Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: R. S. Hughes Company, Inc.
Description: Loctite epoxy adhesive.
- Features: Leveling / Filling Compound
-
Supplier: R. S. Hughes Company, Inc.
Description: Loctite Hysol 1511184 black epoxy potting compound is compatible with ceramic, metal and plastic materials with a 24 hr cure time. Provides a 40 min working time. Works in a mix ratio of 2:1. Delivers great performance with a shear strength of 3000 psi.
- Chemical / Polymer System Type: Epoxy (EP)
- Thermal Conductivity: 0.2500 W/m-K
-
Supplier: R. S. Hughes Company, Inc.
Description: Devcon Epoxy Coat gray 7000 epoxy adhesive is compatible with concrete and metal materials with a 24 hr cure time. Provides a 36 min working time. Works in a mix ratio of 3:2. Maximum operating temperature is +200 F.
- Features: Leveling / Filling Compound
- Use Temperature: 200 F
- Viscosity: 3600 cP
-
-
Description: One-component epoxy resin adhesive is a filling resin that can be reused in CSP (FBGA) or BGA. It cures quickly as soon as it is heated. It is designed to provide good protection to prevent failure due to mechanical stress. Low viscosity allows filling gaps under CSP or BGA.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Specialty / Other
- Industry: Electronics
-
Description: The reusable epoxy primer is designed for CSP and BGA applications. It can be cured quickly at moderate temperatures to reduce the pressure on other parts. After curing, the material has excellent mechanical properties and can protect solder joints during thermal cycling.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Specialty / Other
- Industry: Electronics
-
Supplier: R. S. Hughes Company, Inc.
Description: Devcon Epoxy Coat gray 7000 epoxy adhesive with a 24 hr cure time. Provides a 55 min working time. Works in a mix ratio of 2.1:1. Maximum operating temperature is +180 F.
- Features: Leveling / Filling Compound
- Use Temperature: 180 F
- Viscosity: 2000 cP
-
Supplier: Sauereisen, Inc.
Description: in two formulations, No. 220 is for general purpose applications and No. 221 is a novolac epoxy for more severe chemical environments. Sauereisen Joint Compounds are nonshrinking due to their high-solids content and will not become brittle. These self-priming materials will flow and
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Elongation: 100 %
- Industry: Building / Construction
-
Description: The reusable underfill is specially designed for CSP, WLCSP and BGA applications. Its formula is to cure quickly at moderate temperatures to reduce stress on other parts. The material has a higher glass transition temperature and higher fracture toughness, and can provide good protection for solder
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Specialty / Other
- Industry: Electronics
-
Description: LOCTITE® ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. LOCTITE ECCOBOND UF 1173 material is
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Leveling / Filling Compound
- Industry: OEM / Industrial
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST ES 1904, Epoxy, Potting and Encapsulating LOCTITE® STYCAST ES 1904 is an opaque, medium-viscosity epoxy resin formulation recommended for small potting and laminating applications, excellent structural, mechanical and electrical properties are required. This two-part
- Coeff. of Thermal Expansion (CTE): 37.78 µin/in-F
- Cure Type / Technology: Two Component System
- Features: Leveling / Filling Compound
- Industry: Optical Grade / Material
-
Description: ARMORSEAL 650 SL/RC self-leveling, recoatable epoxy is a two-component, heavy duty floor system that provides a high gloss, seamless, hygienic surface that is extremely hard wearing and durable. The coating can also be applied to provide a nonslip texture. This product may be topcoated
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Industry: OEM / Industrial
- Substrate / Material Compatibility: Concrete / Masonry
-
Description: Classic underfill, ultra-low viscosity suitable for most underfill applications.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Specialty / Other
- Industry: Electronics
- Viscosity: 360 cP
-
Supplier: Henkel Corporation - Industrial
Description: To help manufacturers comply with UL-674 requirements for explosion-proof electric motors, Henkel Corporation has introduced LOCTITE® E-40EXP Hysol, a two-component, room-temperature-cur ing epoxy potting compound designed to pass UL testing and maintain more than 85% of its
- Cure Type / Technology: Two Component System
- Features: Leveling / Filling Compound
- Thermal Conductivity: 1.25 W/m-K
- Viscosity: 24000 cP
-
Supplier: Rust-Oleum Corporation
Description: Ideally suited to resist vibration, high torque loads & physical stresses
- Applied Thickness / Gap Fill: 2 to 3 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 15 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
-
Supplier: Fosroc Limited
Description: A two pack thixotropic epoxy resin product for the repair of cracked concrete and masonry by the injection process.
