip chip
- Memory Type: DRAM
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Supplier: Acme Chip Technology Co., Limited
Description: MODULE DDR2 SDRAM 1GB 200SORDIMM
- Capacity: 1000 MB
- Memory Type: DRAM
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Supplier: Utmel Electronic Limited
Description: DRAM Module DDR3 SDRAM 8Gbyte 240DIMM
- Memory Category: DRAM
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Supplier: Utmel Electronic Limited
Description: DRAM Module DDR3 SDRAM 8Gbyte 204SODIMM
- Memory Category: DRAM
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Supplier: Advantech
Description: SQRAM is Industrial Grade DRAM memory. all of SQRAM are designed with original IC chip and adopt a rigorous test program to ensure durable and reliable quality. SQRAM are fixed IC generation for quality and compatibility controlled. 200-pin SODIMM Data transfer rate: 333 MT
- Form Factor: SO DIMM
- Operating Temperature: -4 to 185 F
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Supplier: InnoDisk USA Corporation
Description: Features JEDEC standard 1.8V +/- 0.1V Power Supply Frequency:400Mhz,533 Mhz, 667Mhz, 800Mhz Programmable CAS Latency: 3, 4, 5, 6 8 Banks 4-bit pre-fetch Posted CAS Burst Length: 4, 8(Interleave/nibble sequential) Off-Chip Driver(OCD) Impedance Adjustment On Die Termination with selectable values
- Capacity: 256 to 2000 MB
- Form Factor: DIMM, SO DIMM
- JEDEC Standard Compatible: Yes
- Operating Temperature: -40 to 185 F
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Supplier: InnoDisk USA Corporation
Description: Features SSTL_2 Interface 2-bit pre-fetch Double-data-rate architecture Differential clock inputs(CK and CK) Programmable Burst length (2, 4, 8) Programmable Burst type (sequential & interleave) Auto & Self refresh, 7.8us refresh interval(8K/64ms refresh) Serial presence detect with EEPROM TSOP II
- Capacity: 128 to 1000 MB
- DRAM Type: DDR SDRAM
- Form Factor: DIMM, SO DIMM
- Operating Temperature: -40 to 185 F
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Supplier: InnoDisk USA Corporation
Description: ACTICA VLP (Very Low Profile, 18.75mm) DDR3 and DDR2 Registered ECC DIMM form factors are special design for the space constraint system which has the height restriction. At the height of 18.75mm, it will also increase the air flow of the whole system. Blade Server and Server RAID controller Card
- Capacity: 2000 to 8000 MB
- Form Factor: DIMM
- Operating Temperature: 32 to 185 F
- Pin Count: 240 #
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Supplier: InnoDisk USA Corporation
Description: ACTICA provides wide range of DDR2 product with the capacities, ranging from 1GB to 8GB. The DDR2 RDIMMs are validated by the major server motherboard manufacturer to ensure the compatibility of the memory. In additional to that the height of the memory is a good fit for the IU server system.
- Capacity: 1000 to 2000 MB
- Form Factor: DIMM
- Operating Temperature: 32 to 185 F
- Pin Count: 240 #
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Supplier: Acme Chip Technology Co., Limited
Description: MODULE DDR3 DRAM 8GB 204SODIMM
- Capacity: 8000 MB
- Memory Type: DRAM
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Supplier: Acme Chip Technology Co., Limited
Description: DDR3-1866 8G DUAL RANK SODIMM
- Capacity: 8000 MB
- Memory Type: DRAM
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Supplier: Acme Chip Technology Co., Limited
Description: MODULE DDR SDRAM 512MB 200SODIMM
- Capacity: 512 MB
- Memory Type: DRAM
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Supplier: DigiKey
Description: Memory Module DDR4 SDRAM 16GB 1.333GHz 260-SORDIMM
- Capacity: 16000 MB
- Memory Type: DRAM
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Supplier: DigiKey
Description: MODULE DDR4 SDRAM 16GB
- Capacity: 16000 MB
- Memory Type: DRAM
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Description: MODULE DDR SDRAM 128MB 200SODIMM
- Capacity: 128 MB
- Memory Type: DRAM
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Description: MODULE DDR SDRAM 256MB 184UDIMM
- Capacity: 256 MB
- Memory Type: DRAM
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Description: MODULE DDR SDRAM 2GB 184RDIMM
- Capacity: 2000 MB
- Memory Type: DRAM
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Description: MODULE SDRAM 64MB 168UDIMM
- Capacity: 64 MB
- Memory Type: DRAM
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Supplier: Shenyang Vhandy Technology Co., Ltd.
Description: GCAN-402 two channel CAN-Bus data recorder is specially used for offline record CAN-Bus data. This adapter has integrated two CAN-bus interface and one TF card port. Users can use TF card record bus data real-time. GCAN-402 is suitable for historical data playback, error message analysis. That can
- Memory Type: DRAM
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Supplier: DigiKey
Description: Memory Module DDR SDRAM 1GB 167MHz 200-SODIMM
- Capacity: 1000 MB
- DRAM Type: DDR SDRAM
- Form Factor: SO DIMM
- Pin Count: 200 #
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Supplier: Win Source Electronics
Description: Alternative Parts (Cross-Reference): Cross Category: Memory Cards, Modules Packaging: Tray Speed: 2666MT/s
- Memory Category: DRAM
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Supplier: Shenyang Vhandy Technology Co., Ltd.
