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Supplier: ThreeBond International, Inc.
Description: Electrically Conductive Resins These Electrically conductive resin can connect multiple electrical contacts simultaneously and make it possible to create an electrical connection in materials that cannot be soldered. They are
- Compound Type: Electrically Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Industry Applications: Automotive
- Viscosity: 75000 cP
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Supplier: Protavic America, Inc.
Description: Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 13.89 µin/in-F
- Composition: Unfilled
- Compound Type: Thermally Conductive
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Supplier: Cri-Tech, Inc.
Description: Cri-plastMP? PFA Electrically Conductive Compounds are formulated to meet your static dissipative/conducti ve, ATEX requirements in multiple applications. Specific grades can be processed by injection, extrusion, transfer molding, and compression molding. Superior static
- Elongation: 280 %
- Features: Anti-static / ESD Control, Electrically Conductive Compound (Adhesive, Grease)
- Industry: Electronics, Electrical Power / HV
- Tensile Strength (Break): 493125 psi
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Supplier: Cri-Tech, Inc.
Description: Cri-plastMP™ PFA Electrically Conductive Compounds are formulated to meet your static dissipative/conducti ve, ATEX requirements in multiple applications. Specific grades can be processed by injection, extrusion, transfer molding, and compression molding. Superior static dissipative
- Chemical / Polymer System Type: Fluoropolymer (PTFE / PVDF)
- Elongation: 280 %
- Features: Anti-static, Electrically Conductive Compound
- Industry: Industrial
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Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical,
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 17.22 to 53.89 µin/in-F
- Compound Type: Casting Resin
- Features: Electrically Conductive
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Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical,
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 29.44 to 44.44 µin/in-F
- Compound Type: Casting Resin
- Features: Electrically Conductive, Thermally Conductive
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Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical,
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 28.89 to 49.44 µin/in-F
- Compound Type: Casting Resin
- Features: Electrically Conductive, EMI / RFI Shielding, Thermally Conductive
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Supplier: Epoxies Etc...
Description: 50-3155 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3155 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination of properties makes this system ideal for applications
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 16.67 µin/in-F
- Composition: Filled
- Compound Type: Thermally Conductive
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Supplier: Epoxies Etc...
Description: 50-3185 is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are available to choose
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 17.72 µin/in-F
- Composition: Filled
- Compound Type: Thermally Conductive
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Supplier: Protavic America, Inc.
Description: PVIC ACE34033 electrically conductive die attach adhesive is designed for high reliability semiconductor packaging application. This high purity adhesive has been engineered for use in high throughput in-line die attach oven cure and its superb rheology allows minimum adhesive dispense
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Protavic America, Inc.
Description: PVIC ACE34030 electrically conductive die attach adhesive is designed for high reliability semiconductor or LED packaging application. This high purity adhesive has been engineered for use in high throughput in-line die attach oven cure and its superb rheology allows minimum adhesive
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 35 to 147 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: SAE International
Description: This specification covers a silver-filled epoxy resin in a suitable vehicle and a curing agent, supplied in kit form.
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 8.89 to 37.78 µin/in-F
- Compound Type: Casting Resin
- Dielectric Constant: 4.9
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Supplier: SAE International
Description: This specification covers an electrically-conduct ive adhesive supplied as two components, a silver-filled, epoxy-base adhesive and a separate curing agent which may be paste or liquid.
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Supplier: SAE International
Description: This specification covers an electrically-conduct ive adhesive supplied as two components; a paste of silver-filled, epoxy-base adhesive and a separate curing agent which may be paste or liquid.
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Supplier: Techsil Limited
Description: Elecolit® 3653 is a 1 component silver filled, solvent-free conductive epoxy adhesive used in applications which are subject to vibrations or quick temperature fluctuations. This unique product can be cured thermally in a very short period of time and cures to a 60 - 75 Shore D material
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Electrically Conductive
- Cure Type / Technology: Thermosetting / Crosslinking
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Ellsworth Adhesives
Description: ResinLab EP1285 Black is a two component, highly filled casting resin that is used for applications that require low CTE and high thermal conductivity. It is medium viscosity and resistance to bases, acids, water, and most organic solvents. Resin only, 1 qt Can.