- Type: Leveling / Filling Compound
-
Description: STEEL-SEAM FT910 EPOXY PATCHING AND SURFACING COMPOUND is a 100% solids epoxy surfacing compound for steel or patching compound for concrete. It is formulated for ease of application with squeegee or trowel on horizontal, vertical or overhead applications. 100%
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Reactive / Moisture Cured, Single Component System
- Industry: OEM / Industrial, Other
- Substrate / Material Compatibility: Concrete / Masonry, Metal
-
Supplier: Epoxies Etc...
Description: 10-3713 used as a two component ultra clear epoxy adhesive designed for a variety of bonding applications. 10- 3713 forms a crystal clear bond line and is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. This adhesive when UV aged in a QUV
- Coeff. of Thermal Expansion (CTE): 27.78 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Strength: 560 kV/in
- Features: Electrical Insulating / Dielectric, Leveling / Filling Compound
-
Supplier: DigiKey
Description: Thermal Gel Gap Filler 10cc Syringe
- Thermal Conductivity: 0.7000 W/m-K
- Use Temperature: -67 to 392 F
-
Supplier: Master Bond, Inc.
Description: Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500°F with truly outstanding chemical resistance. High strength bonds serviceable up to 600°F can be obtained with this exceptionally thermally stable and chemically resistant epoxy
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.8
- Dielectric Strength: 400 to 450 kV/in
- Dissimilar Substrates: Yes
-
Supplier: TFC Ltd.
Description: Loctite® Nordbak® 7218 Wearing Compound Ceramic filled two part epoxy to protect, rebuild and repair high wear areas. Outstanding abrasion and corrosion resistance.
- Features: Leveling / Filling Compound
-
Supplier: Epoxy Technology
Description: maintaining Telcordia level reliability. EPO-TEK® UV adhesives are known in the industry and are used in fiber optics, PCB assembly and medical device applications Our UV Epoxies are commonly used in: Fiber Optic cables and patch cord Fiber Splice and fiber optic components Lens
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 22.78 to 94.44 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light), Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Optoelectronics / Photonics, Semiconductors / IC Packaging
-
Description: KEM® Cati-Coat® HS EPOXY FILLER/SEALER is a high performance, interior/exterior, VOC compliant, epoxy block filler. Designed for tenacious adhesion to masonry substrates while filling voids and crevices to smooth the surface. Excellent resistance to moisture, humidity, impact, and
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Features: Flame Retardant (e.g. UL 94 Rated), Gap Filling Sealant / FIP Gasket, Leveling / Filling Compound
- Industry: OEM / Industrial, Other
-
Description: 3M™ Scotch-Weld™ Structural Void Filling Compound 3439 HT is a temperature-resistan t, one-part, high-temperature curing low density void filling compound.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Industry: Aerospace, OEM / Industrial
-
Supplier: Epoxies Etc...
Description: 20-3030 is an unfilled, low viscosity epoxy system. This system was designed for fast, self leveling and ease of use. 20-3030 has a convenient 2:1 mix ratio and will cure at room temperature. It is a good choice for chemical, water and corrosion resistance. 20-3030 also exhibits
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 3.6
-
Supplier: Ellsworth Adhesives
Description: Parker LORD® 363 Epoxy Adhesive is a two component, fast curing, epoxy system that is used for bonding scuffed sheet molded compounds (SMC), plastics, and wood. It is self-leveling, low odor, non-flammable, and contains no solvents. 50 mL Cartridge.
- Cure Type / Technology: Two Component System
- Substrate / Material Compatibility: Plastic, Wood / Wood Product
- Viscosity: 7000 to 20000 cP
-
Supplier: Master Bond, Inc.
Description: in the electronic, electrical, computer, metalworking, appliance, automotive and chemical industries where electrical insulation and heat transfer are required. The uniqueness of EP37-3FLFAO lies in the fact that this thermally conductive system retains a high level of flexibility while
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 33.33 to 36.11 µin/in-F
- Composition: Unfilled
- Compound Type: Electrically Conductive
-
Supplier: Ellsworth Adhesives
Description: ResinLab EP1305LV Black is a two component, room temperature or heat curing, epoxy casting resin that is used for bonding metal and PVC. It is free flowing, good wetting, self leveling, good air release, and resistant to bases, acids, water, and most organic solvents. 50 mL Cartridge.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 410 kV/in
- Elongation: 12 %
-
Supplier: Master Bond, Inc.
