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Supplier: InnoDisk USA Corporation
Description: Features SSTL_2 Interface 2-bit pre-fetch Double-data-rate architecture Differential clock inputs(CK and CK) Programmable Burst length (2, 4, 8) Programmable Burst type (sequential & interleave) Auto & Self refresh, 7.8us refresh interval(8K/64ms refresh) Serial presence detect with EEPROM TSOP II
- Capacity: 128 to 1,000 MB
- Clock Speed: 333 to 400 MHz
- Pin Count: 184 to 200 #
- Operating Temperature: -40 to 185 F
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Supplier: Twilight Technology Inc.
Description: Twilight Technology, Inc. specializes in IC packaging and testing services focused on providing solutions for high reliability applications or obsolete components. Twilight Technology has manufactured and marketed a variety of standard and proprietary semiconductor packaging and memory module
- Features: DRAM
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Supplier: Utmel Electronic Limited
Description: DRAM Module DDR3 SDRAM 8Gbyte 204SODIMM
- Memory Category: DRAM
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Supplier: Utmel Electronic Limited
Description: DRAM Module DDR3 SDRAM 8Gbyte 240DIMM
- Memory Category: DRAM
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Supplier: InnoDisk USA Corporation
Description: ACTICA VLP (Very Low Profile, 18.75mm) DDR3 and DDR2 Registered ECC DIMM form factors are special design for the space constraint system which has the height restriction. At the height of 18.75mm, it will also increase the air flow of the whole system. Blade Server and Server RAID controller Card
- Capacity: 2,000 to 8,000 MB
- Clock Speed: 800 to 1,333 MHz
- Pin Count: 240 #
- Operating Temperature: 32 to 185 F
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Supplier: Acme Chip Technology Co., Limited
Description: MODULE DDR2 SDRAM 1GB 200SORDIMM
- Capacity: 1,000 MB
- Features: DRAM
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Supplier: Accuris
Description: MICROCIRCUIT MEMORY CMOS, DIGITAL, 256M X 8 BIT STACKED DIE (2GBIT) SYNCHRONOUS DRAM (SDRAM), MODULE
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Supplier: Accuris
Description: MICROCIRCUITS, MEMORY, DIGITAL, CMOS, 128M X 8 bit STACKED DIE(1Gbit) SYNCHRONOUS DRAM (SDRAM), MODULE
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Supplier: Accuris
Description: MICROCIRCUIT MEMORY CMOS, DIGITAL, 256M X 8 Bit STACKED DIE (2Gbit) SYNCHRONOUS DRAM (SDRAM), MODULE
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Supplier: Accuris
Description: MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 16-MEG X 48-BIT X 4-BANK (3-GIG), RADIATION-HARDENED, SYNCHRONOUS DRAM (SDRAM), MULTICHIP MODULE
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Description: MODULE DDR SDRAM 512MB 184UDIMM
- Capacity: 512 MB
- Features: DRAM
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Supplier: DigiKey
Description: Memory Module DDR4 SDRAM 64GB 2400MT/s 288-LRDIMM
- Capacity: 64,000 MB
- Pin Count: 288 #
- Features: DRAM, Other
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Supplier: Shenyang Vhandy Technology Co., Ltd.
Description: GCAN-402 two channel CAN-Bus data recorder is specially used for offline record CAN-Bus data. This adapter has integrated two CAN-bus interface and one TF card port. Users can use TF card record bus data real-time. GCAN-402 is suitable for historical data playback, error message analysis. That can
- Features: DRAM
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Supplier: Win Source Electronics
Description: Alternative Parts (Cross-Reference): Cross Category: Memory Cards, Modules Packaging: Tray Speed: 2666MT/s
- Memory Category: DRAM
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Supplier: Advantech
Description: SQRAM is Industrial Grade DRAM memory. all of SQRAM are designed with original IC chip and adopt a rigorous test program to ensure durable and r 288-pin Dual In-Line Memory Module Data Transfer Rate: 3200 MT/s Capacity: 4GB/8GB/16GB/32GB Operating Temperature: 0°C ~ 85°C Lifetime
- Capacity: 8,000 MB
- Clock Speed: 3,200 MHz
- Pin Count: 288 #
- Operating Temperature: 32 to 185 F
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Supplier: Avant Technology
Description: Avant Technology is a leading US manufacturer and global provider of DRAM memory modules and Flash sub-assemblies. From the POS and telecommunications sector, to commercial, networking, server and PC industries; Avant memory solutions are designed to fulfill a variety of business and
- Capacity: 4,000 MB
- Clock Speed: 400 MHz
- Pin Count: 240 #
- Supply Voltage: 1.8 V
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Supplier: Shenyang Vhandy Technology Co., Ltd.
