Products & Services
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Supplier: Koford Engineering, LLC
Description: E-112 is a high performance, light weight, hollow glass microsphere filled single component pottingmaterial. It is especially suited for applications which involve potting assemblies which have small openingsaround terminals or switches. The microspheres are of sufficient size that the
- Use Temperature: 320 to 392 F
- Features: Encapsulating / Potting Compound
- Cure / Technology: Single Component System, Thermosetting / Crosslinking
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Supplier: Allied Electronics, Inc.
Description: Scotch-Weld™ epoxy potting compound⁄adhesive DP270 is a two-part, low viscosity epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components and is available in clear or black. Scotch-Weld epoxy potting
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Supplier: Allied Electronics, Inc.
Description: Scotch-Weld™ epoxy potting compound⁄adhesive DP270 is a two-part, low viscosity epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components and is available in clear or black. Scotch-Weld epoxy potting
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Supplier: Epoxies Etc...
Description: 20-3205 is a two part room temperature curing epoxy system. It provides a low mixed viscosity and excellent electrical insulation properties.
- Thermal Conductivity: 0.37499254 W/m-K
- Dielectric Strength: 454.99999999999955 kV/in
- Dielectric Constant (Relative Permittivity): 4.3
- Viscosity: 30 to 20,000 cP
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Supplier: Epoxies Etc...
Description: 20-3064 is a filled Epoxy Resin System engineered to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness can be varied from 60 Shore A to 80 Shore D. 20-3064 provides excellent thermal shock resistance and outstanding adhesion.
- Viscosity: 40,000 cP
- Use Temperature: -94 to 212 F
- Thermal Conductivity: 0.4326837 W/m-K
- Coeff. of Thermal Expansion (CTE): 38.888888888888886 µin/in-F
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Supplier: Epoxies Etc...
Description: 20-3046E FR is an epoxy potting and casting compound. This system is designed to be self extinguishing.
- Viscosity: 55,000 cP
- Features: Encapsulant / Potting Compound, Flame Retardant / UL 94V-0 Rated
- Chemical System: Epoxy (EP)
- Industry: OEM / Industrial
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Supplier: Epoxies Etc...
Description: 20-3035 is a low density, two component epoxy potting and encapsulating system. The weight of 20-3035 is less than half of most commercially available potting compounds.
- Use Temperature: -85 to 221 F
- Thermal Conductivity: 0.18749627 W/m-K
- Coeff. of Thermal Expansion (CTE): 23.88888888888889 µin/in-F
- Tensile Strength (Break): 4,300 psi
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Supplier: Allied Electronics, Inc.
Description: Scotch-Weld Epoxy Potting Compound Black, 400 mL
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Supplier: Accuris
Description: EPOXY RESIN, POTTING COMPOUND
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Supplier: Allied Electronics, Inc.
Description: Ideal for potting LED lights or other optics. Can be cured with or without heating. It is tough, water and chemical resistant, an electrical insulator, and has excellent maching properties. Features Water Clear Potting Non-Porous, Water and Chemical Resistant
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Supplier: Newark, An Avnet Company
Description: Epoxy Potting Compound, Flexible (Ratio 1:1) / 57 fl oz Kit
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview ER2223 Highly Chemical Resistant Epoxy Potting Compound has been specially formulated to meet the harsh operating conditions of under-hood applications in the automotive industry. It offers excellent chemical resistance, including to most fluids found in the
- Industry: Automotive, Semiconductors / IC Packaging
- Features: Electronics, Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
- Type: Thermal Compound / Thermally Conductive
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Supplier: RS Components, Ltd.
Description: Water clear epoxy potting compound 3L
- Features: Encapsulating / Potting Compound, Specialty / Other
- Chemical System: Epoxy (EP)
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite EA E-60NC is a low viscosity, electrically non-corrosive epoxy adhesive potting compound. Once cured it provides excellent environmental and chemical resistance, and acts as an electrical insulator. 50 mL Cartridge.