Description: Well suited for glob top or die attach applications, Master Bond Supreme 3HTND-2GT is a one part epoxy system with limited flow for bonding and sealing. Combining outstanding thermal conductivity and electrical insulation values, this system offers superior protection to electronic components
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 12.78 to 15 µin/in-F
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
-
Description: Dual-cure 120c or 180c curing, low-density, expandable product for these applications: honeycomb sandwich edge finishing, filling mismatched areas, and core splicing and reinforcing honeycomb core. Fulfills stand-alone fire, smoke and toxic gas emission (FST) requirements according to FAR 25.853 or
- Cure Type / Technology: Single Component System
- Features: Leveling / Filling Compound
- Industry: Aerospace, OEM / Industrial
- Substrate / Material Compatibility: Other
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK ME 990, Epoxy, Encapsulant LOCTITE® ABLESTIK ME 990 is designed for die bonding and other assembly applications where electrical conductivity is not required. One component Oxide filled Low levels of ionic contaminants
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Single Component System
- Use Temperature: 40 to 257 F
- Viscosity: 50000 cP
-
Supplier: Henkel Corporation - Industrial
Description: 2-part, room temperature-cure, pourable epoxy system heavily reinforced with aluminum powder. LOCTITE® PC 3466 (known as LOCTITE FIXMASTER ALUMINUM LIQUID) is a gray, 2-part, room temperature-cure, pourable epoxy system heavily reinforced with aluminum powder. It is used for filling or
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
-
Description: CoroBond™ CRACK FILLER is a 2 component epoxy paste developed specifically for sealing, smoothing, and fairing applications on concrete, metals, plastics (FRP), wood, or masonry. The smooth consistency and excellent non-sagging properties allow the product to be used on vertical and
- Applied Thickness / Gap Fill: Up to 2 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Features: Flame Retardant (e.g. UL 94 Rated), Grease / Paste, Leveling / Filling Compound
-
Supplier: Henkel Corporation - Electronics
Description: Hysol® GR9810-1™ is a technologically advanced epoxy molding compound designed for use as an overmold on a wide variety of laminate based molded array packages including SIP and flip-chip array packages that have been conventionally underfilled. This material exhibits ultra low warpage
- Chemical / Polymer System Type: Epoxy
- Industry: Electronics
-
Description: Cuming Microwave manufactures a range of epoxy and silicone-based rigid and castable absorbers, loaded with high magnetic loss carbonyl iron and ferrite fillers. The proper filler and loading level can produce a very lossy material in UHF, microwave or millimeter wave frequencies.
- Chemical / Polymer System Type: Silicone, Epoxy
- Features: EMI / RFI Shielding
- Material Type / Grade: Thermoset
-
Supplier: Master Bond, Inc.
Description: EP5G-80 is a one component, NASA low outgassing rated epoxy, with a moderate temperature cure requirement of 80°C for 4 hours. It is non-metallic system designed for heat sensitive electronic applications where high levels of conductivity are desired.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 1.00E7 to 1.17E7 µin/in-F
- Composition: Single Component System, Filled
- Cure Type / Technology: Thermosetting / Crosslinking
Find Suppliers by Category Top
Featured Products Top
-
Master Bond EP5G-80 is a one component, NASA low outgassing rated epoxy, with a moderate temperature cure requirement of 80°C for 4 hours. This graphite filled compound is not premixed and frozen and has an unlimited working life at room temperature. It offers electrical conductivity with a (read more)
Browse Conductive Compounds Datasheets for Master Bond, Inc. -
“EP21AC withstood over 150 arcs without igniting and therefore was assigned the highest PLC (Performance Level Category) of 0 under the UL746A High Amp Arc Ignition test,” says Rohit Ramnath, Senior Product Engineer. “The compound is also flame retardant, as per the UL94 (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
electrical characteristics and exhibits superior performance over conventional PFA, PTFE, polyimide and epoxy materials in many AV applications. Key benefits of Fluon+ PFA EA-2000 compounds include: Superior electrical performance, with the lowest dielectric constant (2.0) and low dissipation factor (read more)
Browse Resins and Compounds Datasheets for AGC Chemicals Americas, Inc. -
materials including acrylates, methacrylates, epoxies, polyesters, nylon, ABS and other resin compounds. Easy dispersion within a polymer matrix. Prevention of soft polymer blocking in powder fusion processes. Active chemical surface facilitating strong chemical bonding (read more)
Browse Silica, Quartz, and Silicate Materials Datasheets for AGC Chemicals Americas, Inc. -
MacuSpec THF 100 is a single step copper through hole filling process that enables improved thermal and structural designs for IC substrates.
