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Supplier: Protavic America, Inc.
Description: PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Protavic America, Inc.
Description: PTS-46323™ is a two-component ONE TO ONE MIX RATIO silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible
- Chemical / Polymer System Type: Silicone
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Protavic America, Inc.
Description: PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Protavic America, Inc.
Description: PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 3056 µin/in-F
- Composition: Unfilled
- Compound Type: Electrically Conductive, Thermal Compound / Thermally Conductive
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Supplier: Chemence Inc.
Description: KSC2040 is a thermally conductive silicone RTV adhesive rubber developed for heat sink applications. KSC2040 is a 1-part silicone that when applied to the substrate enables adhesion to parts and heat transfer of the bonded assembly within minutes. When cured, the elastomer resists
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Die Bonding Adhesive / Compound
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST S 5225, Silicone, Potting, Encapsulating LOCTITE® STYCAST S 5225 liquid encapsulant is designed for use on small electronic devices requiring a low viscosity material capable of flowing throughout tightly packed components. LOCTITE STYCAST S 5225 features
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Viscosity: 2230 cP
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Encapsulants and Potting Compounds - Techsil RTV27905 Clr Silicone Gel Encapsulant 10kg -- TESI19154Supplier: Techsil Limited
Description: Techsil® RTV27905 is a soft, adherent, clear silicone elastomer gel which is designed for the encapsulation and protection of electronic components. It is a low viscosity, 2 component system that is easily mixed in a 1:1 ratio. RTV27905 belongs to a wider family of products in a
- Chemical / Polymer System Type: Silicone
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Encapsulants and Potting Compounds - Techsil® RTV27905 Clr Silicone Gel Encapsulant 2kg -- TESI19128Supplier: Techsil Limited
Description: Techsil® RTV27905 is a soft, adherent, clear silicone elastomer gel which is designed for the encapsulation and protection of electronic components. It is a low viscosity, 2 component system that is easily mixed in a 1:1 ratio. RTV27905 belongs to a wider family of products in a
- Chemical / Polymer System Type: Silicone
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Supplier: Techsil Limited
Description: operating temperatures. In addition, this grade also offers superior thermal conductivity properties when compared to other conventional silicone encapsulants. Product Benefits Convenient 1:1 mixing ratio Solvent free Low shrinkage Reversion resistant and
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermal Compound / Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Techsil Limited
Description: Momentive RTV60 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber parts. Also
- Chemical / Polymer System Type: Silicone
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Supplier: CHT USA Inc.
Description: CHT's QSil 58 is a 2-part, condensation cure, high temperature, self-leveling, silicone elastomer primarily used for electronic potting applications to provide protection from moisture, debris, vibration and shock. The two applicable catalysts are 0.5% DBT by weight and 10% Deep
- Cure Type / Technology: Two Component System, Specialty / Other
- Dielectric Strength: 353 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: CHT USA Inc.
Description: CHT's QSil 12 is a 2-part, condensation cure, transparent, low viscosity, liquid silicone elastomer which cures at room temperature. QSil 12 is primarily intended for electronic and lighting potting applications. This material is typically mixed at a ratio of 100:5. Once mixed, the
- Cure Type / Technology: Two Component System, Specialty / Other
- Dielectric Strength: 315 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Elongation: 35 %
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ EE-3200 Low Stress Silicone Encapsulant is a two component, low viscosity encapsulant with a 1:1 mix ratio, good heat dissipation, and good thermal conductivity. Once thoroughly mixed, the mixture will cure to a flexible elastomer for the protection of
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Dielectric Strength: 0.0089 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ EE-3200 Low Stress Silicone Encapsulant is a two component, low viscosity encapsulant with a 1:1 mix ratio, good heat dissipation, and good thermal conductivity. Once thoroughly mixed, the mixture will cure to a flexible elastomer for the protection of
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Dielectric Strength: 0.0089 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Novagard Solutions
Description: Non-corrosive, single component silicone coating & encapsulating compound
- Chemical / Polymer System Type: Silicone
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Reactive / Moisture Cured, Single Component System
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Supplier: Novagard Solutions
Description: Non-corrosive, single component alkoxy cure silicone sealant/adhesive
- Chemical / Polymer System Type: Silicone
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System
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Supplier: Novagard Solutions
Description: Non-corrosive, single component silicone coating
- Chemical / Polymer System Type: Silicone
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, UV / Radiation Cured (also EB, Light), Reactive / Moisture Cured, Single Component System
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Supplier: Wacker Chemical Corp.
Description: two-part, 1 : 1 mixing ratio low viscosity rapid cure low hardness (silicone gel) Application encapsulation of electronic components
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: CHT USA Inc.