- Compound Type: Electrically Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 365 to 400 kV/in
- Elongation: 1.5 %
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Supplier: Ellsworth Adhesives
Description: ResinLab EP1285 Black is a two component, highly filled casting resin that is used for applications that require low CTE and high thermal conductivity. It is medium viscosity and resistance to bases, acids, water, and most organic solvents. Resin only, 1 gal Pail.
- Compound Type: Electrically Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 365 to 400 kV/in
- Elongation: 1.5 %
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Supplier: SAE International
Description: Technical Standard
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Supplier: Master Bond, Inc.
Description: Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. Its low exotherm makes it well suited for large castings and potting applications. It withstands rigorous thermal cycling, vibration
- Applied Thickness / Gap Fill: 0.0020 to 0.0040 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Thermally Conductive
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Supplier: Ellsworth Adhesives
Description: Parker Lord CoolTherm® SC-309 is a two component, thermally conductive silicone encapsulant that is used for electrical/electroni c encapsulating applications. It provides low stress on components, environmental resistance, and excellent flame retardancy. Resin, 1 gal Pail.
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 599 kV/in
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Supplier: Protavic America, Inc.
Description: The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids which allow package 10 withstand 260C Pb-free reflow temperature. More over
- Chemical / Polymer System Type: Specialty / Other
- Coeff. of Thermal Expansion (CTE): 54.44 to 70 µin/in-F
- Composition: Single Component System, Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Epoxies Etc...
Description: 40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 14.44 µin/in-F
- Composition: Two Component System, Filled
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
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Supplier: Accuris
Description: COATING MATERIAL, ELECTRICALLY CONDUCTIVE SILVER - ORGANIC RESIN
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Supplier: Accuris
Description: Adhesive, Electrically Conductive Silver-Filled Epoxy Resin
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Description: Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive dispensing, has a
- Chemical / Polymer System Type: Epoxy (EP), Silicone
- Cure Type / Technology: Specialty / Other
- Features: Electrically Conductive Compound (Adhesive, Grease)
- Industry: Semiconductors / IC Packaging
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Description: Mainly used in LED chip bonding. Using the smallest dose of adhesive and the smallest residence time for sticking crystals will not cause tailing or wire drawing problems, greatly saving production costs and waste. It is suitable for automatic adhesive dispensing, with excellent adhesive output
- Chemical / Polymer System Type: Epoxy (EP), Silicone
- Cure Type / Technology: Specialty / Other
- Features: Electrically Conductive Compound (Adhesive, Grease)
- Industry: Semiconductors / IC Packaging
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Description: Mainly used in IC chip bonding. Designed for heat-sensitive applications that require low-temperature curing. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves
- Chemical / Polymer System Type: Epoxy (EP), Silicone
- Cure Type / Technology: Specialty / Other
- Features: Electrically Conductive Compound (Adhesive, Grease)
- Industry: Semiconductors / IC Packaging
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Supplier: Epoxies Etc...
Description: Epoxies, Etc... has engineered these materials to satisfy the requirements of many demanding coating and bonding applications that require electrical conductivity.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Two Component System, Unfilled
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
- Features: Electrically Conductive Compound (Adhesive, Grease)
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Supplier: Ellsworth Adhesives
Description: Parker Lord CoolTherm® SC-309 is a two component, thermally conductive silicone encapsulant that is used for electrical/electroni c encapsulating applications. It provides low stress on components, environmental resistance, and excellent flame retardancy. Resin, 5 gal Pail.
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 599 kV/in
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Supplier: Hernon Manufacturing, Inc.
Description: Dissipator® 745 is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator® 745, through a special shimming property, insulates the component electrically while allowing thermal
- Cure Type / Technology: Room Temp. Cure / Vulcanizing
- Features: Thermal Compound / Interface (Thermally Conductive)
- Form: Specialty / Other
- Industry: Electronics, Electrical Power / HV
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Supplier: Master Bond, Inc.