(read more)
Browse Leveling and Filling Compounds Datasheets for MacDermid Alpha Electronics Solutions -
of thermal expansion. With a Tg between 120-125°C, and a service temperature range from -60°C to +175°C, this epoxy is effective in high temperature environments. It is a reliable electrical insulator featuring a volume resistivity of more than (read more)
Browse Leveling and Filling Compounds Datasheets for Master Bond, Inc.
Conduct Research Top
-
Benefits of the Industrial Use of Electronic Epoxy Encapsulant Potting Compounds
various external factors. Since electronic assemblies are subjected to several of these external factors when they work, it means that there needs to be some level of protection involved. Some of the external factors that electronic assemblies are subjected to include corrosion, moisture, thermal
-
EP42HT-2Med: Utilized in prosthetics and fully implantable medical devices
Among the most challenging medical applications for an epoxy compound are prosthetics and fully implantable medical devices. Prosthetics and implantable devices must be able to maintain performance levels even when in direct contact with tissue and bodily fluids, and must not introduce toxins
-
Importance of Hardness Testing
Measuring hardness is a simple yet powerful test to ensure proper curing and evaluate the performance of adhesive materials. The hardness scales for epoxy and silicone formulations range from rigid to flexible. Commonly used hardness scales are A and D. Shore A is used for softer materials, whereas
More Information Top
Indicates content that may require registration and/or purchase.
-
In‐situ self reinforced polyimide for film materials
The conversion ratio reached its saturation point after 3hof reaction.Moreover,theconversionratioshoweda decrease with increasing epoxide compound level .
-
Epoxidation of waste used-oil biodiesel: Effect of reaction factors and its impact on the oxidative stability
…the four independent variables related to the epoxidation conditions (A: reaction temperature, B: mole ratio of H2O2 : HCOOH, C: stirring rate and D: reaction time) and the two selected response factors of the unsaturated carbon bond level and the epoxy compound selectivity.
-
Wafer level encapsulation for system in package generation
To investigate the feasibility of transfer molding on wafer level the Epoxy Molding Compound , material WLM-D, was used.
-
New epoxy molding compounds for SMT with pre-plated lead-frame system
(Same Level as Biphenyl Epoxy Compounds ) .
-
Cholesterol Oxides in Swedish Foods and Food Ingredients: Fresh Eggs and Dehydrated Egg Products
All of our sampleswere dried by indirect spray drying, and therefore one would not expect to find such high levels of the epoxy compounds asthose in someof the samplesanalyzed by Tsai and Hudson (1985).
-
Structure and process development of wafer level embedded SiP (System in Package) for mobile applications
After wafer level flip-chip bonding, molding process has been performed at wafer level using epoxy molding compound .
-
A fast, low cost method to check for moisture in epoxy molding compound
The area under this peak is a critical data to comment the moisture absorption level of epoxy molding compound .
-
The Development of Semiconducting Materials for Anti-Corona Protection Designs of Generator High Voltage Windings and their Testing at Cryogenic Temperatures
The testing of compositions with usage of epoxy compounds with different levels of strength of molecular interaction - KPN-X (cold hardening), KPN (heat hardening), and KPN-S-1 (heat hardening, based on special resistant to chemicals epoxy composition [10, Fig.3]) shows…
-
CR4 - Thread: Cracking Concrete Floor
The floor could then be painted or screeded with an epoxy floor screed or leveling compound (such as quicklevel).
-
Effect of polyester thickeners on thermal stability and low-temperature properties of phosphate fluids
Corrosion of magnesium ML5 can be reduced by normal levels by using the epoxide compound in a higher concentration (2 wt.%).