Products & Services
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Supplier: Protavic America, Inc.
Description: PNE-47207™ is an adhesive/sealant and potting compound. PNE-47207™ is designed to provide air free potting and casting of electronic devices. PNE-47207™ will bond difficult substrates such as glass, ceramics, and metals. It passes UL 94V0 for fire retardant properties,and has a
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite Hysol 1511184 black epoxy potting compound is compatible with ceramic, metal and plastic materials with a 24 hr cure time. Provides a 40 min working time. Works in a mix ratio of 2:1. Delivers great performance with a shear strength of 3000 psi.
- Chemical / Polymer System Type: Epoxy (EP)
- Dielectric Strength: 965 kV/in
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 0.2500 W/m-K
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Supplier: Koford Engineering, LLC
Description: E-112 is a high performance, light weight, hollow glass microsphere filled single component pottingmaterial. It is especially suited for applications which involve potting assemblies which have small openingsaround terminals or switches. The microspheres are of sufficient size that the
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Form / Function: Encapsulant / Potting Compound
- Use Temperature: 320 to 392 F
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Supplier: Epoxies Etc...
Description: 20-3205 is a two part room temperature curing epoxy system. It provides a low mixed viscosity and excellent electrical insulation properties.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Techsil Limited
Description: MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as
- Chemical / Polymer System Type: Epoxy (EP)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Techsil Limited
Description: MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as
- Chemical / Polymer System Type: Epoxy (EP)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Encapsulants and Potting Compounds - MG Chemicals Black Encapsulating/Potting Epoxy Kit -- MGEP00009Supplier: Techsil Limited
Description: MG Chemicals 832B is a black electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being
- Chemical / Polymer System Type: Epoxy (EP)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 2850FT BL, Epoxy, Encapsulant LOCTITE® STYCAST 2850FT BL epoxy is designed for applications where electrical insulation and mechanical protection must be maintained while coping with heat transfer considerations. LOCTITE STYCAST 2850FT BL can be used with a variety of
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Thermal Conductivity: 1.38 W/m-K
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Supplier: Techsil Limited
Description: MG Chemicals 834ATH Flame Retardant Epoxy is a economical, electronic-grade, self-extinguishing, flame retardant epoxy that provides excellent physical, chemical and electrical protection with a degree of thermal conductivity. Designed for encapsulating and potting, this
- Chemical / Polymer System Type: Epoxy (EP)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Flame Retardant / UL 94V-0 Rated: Yes
- Form / Function: Encapsulant / Potting Compound
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Supplier: Epoxies Etc...
Description: 20-3006 is a unique two component, electronic grade, flexible epoxy potting compound. This system was engineered to provide electrical insulation, chemical protection, and thermal shock resistance. The flexibility of 20-3006 provides low stress on surface mount and other
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Henkel Corporation - Industrial
Description: Thermally conductive epoxy encapsulant recommended for encapsulation of components that require heat dissipation and thermal shock properties. LOCTITE® STYCAST 2850FT is a black, thermally conductive epoxy encapsulant recommended for encapsulation of components that require heat
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Viscosity: 225000 cP
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite Stycast HD 3561 gray two-part potting & encapsulating compound with a 3 hr cure time. Works in a mix ratio of 100:10. Formerly known as Loctite Hysol EE1117-HD3561 Epoxy System.
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Encapsulant / Potting Compound
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Supplier: ACCRAbond, Inc.
Description: CONAPOXY® FR-1080 is a two-part high temperature epoxy potting system designed to meet Class H (180°C) operating requirements.
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Encapsulant / Potting Compound
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite 3364 black potting & encapsulating compound is compatible with electronics materials with a 60 min cure time. Provides a 45 sec working time. Works in a mix ratio of 1:2. Delivers great performance with a shear strength of 1100 (Wood Pine) psi, 145 (Nylon) psi, 145
- Dielectric Strength: 813 kV/in
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 0.4300 W/m-K
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Supplier: ACCRAbond, Inc.
