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Supplier: Protavic America, Inc.
Description: PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include
- Viscosity: 8,000 to 10,000 cP
- Use Temperature: -55 to 200 F
- Thermal Conductivity: 1.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 111.11111111111111 µin/in-F
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Supplier: Protavic America, Inc.
Description: PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature
- Viscosity: 400 cP
- Thermal Conductivity: 0.5 W/m-K
- Coeff. of Thermal Expansion (CTE): 3,055.5555555555557 µin/in-F
- Dielectric Strength: 635.0000000000014 kV/in
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Supplier: Ellsworth Adhesives
Description: Dow SYLGARD™ 160 Silicone Elastomer is a two component, room temperature or heat curing encapsulant that is used for general potting applications of power supplies. It has good flowability, moderate thermal conductivity, and flame resistance. 1:1 mix ratio. 200 mL Cartridge. This is a
- Viscosity: 8,775 cP
- Thermal Conductivity: 0.62 W/m-K
- Dielectric Strength: 482.600000000001 kV/in
- Features: Electrical Power / HV, Encapsulating / Potting
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Supplier: Ellsworth Adhesives
Description: Dow SYLGARD™ 164 Silicone Elastomer Gray is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides good flowability, thermal
- Viscosity: 8,925 cP
- Thermal Conductivity: 0.64 W/m-K
- Dielectric Strength: 482.600000000001 kV/in
- Features: Electrical Power / HV, Encapsulating / Potting
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Supplier: CHT USA Inc.
Description: CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where
- Use Temperature: -94 to 482 F
- Thermal Conductivity: 1.17 W/m-K
- Elongation: 30 %
- Tensile Strength (Break): 117.47983987932957 psi
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Supplier: Ellsworth Adhesives
Description: Dow SYLGARD™ 170 Silicone Elastomer is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides good flowability, moderate
- Viscosity: 3,400 cP
- Thermal Conductivity: 0.39 W/m-K
- Dielectric Strength: 482.600000000001 kV/in
- Features: Electrical Power / HV, Encapsulating / Potting
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Supplier: Ellsworth Adhesives
Description: Dow SYLGARD™ 182 Silicone Elastomer Clear is a two component, heat curing encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides flexibility, low stress, easy to repair, long
- Viscosity: 4,575 cP
- Thermal Conductivity: 0.16 W/m-K
- Dielectric Strength: 475 kV/in
- Features: Electrical Power / HV, Encapsulating / Potting
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Supplier: Henkel Corporation - Electronics
Description: (Known as E&C STYCAST 5952 A/B thermally conductive silicone encapsulant ) LOCTITE STYCAST 5952 RD PTA is a filled, addition cured, silicone encapsulant. It features good thermal conductivity, excellent electrical insulation properties. It was designed for encapsulating
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
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Encapsulants and Potting Compounds - Techsil® RTV27905 Clr Silicone Gel Encapsulant 2kg -- TESI19128Supplier: Techsil Limited
Description: Techsil® RTV27905 is a soft, adherent, clear silicone elastomer gel which is designed for the encapsulation and protection of electronic components. It is a low viscosity, 2 component system that is easily mixed in a 1:1 ratio. RTV27905 belongs to a wider family of products in a
- Features: Encapsulating / Potting
- Chemical System: Rubber Based / Elastomeric, Silicone
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Encapsulants and Potting Compounds - Techsil RTV27905 Clr Silicone Gel Encapsulant 10kg -- TESI19154Supplier: Techsil Limited
Description: Techsil® RTV27905 is a soft, adherent, clear silicone elastomer gel which is designed for the encapsulation and protection of electronic components. It is a low viscosity, 2 component system that is easily mixed in a 1:1 ratio. RTV27905 belongs to a wider family of products in a
- Features: Encapsulating / Potting
- Chemical System: Rubber Based / Elastomeric, Silicone
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Supplier: CHT USA Inc.
