Electrically Conductive Resins

Description: Electrically Conductive Resins These Electrically conductive resin can connect multiple electrical contacts simultaneously and make it possible to create an electrical connection in materials that cannot be soldered. They are electro-conductive

• Viscosity: 75,000 cP
• Cure / Technology: Anaerobic
• Industry: Automotive, Electronics
• Features: Electrically Conductive

Description: 50-3185 is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are available to choose from.

• Thermal Conductivity: 1.35574226 W/m-K
• Coeff. of Thermal Expansion (CTE): 16.5 µin/in-F
• Dielectric Strength: 390.0000000000004 kV/in
• Dielectric Constant (Relative Permittivity): 5.21

Description: COATING MATERIAL, ELECTRICALLY CONDUCTIVE SILVER - ORGANIC RESIN

Description: 50-3155 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3155 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination of properties makes this system ideal for applications where

• Viscosity: 3,000 to 15,000 cP
• Use Temperature: -67 to 401 F
• Thermal Conductivity: 3.6056975 W/m-K
• Coeff. of Thermal Expansion (CTE): 16.666666666666668 µin/in-F

Description: Adhesive, Electrically Conductive Silver-Filled Epoxy Resin

Description: ADHESIVE, ELECTRICALLY CONDUCTIVE SILVER-FILLED EPOXY RESIN (STABILIZED TYPE)

Description: Technical Standard

Description: Technical Standard

Description: This specification covers a silver-filled epoxy resin in a suitable vehicle and a curing agent, supplied in kit form.

Description: This specification covers an electrically-conductive adhesive supplied as two components, a silver-filled, epoxy-base adhesive and a separate curing agent which may be paste or liquid.

Description: Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing.

• Viscosity: 20,000 to 30,000 cP
• Coeff. of Thermal Expansion (CTE): 13.88888888888889 µin/in-F
• Substrate Compatibility: Ceramic / Glass
• Features: Die Bonding Adhesive / Compound, Electrical Insulation / Dielectric, Gel, Other, Thermal / Heat Conductive, Unfilled

Description: 40-3905 is an electrically conductive system designed for applications requiring low temperature cures. 40-3905 will cure at room temperature in 18 hours or can be accelerated with mild heat.

• Use Temperature: -58 to 329 F
• Thermal Conductivity: 15.1439295 W/m-K
• Coeff. of Thermal Expansion (CTE): 14.444444444444445 µin/in-F
• Tensile Strength (Break): 9,500 psi

Description: Cri-plastMP™ PFA Electrically Conductive Compounds are formulated to meet your static dissipative/conductive, ATEX requirements in multiple applications. Specific grades can be processed by injection, extrusion, transfer molding, and compression molding. Superior static

• Tensile Strength (Break): 493,125.25381447 psi
• Elongation: 280 %
• Features: ESD Control / Anti-static, Other
• Industry: Electrical Power / HV (Coils, Motors), Electronics (PCB / SMT Assembly)

Description: Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. Its low exotherm makes it well suited for large castings and potting applications. It withstands rigorous thermal cycling, vibration

• Applied Thickness / Gap Fill: 0.002 to 0.004 inch
• Viscosity: 3,000 to 6,000 cP
• Use Temperature: -100 to 400 F
• Tensile Strength (Break): 4,000 to 6,000 psi

Description: Cri-plastMP™ PFA Electrically Conductive Compounds are formulated to meet your static dissipative/conductive, ATEX requirements in multiple applications. Specific grades can be processed by injection, extrusion, transfer molding, and compression molding. Superior static

• Use Temperature: 500 F
• Tensile Strength (Break): 493,125.25381447 psi
• Elongation: 280 %
• Melt Flow Index (MFI): 1 to 5.5 g / 10 minutes

Description: characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These

• Use Temperature: 482 F
• Thermal Conductivity: 1.4 W/m-K
• Coeff. of Thermal Expansion (CTE): 26.666666666666664 to 83.33333333333333 µin/in-F
• Viscosity: 800 to 1,600 cP

Description: characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These

• Use Temperature: 482 F
• Thermal Conductivity: 2.5 W/m-K
• Coeff. of Thermal Expansion (CTE): 28.88888888888889 to 49.44444444444444 µin/in-F
• Viscosity: 25,000 to 45,000 cP

Description: 40-3914 is a one component electrically conductive ink. This Polymer system was developed to provide a good balance of low cost and high conductivity. This thick film ink provides conductivity for many electronic and industrial applications. 40-3914 exhibits outstanding adhesion to a

• Viscosity: 14,000 cP
• Use Temperature: -4 to 275 F
• Substrate Compatibility: Ceramic / Glass, Plastic
• Features: Die Bonding Adhesive / Compound, Electrically Conductive, Filled, Liquid, Room Temperature Curing

Description: characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These

• Use Temperature: 527 F
• Thermal Conductivity: 10.9 to 23 W/m-K
• Coeff. of Thermal Expansion (CTE): 29.444444444444443 to 44.44444444444444 µin/in-F
• Viscosity: 3,500 to 6,000 cP

Description: Ducoya® G202 C is a high-purity-filled polyimide for semiconductor applications requiring electrically conductive material. This material is intended for use in the latest semiconductor manufacturing operations, especially where process conditions could generate static electricity.