Description: CONAPOXY® FR-1612-1 with CONACURE® EA-039 is a high performance flexible epoxy potting and encapsulating system. Flexibility has been built into the cured compound without degradation of electrical properties at elevated temperatures. It cures with minimum strain on potted
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Encapsulant / Potting Compound
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Supplier: ACCRAbond, Inc.
Description: CONAPOXY®FR-1273 is a two-component, low exotherm, long pot life epoxy potting and casting system with excellent handling properties. Because of it's excellent thermal shock resistance, CONAPOXY® FR-1273 is recommended for the encapsulation of strain sensitive devices. FR-1273
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Form / Function: Encapsulant / Potting Compound
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Supplier: Epoxies Etc...
Description: Epoxies, Etc's resins are used to protect, insulate, and conceal circuitry, components, and devices. These formulations were designed to satisfy the requirements of many demanding potting, encapsulating, and casting applications in the electronic, electrical, automotive, and aerospace
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 15 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
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Supplier: Epoxies Etc...
Description: 10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: ACCRAbond, Inc.
Description: CONAPOXY® FR-1047 is an inexpensive, flame retardant, non-abrasive epoxy potting and casting system. It has excellent resistance to thermal shock, low exotherm, and good electrical properties, typified by very good arc resistance. When cured with any of the hardeners presented below, a
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST ES 1904, Epoxy, Potting and Encapsulating LOCTITE® STYCAST ES 1904 is an opaque, medium-viscosity epoxy resin formulation recommended for small potting and laminating applications, excellent structural, mechanical and electrical properties are required.
- Coeff. of Thermal Expansion (CTE): 37.78 µin/in-F
- Cure Type / Technology: Two Component System
- Features: Leveling / Filling Compound
- Industry: Optical Grade / Material
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Supplier: MacDermid Alpha Electronics Solutions
Description: Flame-retardant, thermally conductive epoxy potting compound designed for easy processing and enhanced thermal conductivity. Product Overview ER2220 Highly Thermally Conductive Epoxy Potting Compound is a flame retardant, two-part epoxy resin designed
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Electrically Conductive, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: MacDermid Alpha Electronics Solutions
Description: Highly chemical-resistant epoxy potting compound formulated for harsh conditions in under-hood applications. Product Overview ER2223 Highly Chemical Resistant Epoxy Potting Compound has been specially formulated to meet the harsh operating conditions of
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Form / Function: Encapsulant / Potting Compound
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Supplier: DigiKey
Description: Thermal Potting Compound, 2 Part 0.75 kg Container
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 1.1 W/m-K
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Description: DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Specialty / Other
- Form / Function: Encapsulant / Potting Compound
- Viscosity: 58000 to 62000 cP
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite EA E-60NC is a low viscosity, electrically non-corrosive epoxy adhesive potting compound. Once cured it provides excellent environmental and chemical resistance, and acts as an electrical insulator. 400 mL Cartridge.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 550 kV/in
- Elongation: 8 %
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite EA E-60NC is a low viscosity, electrically non-corrosive epoxy adhesive potting compound. Once cured it provides excellent environmental and chemical resistance, and acts as an electrical insulator. 50 mL Cartridge.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 550 kV/in
- Elongation: 8 %
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite EA E-60NC is a low viscosity, electrically non-corrosive epoxy adhesive potting compound. Once cured it provides excellent environmental and chemical resistance, and acts as an electrical insulator. 200 mL Cartridge.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 550 kV/in
- Elongation: 8 %
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Description: DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Specialty / Other
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Form / Function: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Industrial
Description: To help manufacturers comply with UL-674 requirements for explosion-proof electric motors, Henkel Corporation has introduced LOCTITE® E-40EXP Hysol, a two-component, room-temperature-cur ing epoxy potting compound designed to pass UL testing and maintain more than 85% of its
- Cure Type / Technology: Two Component System
- Features: Leveling / Filling Compound
- Thermal Conductivity: 1.25 W/m-K
- Viscosity: 24000 cP
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Supplier: DigiKey
Description: SILICONE POTTING COMPOUND 1KG GR
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 2.8 W/m-K
- Use Temperature: Over -13 F
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Supplier: DigiKey
Description: Thermal Potting Compound, 2 Part 0.75 kg Container
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 1.1 W/m-K
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG Epoxylite® E 5302 HI TEMP Epoxy Potting Compound is a two-component system that consists of a liquid resin and a powder hardener. It has excellent adhesion to metals, ceramics, and most plastics. It is used for bonding and sealing of electrical components requiring
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 560 kV/in
- Elongation: 2 %
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Supplier: SAE International
Description: This specification and its supplementary detail specifications cover epoxy resin formulations based on diglycidyl ether of bisphenol A with an epoxide equivalent of 175 - 195. When properly mixed and cured, these resins produce a rigid or flexible product.