Description: CHT's QSil 58 is a 2-part, condensation cure, high temperature, self-leveling, silicone elastomer primarily used for electronic potting applications to provide protection from moisture, debris, vibration and shock. The two applicable catalysts are 0.5% DBT by weight and 10% Deep
- Use Temperature: -65.2 to 500 F
- Thermal Conductivity: 0.31 W/m-K
- Dielectric Strength: 353.06000000000074 kV/in
- Viscosity: 9,000 cP
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Supplier: CHT USA Inc.
Description: CHT’s TufGel 336 is a 2-part, tough, black silicone gel designed for electronic potting applications to provide protection from moisture, vibration and thermal or mechanical shock. TufGel 336 can also function as a contrast enhancement material in LED applications. TufGel 336 is also
- Viscosity: 390 cP
- Use Temperature: -67 to 399.2 F
- Dielectric Strength: 450.00000000000006 kV/in
- Industry: Automotive, OEM / Industrial
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Supplier: CHT USA Inc.
Description: CHT's QSil 216 is a 2-part, platinum cure, optically clear silicone encapsulant designed for optical applications. QSil 216 features a 10:1 mix ratio by weight and its low viscosity profile enables excellent flow around components and is excellent for potting complex parts. The
- Use Temperature: -67 to 399.2 F
- Thermal Conductivity: 0.18 W/m-K
- Elongation: 100 %
- Tensile Strength (Break): 749.8404594767085 psi
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Supplier: Wacker Chemical Corp.
Description: WACKER SilGel® 611 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a soft silicone gel. WACKER SilGel® 611 A/B is a white colored modification of WACKER SilGel® 612 with higher hardness and reactivity. Special features two-part, 1 : 1
- Viscosity: 1,000 cP
- Features: Electronics, Encapsulating / Potting, Liquid, RTV / Room Temperature Curing
- Chemical System: Rubber Based / Elastomeric, Silicone
- Cure / Technology: Single Component System, Thermosetting / Crosslinking
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Supplier: Chemence Inc.
Description: KSC2040 is a thermally conductive silicone RTV adhesive rubber developed for heat sink applications. KSC2040 is a 1-part silicone that when applied to the substrate enables adhesion to parts and heat transfer of the bonded assembly within minutes. When cured, the elastomer resists
- Viscosity: 600,000 cP
- Form / Function: Die Bonding Adhesive / Compound
- Features: Electronics, Grease / Paste, Metal, Plastic
- Chemical System: Silicone
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST S 5225, Silicone, Potting, Encapsulating LOCTITE® STYCAST S 5225 liquid encapsulant is designed for use on small electronic devices requiring a low viscosity material capable of flowing throughout tightly packed components. LOCTITE STYCAST S 5225 features
- Viscosity: 2,230 cP
- Chemical System: Silicone
- Cure / Technology: Two Component System
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 924 is a pourable,thermally curable, addition-curing one-part silicone rubber that cures to a very soft silicone gel. Special features one-part, ready-to-use thixotropic flow forms a soft gel on vulcanization low content of volatiles low content of uncured polymer low ion
- Viscosity: 2,500 to 35,000 cP
- Use Temperature: -58 to 356 F
- Features: Electronics, Encapsulating / Potting
- Chemical System: Rubber Based / Elastomeric, Silicone
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Supplier: Bluestar Silicones USA Corp.
Description: Clear, Two-Component, Addition Cure, Heat Curing Electronic coating Silicone Compound Properties Viscosity 6000 Hardness Sha 30 Description BLUESIL V-207 is a clear, two component, addition cure, heat curing silicone rubber compound. It is designed as a primerless coating and
- Form / Function: Conformal / Encapsulating Coating
- Features: Electronics, Encapsulating / Potting, Liquid
- Cure / Technology: Reactive / Moisture Cured, Thermosetting / Crosslinking, Two Component System
- Chemical System: Silicone
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 992JC is a white, high purity, semi-thixotropic, one-component heat-cured compound.