- Viscosity: 6,200 to 13,000 cP
- Tensile Strength (Break): 6,800 psi
- Elongation: 8 %
- Dielectric Strength: 550 kV/in
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite EA E-60NC is a low viscosity, electrically non-corrosive epoxy adhesive potting compound. Once cured it provides excellent environmental and chemical resistance, and acts as an electrical insulator. 200 mL Cartridge.
- Viscosity: 6,200 to 13,000 cP
- Tensile Strength (Break): 6,800 psi
- Elongation: 8 %
- Dielectric Strength: 550 kV/in
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite EA E-60NC is a low viscosity, electrically non-corrosive epoxy adhesive potting compound. Once cured it provides excellent environmental and chemical resistance, and acts as an electrical insulator. 400 mL Cartridge.
- Viscosity: 6,200 to 13,000 cP
- Tensile Strength (Break): 6,800 psi
- Elongation: 8 %
- Dielectric Strength: 550 kV/in
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Supplier: Accuris
Description: POTTING COMPOUND, EPOXY RESIN, THERMOSETTING
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Supplier: ACCRAbond, Inc.
Description: CONAPOXY® FR-1080 is a two-part high temperature epoxy potting system designed to meet Class H (180°C) operating requirements.
- Features: Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
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Supplier: Accuris
Description: Potting Compound, Epoxy Bisphenol A-Type
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Supplier: Accuris
Description: POTTING COMPOUND, EPOXY, FLEXIBLE DUROMETER 75-85
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG Epoxylite® E 5302 HI TEMP Epoxy Potting Compound is a two-component system that consists of a liquid resin and a powder hardener. It has excellent adhesion to metals, ceramics, and most plastics. It is used for bonding and sealing of electrical components requiring
- Tensile Strength (Break): 4,000 psi
- Elongation: 2 %
- Dielectric Strength: 560 kV/in
- Features: Encapsulating / Potting
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite Hysol 1511184 black epoxy potting compound is compatible with ceramic, metal and plastic materials with a 24 hr cure time. Provides a 40 min working time. Works in a mix ratio of 2:1. Delivers great performance with a shear strength of 3000 psi.
- Thermal Conductivity: 0.25 W/m-K
- Dielectric Strength: 965.200000000002 kV/in
- Features: Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
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Supplier: Newark, An Avnet Company
Description: Epoxy - Black Encapsulating & Potting Compound (Ratio 2:1) / 2.7 qt Kit
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Supplier: SAE International
Description: This specification and its supplementary detail specifications cover epoxy resin formulations based on diglycidyl ether of bisphenol A with an epoxide equivalent of 175 - 195. When property mixed and cured, these resins produce a rigid or flexible product.
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Supplier: SAE International
Description: This specification and its supplementary detail specifications cover epoxy resin formulations based on diglycidyl ether of bisphenol A with an epoxide equivalent of 175-195. When properly mixed and cured, these resisns produce a rigid or flexible product.
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST ES 1904, Epoxy, Potting and Encapsulating LOCTITE® STYCAST ES 1904 is an opaque, medium-viscosity epoxy resin formulation recommended for small potting and laminating applications, excellent structural, mechanical and electrical properties are required.
- Viscosity: 25,000 cP
- Coeff. of Thermal Expansion (CTE): 37.77777777777778 µin/in-F
- Chemical System: Epoxy (EP)
- Features: Leveling / Filling Compound
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Supplier: SAE International
Description: Technical Standard
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Supplier: Newark, An Avnet Company
Description: 3M SCOTCH WELD 2 PART EPOXY POTTING COMPOUND 270 BLACK B/A 2
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Supplier: SAE International
Description: Technical Standard
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Supplier: Protavic America, Inc.