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Supplier: Accuris
Description: EPOXY RESIN, POTTING COMPOUND
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following industries
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 18.33 to 72.22 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
Find Suppliers by Category Top
Featured Products Top
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MG Chemicals 832FXC is a clear, flexible epoxy potting compound designed to minimize physical stress on delicate components. Ideal for low-temperature, arctic, or temperature-cycling environments, it maintains flexibility and stability through rapid thermal changes. Its transparency allows easy (read more)
Browse Industrial Enclosures Datasheets for New Yorker Electronics Co., Inc. -
Master Bond EP30LP-2 is an optically clear epoxy with superb light transmission properties. This low viscosity, electrical insulator also features outstanding dimensional stability. Featuring easy handling, this compound has a convenient two to one mix ratio by weight or (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
Supreme 11ANHT-2 Two component epoxy compound for bonding, coating and sealing Master Bond Supreme 11ANHT-2 is a two component thermally conductive, electrically insulating epoxy resin system for bonding, coating and (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
sensitive components (Bectron®, CONAP®). Epoxy and silicone potting materials that provide protection for high temperature applications (Epoxylite®, (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
high temperature electrical potting compounds and powdered epoxies for electrical insulating and electric conductivity as well as UV curable adhesives for temporary metal maskants and insulating coatings. (read more)
Browse Epoxy Adhesives Datasheets for Beacon Adhesives, Inc. -
“EP21AC withstood over 150 arcs without igniting and therefore was assigned the highest PLC (Performance Level Category) of 0 under the UL746A High Amp Arc Ignition test,” says Rohit Ramnath, Senior Product Engineer. “The compound is also flame retardant, as per the UL94 (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
EP30HV Master Bond EP30HV is a lower viscosity, two component epoxy system for high performance bonding, sealing, coating and potting. It is formulated to cure at room temperature or more rapidly at elevated temperatures. The optimum (read more)
Browse Conformal Coatings Datasheets for Master Bond, Inc. -
EP21LSCL-2Med Master Bond EP21LSCL-2Med is a two component, low viscosity epoxy resin system featuring superb optical clarity. This system has a forgiving mix ratio of 100 to 20 by weight. The (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
latter property is particularly useful in potting and encapsulation applications. Also, the compound allows for precise alignment with minimal fixturing and simple curing. Its service temperature range is from 4K to +300°F. The color of Part A is light cream and Part B is similar, but slightly darker (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
engineers. The ELANTAS product portfolio includes Thin film conformal coatings (acrylic, alkyd, urethane, silicone) Thick film coatings (VOC-free; urethane, epoxy, silicone) Potting and encapsulation (read more)
Browse Electrical and Electronic Resins Datasheets for ELANTAS North America LLC
Conduct Research Top
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Epoxy Potting Compound for PCB: The Options and Benefits
PCBs or printed circuit boards have the most critical components in any electronics. They are the best if you want to protect the components from all sorts of damage. Two methods are used to protect the components. This is by conformal coating and PCB coating.