Description: The GCAN-401 is a CAN-Bus storage, used for saving CAN-Bus data. This module can save the real-time data, whose function is to realize to collect history CAN-Bus data and analyze fault message. Function This module has integrated with system clock and document system.You can save and
- Supply Voltage: 1.2 V, 1.5 V, 1.8 V, 2.5 V, 2.7 V, 3 V
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Supplier: Yang Ming International Corporation
Description: DDR3 1333MHz 2GB REG ECC 256X4 M393B5670EH1-CH901 SAMSUNG Original Memory Module
- Capacity: 2000 MB
- Clock Speed: 1333 MHz
- Memory Type: DRAM
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Supplier: Radwell International
Description: MODULE BOARD VME VSB DRAM. FREE 2 YEAR RADWELL WARRANTY
- Memory Category: DRAM
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Supplier: Avant Technology
Description: Avant Technology is a leading US manufacturer and global provider of DRAM memory modules and Flash sub-assemblies. From the POS and telecommunications sector, to commercial, networking, server and PC industries; Avant memory solutions are designed to fulfill a variety of business and
- Capacity: 256 MB
- DRAM Type: SDRAM
- Form Factor: Other
- Pin Count: 168 #
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Supplier: Accuris
Description: MICROCIRCUIT MEMORY CMOS, DIGITAL, 256M X 8 BIT STACKED DIE (2GBIT) SYNCHRONOUS DRAM (SDRAM), MODULE
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Supplier: SK Hynix
Description: WIO2 (Wide IO 2) is the strong candidate of future mobile DRAM achieving high bandwidth (51.2GB/s, up to 68GB/s), advanced power efficiency, and small form factor.
- Capacity: 2000 to 16000 MB
- Supply Voltage: 1.2 V, 1.8 V
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Supplier: Advanced Micro Devices, Inc.
Description: Get superior stability and excellent performance with AMD Radeon™ memory Get more out of what you’ve already got with an easy, cost-effective memory upgrade from AMD. From browsing the Web and watching brilliant HD streaming video to playing the most demanding video games, AMD Radeon™ memory is
- Capacity: 4000 to 16000 MB
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Supplier: ODG (Origin Data Global)
Description: DRAM DDR4 8GB EUDIMM FBGA
- Capacity: 8000 MB
- Memory Type: Other
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Supplier: Lingto Electronic Limited
Description: MODULE DRAM DDR
- Access Time: 19 ns
- Density: 4.00E6 kbits
- Memory Category: DRAM, Other
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Supplier: SK Hynix
Description: improved features, making DDR4 more capable than the earlier DRAM generations in key attributes. DDR4 is expected to provide stable performance beyond 2400Mbps Normal temperature (0? ~ 95? ), IT (Industrial Temperature : -40? ~ 95?) and AT (Automotive Temperature : -40? ~ 105?) supportable.
- Applications: Personal Computing
- Capacity: 1000 to 8000 MB
- Memory Type: DRAM
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Supplier: VAST STOCK CO., LIMITED
Description: Computer-On-Modules - COM NXP i.MX6 Dual Q7 1GB DRAM
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Supplier: Win Source Electronics
Description: Manufacturer: CC-WMX-JN7A-NE Digi Alternative Parts (Cross-Reference): Cross Category: RF and Wireless RF Transceiver Modules and Modems Series: ConnectCore® 6UL Package: Tray Product Status: Active RF Family/Standard: Bluetooth, WiFi Frequency: 528MHz Serial Interfaces: Ethernet, I²C, I²S,
- Function: Transceiver
- Operating Frequency: 528 MHz
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Supplier: Radwell International
Description: DISCONTINUED BY MANUFACTURER, CPU CARD, MODULE - DRAM CPU 16 MEG, A2 DRAM, 16 MB. FREE 2 YEAR RADWELL WARRANTY
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Supplier: DigiKey
Description: 100 Position DIMM DRAM Socket Through Hole
- Connector Type: Other
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
offer IC design and foundry services in Europe Accent S.r.l. and Semiconductor Manufacturing International Corp. (SMIC) announced today (April 18, 2003) that the two companies will jointly provide a full range of IC design and production services for the European market. Asia rises in third-party DRAM
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
modules. DRAM prices keep rising despite dearth of demand Toshiba proposes flash lamp annealing for 65-nm node Flash lamp annealing (FLA) technology will
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
UniRAM 2004 module market to grow 27% February chip market sales up 30.8% y-on-y Silicon Image reorganizes, raises quarterly forecast Wi-Fi's penetration is rising in everything Gateway to shut down retail stores, cuts 2,500 jobs Elpida to acquire NEC fab, add to its DRAM operation SEMI speaks out
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Heard on the Beat (Jan. 25) Heard on the Beat (Jan. 25) Move to faster, more profitable DRAMs goes painfully slow for suppliers SAN JOSE -- It could be another long and miserable year in the poor DRAM industry, based on the consensus and general mood at the Platform Conference here this week
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
STMicroelectronics staffs up for likely FPGA bid Trikon introduces module to extend PVD tool use below 0.15 micron Rivals merge, paving way for unified digital radio spec Dense-Pac claims to stack different IC products in one unit On Semi rolls out dozen new devices in tiny package for wireless
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Trying to make sense of the cyclical semiconductor industry? Gathered here is a compendium of recent stories on IC forecasts, August chip data, DRAMs, PCs, and semiconductor equipment. Micrel latest to reduce forecast amid sales lull Chip maker Micrel Inc. on Friday (Oct. 1) lowered its revenue
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Betrayed Infineon to sell shares in ProMOS Claiming it was "betrayed " by Mosel Vitelic Inc. at a shareholders meeting, Infineon Technologies AG said Saturday it will sell its entire 30.7% stake in ProMOS Technologies Inc., its Taiwanese DRAM joint venture, according to a report from National
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Global Perspective for Competitive Enterprise, Economy and Ecology
Predicting the Yield Rate of DRAM Modules by Support Vector Regression............747 .
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Page 3. Semiconductor parts with 343 in root number
4,194,304-word x 32-bit DRAM module .
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