- Viscosity: 150,000 cP
- Elongation: 100 %
- Dielectric Strength: 508.0000000000011 kV/in
- Dielectric Constant (Relative Permittivity): 3.5
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Supplier: Techsil Limited
Description: temperatures. In addition, this grade also offers superior thermal conductivity properties when compared to other conventional silicone encapsulants. Product Benefits Convenient 1:1 mixing ratio Solvent free Low shrinkage Reversion resistant and hydrolytically stable Self-bonding,
- Use Temperature: -55 to 200 F
- Features: Electronics, Encapsulating / Potting, Thermal Compound / Heat Conductive
- Chemical System: Rubber Based / Elastomeric, Silicone
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Supplier: Techsil Limited
Description: RTV560 is a silicone rubber compound from Momentive Performance Materials. It offers excellent release properties and also good adhesion capabilities with the use of a primer. This grade with cure at room temperature and retains its elastomeric properties across a wide temperature range.
- Use Temperature: -115 to 260 F
- Features: Electronics, Encapsulating / Potting
- Chemical System: Rubber Based / Elastomeric, Silicone
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Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL STYCAST U2535 Polyurethane Encapsulant ) LOCTITE STYCAST U 2535 PTB two component flexible polyurethane encapsulant designed for transformer, PCB's and other insulation applications. It allows complete impregnation of either small slightly wound coils or large castings.
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
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Supplier: Allied Electronics, Inc.
Description: MG Chemicals offers a comprehensive portfolio of silicone solutions to help meet a broad array of handling and performance needs in electronic components and assemblies. Selection of the appropriate type of RTV depends upon the required manufacturing process, handling requirements,
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Supplier: Bluestar Silicones USA Corp.
Description: Potting, encapsulant elastomer Properties Viscosity 3500 Hardness Sha 48 Description a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL™ ESA 7252 QC A & B is supplied as a viscous liquid which is
- Thermal Conductivity: 0.42 W/m-K
- Tensile Strength (Break): 333.584730521553 psi
- Elongation: 170 %
- Dielectric Strength: 457.20000000000095 kV/in
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Supplier: Epoxies Etc...
Description: 20-1615 is a two component, room temperature curing silicone rubber compound. This silicone system is clear, odorless, and low in viscosity. 20-1615 is an excellent choice for potting electronic assemblies that require shock and vibration resistance. It also protects assemblies
- Viscosity: 6,000 cP
- Use Temperature: -175 to 401 F
- Thermal Conductivity: 0.207688176 W/m-K
- Coeff. of Thermal Expansion (CTE): 182.99999999999997 µin/in-F
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Supplier: Allied Electronics, Inc.
Description: Potting⁄Encapsulating Compound, 120% Elongation, 1.05 Specific Gravity, Optical Clear Color Offering higher performance qualities over conventional RTV silicones. MG Chemicals sealants will bond to many clean surfaces without the aid of primers. Many of these one-part RTV silicone
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Supplier: Bluestar Silicones USA Corp.
Description: Silicone Elastomer for encapsulating applications Properties Viscosity 7500 Hardness Sha 55 Description Bluesil V-1010 is a medium strength, two-component, tin catalyzed, room temperature cure silicone rubber. It is designed as a low viscosity, very flowable material for use as a
- Use Temperature: -65 to 400 F
- Tensile Strength (Break): 400 psi
- Elongation: 105 %
- Form / Function: Conformal / Encapsulating Coating
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Supplier: Bluestar Silicones USA Corp.
Description: Two-Component, Medium Viscosity, Addition Cure, Potting/Encapsulating Silicone Compound Properties Viscosity 44000 Hardness Sha 29 Description Bluesil V-217 is a clear, two component, medium viscosity, addition cure silicone compound. It is designed for potting and encapsulating
- Viscosity: 44,000 cP
- Form / Function: Conformal / Encapsulating Coating
- Features: Electronics, Encapsulating / Potting, Grease / Paste
- Chemical System: Silicone
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Supplier: Allied Electronics, Inc.