Description: PNE-47207™ is an adhesive/sealant and potting compound. PNE-47207™ is designed to provide air free potting and casting of electronic devices. PNE-47207™ will bond difficult substrates such as glass, ceramics, and metals. It passes UL 94V0 for fire retardant properties,and has a
- Viscosity: 20,000 cP
- Use Temperature: -55 to 150 F
- Dielectric Constant (Relative Permittivity): 4.3
- Features: Ceramic / Glass, Electrical Insulating / Dielectric, Electrical Power / HV, Electronics, Encapsulating / Potting, Flame Retardant (e.g. UL 94 Rated), Gap Filling Sealant / FIP Gasket, Liquid, Metal
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Supplier: Techsil Limited
Description: MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite Stycast HD 3561 gray two-part potting & encapsulating compound with a 3 hr cure time. Works in a mix ratio of 100:10. Formerly known as Loctite Hysol EE1117-HD3561 Epoxy System.
- Features: Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
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Supplier: Techsil Limited
Description: MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
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Supplier: Techsil Limited
Description: MG Chemicals 834ATH Flame Retardant Epoxy is a economical, electronic-grade, self-extinguishing, flame retardant epoxy that provides excellent physical, chemical and electrical protection with a degree of thermal conductivity. Designed for encapsulating and potting, this
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound, Flame Retardant / UL 94V-0 Rated
- Chemical System: Epoxy (EP)
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Supplier: R. S. Hughes Company, Inc.
Description: Devcon potting & encapsulating compound is compatible with metal materials with a 16 hr cure time. Provides a 60 min working time. Works in a mix ratio of 4:1. Delivers great performance with a shear strength of 2600 psi.
- Dielectric Strength: 100.00000000000001 kV/in
- Features: Encapsulant / Potting Compound
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Featured Products Top
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MG Chemicals 832FXC is a clear, flexible epoxy potting compound designed to minimize physical stress on delicate components. Ideal for low-temperature, arctic, or temperature-cycling environments, it maintains flexibility and stability through rapid thermal changes. Its transparency allows easy (read more)
Browse Industrial Enclosures Datasheets for New Yorker Electronics Co., Inc. -
Master Bond EP30LP-2 is an optically clear epoxy with superb light transmission properties. This low viscosity, electrical insulator also features outstanding dimensional stability. Featuring easy handling, this compound has a convenient two to one mix ratio by weight or (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
Supreme 11ANHT-2 Two component epoxy compound for bonding, coating and sealing Master Bond Supreme 11ANHT-2 is a two component thermally conductive, electrically insulating epoxy resin system for bonding, coating and (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
sensitive components (Bectron®, CONAP®). Epoxy and silicone potting materials that provide protection for high temperature applications (Epoxylite®, (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
high temperature electrical potting compounds and powdered epoxies for electrical insulating and electric conductivity as well as UV curable adhesives for temporary metal maskants and insulating coatings. (read more)
Browse Epoxy Adhesives Datasheets for Beacon Adhesives, Inc. -
“EP21AC withstood over 150 arcs without igniting and therefore was assigned the highest PLC (Performance Level Category) of 0 under the UL746A High Amp Arc Ignition test,” says Rohit Ramnath, Senior Product Engineer. “The compound is also flame retardant, as per the UL94 (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
EP30HV Master Bond EP30HV is a lower viscosity, two component epoxy system for high performance bonding, sealing, coating and potting. It is formulated to cure at room temperature or more rapidly at elevated temperatures. The optimum (read more)
Browse Conformal Coatings Datasheets for Master Bond, Inc. -
EP21LSCL-2Med Master Bond EP21LSCL-2Med is a two component, low viscosity epoxy resin system featuring superb optical clarity. This system has a forgiving mix ratio of 100 to 20 by weight. The (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
latter property is particularly useful in potting and encapsulation applications. Also, the compound allows for precise alignment with minimal fixturing and simple curing. Its service temperature range is from 4K to +300°F. The color of Part A is light cream and Part B is similar, but slightly darker (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
engineers. The ELANTAS product portfolio includes Thin film conformal coatings (acrylic, alkyd, urethane, silicone) Thick film coatings (VOC-free; urethane, epoxy, silicone) Potting and encapsulation (read more)
Browse Electrical and Electronic Resins Datasheets for ELANTAS North America LLC
Conduct Research Top
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Epoxy Potting Compound for PCB: The Options and Benefits
PCBs or printed circuit boards have the most critical components in any electronics. They are the best if you want to protect the components from all sorts of damage. Two methods are used to protect the components. This is by conformal coating and PCB coating.