Description: developed one component formulation features outstanding electrical conductivity, superior mechanical strength plus excellent adhesive properties to both similar and dissimilar substrates. An additional attractive characteristic of this silver conductive film is its ability to cure
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 3.33E-5 to 1.11E-4 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 979 EC is a RTV-1 amine cure silicone rubber that cures on contact with moisture in the air. Special features Low volume resistivity Thixotropic paste Solvated Excellent adhesion to many substrates Application SEMICOSIL® 979 EC is an electrically conductive adhesive for use
- Chemical / Polymer System Type: Silicone
- Composition: Single Component System
- Cure Type / Technology: Reactive / Moisture Cured, Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
- Elongation: 200 %
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Supplier: Hernon Manufacturing, Inc.
Description: Hernon Dissipator 745D is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap.
- Cure Type / Technology: Room Temp. Cure / Vulcanizing
- Features: Thermal Compound / Interface (Thermally Conductive)
- Industry: Electronics, Electrical Power / HV
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Supplier: MacDermid Alpha Electronics Solutions
Description: Screen printable conductive adhesive for secure connection of components to flexible and formable circuit tracks. Product Overview XtraForm E7000 is a silver electrically conductive adhesive (ECA) designed for low-temperature substrates such as polyethylene terephthalate (PET)
- Features: Electrically Conductive Compound (Adhesive, Grease)
- Industry: Semiconductors / IC Packaging, Electronics
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Supplier: Hernon Manufacturing, Inc.
Description: Dissipator® 319 is a room temperature curing, two component thermal conductive epoxy adhesive for potting applications. Dissipator® 319 offers low viscosity for potting applications, is recommended for encapsulation of components that require heat dissipation and thermal shock properties.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Two Component System
- Features: Thermal Compound / Interface (Thermally Conductive)
- Form: Specialty / Other
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Supplier: Techsil Limited
Description: Momentive CRTV5120 is a high performance, semi-conductive silicone adhesive. This one-part RTV offers fast cure and a resistivity of 200 - 800 ohm-cm. CRTV5120 offers a primerless adhesion to many metals, plastics and glass. This product is ideal for gaskets & seals for electronics
- Chemical / Polymer System Type: Silicone
- Features: Electrically Conductive Compound (Adhesive, Grease)
- Industry: Electronics
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Supplier: Henkel Corporation - Industrial
Description: schedules. Non-conductive Low viscosity Reduced resin bleed Hydrophobic Stable at high temperatures Void-free bondline Excellent adhesive strength High resistance to delamination Good resistance to "popcorning" after exposure to lead-free solder reflow temperature
- Coeff. of Thermal Expansion (CTE): 32.78 µin/in-F
- Features: Electrically Insulating / Dielectric
- Substrate / Material Compatibility: Plastic
- Viscosity: 8200 cP
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Supplier: Techsil Limited
Description: MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive Compound (Adhesive, Grease), Thermal Compound / Interface (Thermally Conductive)
- Industry: Electronics
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Supplier: Henkel Corporation - Industrial
Description: ABLESTIK ABP 8420 will cure at temperatures as low as 80ºC in conventional box or convection conveyor oven curing. If used over an active die face, an adhesive bondline thickness of >1 mil must be maintained to prevent die scarring. Non-conductive Excellent resin bleed out
- Coeff. of Thermal Expansion (CTE): 30 µin/in-F
- Features: Electrically Insulating / Dielectric
- Thermal Conductivity: 0.3000 W/m-K
- Viscosity: 13500 cP
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Supplier: AGC Chemicals Americas, Inc.
Description: Melt processable copolymers composed of tetrafluoroethylene and ethylene, Fluon® ETFE Resins offer superior physical toughness and adaptability to meet the ranging needs of simple, high-quality, complicated and even high-performance products. The fluoropolymers maintain stable mechanical and
- Dielectric Constant: 2.4
- Elongation: 380 %
- Features: Electrically Conductive, Flame Retardant (e.g. UL 94 Rated), UL Approved
- Filler Material: Unfilled
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Supplier: AGC Chemicals Americas, Inc.
