Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: Sauereisen, Inc.
Description: Sauereisen Epoxy Expansion Joint Compounds are used to provide a durable joint filler. They maintain excellent flexibility. The materials are 100% solids, pourable epoxies designed to effectively absorb the shock and impact of heavy loads and steel-wheeled vehicles over narrow joints.
- Use Temperature: 180 F
- Tensile Strength (Break): 800 psi
- Elongation: 50 %
- Industry: Building / Construction
-
Supplier: Newark, An Avnet Company
Description: Self Leveling Flooring Epoxy, Light Grey Resin
-
Supplier: Henkel Corporation - Industrial
Description: Loctite® Fixmaster® Self Leveling Flooring Epoxy, Resin is a high gloss, seamless, hygienic surface. High chemical resistance, extremely hard wearing and durable.
-
-
Description: LOCTITE® ECCOBOND UF 1173 is designed to provide a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. LOCTITE ECCOBOND UF 1173 material is
- Chemical System: Epoxy (EP)
- Features: Leveling / Filling Compound
- Industry: OEM / Industrial
- Cure / Technology: Thermosetting / Crosslinking
-
Supplier: R. S. Hughes Company, Inc.
Description: Devcon Epoxy Coat gray 7000 epoxy adhesive is compatible with concrete and metal materials with a 24 hr cure time. Provides a 36 min working time. Works in a mix ratio of 3:2. Maximum operating temperature is +200 F.
- Viscosity: 3,600 cP
- Use Temperature: 200 F
- Chemical System: Epoxy (EP)
- Features: Leveling / Filling Compound
-
Supplier: R. S. Hughes Company, Inc.
Description: Loctite epoxy adhesive.
- Chemical System: Epoxy (EP)
- Features: Leveling / Filling Compound
-
Supplier: R. S. Hughes Company, Inc.
Description: Loctite Hysol 1511184 black epoxy potting compound is compatible with ceramic, metal and plastic materials with a 24 hr cure time. Provides a 40 min working time. Works in a mix ratio of 2:1. Delivers great performance with a shear strength of 3000 psi.
- Thermal Conductivity: 0.25 W/m-K
- Dielectric Strength: 965.200000000002 kV/in
- Features: Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
-
Supplier: R. S. Hughes Company, Inc.
Description: Devcon Epoxy Coat gray 7000 epoxy adhesive with a 24 hr cure time. Provides a 55 min working time. Works in a mix ratio of 2.1:1. Maximum operating temperature is +180 F.
- Viscosity: 2,000 cP
- Use Temperature: 180 F
- Chemical System: Epoxy (EP)
- Features: Leveling / Filling Compound
-
Supplier: TFC Ltd.
Description: Loctite® Nordbak® 7218 Wearing Compound Ceramic filled two part epoxy to protect, rebuild and repair high wear areas. Outstanding abrasion and corrosion resistance.
- Features: Leveling / Filling Compound
-
Supplier: TFC Ltd.
Description: Loctite® Nordbak® 7219 High Impact Wearing Compound Rubber modified epoxy that provides a combination of wear resistance and impact resistance not usually found in epoxies. Use for lining and protecting flumes, troughs, elbows, hoppers, chutes, and other surfaces exposed to both wear
- Features: Leveling / Filling Compound
-
Supplier: TFC Ltd.
Description: Loctite® Nordbak® 7230 High Temperature Wearing Compound Ceramic filled two part epoxy to protect, rebuild and repair high wear areas. Use to rebuild and protect chutes, pump housings, elbows, cyclones and material handling equipment in hot environments.
- Features: Leveling / Filling Compound
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST ES 1904, Epoxy, Potting and Encapsulating LOCTITE® STYCAST ES 1904 is an opaque, medium-viscosity epoxy resin formulation recommended for small potting and laminating applications, excellent structural, mechanical and electrical properties are required. This two-part
- Viscosity: 25,000 cP
- Coeff. of Thermal Expansion (CTE): 37.77777777777778 µin/in-F
- Chemical System: Epoxy (EP)
- Features: Leveling / Filling Compound, Optical Grade / Material
-
Supplier: DigiKey
Description: Thermal Epoxy, 2 Part (Order Catalyst Separately) 1.36 kg Container
- Use Temperature: -85 F
- Chemical System: Epoxy (EP)
-
Supplier: Sauereisen, Inc.