• Features: Electrically Conductive Compound
• Form / Shape: Pellets
• Chemical System: Polyimide
• Industry: Semiconductor / IC's

Description: SEMICOSIL® 979 EC is a RTV-1 amine cure silicone rubber that cures on contact with moisture in the air. Special features Low volume resistivity Thixotropic paste Solvated Excellent adhesion to many substrates Application SEMICOSIL® 979 EC is an electrically conductive adhesive for use

• Tensile Strength (Break): 200 psi
• Elongation: 200 %
• Features: Electrically Conductive Compound (Adhesive, Grease), Grease / Paste
• Industry: Electronics

Description: ResinLab EP1285 Black is a two component, highly filled casting resin that is used for applications that require low CTE and high thermal conductivity. It is medium viscosity and resistance to bases, acids, water, and most organic solvents. Resin only, 1 qt Can.

• Thermal Conductivity: 0.79 to 1.2 W/m-K
• Elongation: 1.5 %
• Tensile Strength (Break): 4,000 to 6,900 psi
• Dielectric Strength: 365.00000000000006 to 400.00000000000006 kV/in

Description: Parker Lord CoolTherm® SC-309 is a two component, thermally conductive silicone encapsulant that is used for electrical/electronic encapsulating applications. It provides low stress on components, environmental resistance, and excellent flame retardancy. Resin, 1 gal Pail.

• Thermal Conductivity: 0.9 W/m-K
• Tensile Strength (Break): 50 psi
• Dielectric Strength: 599.4400000000013 kV/in
• Features: Encapsulating / Potting, Thermal Compound / Heat Conductive

Description: Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required.

• Applied Thickness / Gap Fill: 0.001 to 0.003 inch
• Viscosity: 80,000 to 100,000 cP
• Use Temperature: -100 to 300 F
• Thermal Conductivity: 1.16 to 1.6 W/m-K

Description: ResinLab EP1285 Black is a two component, highly filled casting resin that is used for applications that require low CTE and high thermal conductivity. It is medium viscosity and resistance to bases, acids, water, and most organic solvents. Resin only, 1 gal Pail.

• Thermal Conductivity: 0.79 to 1.2 W/m-K
• Elongation: 1.5 %
• Tensile Strength (Break): 4,000 to 6,900 psi
• Dielectric Strength: 365.00000000000006 to 400.00000000000006 kV/in

Description: characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These

• Use Temperature: 617 F
• Thermal Conductivity: 3.2 W/m-K
• Coeff. of Thermal Expansion (CTE): 26.666666666666664 to 58.888888888888886 µin/in-F
• Viscosity: 3,000 to 4,000 cP

Description: Parker Lord CoolTherm® SC-309 is a two component, thermally conductive silicone encapsulant that is used for electrical/electronic encapsulating applications. It provides low stress on components, environmental resistance, and excellent flame retardancy. Resin, 5 gal Pail.

• Thermal Conductivity: 0.9 W/m-K
• Tensile Strength (Break): 50 psi
• Dielectric Strength: 599.4400000000013 kV/in
• Features: Encapsulating / Potting, Thermal Compound / Heat Conductive

Description: Toughened, two part epoxy Supreme 11ANHT withstands thermal cycling and is both thermally conductive and electrically insulative.

• Applied Thickness / Gap Fill: 0.002 to 0.004 inch
• Use Temperature: -112 to 400 F
• Thermal Conductivity: 2.88 to 3.1 W/m-K
• Coeff. of Thermal Expansion (CTE): 16.666666666666668 to 19.444444444444443 µin/in-F

Description: Cyanoacrylate Adhesive, 1.05 @ 75 ºF Specific Gravity Conductive Epoxy, Silver Epoxy Resin, Mild Odor Conductive Silver Epoxy Provides Excellent Electrical and Thermal Conductivity High Strength Conductive Bonding Repairs Defective Traces and Creates Jumpers on Boards

Description: Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures. The mix ratio of the EP75-1 system is 100 to 15 by

• Use Temperature: -60 to 250 F
• Thermal Conductivity: 0.7211395 W/m-K
• Coeff. of Thermal Expansion (CTE): 19.444444444444443 µin/in-F
• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material

Description: LOCTITE ABLESTIK ABP 8420, Epoxy, Die Attach, Non-Conductive Adhesive LOCTITE® ABLESTIK ABP 8420 non-conductive adhesive is designed for cap, lid attach applications in wirebond packages. This adhesive can be fast cured using directed heat energy or hot plate curing techniques. LOCTITE

• Viscosity: 13,500 cP
• Thermal Conductivity: 0.3 W/m-K
• Coeff. of Thermal Expansion (CTE): 30 µin/in-F
• Features: Electrically Insulating / Dielectric

Description: Screen printable conductive adhesive for secure connection of components to flexible and formable circuit tracks. Product Overview XtraForm E7000 is a silver electrically conductive adhesive (ECA) designed for low-temperature substrates such as polyethylene terephthalate (PET)

• Features: Electrically Conductive
• Industry: Electronics, Semiconductors / IC Packaging