Description: The GCAN-401 is a CAN-Bus storage, used for saving CAN-Bus data. This module can save the real-time data, whose function is to realize to collect history CAN-Bus data and analyze fault message. Function This module has integrated with system clock and document system.You can save and
- Supply Voltage: 1.2 V, 1.5 V, 1.8 V, 2.5 V, 2.7 V, 3 V
- Features: DRAM
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Supplier: ODG (Origin Data Global)
Description: MEMORY MODULES 32GB
- Capacity: 32,000 MB
- Features: Other
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1379256-MT18HTF25672FDZ-80EH1D6 Category: Memory Cards, Modules - Memory - Modules Fake Threat In the Open Market: 50 pct. MSL Level: 3 (168 Hours) Mfr: Micron Technology Inc. Package: Box Product Status: Obsolete Package / Case: 240-FBDIMM HTSUS: 8542.32.0036
- Memory Category: DRAM
- Features: Other
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Supplier: Radwell International
Description: DISCONTINUED BY MANUFACTURER, CPU CARD, MODULE - DRAM CPU 16 MEG, A2 DRAM, 16 MB. FREE 2 YEAR RADWELL WARRANTY
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Supplier: Shenyang Vhandy Technology Co., Ltd.
Description: GCAN-402 two channel CAN-Bus data recorder is specially used for offline record CAN-Bus data. This adapter has integrated two CAN-bus interface and one TF card port. Users can use TF card record bus data real-time. GCAN-402 is suitable for historical data playback, error message analysis. That can
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Supplier: VAST STOCK CO., LIMITED
Description: Computer-On-Modules - COM NXP i.MX6 Dual Q7 1GB DRAM
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Supplier: Win Source Electronics
Description: Manufacturer: Terasic Inc. Win Source Part Number: 1077905-MMM-3033-DSL Memory Type: DDR2 SDRAM Memory Size: 1GB Categories: Memory Cards, Modules Status: Active Dimension: 200-SODIMM Speed(Frequency): 800MT/s Popularity: Medium Fake Threat In the Open Market: 60 pct. Supply and Demand
- Memory Category: DRAM
- Features: Other
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Supplier: Win Source Electronics
Description: Manufacturer: CC-WMX-JN7A-NE Digi Alternative Parts (Cross-Reference): Cross Category: RF and Wireless RF Transceiver Modules and Modems Series: ConnectCore® 6UL Package: Tray Product Status: Active RF Family/Standard: Bluetooth, WiFi Frequency: 528MHz Serial Interfaces: Ethernet, I²C, I²S,
- Operating Frequency: 528 MHz
- Device Type: Transceiver
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Supplier: DigiKey
Description: 168 Position DIMM DRAM Socket Through Hole
- Features: Board Mount Connector, Other
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Supplier: Lingto Electronic Limited
Description: MODULE DRAM DDR
- Density: 4,000,000 kbits
- Access Time: 19 ns
- Memory Category: DRAM
- Features: Other
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Supplier: Yang Ming International Corporation
Description: DDR3 1333MHz 2GB REG ECC 128X8 M393B5673EH1-CH901 SAMSUNG Original Memory Module
- Capacity: 2,000 MB
- Clock Speed: 1,333 MHz
- Pin Count: 240 #
- Features: DRAM
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Supplier: Radwell International
Description: MODULE BOARD VME VSB DRAM. FREE 2 YEAR RADWELL WARRANTY
- Memory Category: DRAM
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Supplier: SK Hynix
Description: SK hynix is introducing 20nm class DDR4 SDRAM and its memory module family, best suited for all server segments such as enterprise, high-end and scale-out server, as well as high-end desktop. DDR4 introduces new and improved features, making DDR4 more capable than the earlier DRAM
- Capacity: 16 to 8,000 MB
- Pin Count: 204 to 244 #
- Operating Temperature: -40 to 185 F
- Form Factor: DIMM, SO DIMM
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Supplier: SK Hynix
Description: WIO2 (Wide IO 2) is the strong candidate of future mobile DRAM achieving high bandwidth (51.2GB/s, up to 68GB/s), advanced power efficiency, and small form factor.