Description: Hi-Build Filler Compound No. 209HB is an epoxy material specifically designed to refinish large surfaces and open joints within concrete. No. 209HB provides a smooth finish and appropriate bonding surface for epoxy topcoats. Sauereisen Hi-Build Filler Compound is
- Use Temperature: 150 F
- Tensile Strength (Break): 1,645 psi
- Industry: Building / Construction
- Substrate Compatibility: Concrete / Masonry
-
Supplier: Fosroc Limited
Description: A two pack thixotropic epoxy resin product for the repair of cracked concrete and masonry by the injection process.
- Features: Caulk / Grout, Leveling / Filling Compound
-
Supplier: Epoxies Etc...
Description: 10-3713 used as a two component ultra clear epoxy adhesive designed for a variety of bonding applications. 10- 3713 forms a crystal clear bond line and is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. This adhesive when UV aged in a QUV
- Use Temperature: -58 to 302 F
- Thermal Conductivity: 0.41826091 W/m-K
- Coeff. of Thermal Expansion (CTE): 27.77777777777778 µin/in-F
- Tensile Strength (Break): 9,400 psi
-
Description: One-component epoxy resin adhesive is a filling resin that can be reused in CSP (FBGA) or BGA. It cures quickly as soon as it is heated. It is designed to provide good protection to prevent failure due to mechanical stress. Low viscosity allows filling gaps under CSP or BGA.
- Industry: Electronics
- Chemical System: Epoxy (EP)
- Features: Specialty / Other
-
Supplier: Fosroc Limited
Description: A two pack low viscosity epoxy resin product for the repair of cracked concrete and masonry by the injection process.
- Features: Caulk / Grout, Leveling / Filling Compound
-
Description: KEM® Cati-Coat® HS EPOXY FILLER/SEALER is a high performance, interior/exterior, VOC compliant, epoxy block filler. Designed for tenacious adhesion to masonry substrates while filling voids and crevices to smooth the surface. Excellent resistance to moisture, humidity, impact, and
- Use Temperature: 45 to 100 F
- Substrate Compatibility: Concrete / Masonry
- Chemical System: Epoxy (EP)
- Features: Flame Retardant (e.g. UL 94 Rated), Gap Filling Sealant / FIP Gasket, Leveling / Filling Compound, Other
-
Description: KEM CATI-COAT HS N EPOXY FILLER/SEALER is a high performance, interior/exterior, low VOC, epoxy. Designed for tenacious adhesion to masonry and concrete substrates. This product meets specific design requirements for nuclear safety related qualification*. This product is quality
- Use Temperature: 45 to 100 F
- Features: Air Setting / Film Drying, Leveling / Filling Compound
- Substrate Compatibility: Concrete / Masonry
- Chemical System: Epoxy (EP)
-
Description: Classic underfill, ultra-low viscosity suitable for most underfill applications.
- Viscosity: 360 cP
- Industry: Electronics
- Features: Encapsulant / Potting Compound, Specialty / Other
- Chemical System: Epoxy (EP)
-
Description: STEEL-SEAM FT910 EPOXY PATCHING AND SURFACING COMPOUND is a 100% solids epoxy surfacing compound for steel or patching compound for concrete. It is formulated for ease of application with squeegee or trowel on horizontal, vertical or overhead applications. 100%
- Use Temperature: 50 to 120 F
- Tensile Strength (Break): 2,300 psi
- Features: Caulk / Grout, Leveling / Filling Compound, Other, Reactive / Moisture Cured
- Substrate Compatibility: Concrete / Masonry, Metal
-
Supplier: Master Bond, Inc.
Description: Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F which gives it a higher resistance to elevated temperatures than most polysulfide systems.
- Applied Thickness / Gap Fill: 0.004 to 0.006 inch
- Viscosity: 5,000 to 15,000 cP
- Use Temperature: -80 to 350 F
- Coeff. of Thermal Expansion (CTE): 30,555,555.555555556 to 33,333,333.333333332 µin/in-F
-
Description: 3M™ Scotch-Weld™ Structural Void Filling Compound 3439 HT is a temperature-resistant, one-part, high-temperature curing low density void filling compound.
- Industry: Aerospace, OEM / Industrial
- Chemical System: Epoxy (EP)
- Features: Gap Filling Sealant / FIP Gasket, Grease / Paste, Leveling / Filling Compound
- Cure / Technology: Single Component System, Thermosetting / Crosslinking
-
Supplier: Ellsworth Adhesives
Description: ITW Performance Polymers Devcon 2 Ton Epoxy 14355 Clear is used for bonding structural environment components, glass, ceramics, wood, concrete, metal, and potting electronic assemblies. It is self leveling, medium curing, and water resistant. 400 mL Cartridge.
