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Supplier: Henkel Corporation - Electronics
Description: (Known as LOCTITE HYSOL GR 646HV-L1 Epoxy molding compound ) LOCTITE HYSOL GR 646HV-L1 is recommended for automatic molding operations. It is a green product, low stress, fast cure and delivers outstanding performance and ease of use. It meets UL 94 V-0 flammability at
- Chemical / Polymer System Type: Epoxy
- Industry: Electronics
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Supplier: SAE International
Description: This specification covers a chopped-glass-fiber filled EPI-BIS epoxy resin molding compound.
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Supplier: SAE International
Description: This specification covers a modified novolac epoxy resin in the form of a chopped-glass-fiber filled molding compound processed to a dry "B" stage condition.
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Supplier: Accuris
Description: MOLDING MATERIAL, PLASTIC, EPOXY COMPOUNDS THERMOSETTING
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Supplier: Accuris
Description: COMPOUND MOLDING, TRANSFER, EPOXY RESIN, SINGLE-COMPONENT
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Supplier: Accuris
Description: COMPOUND, EPOXY MOLDING AND APPLICATION OF
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Supplier: Accuris
Description: STANDARD SPECIFICATION FOR EPOXY MOLDING COMPOUNDS
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE 3517M, Epoxy, Underfill LOCTITE® 3517M underfill is designed for use as a solder joint protection against mechanical stress in hand held electronic device applications. One component - requires no mixing Reworkable Low halogen content
- Coeff. of Thermal Expansion (CTE): 36.11 µin/in-F
- Viscosity: 2600 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE 3508NH, Epoxy, Underfill LOCTITE® 3508NH is designed to cure during Pb-free solder reflow while allowing self-alignment of IC components. It can be pre-applied to the board at the corners of the pad site using a standard SMA dispenser Reflow curable Reworkable Eliminates post-reflow
- Coeff. of Thermal Expansion (CTE): 36.11 µin/in-F
- Viscosity: 70000 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ECCOBOND UF 3811, Halogen free, Reworkable, Low viscosity, Epoxy, Underfill, Encapsulant LOCTITE® ECCOBOND UF 3811 reworkable epoxy underfill is designed for CSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional
- Coeff. of Thermal Expansion (CTE): 33.89 µin/in-F
- Viscosity: 354 cP
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Supplier: SAE International
Description: This specification has been "CANCELLED" by the Aerospace Materials Division, SAE, as of October 1996.
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Supplier: SAE International
Description: This specification has been "CANCELLED" by the Aerospace Materials Division, SAE, as of October 1995.
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Supplier: ASTM International
Description: This specification covers the requirements for epoxy thermosetting molding compounds and provides for their identification, quality control, and purchase. Material covered in this specification consists of mixtures or blends of epoxy resins and curing agents intimately
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Supplier: ASTM International
Description: 1.1 This specification covers requirements for epoxy thermosetting molding compounds. It provides for their identification, quality control, and purchase in such a manner that the purchaser and the seller can agree on the substantial similarity of different commercial lots or
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ECCOBOND E 1216M, Epoxy, Underfill LOCTITE® ECCOBOND E 1216M innovative capillary flow underfill is designed for high volume assembly operations requiring a very fast flowing underfill that fully cures in a single reflow cycle, but is stable enough to be easily shipped and used in
- Coeff. of Thermal Expansion (CTE): 19.44 µin/in-F
- Viscosity: 4000 cP
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Supplier: Georgia-Pacific Chemicals LLC
Description: These phenolic novolac resins are used as curing agents for epoxy resins in molding compounds, copper clad laminates, electrical applications and potting.
