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Supplier: Henkel Corporation - Industrial
Description: Acrylated urethane acrylic structural adhesive primarily designed for bonding rigid and flexible PVC to polycarbonate. LOCTITE® 3703 is a bone white to beige, translucent, acrylated urethane acrylic structural adhesive primarily designed for bonding rigid and flexible PVC to polycarbonate where
- Chemical / Polymer System Type: Acrylic / Polyacrylate
- Cure Type / Technology: UV / Radiation Cured (also EB, Light), Single Component System
- Form / Function: Gap Filling Compound, Specialty / Other
- Viscosity: Up to 35000 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE 3517M, Epoxy, Underfill LOCTITE® 3517M underfill is designed for use as a solder joint protection against mechanical stress in hand held electronic device applications. One component - requires no mixing Reworkable Low halogen content
- Coeff. of Thermal Expansion (CTE): 36.11 µin/in-F
- Viscosity: 2600 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE 3508NH, Epoxy, Underfill LOCTITE® 3508NH is designed to cure during Pb-free solder reflow while allowing self-alignment of IC components. It can be pre-applied to the board at the corners of the pad site using a standard SMA dispenser Reflow curable Reworkable Eliminates post-reflow
- Coeff. of Thermal Expansion (CTE): 36.11 µin/in-F
- Viscosity: 70000 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ECCOBOND UF 3811, Halogen free, Reworkable, Low viscosity, Epoxy, Underfill, Encapsulant LOCTITE® ECCOBOND UF 3811 reworkable epoxy underfill is designed for CSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating
- Coeff. of Thermal Expansion (CTE): 33.89 µin/in-F
- Viscosity: 354 cP
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® 803 A low viscosity two-component general purpose electrical encapsulant/molding compound that is designed for applications requiring high-impact strength, thermal shock resistance, good corrosion resistance, and good water resistance. INSTAbond® 803 is suitable for service
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
- Use Temperature: -58 to 248 F
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® 826 A low viscosity, two-component epoxy compound that cures at room temperature. High flexibility, high impact resistance, thermal shock, water/chemical resistance, and good mechanical properties. Wicking and air release capabilities of INSTAbond® 826 make it ideal for
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
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Supplier: Accuris
Description: Standard Guide for Selection of Tests for Material Properties of Transfer Molding Compounds for Electronic and Microelectronic Encapsulation
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Supplier: ASTM International
Description: Guide for Selection of Tests for Material Properties of Transfer Molding Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 1996)
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Supplier: Bluestar Silicones USA Corp.
Description: compound. It is designed as a potting and encapsulating material for environmental and dielectric protection of electrical, electronic and mechanical parts and assemblies. Bluesil V-1022 is a primerless-bonding, thick section curing rubber, which will bond to most metals and many
- Chemical / Polymer System Type: Silicone
- Dielectric Constant: 3.4
- Dielectric Strength: 442 kV/in
- Electrical Resistivity: 8.30E14 ohm-cm
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Supplier: ExxonMobil - Polyethylene Products
Description: Base polymer in many adhesion resin formulations. Outstanding compounding makes it a material of choice for use in wire and cable. High transparency is a key attribute for photovoltaic cell encapsulation.
- Applications: Adhesives / Sealants
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Supplier: ASTM International
Description: 1.1 This test method covers a procedure for measuring the spiral flow of thermosetting molding compounds (soft or very soft) designed for molding pressures under 6.9 MPa (1000 psi). It is especially suited for those compounds used for encapsulation or other low
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Supplier: ASTM International
Description: 1.1 This test method covers a procedure for measuring the spiral flow of thermosetting molding compounds (soft or very soft) designed for molding pressures under 6.9 MPa [1000 psi]. It is especially suited for those compounds that may be used for encapsulation or
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Supplier: ASTM International
Description: 1.1 This test method covers a procedure for measuring the spiral flow of thermosetting molding compounds (soft or very soft) designed for molding pressures under 6.9 MPa (1000 psi). It is especially suited for those compounds that may be used for encapsulation or
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Supplier: Hapco, Inc.
Description: the Color Dispersion page. Hapflex™ 1000 Series products are used in both Liquid Molding applications (i.e. parts, gaskets, molds) and electrical insulation applications (i.e. potting and encapsulating).
- Chemical / Polymer System Type: Polyurethane
- Filler Material: Unfilled
- Industry: Electronics, Industrial, Tooling / Molds
- Liquid: Yes
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Supplier: Henkel Corporation - Electronics
Description: Black environmentally-frie ndly green molding compound designed especially for the encapsulation of tantalum capacitors. Low moisture absorption, excellent moldability with fast cycle times, especially auto-mold applications.