- Viscosity: 8,000 cP
- Dielectric Strength: 600 kV/in
- Chemical System: Epoxy (EP)
- Cure / Technology: Two Component System
-
Supplier: Ellsworth Adhesives
Description: Henkel Loctite 3621 is a heat curing epoxy adhesive designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. It is suited for applications where medium to high dispense speeds, high dot profile, high wet strength, and good electrical
- Viscosity: 500 to 3,000 cP
- Thermal Conductivity: 0.3 W/m-K
- Dielectric Strength: 1,016.0000000000022 kV/in
- Chemical System: Epoxy (EP)
-
Supplier: Ellsworth Adhesives
Description: Henkel Loctite 3621 is a heat curing epoxy adhesive designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. It is suited for applications where medium to high dispense speeds, high dot profile, high wet strength, and good electrical
- Viscosity: 500 to 3,000 cP
- Thermal Conductivity: 0.3 W/m-K
- Dielectric Strength: 1,016.0000000000022 kV/in
- Chemical System: Epoxy (EP)
-
Supplier: Master Bond, Inc.
Description: over a wide temperature range. Physical strength and electrical insulation properties of the cured EP121CL resin system are significantly superior to those exhibited by typical room temperature and also thermally cured epoxy resin systems. The cured epoxy can meet all service
- Viscosity: 1,000 to 3,000 cP
- Use Temperature: -80 to 500 F
- Coeff. of Thermal Expansion (CTE): 22.220000000000002 to 25 µin/in-F
- Tensile Strength (Break): 11,600 to 12,100 psi
-
Supplier: Epoxies Etc...
Description: 20-3030 is an unfilled, low viscosity epoxy system. This system was designed for fast, self leveling and ease of use. 20-3030 has a convenient 2:1 mix ratio and will cure at room temperature. It is a good choice for chemical, water and corrosion resistance. 20-3030 also exhibits
- Use Temperature: -40 to 275 F
- Elongation: 4.5 %
- Tensile Strength (Break): 8,500 psi
- Dielectric Strength: 550.0000000000008 kV/in
-
Supplier: Ellsworth Adhesives
Description: ITW Performance Polymers Devcon 2 Ton Epoxy 14360 Clear is used for bonding structural environment components, glass, ceramics, wood, concrete, metal, and potting electronic assemblies. It is self leveling, medium curing, and water resistant. 9 lb Kit.
- Viscosity: 8,000 cP
- Elongation: 1 %
- Dielectric Strength: 600 kV/in
- Substrate Compatibility: Ceramic / Glass, Metal, Wood / Wood Product
-
Supplier: Master Bond, Inc.
Description: from metal, etc., over a wide temperature range. Physical strength thermal conductivity and electrical insulation properties of the cured EP121AO resin system are significantly superior to those exhibited by typical room temperature and also thermally cured epoxy resin systems. The cured
- Viscosity: 55,000 to 95,000 cP
- Use Temperature: -60 to 500 F
- Thermal Conductivity: 1.44 W/m-K
- Coeff. of Thermal Expansion (CTE): 10 to 11.67 µin/in-F
-
Supplier: Epoxies Etc...
Description: 10-3050 is a thixotropic, Non-Sag, gel epoxy designed to protect motor windings from abrasives, chemicals, vibration, oils, jet fuels, etc... 10-3050 self levels to a smooth void free coating once applied with a spatula or brush.
- Use Temperature: -76 to 320 F
- Thermal Conductivity: 0.59133439 W/m-K
- Coeff. of Thermal Expansion (CTE): 27.22222222222222 µin/in-F
- Tensile Strength (Break): 8,000 psi
Find Suppliers by Category Top
Featured Products Top
-
Master Bond EP5G-80 is a one component, NASA low outgassing rated epoxy, with a moderate temperature cure requirement of 80°C for 4 hours. This graphite filled compound is not premixed and frozen and has an unlimited working life at room temperature. It offers electrical conductivity with a (read more)
Browse Conductive Compounds Datasheets for Master Bond, Inc. -
“EP21AC withstood over 150 arcs without igniting and therefore was assigned the highest PLC (Performance Level Category) of 0 under the UL746A High Amp Arc Ignition test,” says Rohit Ramnath, Senior Product Engineer. “The compound is also flame retardant, as per the UL94 (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
electrical characteristics and exhibits superior performance over conventional PFA, PTFE, polyimide and epoxy materials in many AV applications. Key benefits of Fluon+ PFA EA-2000 compounds include: Superior electrical performance, with the lowest dielectric constant (2.0) and low dissipation factor (read more)
Browse Resins and Compounds Datasheets for AGC Chemicals Americas, Inc. -
materials including acrylates, methacrylates, epoxies, polyesters, nylon, ABS and other resin compounds. Easy dispersion within a polymer matrix. Prevention of soft polymer blocking in powder fusion processes. Active chemical surface facilitating strong chemical bonding (read more)
Browse Silica, Quartz, and Silicate Materials Datasheets for AGC Chemicals Americas, Inc. -
MacuSpec THF 100 is a single step copper through hole filling process that enables improved thermal and structural designs for IC substrates.