- Chemical / Polymer System Type: Phenolics (Melamine, Furan)
- Compound Type: Liquid
- Industry: Industrial
- Material Type / Grade: Thermoset
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 30 to 97.22 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.26
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 33.89 to 100 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.34
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 31.67 to 117 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 3.36
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 33.89 to 100 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 3.8
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® 826 A low viscosity, two-component epoxy compound that cures at room temperature. High flexibility, high impact resistance, thermal shock, water/chemical resistance, and good mechanical properties. Wicking and air release capabilities of INSTAbond® 826 make it ideal for
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® 803 A low viscosity two-component general purpose electrical encapsulant/molding compound that is designed for applications requiring high-impact strength, thermal shock resistance, good corrosion resistance, and good water resistance. INSTAbond® 803 is suitable for service
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
- Use Temperature: -58 to 248 F
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Supplier: ASTM International
Description: 1.1 This practice covers the general principles to be followed when compression molding test specimens of thermosetting molding compounds, such as phenolics, aminoplastics, melamine phenolics, epoxies, and unsaturated polyesters. Note 1-This standard is similar in content
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Supplier: ASTM International
Description: 1.1 This practice covers the general principles to be followed when compression molding test specimens of thermosetting molding compounds, such as phenolics, aminoplastics, melamine phenolics, epoxies, and unsaturated polyesters. Note 1--This standard is similar in
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Supplier: Norplex-Micarta
Description: NP114B pre-preg is composed of an electrical grade of epoxy resin (Tg = 175°C) combined with an aramid paper substrate. This grade of pre-preg does not use halogen flame retardants to obtain its flame retardant characteristics. This is essential since it cannot contain bromine in its primary
- Chemical / Polymer System Type: Epoxy
- Filler Material: Aramid Fiber
- Material Type / Grade: Thermoset
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Supplier: Norplex-Micarta
Description: NP130B pre-preg is a combination of a woven glass fabric combined with a flame retardant epoxy resin system. It can be molded into a composite with all of the excellent physical and electrical properties of NEMA Grade FR-4, in the sheet form. NP130B is an electrical and mechanical pre-preg
- Chemical / Polymer System Type: Epoxy
- Filler Material: Fiber Glass
- Material Type / Grade: Thermoset
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Supplier: Norplex-Micarta
Description: NP511B pre-preg is composed of a high temperature electrical grade of epoxy resin (Tg = 170°C) combined with a woven glass substrate. This grade of pre-preg is not flame retardant. With a non-brominated resin system, the product offers high mechanical strength at temperatures up to
- Chemical / Polymer System Type: Epoxy
- Filler Material: Fiber Glass
- Material Type / Grade: Thermoset
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Supplier: Norplex-Micarta
Description: NP510AB pre-preg is composed of woven glass fabric impregnated with a brominated epoxy resin (Tg = 130°C). It is designed to provide electrical insulation in high humidity environments. This pre-preg product offers consistent quality and good electrical properties. With proper cure
- Chemical / Polymer System Type: Epoxy
- Filler Material: Fiber Glass
- Material Type / Grade: Thermoset
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Supplier: Henkel Corporation - Electronics
Description: (Known as Hysol GR2220 ) GR2220 epoxy molding compound delivers outstanding performance and ease of use. Meets UL 94 V-0 Flammability at 6.35mm thickness.
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 10.56 µin/in-F
- Industry: Electronics
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Supplier: Henkel Corporation - Electronics
Description: Hysol® GR9851™ is a technologically advanced epoxy molding compound designed for use as an overmold on a wide variety of laminate based molded array packages.
- Chemical / Polymer System Type: Epoxy
- Industry: Electronics
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Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL MG15F ) LOCTITE HYSOL MG15F BULK is a white epoxy molding compound specifically formulated for use as an overmold for opto coupler devices.
- Chemical / Polymer System Type: Epoxy
- Industry: Electronics
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Supplier: Bluestar Silicones USA Corp.