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Potting Electronics PCB with Epoxy Potting Compound and Epoxy Resin Conformal Coating
Electronic assemblies have to be protected from a wide range of factors, such as corrosive agents, moisture thermal dissipation, shock, and vibration. The protection is achieved when we do pot. This process involves filling electronic assemblies with compounds to give permanent protection.
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What you Should Know about Epoxy Potting Compound and Epoxy Sealing Compound
Potting compounds are used to protect electronic assemblies from different factors such as corrosive agents, moisture, thermal dissipation, shock, vibration, and so on. The protection is made possible through potting. Compounds are added to assemblies to offer much-needed protection.
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Common Applications for Electronic Epoxy Encapsulant Potting Compounds
Electronic epoxy encapsulant potting compounds are materials used to protect electronic components from environmental factors such as moisture, dust, and temperature changes. These compounds are essential in the electronics industry as they help to improve the durability and reliability
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Electronic Epoxy Encapsulant Potting Compounds in Harsh Environments
Electronic epoxy encapsulant potting compounds are essential for protecting electronic components from harsh environments. These compounds provide a protective barrier that shields electronics from moisture, dust, and other contaminants that can cause damage or failure. In this article, we
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Choosing The Best Electronic Epoxy Encapsulant Potting Compounds For Your Needs
Electronic epoxy encapsulant potting compounds are essential for protecting electronic components from harsh environmental factors. However, with so many options available on the market today, choosing the right compound for your specific needs can be a daunting task.
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Polyurethane Potting Compound for Electronics from China Polyurethane Potting Compound Manufacturers
Polyurethane encapsulating and potting compounds have many advantages, especially when a quick cure is needed at low temperatures. This solution is better compared to epoxy systems. With polyurethanes, there is better crack resistance and flexibility. There is also better adhesion to some
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Managing Heat Transfer With Potting Compounds
and require additional power to operate. Molded plastics are used in place of metal enclosures due to cost control and weight savings. In most cases, these plastics are not as effective at transferring heat away from its source. Thermally conductive potting compounds are an effective way to control
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UV Curing Adhesives and Potting Compounds
Recent advancements in ultraviolet curing have given engineers a new opportunity when choosing adhesives, potting compounds, coatings, and sealants. Until now, most of these systems were either two-component systems requiring mixing, one-component heat cure systems, or solvent-based systems
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New Urethane Technology for Potting & Encapsulation in Electronics
Many electronic components and assemblies require a potting compound for protection against moisture, thermal shock, vibration and very low temperatures. Most of the potting & encapsulating compounds available to designers are unable to give adequate protection over a wide temperature range
More Information Top
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3M - DP270 - Chemicals - Potting Compounds - Allied Electronics
Adhesive; Epoxy Potting Compound ; Black; 200 ml (6.7 oz .
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Internal stresses developed in an epoxy resin potting compound during long‐term storage
Stress developed during poly- merization of a filled epoxy potting com- pound .
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http://qspace.library.queensu.ca/jspui/bitstream/1974/8342/1/ElKouche_Ahmad_H_201309_PhD.pdf
water sealed using epoxy potting compounds (e.g. MG-Chemicals-832B).
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http://www.polysciences.com/SiteData/docs/201415PROD/fdc6998e52f8c3b4/2014-15%20PRODUCT%20CATALOG.pdf
256 Epoxy Potting Compounds . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Advanced Materials and Information Technology Processing II
As the epoxy potting compound widely used, their flame retardant properties were concerned day by day.
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Analyses for mechanical and electrical properties of epoxy resins used as potting compounds
Abstract Chemical batch‐to‐batch variations of an acrylonitrile‐modified epoxy potting compound were monitored by infrared spectroscopy and correlated to capacitance and hardness measurements of the cured product before and after exposure to high humidity.
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