- Capacity: 2,000 to 16,000 MB
- Supply Voltage: 1.2 V, 1.8 V
- Features: DRAM, Digital Electronics
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Supplier: SK Hynix
Description: WIO2 (Wide IO 2) is the strong candidate of future mobile DRAM achieving high bandwidth (51.2GB/s, up to 68GB/s), advanced power efficiency, and small form factor.
- Capacity: 64 to 2,000 MB
- Clock Speed: 105 to 166 MHz
- Operating Temperature: -22 to 185 F
- Supply Voltage: 1.2 V, 1.8 V
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Supplier: Radwell International
Description: PC BOARD MEMORY MODULE DRAM .7NS 64MX64. FREE 2 YEAR RADWELL WARRANTY
- Memory Category: DRAM
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Supplier: Advanced Micro Devices, Inc.
Description: Get superior stability and excellent performance with AMD Radeon™ memory Get more out of what you’ve already got with an easy, cost-effective memory upgrade from AMD. From browsing the Web and watching brilliant HD streaming video to playing the most demanding video games, AMD Radeon™ memory is
- Capacity: 4,000 to 16,000 MB
- Clock Speed: 1,333 to 2,400 MHz
- Features: DRAM, Personal Computing
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
offer IC design and foundry services in Europe Accent S.r.l. and Semiconductor Manufacturing International Corp. (SMIC) announced today (April 18, 2003) that the two companies will jointly provide a full range of IC design and production services for the European market. Asia rises in third-party DRAM
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
modules. DRAM prices keep rising despite dearth of demand Toshiba proposes flash lamp annealing for 65-nm node Flash lamp annealing (FLA) technology will
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
UniRAM 2004 module market to grow 27% February chip market sales up 30.8% y-on-y Silicon Image reorganizes, raises quarterly forecast Wi-Fi's penetration is rising in everything Gateway to shut down retail stores, cuts 2,500 jobs Elpida to acquire NEC fab, add to its DRAM operation SEMI speaks out
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Heard on the Beat (Jan. 25) Heard on the Beat (Jan. 25) Move to faster, more profitable DRAMs goes painfully slow for suppliers SAN JOSE -- It could be another long and miserable year in the poor DRAM industry, based on the consensus and general mood at the Platform Conference here this week
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
STMicroelectronics staffs up for likely FPGA bid Trikon introduces module to extend PVD tool use below 0.15 micron Rivals merge, paving way for unified digital radio spec Dense-Pac claims to stack different IC products in one unit On Semi rolls out dozen new devices in tiny package for wireless
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Trying to make sense of the cyclical semiconductor industry? Gathered here is a compendium of recent stories on IC forecasts, August chip data, DRAMs, PCs, and semiconductor equipment. Micrel latest to reduce forecast amid sales lull Chip maker Micrel Inc. on Friday (Oct. 1) lowered its revenue
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Betrayed Infineon to sell shares in ProMOS Claiming it was "betrayed " by Mosel Vitelic Inc. at a shareholders meeting, Infineon Technologies AG said Saturday it will sell its entire 30.7% stake in ProMOS Technologies Inc., its Taiwanese DRAM joint venture, according to a report from National
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Global Perspective for Competitive Enterprise, Economy and Ecology
Predicting the Yield Rate of DRAM Modules by Support Vector Regression............747 .
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Page 3. Semiconductor parts with 343 in root number
4,194,304-word x 32-bit DRAM module .
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