Description: Specific Gravity 1.47, Red, RTV Silicone Adhesive Sealant Offering higher performance qualities over conventional RTV silicones. MG Chemicals sealants will bond to many clean surfaces without the aid of primers. Many of these one-part RTV silicone adhesive sealants are suitable
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Supplier: Chemence Inc.
Description: KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that when mixed will cure
- Viscosity: 150,000 cP
- Form / Function: Die Bonding Adhesive / Compound
- Features: Electronics, Grease / Paste, Plastic
- Chemical System: Silicone
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Supplier: Novagard Solutions
Description: No Description Provided
- Tensile Strength (Break): 200 to 240 psi
- Elongation: 600 %
- Features: Ceramic / Glass, Composites, Conformal Coating, Electrical Insulation / Dielectric Material, Electronics, Encapsulanting / Potting, Gap Filling Sealant / FIP Gasket, Grease / Paste, Metal, Non-corrosive Cure, Plastic, UL Approved
- Form / Function: Die Bonding Adhesive / Compound, Glob Top / Daub
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Supplier: Novagard Solutions
Description: No Description Provided
- Viscosity: 8,000 to 12,000 cP
- Tensile Strength (Break): 30 to 50 psi
- Elongation: 80 to 120 %
- Features: Ceramic / Glass, Composites, Conformal Coating, Electrical Insulation / Dielectric Material, Electrical Power / HV, Electronics, Encapsulating / Potting, Liquid, Metal, Non-corrosive Cure, RTV / Room Temperature Curing
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Supplier: Master Bond, Inc.
Description: MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation.
- Applied Thickness / Gap Fill: 1 inch
- Viscosity: 1,000 cP
- Use Temperature: -67 to 392 F
- Dielectric Strength: 500.00000000000006 kV/in
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview SC4004 is a thixotropic silicone potting compound developed for the Indian electronics market. Its thixotropic nature provides excellent flow characteristics, making it ideal for potting tight units or electronics with small and delicate components. It offers
- Features: Electronics, Encapsulating / Potting, Thermal Compound / Heat Conductive
- Industry: Semiconductors / IC Packaging
- Chemical System: Silicone
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Supplier: Allied Electronics, Inc.
Description: Specific Gravity 1.04, Translucent, RTV Silicone Adhesive Sealant Offering higher performance qualities over conventional RTV silicones. MG Chemicals sealants will bond to many clean surfaces without the aid of primers. Many of these one-part RTV silicone adhesive sealants are
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Silicones for Electronic Protection and Long-term Performance Electronics function in many different applications. However, there is a common requirement to protect sensitive components and systems from (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
and premature failure such as vibration, shock, and stress caused by temperature fluctuation during thermal cycling. Material options for electronic protection include silicones, epoxies, polyurethanes, and other various polymers. Silicones are extremely durable and feature important and (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
be formulated to only cure with the use of heat in order to achieve a very long pot life. Silicone gels are used in numerous electronic applications when a soft and highly flexible encapsulation or potting is required. CHT’s silicone gels protect delicate components and assemblies (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
Potting Materials for Electronic Applications ELANTAS offers a broad range of potting and encapsulation materials for electronic protection (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
Dymax light?curable encapsulants help simplify PCB assembly while improving reliability and long?term performance. Key advantages include: Faster throughput and less rework using UV or LED light?curing that (read more)
Browse Encapsulants and Potting Compounds Datasheets for Dymax -
Resilient Encapsulant for PCB and Electronic Assembly Engineered for rapid, reliable protection of complex electronic and microelectronic assemblies, this light-curable encapsulant enhances resistance to moisture, thermal cycling, and abrasion while maintaining (read more)
Browse Encapsulants and Potting Compounds Datasheets for Dymax -
runaway and provide protection from moisture, debris, vibration and shock for electronic components and EV battery packs. CHT’s silicone foam is also ideal where low smoke, flame and toxicity are required. CHT’s SilSo Lite 21025 is a two-part, room temperature platinum cure, self (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
potting materials are based on epoxy, polyurethane, polybutadiene and silicone and are especially designed for areas in demanding electrical and electronic applications. Additional properties such as improved heat dissipation, much greater mechanical stability at high vibrational forces, noise reduction (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
CoolTherm® SC-320 silicone encapsulant is a two component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications while retaining desirable properties associated with silicones. (read more)
Browse Silicone Adhesives and Sealants Datasheets for Ellsworth Adhesives -
. Encapsulation and Potting CHT’s silicone potting compounds and encapsulants are used when a deep section cure is required and endure extreme temperatures while protecting electronic components from shock and vibration, moisture, and other atmospheric contaminants. The hardness of these (read more)
Browse Conformal Coatings Datasheets for CHT USA Inc.
