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Supplier: Accuris
Description: STANDARD SPECIFICATION FOR EPOXY MOLDING COMPOUNDS
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Standards and Technical Documents - Standard Specification for Epoxy Molding Compounds -- D3013 (RL)Supplier: Accuris
Description: Standard Specification for Epoxy Molding Compounds
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Supplier: ASTM International
Description: reinforcements, colorants, and other chemical agents. The epoxy molding compounds are classified into grades based on physical properties, which may be further classified into classes (dielectric or flame retardant) according to special requirements. The molding
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Supplier: Accuris
Description: STANDARD SPECIFICATION FOR EPOXY MOLDING COMPOUNDS - INCLUDES STANDARD + REDLINE (PDF)
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Supplier: Accuris
Description: EPOXY (EP), FILLED MOLDING COMPOUND
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Supplier: Henkel Corporation - Electronics
Description: (Known as LOCTITE HYSOL GR 646HV-L1 Epoxy molding compound ) LOCTITE HYSOL GR 646HV-L1 is recommended for automatic molding operations. It is a green product, low stress, fast cure and delivers outstanding performance and ease of use. It meets UL 94 V-0 flammability at
- Industry: Electronics
- Chemical System: Epoxy
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Supplier: SAE International
Description: This specification covers a chopped-glass-fiber filled EPI-BIS epoxy resin molding compound.
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Supplier: SAE International
Description: This specification covers a modified novolac epoxy resin in the form of a chopped-glass-fiber filled molding compound processed to a dry "B" stage condition.
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Supplier: SAE International
Description: This specification has been "CANCELLED" by the Aerospace Materials Division, SAE, as of October 1995.
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Supplier: SAE International
Description: This specification has been "CANCELLED" by the Aerospace Materials Division, SAE, as of October 1996.
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE 3517M, Epoxy, Underfill LOCTITE® 3517M underfill is designed for use as a solder joint protection against mechanical stress in hand held electronic device applications. One component - requires no mixing Reworkable Low halogen content
- Coeff. of Thermal Expansion (CTE): 36.11111111111111 µin/in-F
- Viscosity: 2,600 cP
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Supplier: ASTM International
Description: 1.1 This practice covers the general principles to be followed when compression molding test specimens of thermosetting molding compounds, such as phenolics, aminoplastics, melamine phenolics, epoxies, and unsaturated polyesters. Note 1--This standard is similar in content (but
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Supplier: ASTM International
Description: This specification covers the basic properties of thermoset molding plastic compounds and the test methods used to establish the properties. The plastic compounds shall be a resin, cellulose-filled or mineral/glass-filled phenolic, melamine, polyester, diallyl iso-phthalate,
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® 826 A low viscosity, two-component epoxy compound that cures at room temperature. High flexibility, high impact resistance, thermal shock, water/chemical resistance, and good mechanical properties. Wicking and air release capabilities of INSTAbond® 826 make it ideal for
- Features: Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: Georgia-Pacific Chemicals LLC
Description: These phenolic novolac resins are used as curing agents for epoxy resins in molding compounds, copper clad laminates, electrical applications and potting.
- Industry: Industrial
- Form / Shape: Liquid
- Chemical System: Phenolics (Melamine, Furan)
- Type: Thermoset
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Supplier: Epoxy Technology
Description: spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs. More recently, solar cells require our UV curing resin
- Viscosity: 150 to 300 cP
- Use Temperature: 572 F
- Coeff. of Thermal Expansion (CTE): 31.666666666666664 to 116.66666666666666 µin/in-F
- Dielectric Constant (Relative Permittivity): 3.36
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Supplier: Epoxy Technology
Description: spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs. More recently, solar cells require our UV curing resin
- Viscosity: 150 to 250 cP
- Use Temperature: 392 F
- Coeff. of Thermal Expansion (CTE): 17.22222222222222 to 82.22222222222221 µin/in-F
- Dielectric Constant (Relative Permittivity): 4.46
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Supplier: Epoxy Technology
Description: spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs. More recently, solar cells require our UV curing resin
- Use Temperature: 572 F
- Coeff. of Thermal Expansion (CTE): 28.333333333333332 to 102.77777777777777 µin/in-F
- Dielectric Constant: 2.62
- Index of Refraction: 1.5704
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Supplier: Epoxy Technology
Description: spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs. More recently, solar cells require our UV curing resin
- Use Temperature: 572 F
- Coeff. of Thermal Expansion (CTE): 32.22222222222222 to 93.88888888888889 µin/in-F
- Light Transmission: 1 %
- Viscosity: 700 to 1,200 cP
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Supplier: Bluestar Silicones USA Corp.