- Coeff. of Thermal Expansion (CTE): 10.56 µin/in-F
- Industry: Electronics
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Supplier: Techsil Limited
Description: BJB TC5040 is a room temperature curing silicone elastomer designed for mold making, encapsulation applications, pressure pads, gaskets and various other types of part creation. Product Benefits Translucent in color - easy to pigment RoHS/Reach Compliant Technical Properties Work Time: 40 -
- Chemical / Polymer System Type: Silicone
- Material Type / Grade: Elastomer / Rubber
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Supplier: Techsil Limited
Description: TC-5120 from BJB is a room temperature, 20 Shore A, addition/platinum curing silicone rubber designed for part making or mold making. Can be easily pigmented, encapsulating products, making flexible molds and creating parts and skins. Product Specifications 20 Shore A 40 Minute Work Time 24
- Material Type / Grade: Elastomer / Rubber
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Supplier: Hapco, Inc.
Description: . Extremely UV resistant. High physicals such as: HDT, tensile strength, and impact resistance. Ultraclear™ can be used in a wide variety of applications that require exceptional clarity; e.g., encapsulation, optical components, part overmolding, test models, and display pieces. The wide
- Elongation: 13 %
- Filler Material: Unfilled
- Industry: Tooling / Molds
- Liquid: Yes
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Supplier: Techsil Limited
Description: BJB TC5050 is a room temperature curing silicone elastomer designed for mold making, encapsulation applications, pressure pads, gaskets and various other types of parts. It is also used to make molds used for casting low melting metals (with the use of talc). TC-5050's ability to
- Chemical / Polymer System Type: Silicone
- Material Type / Grade: Elastomer / Rubber
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Supplier: Techsil Limited
Description: BJB TC5041 is a room temperature curing silicone elastomer designed for mold making, encapsulation applications, pressure pads, gaskets and various other types of parts. It is also used to make molds used for casting low melting metals (with the use of talc). TC-5041's ability to
- Chemical / Polymer System Type: Silicone
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Supplier: Henkel Corporation - Electronics
Description: (Known as Hysol GR735 ) LOCTITE HYSOL CG0645 GR735 is a high productivity molding compound designed specifically for the encapsulation of discrete semiconductor devices. This material is formulated to have higher thermal conductivity, which makes it applicable for devices
- Features: Thermally Conductive
- Industry: Electronics
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Supplier: Henkel Corporation - Electronics
Description: (Known as Hysol GR9810-1P ) LOCTITE HYSOL GR9810-1P is a state-of-the-art epoxy molding compound developed to meet the stringent encapsulation requirements of package-on-package (POP) devices. This compound exhibits advanced warpage control characteristics; these
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 6.11 µin/in-F
- Industry: Electronics
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Supplier: Teknor Apex Company
Description: North America Uses Automotive Window Encapsulation Automotive Specifications CHRYSLER MS-DC543 CPN4721 GM GMP.PVC.009 Forms Pellets Processing Method Injection Molding
- Chemical / Polymer System Type: PolyVinyl Chloride (PVC)
- Industry: Automotive
- Material Type / Grade: Thermoplastic
- Pellets: Yes
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Supplier: Teknor Apex Company
Description: North America Uses Automotive Window Encapsulation Automotive Specifications FORD WSK-M4D689-A5 Forms Pellets Processing Method Injection Molding
- Chemical / Polymer System Type: PolyVinyl Chloride (PVC)
- Industry: Automotive
- Material Type / Grade: Thermoplastic
- Pellets: Yes
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Supplier: Teknor Apex Company
Description: North America Uses Automotive Window Encapsulation Automotive Specifications CHRYSLER MS-DC543 CPN4345 Forms Pellets Processing Method Injection Molding
- Chemical / Polymer System Type: PolyVinyl Chloride (PVC)
- Industry: Automotive
- Material Type / Grade: Thermoplastic
- Melt Flow Index (MFI): 93 g / 10 minutes
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Supplier: Henkel Corporation - Electronics
Description: High performance thermoplastic polyamide is designed to meet low pressure molding process requirements. This product can be processed at low processing pressure due to its low viscosity, allowing encapsulation of fragile components without damage. This material produces no toxic fumes
- Chemical / Polymer System Type: Polyamide / Nylon
- Industry: Electronics
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Supplier: Teknor Apex Company
Description: North America Uses Automotive Window Encapsulation Automotive Specifications FORD WSK-M4D689-A6 GM GMP.PVC.074
- Chemical / Polymer System Type: PolyVinyl Chloride (PVC)
- Industry: Automotive
- Material Type / Grade: Thermoplastic
- Pellets: Yes
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Supplier: Epoxy Technology
Description: We have served the optical market since 301 was introduced in 1969.? Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 31.11 to 111 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive
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Supplier: Sauereisen, Inc.
Description: Sauereisen Electric Heater Cement No. 6 is a versatile high-temperature cement used for refractory coatings, lining furnaces, embedding electric heating elements, coating resistors, molding and insulating. No. 6 is supplied in Powder form and needs only be mixed with water to apply.