Description: CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System, Specialty / Other
- Dielectric Strength: 470 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Ellsworth Adhesives
Description: Parker Lord CoolTherm® SC-320 is a two component, thermally conductive silicone encapsulant designed to provide thermal conductivity for electrical and electronic encapsulating applications. Durable, low stress, low viscosity, and environmentally resistant. UL 94 V-0 certified.
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Elongation: 50 %
- Form / Function: Encapsulant / Potting Compound
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Supplier: Ellsworth Adhesives
Description: Parker Lord CoolTherm® SC-320 is a two component, thermally conductive silicone encapsulant designed to provide thermal conductivity for electrical and electronic encapsulating applications. Durable, low stress, low viscosity, and environmentally resistant. UL 94 V-0 certified.
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Elongation: 50 %
- Form / Function: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Electronics
Description: (Known as E&C STYCAST 5952 A/B thermally conductive silicone encapsulant ) LOCTITE STYCAST 5952 RD PTA is a filled, addition cured, silicone encapsulant. It features good thermal conductivity, excellent electrical insulation properties. It was designed for encapsulating
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Novagard Solutions
Description: Non-corrosive, single component silicone sealant, self-leveling liquid
- Chemical / Polymer System Type: Silicone
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Reactive / Moisture Cured, Single Component System
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Supplier: Chemence Inc.
Description: KSC12028 is a silicone RTV gel developed for electronic applications requiring a re-penetrable self-sealing, silicone gel product. KSC12028 is a two part, solvent free, 1:1 mix ratio silicone that when mixed cures in 12 hours at room temperature. Alternatively, KSC12028
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
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Supplier: CHT USA Inc.
Description: CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to protect electronic components from harsh environmental conditions and shock and vibration. It features a low viscosity for convenient dispensing and will easily flow throughout
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System, Specialty / Other
- Dielectric Strength: 600 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Wacker Chemical Corp.
Description: WACKER SilGel® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features two-part, 1 : 1 mixing ratio low viscosity rapid heat cure very low hardness (silicone
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
- Flame Retardant / UL 94V-0 Rated: Yes
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Supplier: Wacker Chemical Corp.
Description: ELASTOSIL® CAT PT-F very low hardness (silicone gel) inherent tack excellent mechanical damping properties rapid UV curing at room temperature in combination with long potlife (with ELASTOSIL® CATUV) Application encapsulation of electronic components for the automotive and power
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
- Flexible / Dampening: Yes
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 928 F is a pourable, thermally curable, addition-curing, one-part fluoro silicone rubber that cures to a soft silicone gel. Special features one-part, ready-to-use thixotropic behavior rapid heat cure very low hardness (gel) outstanding resistance to chemicals Application
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Bluestar Silicones USA Corp.
Description: Potting, encapsulant elastomer Properties Viscosity 3500 Hardness Sha 48 Description a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL™ ESA 7252 QC A & B is supplied as a viscous liquid which is
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 4.44 µin/in-F
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Bluestar Silicones USA Corp.
Description: Clear, Two-Component, Addition Cure, Heat Curing Electronic coating Silicone Compound Properties Viscosity 6000 Hardness Sha 30 Description BLUESIL V-207 is a clear, two component, addition cure, heat curing silicone rubber compound. It is designed as a primerless coating and
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Thermosetting / Crosslinking, Reactive / Moisture Cured, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Conformal / Encapsulating Coating, Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL STYCAST U2535 Polyurethane Encapsulant ) LOCTITE STYCAST U 2535 PTB two component flexible polyurethane encapsulant designed for transformer, PCB's and other insulation applications. It allows complete impregnation of either small slightly wound coils or large castings.
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Description: Used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. This product is usually used from -53°C to 204°C.
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: UV / Radiation Cured (also EB, Light), Reactive / Moisture Cured
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Conformal / Encapsulating Coating
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Supplier: Epoxies Etc...
Description: 20-1615 is a two component, room temperature curing silicone rubber compound. This silicone system is clear, odorless, and low in viscosity. 20-1615 is an excellent choice for potting electronic assemblies that require shock and vibration resistance. It also protects assemblies
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 183 µin/in-F
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: MacDermid Alpha Electronics Solutions
Description: Enhanced flow properties aid potting of tight units and delicate electronics with effective heat dissipation and thermal performance. Product Overview SC4004 is a thixotropic silicone potting compound developed for the Indian electronics market. Its thixotropic nature provides
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermal Compound / Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Form / Function: Encapsulant / Potting Compound
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Supplier: Master Bond, Inc.
Description: MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation.