(read more)
Browse Leveling and Filling Compounds Datasheets for MacDermid Alpha Electronics Solutions -
of thermal expansion. With a Tg between 120-125°C, and a service temperature range from -60°C to +175°C, this epoxy is effective in high temperature environments. It is a reliable electrical insulator featuring a volume resistivity of more than (read more)
Browse Leveling and Filling Compounds Datasheets for Master Bond, Inc.
Conduct Research Top
-
Benefits of the Industrial Use of Electronic Epoxy Encapsulant Potting Compounds
various external factors. Since electronic assemblies are subjected to several of these external factors when they work, it means that there needs to be some level of protection involved. Some of the external factors that electronic assemblies are subjected to include corrosion, moisture, thermal
-
EP42HT-2Med: Utilized in prosthetics and fully implantable medical devices
Among the most challenging medical applications for an epoxy compound are prosthetics and fully implantable medical devices. Prosthetics and implantable devices must be able to maintain performance levels even when in direct contact with tissue and bodily fluids, and must not introduce toxins
-
Importance of Hardness Testing
Measuring hardness is a simple yet powerful test to ensure proper curing and evaluate the performance of adhesive materials. The hardness scales for epoxy and silicone formulations range from rigid to flexible. Commonly used hardness scales are A and D. Shore A is used for softer materials, whereas
More Information Top
Indicates content that may require registration and/or purchase.
-
In‐situ self reinforced polyimide for film materials
The conversion ratio reached its saturation point after 3hof reaction.Moreover,theconversionratioshoweda decrease with increasing epoxide compound level .
-
Epoxidation of waste used-oil biodiesel: Effect of reaction factors and its impact on the oxidative stability
…the four independent variables related to the epoxidation conditions (A: reaction temperature, B: mole ratio of H2O2 : HCOOH, C: stirring rate and D: reaction time) and the two selected response factors of the unsaturated carbon bond level and the epoxy compound selectivity.
-
Wafer level encapsulation for system in package generation
To investigate the feasibility of transfer molding on wafer level the Epoxy Molding Compound , material WLM-D, was used.
-
New epoxy molding compounds for SMT with pre-plated lead-frame system
(Same Level as Biphenyl Epoxy Compounds ) .
-
Cholesterol Oxides in Swedish Foods and Food Ingredients: Fresh Eggs and Dehydrated Egg Products
All of our sampleswere dried by indirect spray drying, and therefore one would not expect to find such high levels of the epoxy compounds asthose in someof the samplesanalyzed by Tsai and Hudson (1985).
-
Structure and process development of wafer level embedded SiP (System in Package) for mobile applications
After wafer level flip-chip bonding, molding process has been performed at wafer level using epoxy molding compound .
-
A fast, low cost method to check for moisture in epoxy molding compound
The area under this peak is a critical data to comment the moisture absorption level of epoxy molding compound .
-
The Development of Semiconducting Materials for Anti-Corona Protection Designs of Generator High Voltage Windings and their Testing at Cryogenic Temperatures
The testing of compositions with usage of epoxy compounds with different levels of strength of molecular interaction - KPN-X (cold hardening), KPN (heat hardening), and KPN-S-1 (heat hardening, based on special resistant to chemicals epoxy composition [10, Fig.3]) shows…
-
CR4 - Thread: Cracking Concrete Floor
The floor could then be painted or screeded with an epoxy floor screed or leveling compound (such as quicklevel).
-
Effect of polyester thickeners on thermal stability and low-temperature properties of phosphate fluids
Corrosion of magnesium ML5 can be reduced by normal levels by using the epoxide compound in a higher concentration (2 wt.%).