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Potting Electronics PCB with Epoxy Potting Compound and Epoxy Resin Conformal Coating
Electronic assemblies have to be protected from a wide range of factors, such as corrosive agents, moisture thermal dissipation, shock, and vibration. The protection is achieved when we do pot. This process involves filling electronic assemblies with compounds to give permanent protection.
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What you Should Know about Epoxy Potting Compound and Epoxy Sealing Compound
Potting compounds are used to protect electronic assemblies from different factors such as corrosive agents, moisture, thermal dissipation, shock, vibration, and so on. The protection is made possible through potting. Compounds are added to assemblies to offer much-needed protection.
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Common Applications for Electronic Epoxy Encapsulant Potting Compounds
Electronic epoxy encapsulant potting compounds are materials used to protect electronic components from environmental factors such as moisture, dust, and temperature changes. These compounds are essential in the electronics industry as they help to improve the durability and reliability
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Electronic Epoxy Encapsulant Potting Compounds in Harsh Environments
Electronic epoxy encapsulant potting compounds are essential for protecting electronic components from harsh environments. These compounds provide a protective barrier that shields electronics from moisture, dust, and other contaminants that can cause damage or failure. In this article, we
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Choosing The Best Electronic Epoxy Encapsulant Potting Compounds For Your Needs
Electronic epoxy encapsulant potting compounds are essential for protecting electronic components from harsh environmental factors. However, with so many options available on the market today, choosing the right compound for your specific needs can be a daunting task.
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Polyurethane Potting Compound for Electronics from China Polyurethane Potting Compound Manufacturers
Polyurethane encapsulating and potting compounds have many advantages, especially when a quick cure is needed at low temperatures. This solution is better compared to epoxy systems. With polyurethanes, there is better crack resistance and flexibility. There is also better adhesion to some
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Managing Heat Transfer With Potting Compounds
and require additional power to operate. Molded plastics are used in place of metal enclosures due to cost control and weight savings. In most cases, these plastics are not as effective at transferring heat away from its source. Thermally conductive potting compounds are an effective way to control
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UV Curing Adhesives and Potting Compounds
Recent advancements in ultraviolet curing have given engineers a new opportunity when choosing adhesives, potting compounds, coatings, and sealants. Until now, most of these systems were either two-component systems requiring mixing, one-component heat cure systems, or solvent-based systems
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New Urethane Technology for Potting & Encapsulation in Electronics
Many electronic components and assemblies require a potting compound for protection against moisture, thermal shock, vibration and very low temperatures. Most of the potting & encapsulating compounds available to designers are unable to give adequate protection over a wide temperature range
More Information Top
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3M - DP270 - Chemicals - Potting Compounds - Allied Electronics
Adhesive; Epoxy Potting Compound ; Black; 200 ml (6.7 oz .
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Internal stresses developed in an epoxy resin potting compound during long‐term storage
Stress developed during poly- merization of a filled epoxy potting com- pound .
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http://qspace.library.queensu.ca/jspui/bitstream/1974/8342/1/ElKouche_Ahmad_H_201309_PhD.pdf
water sealed using epoxy potting compounds (e.g. MG-Chemicals-832B).
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http://www.polysciences.com/SiteData/docs/201415PROD/fdc6998e52f8c3b4/2014-15%20PRODUCT%20CATALOG.pdf
256 Epoxy Potting Compounds . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Advanced Materials and Information Technology Processing II
As the epoxy potting compound widely used, their flame retardant properties were concerned day by day.
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Analyses for mechanical and electrical properties of epoxy resins used as potting compounds
Abstract Chemical batch‐to‐batch variations of an acrylonitrile‐modified epoxy potting compound were monitored by infrared spectroscopy and correlated to capacitance and hardness measurements of the cured product before and after exposure to high humidity.
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