Description: Accelerator for platinum cure, polyaddition silicone moldmaking compounds Properties Viscosity 19000 Hardness Sha 19 Description Bluesil RTV-573 is a low viscosity liquid silicone product which, after the addition of a curing agent
- Chemical / Polymer System Type: Silicone
- Elongation: 250 %
- Filler Material: Unfilled
- Industry: Industrial, Tooling / Molds
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Supplier: Ellsworth Adhesives
Description: Parker Lord CoolTherm® ME-543 Black is a thermally conductive, anhydride-free, semiconductor grade epoxy underfill designed for encapsulating densely populated area array flip chip devices. Able to handle over-molding processes. Fast cure, jettable, self-filleting, and can withstand
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Single Component System
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 1.2 W/m-K
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Supplier: Techsil Limited
Description: RTV630 is a room temperature molding compound from Momentive which cures to a high strength silicone rubber. This medium viscosity grade forms thin, light-weight molds with excellent durability. The high tear resistance and inherent release ability of this grade make it well suited to
- Material Type / Grade: Elastomer / Rubber
- Use Temperature: -76 to 399 F
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Supplier: ELANTAS North America LLC
Description: wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 22.22 to 122 µin/in-F
- Filler Material: Mineral
- Industry: Aerospace, Electronics, Industrial, Tooling / Molds
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Featured Products Top
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Browse Silica, Quartz, and Silicate Materials Datasheets for AGC Chemicals Americas, Inc. -
Cri-Tech, Inc. manufactures custom static control products to match your specifications. Formulation Development, Custom Rubber and Plastic Compounding, Color development & Specialty Toll Manufacturing. Cri-Tech 5,200 m2 state of the art facility has over 3,600 MTs of internal and (read more)
Browse Molding Compounds and Resins Datasheets for Cri-Tech, Inc. -
Cri-plastMP PFA Static Dissipative Compounds are formulated to meet your static dissipative/conductive, ATEX requirements in multiple applications. Specific grades can be processed by injection, extrusion, transfer molding, and compression molding. Special Features (read more)
Browse Molding Compounds and Resins Datasheets for Cri-Tech, Inc. -
Cri-Tech, Inc. manufactures custom molding compounds and resins to match your specifications. For the past 39 years, Cri-Tech has specialized in the development and production of high performance elastomer (and now thermoplastic) materials. Our core competency is in elastomer chemistry (read more)
Browse Molding Compounds and Resins Datasheets for Cri-Tech, Inc.
Conduct Research Top
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Which is Better to Use: Resin or Epoxy?
Resin is a natural or synthetic compound, typically viscous, liquid, or semi-solid. It is often used to manufacture paints, inks, and adhesives. Additionally, the resin can be used as a molding or casting material or as a protective coating. The word "resin " has been traced back to the Latin word
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Solving Ultraviolet Curable Potting & Encapsulating Problems With Shadow Cure Technology
potting compound is poured over the assembly. The term Encapsulation describes a molding or dipping process where there is no case or shell. The assembly is either coated or the compound is poured into a mold and the cured compound becomes the outside of the assembly. The terms Potting and Encapsulating
More Information Top
Indicates content that may require registration and/or purchase.
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Moisture Sensitivity of Plastic Packages of IC Devices
Chapter 2 describes the latest investigations of anomalous moisture diffusion and the corresponding adhe- sion behaviors in epoxy molding compounds .
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Power Electronic Packaging
Models for power packaging designs, materials, reliability and assembly manufacturing processes include electromigration simulation; diffusion along the interface of two metal materials; contamination at the interface between the lead frame, multiple chips, and epoxy mold compound (EMC); thermal resistance definition in multiple …
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Materials for Advanced Packaging
Latest advances in several key packaging materials including lead-free solders, flip chip underfills, epoxy molding compounds , conductive adhesives, die attach adhesives/films, and Thermal Interface Materials (TIMs) are reviewed in great detail in Chapters 5, 9, 10, 11, 12, and 13, respectively.
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Effect of adhesive surface chemistry and morphology on package cracking in tapeless lead-on-chip (LOC) packages
The dominant issue is device failure, due to package cracking, caused by inter- facial delamination between the adhesive-coated chip surface and the epoxy molding compound .
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Investigation of stress singularity fields and stress intensity factors for cracks [IC packages]
Figure 4 Package cracking induced by interjfacial delamination between the chip backside and the epoxy molding compound .
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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
In [4] the procedure is worked out for an epoxy molding compound .
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Advanced virtual testing of structural integrity in microelectronic assemblies
Epoxy Molding Compounds (EMCs) are widely used as encapsulating materials in semiconductor packaging industry.