Description: Melt processable copolymers composed of tetrafluoroethylene and ethylene, Fluon® ETFE Resins offer superior physical toughness and adaptability to meet the ranging needs of simple, high-quality, complicated and even high-performance products. The fluoropolymers maintain stable mechanical and
- Dielectric Constant: 2.6
- Dielectric Strength: 1800 kV/in
- Elongation: 382 %
- Features: Electrically Conductive, Flame Retardant (e.g. UL 94 Rated), UL Approved
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Supplier: Techsil Limited
Description: Elecolit® 6603 is a thermally conductive epoxy with very good metal adhesion and slight flexibility. This grade has very good flow behavior and can easily be processed using a dispenser, spreading knife or spatula. Although designed for bonding applications, 6603 can also be used as
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive Compound (Adhesive, Grease), Thermal Compound / Interface (Thermally Conductive)
- Industry: Electronics
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Featured Products Top
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Static Dissipative / Electrical Conductive Thermal Conductivity EMI Shielding Reduced Permeation Elevated Temperature Performance Masterbatch Overview: Graphene (read more)
Browse Resins and Compounds Datasheets for Cri-Tech, Inc. -
Whether you are looking for Constant Wattage (stable resistance over a wide temperature range), or desire Self-Regulating behavior (change with temp), Cri-plastMP Electrically Conductive Compounds are formulated to meet your static dissipative/conductive, ATEX requirements in multiple (read more)
Browse Resins and Compounds Datasheets for Cri-Tech, Inc. -
Cri-plastMP PFA Static Dissipative Compounds are formulated to meet your static dissipative/conductive, ATEX requirements in multiple applications. Specific grades can be processed by injection, extrusion, transfer molding, and compression molding. Special Features (read more)
Browse Molding Compounds and Resins Datasheets for Cri-Tech, Inc. -
Cri-Tech, Inc. announces the introduction of a new line of Cri-plastMPTM PFA Static Dissipative - High Flow Compounds. Specially formulated for injection molding and designed to meet your static dissipative/conductive, ATEX requirements in multiple applications (read more)
Browse Resins and Compounds Datasheets for Cri-Tech, Inc. -
. Filled PTFE Compounds: Compounded with pigments and fillers like glass, graphite and metal powders for enhanced wear, creep resistance and thermal/electrical performance. Adhesive Grades: Fluorinated adhesive resin compounds made with Fluon (read more)
Browse Resins and Compounds Datasheets for AGC Chemicals Americas, Inc. -
You application needs both barrier and flexibility!! In the past, THV500 was an option, but is now obsolete. We have the solution. Cri-plastMP F-TPVs are proven compounds designed to meet your Automotive and Small Engine Fuel System requirements. Cri-plastMP F-TPV compounds offer a range of solutions to meet your specific application permeation, flexibility, bonding...
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Browse Resins and Compounds Datasheets for Cri-Tech, Inc. -
Cri-Tech, Inc. manufactures custom thermoplastics and thermoplastic resins to match your specifications. Cri-Tech continues to grow its compounding business which includes fluoroplastics, alloys/blends of fluoroplastics and fluoroelastomers (FKM), as well as other high performance (read more)
Browse Resins and Compounds Datasheets for Cri-Tech, Inc. -
Cri-Tech specializes in both Elastomer and Plastic Fluoromaterials, allowing for the development of unique Cri-plastMPTM F-TPE, TPV and TPX for automotive wire & cable and fuel systems. These standard, or custom tailored comounds, offer a unique combination of heat performance, chemical resistance and flexibility.
