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Supplier: Henkel Corporation - Industrial
Description: Acrylated urethane acrylic structural adhesive primarily designed for bonding rigid and flexible PVC to polycarbonate. LOCTITE® 3703 is a bone white to beige, translucent, acrylated urethane acrylic structural adhesive primarily designed for bonding rigid and flexible PVC to polycarbonate where
- Viscosity: 35,000 cP
- Chemical System: Acrylic / Polyacrylate
- Features: Gap Filling Compound, Specialty / Other, UV / Radiation Cured (also EB, Light)
- Cure / Technology: Single Component System
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Supplier: Accuris
Description: Standard Guide for Selection of Tests for Material Properties of Transfer Molding Compounds for Electronic and Microelectronic Encapsulation
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® 803 A low viscosity two-component general purpose electrical encapsulant/molding compound that is designed for applications requiring high-impact strength, thermal shock resistance, good corrosion resistance, and good water resistance. INSTAbond® 803 is suitable for service
- Use Temperature: -58 to 248 F
- Features: Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: ASTM International
Description: Guide for Selection of Tests for Material Properties of Transfer Molding Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 1996)
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Supplier: ASTM International
Description: 1.1 This test method covers a procedure for measuring the spiral flow of thermosetting molding compounds (soft or very soft) designed for molding pressures under 6.9 MPa (1000 psi). It is especially suited for those compounds used for encapsulation or other low
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Supplier: Bluestar Silicones USA Corp.
Description: 20 durometer, designed for use in special effects applications, skin contact grade Properties Viscosity 50000 Hardness Sha 25 Description Bluesil V-1022 is a medium hardness, self-bonding, room temperature curing silicone rubber compound. It is designed as a potting and encapsulating material
- Use Temperature: -65 to 400 F
- Thermal Conductivity: 0.184611712 W/m-K
- Tensile Strength (Break): 150 psi
- Elongation: 150 %
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Supplier: ExxonMobil - Polyethylene Products
Description: Base polymer in many adhesion resin formulations. Outstanding compounding makes it a material of choice for use in wire and cable. High transparency is a key attribute for photovoltaic cell encapsulation.
- Applications: Adhesives / Sealants
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Supplier: Henkel Corporation - Electronics
Description: Black environmentally-friendly green molding compound designed especially for the encapsulation of tantalum capacitors. Low moisture absorption, excellent moldability with fast cycle times, especially auto-mold applications.
- Coeff. of Thermal Expansion (CTE): 10.555555555555555 µin/in-F
- Industry: Electronics
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONATHANE EN-1556 Polyurethane Encapsulant is a two-component polyether-based system used as an encapsulating, molding, and potting compound. It is recommended for harness breakouts, watertight electrical connectors, cables, and cable end seals. It also offers thermal shock
- Viscosity: 10,040 to 18,000 cP
- Tensile Strength (Break): 1,400 to 5,000 psi
- Elongation: 400 %
- Dielectric Strength: 350 kV/in
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONATHANE EN-1556 Polyurethane Encapsulant is a two-component polyether-based system used as an encapsulating, molding, and potting compound. It is recommended for harness breakouts, watertight electrical connectors, cables, and cable end seals. It also offers thermal shock
- Viscosity: 3,000 to 10,040 cP
- Tensile Strength (Break): 1,400 to 5,000 psi
- Elongation: 400 %
- Dielectric Strength: 350 kV/in
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Supplier: Henkel Corporation - Electronics
Description: (Known as Hysol GR735 ) LOCTITE HYSOL CG0645 GR735 is a high productivity molding compound designed specifically for the encapsulation of discrete semiconductor devices. This material is formulated to have higher thermal conductivity, which makes it applicable for devices
- Industry: Electronics
- Features: Thermally Conductive
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Supplier: Henkel Corporation - Electronics
Description: High performance thermoplastic polyamide is designed to meet low pressure molding process requirements. This product can be processed at low processing pressure due to its low viscosity, allowing encapsulation of fragile components without damage. This material produces no toxic fumes
- Industry: Electronics
- Features: Molding Resin
- Chemical System: Polyamide / Nylon
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Technomelt PA 6208 Black is a one component, thermoplastic, hot melt adhesive. It is used for molding compound applications. 20 kg Bag.