- Applied Thickness / Gap Fill: Over 1 inch
- Chemical / Polymer System Type: Silicone
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Featured Products Top
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Silicones for Electronic Protection and Long-term Performance Electronics function in many different applications. However, there is a common requirement to protect sensitive components and systems from (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
and premature failure such as vibration, shock, and stress caused by temperature fluctuation during thermal cycling. Material options for electronic protection include silicones, epoxies, polyurethanes, and other various polymers. Silicones are extremely durable and feature important and (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
be formulated to only cure with the use of heat in order to achieve a very long pot life. Silicone gels are used in numerous electronic applications when a soft and highly flexible encapsulation or potting is required. CHT’s silicone gels protect delicate components and assemblies (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
Potting Materials for Electronic Applications ELANTAS offers a broad range of potting and encapsulation materials for electronic protection (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
Dymax light?curable encapsulants help simplify PCB assembly while improving reliability and long?term performance. Key advantages include: Faster throughput and less rework using UV or LED light?curing that (read more)
Browse Encapsulants and Potting Compounds Datasheets for Dymax -
Resilient Encapsulant for PCB and Electronic Assembly Engineered for rapid, reliable protection of complex electronic and microelectronic assemblies, this light-curable encapsulant enhances resistance to moisture, thermal cycling, and abrasion while maintaining (read more)
Browse Encapsulants and Potting Compounds Datasheets for Dymax -
runaway and provide protection from moisture, debris, vibration and shock for electronic components and EV battery packs. CHT’s silicone foam is also ideal where low smoke, flame and toxicity are required. CHT’s SilSo Lite 21025 is a two-part, room temperature platinum cure, self (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
potting materials are based on epoxy, polyurethane, polybutadiene and silicone and are especially designed for areas in demanding electrical and electronic applications. Additional properties such as improved heat dissipation, much greater mechanical stability at high vibrational forces, noise reduction (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
CoolTherm® SC-320 silicone encapsulant is a two component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications while retaining desirable properties associated with silicones. (read more)
Browse Silicone Adhesives and Sealants Datasheets for Ellsworth Adhesives -
. Encapsulation and Potting CHT’s silicone potting compounds and encapsulants are used when a deep section cure is required and endure extreme temperatures while protecting electronic components from shock and vibration, moisture, and other atmospheric contaminants. The hardness of these (read more)
Browse Conformal Coatings Datasheets for CHT USA Inc.
Conduct Research Top
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Optical Transmission Properties of Adhesives
Optical transmission, the ability for light to be channeled through a material, is particularly important for fiber optic, opto-electronic and photonic applications. Superior transparency is an essential characteristic of an optical adhesive. Optical transmission is measured from 0 to 100%
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High refractive index thermally stable phenoxyphenyl and phenylthiophenyl silicones for light‐emitting diode applications
Platinum hydrosilation chemistry is the most commonly used crosslinking chemistry for electronic -grade silicone encapsulants .
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Sensor Layer of a Multiparameter Single-Point Integrated System
Typical electronic -grade silicone encapsulants provide good insulation and mechanical protection for the underlying devices in a flexible and mal- leable manner.
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Silicone Surface Science
For example, some silicone surfactants are used as emulsifiers in personal care products while clearly part of the attraction of silicone encapsulants to some micro electronic applications must derive from its water repellency as well as its electrical properties.
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Stress analysis for the optimization of a new plastic package for optical sensors
J. Davis, " Silicone Protective Encapsulants and Coatings for Electronic Components and Circuits", Dow Corning Ltd., Barry, Wales, UK, 1994.
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Abstract listings
Today, there is a growing interest in silicone adhesives and encapsulants for terrestrial electronic packaging applications.
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Versatility and flexibility from low outgassing silicones
Subsequently, there is growing interest in silicone adhesives and encapsulants for terrestrial electronic packaging applications.
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Materials for Advanced Packaging
C.P. Wong, ‘‘Thermal-mechanical enhanced high-performance silicone gels and elasto- meric encapsulants in micro electronic packaging’’, IEEE Transactions on Components Packaging and Manufacturing Technology (PART A), Vol. 18, No. 2, pp. 270–273, 1995 13.
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A technology for implantable hermetic packages. Part 2: An implementation
1977) Silicone rubber adhesives as encapsulants for micro electronic implants; effect of high electric fields and of tensile stress.
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http://www.polysciences.com/SiteData/docs/2012_E-Che/4d5aec85b046969b/2012_E-Chem_unpriced.pdf
Potting Compounds - Epoxy & Silicone Silicone Adhesives & Encapsulants Dam Encapsulants for Electronic Assembly Ultra Pure Chemicals for Electronic Processes NIST Precision Size Standards .
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http://www.polysciences.com/SiteData/docs/201415PROD/fdc6998e52f8c3b4/2014-15%20PRODUCT%20CATALOG.pdf
Wire Bond Encapsulants - NoSWEEP™ Liquid Encapsulants - LoSTRESS™ Optical Encapsulants and Adhesives - OptiCLEAR™ Potting Compounds - Epoxy & Silicone Silicone Adhesives & Encapsulants Dam Encapsulants for Electronic Assembly - EdgeCONTROL™ Wafer Level Coatings Chemicals for CMP NIST Traceable Particle Size Standards JEDEC Reference Guide .