Description: Accelerator for platinum cure, polyaddition silicone moldmaking compounds Properties Viscosity 19000 Hardness Sha 19 Description Bluesil RTV-573 is a low viscosity liquid silicone product which, after the addition of a curing agent, cures at room temperature to a strong, flexible silicone
- Tensile Strength (Break): 275 psi
- Elongation: 250 %
- Viscosity: 50 to 19,000 cP
- Type: Elastomer / Rubber
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Supplier: Ellsworth Adhesives
Description: Parker Lord CoolTherm® ME-543 Black is a thermally conductive, anhydride-free, semiconductor grade epoxy underfill designed for encapsulating densely populated area array flip chip devices. Able to handle over-molding processes. Fast cure, jettable, self-filleting, and can withstand
- Thermal Conductivity: 1.2 W/m-K
- Viscosity: 21,000 cP
- Features: Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
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Supplier: Henkel Corporation - Electronics
Description: Hysol® GR9810-1™ is a technologically advanced epoxy molding compound designed for use as an overmold on a wide variety of laminate based molded array packages including SIP and flip-chip array packages that have been conventionally underfilled. This material exhibits ultra low
- Industry: Electronics
- Chemical System: Epoxy
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Supplier: Henkel Corporation - Electronics
Description: (Known as Hysol GR 2811 ) LOCTITE HYSOL GR2811 is an epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements to 260°C reflow temperature. GR2811 meets UL 94 V-0 Flammability at 6.35mm thickness.
- Coeff. of Thermal Expansion (CTE): 7.222222222222222 µin/in-F
- Industry: Electronics
- Chemical System: Epoxy
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Supplier: Henkel Corporation - Electronics
Description: (Known as Hysol GR9810-1P ) LOCTITE HYSOL GR9810-1P is a state-of-the-art epoxy molding compound developed to meet the stringent encapsulation requirements of package-on-package (POP) devices. This compound exhibits advanced warpage control characteristics; these
- Coeff. of Thermal Expansion (CTE): 6.111111111111111 µin/in-F
- Industry: Electronics
- Chemical System: Epoxy
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Supplier: Norplex-Micarta
Description: NP114B pre-preg is composed of an electrical grade of epoxy resin (Tg = 175°C) combined with an aramid paper substrate. This grade of pre-preg does not use halogen flame retardants to obtain its flame retardant characteristics. This is essential since it cannot contain bromine in its primary
- Filler: Aramid Fiber
- Chemical System: Epoxy
- Features: Molding Resin
- Type: Thermoset
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Supplier: Techsil Limited
Description: RTV630 is a room temperature molding compound from Momentive which cures to a high strength silicone rubber. This medium viscosity grade forms thin, light-weight molds with excellent durability. The high tear resistance and inherent release ability of this grade make it well suited to
- Use Temperature: -76 to 399.2 F
- Type: Elastomer / Rubber
- Features: Molding Resin
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Supplier: Techsil Limited
Description: RTV630 is a room temperature molding compound from Momentive which cures to a high strength silicone rubber. This medium viscosity grade forms thin, light-weight molds with excellent durability. The high tear resistance and inherent release ability of this grade make it well suited to
- Use Temperature: -76 to 399.2 F
- Type: Elastomer / Rubber
- Features: Molding Resin
- Chemical System: Silicone
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Supplier: Techsil Limited
Description: appliances, mobile phones, copy machines etc. It is also ideal for the creation of prototype molds for the automotive industry for the creation of console boxes, radiator grills, lamp housings etc. Product Benefits Convenient 10:1 mixing ratio Excellent molding durability to epoxy
- Type: Elastomer / Rubber
- Features: Molding Resin
- Chemical System: Silicone
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Supplier: Techsil Limited
Description: appliances, mobile phones, copy machines etc. It is also ideal for the creation of prototype molds for the automotive industry for the creation of console boxes, radiator grills, lamp housings etc. Product Benefits Convenient 10:1 mixing ratio Excellent molding durability to epoxy
- Type: Elastomer / Rubber
- Features: Molding Resin
- Chemical System: Silicone
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Supplier: Bluestar Silicones USA Corp.
Description: silicone designed for casting polyurethane, epoxy and polyester resins as well as wax and polyurethane foams.