- Elongation: 600 %
- Features: Encapsulating / Potting
- Cure / Technology: Single Component System
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Supplier: Henkel Corporation - Electronics
Description: (Known as Hysol GR9810-1P ) LOCTITE HYSOL GR9810-1P is a state-of-the-art epoxy molding compound developed to meet the stringent encapsulation requirements of package-on-package (POP) devices. This compound exhibits advanced warpage control characteristics; these
- Coeff. of Thermal Expansion (CTE): 6.111111111111111 µin/in-F
- Industry: Electronics
- Chemical System: Epoxy
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Supplier: Teknor Apex Company
Description: Material Status Commercial: Active Availability Africa & Middle East Asia Pacific Europe Latin America North America Uses Automotive Window Encapsulation Automotive Specifications CHRYSLER MS-DC543 CPN4345 Forms Pellets Processing Method Injection Molding
- Tensile Strength (Break): 1,170 psi
- Melt Flow Index (MFI): 93 g / 10 minutes
- Industry: Automotive
- Features: Molding Resin
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Supplier: Techsil Limited
Description: TC-5120 from BJB is a room temperature, 20 Shore A, addition/platinum curing silicone rubber designed for part making or mold making. Can be easily pigmented, encapsulating products, making flexible molds and creating parts and skins. Product Specifications 20 Shore A 40 Minute Work Time 24 Hour
- Type: Elastomer / Rubber
- Features: Molding Resin
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Supplier: Henkel Corporation - Industrial
Description: TECHNOMELT PA 638, Polyamide, Molding compound thermoplastic TECHNOMELT® PA 638 high performance thermoplastic polyamide is designed to meet low pressure molding process requirements. This product can be processed at low processing pressure due to its low viscosity, allowing
- Use Temperature: 40 to 212 F
- Viscosity: 4,000 cP
- Features: Encapsulant / Potting Compound
- Chemical System: Polyamide
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Supplier: Techsil Limited
Description: BJB TC5040 is a room temperature curing silicone elastomer designed for mold making, encapsulation applications, pressure pads, gaskets and various other types of part creation. Product Benefits Translucent in color - easy to pigment RoHS/Reach Compliant Technical Properties Work Time: 40 -
- Type: Elastomer / Rubber
- Features: Molding Resin
- Chemical System: Silicone
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Supplier: Techsil Limited
Description: BJB TC5050 is a room temperature curing silicone elastomer designed for mold making, encapsulation applications, pressure pads, gaskets and various other types of parts. It is also used to make molds used for casting low melting metals (with the use of talc). TC-5050's ability to withstand
- Type: Elastomer / Rubber
- Features: Molding Resin
- Chemical System: Silicone
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Supplier: Teknor Apex Company
Description: encapsulation, spoiler extensions and other intricate and high flow demanding applications. Material Status Commercial: Active Availability Asia Pacific Europe Latin America North America Features Good UV Resistance Good Weather Resistance High Flow Uses Automotive Applications Appearance
- Tensile Strength (Break): 914 psi
- Industry: Automotive
- Type: Elastomer / Rubber
- Features: Molding Resin, Thermoplastic / TPE
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Supplier: Ellsworth Adhesives
Description: Parker Lord CoolTherm® ME-543 Black is a thermally conductive, anhydride-free, semiconductor grade epoxy underfill designed for encapsulating densely populated area array flip chip devices. Able to handle over-molding processes. Fast cure, jettable, self-filleting, and can withstand 260 °C
- Thermal Conductivity: 1.2 W/m-K
- Viscosity: 21,000 cP
- Features: Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
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Supplier: Hapco, Inc.
Description: Liquid Molding applications (i.e. parts, gaskets, molds) and electrical insulation applications (i.e. potting and encapsulating).
- Viscosity: 3,000 cP
- Features: Casting Resin, Molding Resin
- Type: Elastomer / Rubber
- Industry: Electronics, Industrial, Tooling / Molds
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Supplier: Henkel Corporation - Industrial
Description: low viscosity, allowing encapsulation of fragile components without damage. This material produces no toxic fumes in process and provides a good balance of low and high temperature performance. Meets UL 94 V-0 Flammability at 3.175 mm thickness. Easy mouldability Good adhesion to a variety of
- Industry: Electronics, Semiconductor / IC's
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Supplier: Sauereisen, Inc.