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Browse Resins and Compounds Datasheets for Cri-Tech, Inc. -
Low permeation and excellent flexibility. Cri-plastMP F-TPVs are proven compounds designed to meet your Automotive and Small Engine Fuel System requirements. Cri-plastMP F-TPV compounds offer a range of solutions to meet your specific application permeation, modulus/flexibility,
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Browse Resins and Compounds Datasheets for Cri-Tech, Inc. -
Cri-Tech, Inc. manufactures custom resins and compounds to match your specifications. Formulation Development, Custom Rubber and Plastic Compounding, Color development & Specialty Toll Manufacturing. Cri-Tech 5,200 m2 state of the art facility has over 3,600 MTs of internal and twin (read more)
Browse Resins and Compounds Datasheets for Cri-Tech, Inc.
Conduct Research Top
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Electrically Conductive Adhesives
The exponential rise and now nearly universal integration of electronic devices in our daily lives has necessitated the creation of advanced adhesives and coatings. Electrically Conductive Adhesives (ECAs) have worked their way into a number of fields both directly and indirectly related
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Graphene Enhanced Conductive Adhesives
G6 Epoxy offers a broad range of electrically conductive adhesives based on proprietary fillers. In our formulations, we extensively use nanomaterials, especially graphene, which profoundly enhance the performance of epoxy resins.
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Choosing the Best Epoxy or Urethane for Electrical Applications
The 3 most commonly sought after resins for electrical applications can be classified as electrically conductive, electrically insulative, and statically dissipative.
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Silicone Based Electrical Insulation Material for High Speed/Voltage Rotating Machines
This paper introduces the key requirements for resin rich electrical insulation materials for rotating machinery. The key requirements, or stresses that insulation are subject to, are summarized as T.E.A.M. (thermal, electrical, ambient, and mechanical). Resin rich insulation materials can be based
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Silicone Based Insulation Material for High Speed/Voltage Rotating Machines
This paper introduces the key requirements for resin rich electrical insulation materials for rotating machinery. The key requirements, or stresses that insulation are subject to, are summarized as T.E.A.M. (thermal, electrical, ambient, and mechanical). Resin rich insulation materials can be based
More Information Top
Indicates content that may require registration and/or purchase.
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Electrical conductivity and rheology of carbon‐filled liquid crystal polymer composites
Abstract One emerging market for electrically conductive resins is for bipolar plates for use in fuel cells.
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Thermal and electrical conductivity of carbon–filled liquid crystal polymer composites
One emerging market for thermally and electrically conductive resins is for bipolar plates for use in fuel cells.
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Synergistic effects of carbon fillers in electrically and thermally conductive liquid crystal polymer based resins
One emerging mar- ket for electrically conductive resins is for bipolar plates for use in fuel cells.
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Synergistic effects of carbon fillers on tensile and flexural properties in liquid‐crystal polymer based resins
Abstract One emerging market for thermally and electrically conductive resins is bipolar plates for use in fuel cells.
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Electrical conductivity and rheology of carbon fiber/liquid crystal polymer composites
Abstract One emerging market for electrically conductive resins is for bipolar plates for use in fuel cells.
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Electrical conductivity modeling of carbon‐filled liquid‐crystalline polymer composites
Abstract Electrically conductive resins are needed for bipolar plates used in fuel cells.
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Tensile modulus modeling of carbon‐filled liquid crystal polymer composites
An electrically conductive resin is used in static dissipative, semiconducting (e.g., fuel gages, etc.), or EMI (electromagnetic interference)/RFI (radio fre- quency interference) shielding applications (e.g., com- puter and cellular phone housings, etc).
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Electrical conductivity model evaluation of carbon fiber filled liquid crystal polymer composites
Abstract Electrically conductive resins may have applications as fuel cell bipolar plates.
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Shielding effectiveness of carbon‐filled nylon 6,6
Abstract Electrically conductive resins can be made by adding electrically conductive fillers to typically insulating polymers.
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Synergistic effects of carbon fillers on tensile and impact properties in nylon 6,6 and polycarbonate based resins
An elec- trically conductive resin is used in static dissipative, semi-conducting (e.g., fuel gauges), or EMI (Electromag- netic Interference)/RFI (Radio Frequency Interference) shielding applications (e.g., computer and cellular phone housings).