- Tensile Strength (Break): 797.702616464583 psi
- Elongation: 400 %
- Type: Elastomer / Rubber
- Industry: Industrial, Tooling / Molds
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Supplier: PANJIT SemiConductor
Description: Schottky Barrier Rectifiers feature a plastic package with UL Flammability Classification 94V-O utilizing flame retardant Epoxy Molding Compound and are in compliance with EU RoHS 2002/95/EC directives. They exceed environmental standards of MIL-S-19500/288 and are for use in
- VF: 0.5 volts
- IF: 1,000 mA
- VR: 40 volts
- IR: 0.5 mA
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Supplier: Hangzhou X-mag Inc.
Description: pressing that compound in a die, and then curing the epoxy in an oven. To improve the corrosion resistance of the product, these components are often finished with a surface treatment such as Epoxy resin/Parylene after the curing process. Injection Molding Injection
- Maximum Energy Product, BHmax: 1.45 to 12 MGOe
- Residual Induction, Br: 2.2 to 7.6 kilogauss
- Coercive Force, Hc: 2,000 to 6,000 Oersted
- Intrinsic Coercive Force, Hci: 2,600 to 16,000 Oersted
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Supplier: Ohmite Manufacturing Co.
Description: 14AFR Current Sense resistors feature a high temperature ceramic body which affords the user higher power densities than similar products which utilize silicone based epoxy molding compounds. The internal construction involves a straight, low inductance,3-piece welded metal
- Resistance Range: 0.004 to 0.051 ohms
- Tolerance: 1 +/- %
- Temperature Coefficient (TCR): 150 to 1,100 ±ppm/°C
- Power Rating: 4 watts
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Supplier: ACCRAbond, Inc.
Description: compounds designed for trowel or molding application. E-340 is supplied in a variety of camouflage colors for application to tracked vehicles of the United States and its allies. A deck gray shade matching color chip 26081 of Federal Standard 595 is available for use on naval vessels.
- Features: Heat Resistant / High Temperature, Protective, Wear Resistant (Abrasion / Erosion)
- Industry: Military Specification
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Supplier: Ohmite Manufacturing Co.
Description: manufactured using Wire winding/Spot Welding–by Computer Numerical Control (CNC) machine tools to ensure consistency of product quality. The encapsulation of the epoxy molding compound is done by advanced IC encapsulation mold/die technologies. Power rating 0.5-2 watts
- Resistance Range: 0.005 to 0.1 ohms
- Tolerance: 1 to 5 +/- %
- Temperature Coefficient (TCR): 100 to 300 ±ppm/°C
- Power Rating: 0.5 to 3 watts
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Browse Molding Compounds and Resins Datasheets for Cri-Tech, Inc.
Conduct Research Top
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Which is Better to Use: Resin or Epoxy?
Resin is a natural or synthetic compound, typically viscous, liquid, or semi-solid. It is often used to manufacture paints, inks, and adhesives. Additionally, the resin can be used as a molding or casting material or as a protective coating. The word "resin " has been traced back to the Latin word
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Solving Ultraviolet Curable Potting & Encapsulating Problems With Shadow Cure Technology
potting compound is poured over the assembly. The term Encapsulation describes a molding or dipping process where there is no case or shell. The assembly is either coated or the compound is poured into a mold and the cured compound becomes the outside of the assembly. The terms Potting and Encapsulating
More Information Top
Indicates content that may require registration and/or purchase.
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Moisture Sensitivity of Plastic Packages of IC Devices
Chapter 2 describes the latest investigations of anomalous moisture diffusion and the corresponding adhe- sion behaviors in epoxy molding compounds .
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Power Electronic Packaging
Models for power packaging designs, materials, reliability and assembly manufacturing processes include electromigration simulation; diffusion along the interface of two metal materials; contamination at the interface between the lead frame, multiple chips, and epoxy mold compound (EMC); thermal resistance definition in multiple …
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Materials for Advanced Packaging
Latest advances in several key packaging materials including lead-free solders, flip chip underfills, epoxy molding compounds , conductive adhesives, die attach adhesives/films, and Thermal Interface Materials (TIMs) are reviewed in great detail in Chapters 5, 9, 10, 11, 12, and 13, respectively.
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Effect of adhesive surface chemistry and morphology on package cracking in tapeless lead-on-chip (LOC) packages
The dominant issue is device failure, due to package cracking, caused by inter- facial delamination between the adhesive-coated chip surface and the epoxy molding compound .
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Investigation of stress singularity fields and stress intensity factors for cracks [IC packages]
Figure 4 Package cracking induced by interjfacial delamination between the chip backside and the epoxy molding compound .
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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
In [4] the procedure is worked out for an epoxy molding compound .
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Advanced virtual testing of structural integrity in microelectronic assemblies
Epoxy Molding Compounds (EMCs) are widely used as encapsulating materials in semiconductor packaging industry.