Description: Sauereisen Electric Heater Cement No. 6 is a versatile high-temperature cement used for refractory coatings, lining furnaces, embedding electric heating elements, coating resistors, molding and insulating. No. 6 is supplied in Powder form and needs only be mixed with water to apply.
- Use Temperature: 1,475 F
- Tensile Strength (Break): 285 psi
- Dielectric Strength: 0.0000965200000000002 to 0.0012954000000000028 kV/in
- Dielectric Constant (Relative Permittivity): 5 to 7
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Supplier: Techsil Limited
Description: BJB TC5041 is a room temperature curing silicone elastomer designed for mold making, encapsulation applications, pressure pads, gaskets and various other types of parts. It is also used to make molds used for casting low melting metals (with the use of talc). TC-5041's ability to withstand
- Chemical System: Silicone
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Supplier: Hapco, Inc.
Description: HDT, tensile strength, and impact resistance. Ultraclear™ can be used in a wide variety of applications that require exceptional clarity; e.g., encapsulation, optical components, part overmolding, test models, and display pieces. The wide range of gel times makes Ultraclear™ suitable for
- Tensile Strength (Break): 6,800 psi
- Elongation: 13 %
- Viscosity: 600 cP
- Form / Shape: Liquid
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Resistors - RESISTOR;WIREWOUND;RES 0.10 OHMS,PWR-RTG 7 W,TOL 1%;AXIAL;SILICONE,CUR-SENSE -- 70024366Supplier: Allied Electronics, Inc.
Description: These molded silicone resistors are ideal for current sensing applications. They have low inductance (non-inductive below 0.25 μ). Terminals are constructed of solder-plated copper leads or copper clad steel depending of ohm value with silicone molding encapsulation compound.
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Supplier: Allied Electronics, Inc.
Description: These molded silicone resistors are ideal for current sensing applications. They have low inductance (non-inductive below 0.25 μ). Terminals are constructed of solder-plated copper leads or copper clad steel depending of ohm value with silicone molding encapsulation compound.
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Supplier: Allied Electronics, Inc.
Description: These molded silicone resistors are ideal for current sensing applications. They have low inductance (non-inductive below 0.25 μ). Terminals are constructed of solder-plated copper leads or copper clad steel depending of ohm value with silicone molding encapsulation compound.
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Supplier: Allied Electronics, Inc.
Description: These molded silicone resistors are ideal for current sensing applications. They have low inductance (non-inductive below 0.25 μ). Terminals are constructed of solder-plated copper leads or copper clad steel depending of ohm value with silicone molding encapsulation compound.
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Supplier: Gelest, Inc.
Description: flexible, optically clear molding, encapsulation, and coating compound with a RI of 1.49. The higher refractive index of PP2-OE50 can act as cladding in optical waveguide applications. The low viscosity of the platinum catalyzed mix, long pot-life at room temperature, and
- Tensile Strength (Break): 18.8547891164356 psi
- Index of Refraction: 1.49
- Type: Elastomer / Rubber, Optical Grade
- Chemical System: Polystyrene
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Supplier: Gelest, Inc.
Description: is a flexible, optically clear molding, encapsulation, and coating compound with a RI of 1.42. This RTV kit offers improved adhesion to substrates compared to . The low viscosity of the platinum catalyzed mix, long pot-life at room temperature, and moderate cure temperature make
- Tensile Strength (Break): 217.555259035796 psi
- Elongation: 90 to 150 %
- Index of Refraction: 1.42
- Type: Elastomer / Rubber, Optical Grade
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Supplier: Hapco, Inc.
Description: RAPIDFIL™ C Series is a portable, LCD computer controlled, 2 component dispensing machine specifically designed to dispense Hapco's products. It is reliable and easy to use. Current Applications for RAPIDFIL™ include: Liquid Molding - Plastic and rubber parts. Ideal for 1-10,000 parts.
- Container Size: 22,712.4707347922 to 45,424.9414695844 cc
- Application: Adhesive / Silicone, Coatings / Paint
- Dispensed From: Can / Pail / Drum
- Mounting: Container Mounted
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Supplier: Ohmite Manufacturing Co.