Conduct Research Top
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Optical Transmission Properties of Adhesives
Optical transmission, the ability for light to be channeled through a material, is particularly important for fiber optic, opto-electronic and photonic applications. Superior transparency is an essential characteristic of an optical adhesive. Optical transmission is measured from 0 to 100%
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High refractive index thermally stable phenoxyphenyl and phenylthiophenyl silicones for light‐emitting diode applications
Platinum hydrosilation chemistry is the most commonly used crosslinking chemistry for electronic -grade silicone encapsulants .
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Sensor Layer of a Multiparameter Single-Point Integrated System
Typical electronic -grade silicone encapsulants provide good insulation and mechanical protection for the underlying devices in a flexible and mal- leable manner.
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Silicone Surface Science
For example, some silicone surfactants are used as emulsifiers in personal care products while clearly part of the attraction of silicone encapsulants to some micro electronic applications must derive from its water repellency as well as its electrical properties.
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Stress analysis for the optimization of a new plastic package for optical sensors
J. Davis, " Silicone Protective Encapsulants and Coatings for Electronic Components and Circuits", Dow Corning Ltd., Barry, Wales, UK, 1994.
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Abstract listings
Today, there is a growing interest in silicone adhesives and encapsulants for terrestrial electronic packaging applications.
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Versatility and flexibility from low outgassing silicones
Subsequently, there is growing interest in silicone adhesives and encapsulants for terrestrial electronic packaging applications.
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Materials for Advanced Packaging
C.P. Wong, ‘‘Thermal-mechanical enhanced high-performance silicone gels and elasto- meric encapsulants in micro electronic packaging’’, IEEE Transactions on Components Packaging and Manufacturing Technology (PART A), Vol. 18, No. 2, pp. 270–273, 1995 13.
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A technology for implantable hermetic packages. Part 2: An implementation
1977) Silicone rubber adhesives as encapsulants for micro electronic implants; effect of high electric fields and of tensile stress.
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http://www.polysciences.com/SiteData/docs/2012_E-Che/4d5aec85b046969b/2012_E-Chem_unpriced.pdf
Potting Compounds - Epoxy & Silicone Silicone Adhesives & Encapsulants Dam Encapsulants for Electronic Assembly Ultra Pure Chemicals for Electronic Processes NIST Precision Size Standards .
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http://www.polysciences.com/SiteData/docs/201415PROD/fdc6998e52f8c3b4/2014-15%20PRODUCT%20CATALOG.pdf
Wire Bond Encapsulants - NoSWEEP™ Liquid Encapsulants - LoSTRESS™ Optical Encapsulants and Adhesives - OptiCLEAR™ Potting Compounds - Epoxy & Silicone Silicone Adhesives & Encapsulants Dam Encapsulants for Electronic Assembly - EdgeCONTROL™ Wafer Level Coatings Chemicals for CMP NIST Traceable Particle Size Standards JEDEC Reference Guide .
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