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Composition: Unfilled
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 5 to 7
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONATHANE EN-1556 Polyurethane Encapsulant is a two-component polyether-based system used as an encapsulating, molding, and potting compound. It is recommended for harness breakouts, watertight electrical connectors, cables, and cable end seals. It also offers
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 350 kV/in
- Elongation: 400 %
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONATHANE EN-1556 Polyurethane Encapsulant is a two-component polyether-based system used as an encapsulating, molding, and potting compound. It is recommended for harness breakouts, watertight electrical connectors, cables, and cable end seals. It also offers
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 350 kV/in
- Elongation: 400 %
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Supplier: Epoxy Technology
Description: We have served the optical market since 301 was introduced in 1969.? Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 30 to 97.22 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.26
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Supplier: Epoxy Technology
Description: We have served the optical market since 301 was introduced in 1969.? Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 33.89 to 100 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.34
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Supplier: Epoxy Technology
Description: We have served the optical market since 301 was introduced in 1969.? Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 31.11 to 107 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 3.39
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Supplier: Gelest, Inc.
Description: (cross-linker) Gelest®OE 43: 1.43 Refractive Index 2-Part Silicone Elastomer Gelest OE 43 is a flexible, optically clear molding, encapsulation, and coating compound with a RI of 1.43. This RTV kit offers improved adhesion to substrates compared to PP2-OE41. The low viscosity of
- Chemical / Polymer System Type: Polystyrene
- Elongation: 75 to 100 %
- Features: Optical Grade
- Index of Refraction: 1.43
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releasability and provide moderate cushioning, even at high temperatures exceeding 200 °C, making them ideal release films for electronics and semiconductor encapsulation. These films contain minimal additives or plasticizers, ensuring they won’t contaminate products or devices. Fluon ETFE (read more)
Browse Polymers and Plastic Resins Datasheets for AGC Chemicals Americas, Inc.
Conduct Research Top
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Solving Ultraviolet Curable Potting & Encapsulating Problems With Shadow Cure Technology
potting compound is poured over the assembly. The term Encapsulation describes a molding or dipping process where there is no case or shell. The assembly is either coated or the compound is poured into a mold and the cured compound becomes the outside of the assembly. The terms Potting and Encapsulating
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Lead (Pb):In the Metalworking Environment
or grinding lead containing metals, melting pure lead, molding, soldering, removal or encapsulation of lead and/or lead containing compounds. There have even been cases where lead babbits have fallen into a metal removal fluid sump or system leading to significant buildup of lead content
More Information Top
Indicates content that may require registration and/or purchase.
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Moisture Sensitivity of Plastic Packages of IC Devices
In order to devise an accelerated test condition that would be equivalent to the moisture response of 30◦C/60%RH testing, the behavior of the diffusing moisture into the encapsulating molding compound must be well understood and predicted.
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MODELS FOR THERMO-MECHANICAL RELIABILITY TRADE-OFFS FOR
BALL GRID ARRAY AND FLIP CHIP PACKAGES
IN EXTREME ENVIRONMENTS
Encapsulant Mold Compound Filler Content…
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Die cracking evaluation and improvement in ULSI plastic package
Die cracking failures are found in the chips with six-level AI-OSCu metal, and depend strongly upon the encapsulated molding compound material properties during temperature cycling (TC) and thermal shock (TS) testing.
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Molding Compounds Adhesion and Influence on Reliability of Plastic Packages for SiC-Based Power MOS Devices
[21] A. Scandurra, R. Zafarana, Y. Tenya, and S. Pignataro, “Chemistry of green encapsulating molding compounds at interfaces with other materials in electronic devices,” Appl.
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THERMO-MECHANICAL RELIABILITY MODELS FOR LIFE PREDICTION OF
AREA ARRAY ELECTRONICS IN EXTREME ENVIRONMENTS
5.1.5 Encapsulant Mold Compound Filler Content…
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Packaging of copper/low-k IC devices: a novel direct fine pitch gold wirebond ball interconnects onto copper/low-k terminal pads
In addition, after wirebonding, residual films should not be present as a new interface between the die and the encapsulated mold compound due to potential reliability concerns.
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Stress relaxation in plastic molding compounds
Abstract Viscoelastic materials for plastic encapsulated molding compounds invariably exhibit a time-dependent stress response to an imposed constant strain, which is called stress relaxation.
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Packaging of Cu/low-k IC devices: a novel surface passivation and direct fine-pitched gold wirebond ball interconnects analysis
In addition, after wirebonding, residual films should not be present as a new interface between the die and the encapsulated mold compound due to potential reliability concerns.
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Insight Weekly – 7th March 2016
26 Panasonic commercialises sulfur-free encapsulation moulding compound for copper wires........................................................27 .
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Taguchi‐numerical approach on thermomechanical reliability for PBGA
An L18(21 × 37) orthogonal array is designed for selecting eight control factors of BGA, which includes Printed Circuit Board) dimensions, substrate dimensions, dimensions of solder joints, the thickness of silicon die and the thickness of encapsulation molding compound .