Description: manufactured using Wire winding/Spot Welding–by Computer Numerical Control (CNC) machine tools to ensure consistency of product quality. The encapsulation of the epoxy molding compound is done by advanced IC encapsulation mold/die technologies. Power rating 0.5-2 watts
- Resistance Range: 0.005 to 0.1 ohms
- Tolerance: 1 to 5 +/- %
- Temperature Coefficient (TCR): 100 to 300 ±ppm/°C
- Power Rating: 0.5 to 3 watts
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Supplier: Gelest, Inc.
Description: 500 g part B (cross-linker) 6 kg kit – contains 3000 g part A (base), 3000 g part B (cross-linker) Gelest®OE41: 1.41 Refractive Index 2-Part Silicone Elastomer Gelest OE41 is a flexible, optically clear general purpose molding, encapsulation, and coating compound with a RI of
- Tensile Strength (Break): 290.073678714394 psi
- Elongation: 140 to 200 %
- Index of Refraction: 1.41
- Type: Elastomer / Rubber, Optical Grade
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Featured Products Top
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releasability and provide moderate cushioning, even at high temperatures exceeding 200 °C, making them ideal release films for electronics and semiconductor encapsulation. These films contain minimal additives or plasticizers, ensuring they won’t contaminate products or devices. Fluon ETFE (read more)
Browse Polymers and Plastic Resins Datasheets for AGC Chemicals Americas, Inc.
Conduct Research Top
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Solving Ultraviolet Curable Potting & Encapsulating Problems With Shadow Cure Technology
potting compound is poured over the assembly. The term Encapsulation describes a molding or dipping process where there is no case or shell. The assembly is either coated or the compound is poured into a mold and the cured compound becomes the outside of the assembly. The terms Potting and Encapsulating
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Lead (Pb):In the Metalworking Environment
or grinding lead containing metals, melting pure lead, molding, soldering, removal or encapsulation of lead and/or lead containing compounds. There have even been cases where lead babbits have fallen into a metal removal fluid sump or system leading to significant buildup of lead content
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Moisture Sensitivity of Plastic Packages of IC Devices
In order to devise an accelerated test condition that would be equivalent to the moisture response of 30◦C/60%RH testing, the behavior of the diffusing moisture into the encapsulating molding compound must be well understood and predicted.
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MODELS FOR THERMO-MECHANICAL RELIABILITY TRADE-OFFS FOR
BALL GRID ARRAY AND FLIP CHIP PACKAGES
IN EXTREME ENVIRONMENTS
Encapsulant Mold Compound Filler Content…
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Die cracking evaluation and improvement in ULSI plastic package
Die cracking failures are found in the chips with six-level AI-OSCu metal, and depend strongly upon the encapsulated molding compound material properties during temperature cycling (TC) and thermal shock (TS) testing.
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Molding Compounds Adhesion and Influence on Reliability of Plastic Packages for SiC-Based Power MOS Devices
[21] A. Scandurra, R. Zafarana, Y. Tenya, and S. Pignataro, “Chemistry of green encapsulating molding compounds at interfaces with other materials in electronic devices,” Appl.
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THERMO-MECHANICAL RELIABILITY MODELS FOR LIFE PREDICTION OF
AREA ARRAY ELECTRONICS IN EXTREME ENVIRONMENTS
5.1.5 Encapsulant Mold Compound Filler Content…
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Packaging of copper/low-k IC devices: a novel direct fine pitch gold wirebond ball interconnects onto copper/low-k terminal pads
In addition, after wirebonding, residual films should not be present as a new interface between the die and the encapsulated mold compound due to potential reliability concerns.
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Stress relaxation in plastic molding compounds
Abstract Viscoelastic materials for plastic encapsulated molding compounds invariably exhibit a time-dependent stress response to an imposed constant strain, which is called stress relaxation.
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Packaging of Cu/low-k IC devices: a novel surface passivation and direct fine-pitched gold wirebond ball interconnects analysis
In addition, after wirebonding, residual films should not be present as a new interface between the die and the encapsulated mold compound due to potential reliability concerns.
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Insight Weekly – 7th March 2016
26 Panasonic commercialises sulfur-free encapsulation moulding compound for copper wires........................................................27 .
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Taguchi‐numerical approach on thermomechanical reliability for PBGA
An L18(21 × 37) orthogonal array is designed for selecting eight control factors of BGA, which includes Printed Circuit Board) dimensions, substrate dimensions, dimensions of solder joints, the thickness of silicon die and the thickness of encapsulation molding compound .