Products & Services
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Supplier: DigiKey
Description: KIT ETCHING PCB ECONOMY W/PUMP
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Supplier: JST Manufacturing, Inc.
Description: JST's Single Wafer Etching and Stripping System utilizes an automated chemical spray process on a single wafer. The system includes oscillating spray nozzles, adjustable wafer speed (RPM) and precision adjustment of the distance between the nozzles and the surface of the wafer. It's automated
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Supplier: Jiangyin Deli Laser Solutions Co., Ltd.
Description: bases Size of working area: 600mm*600mm (customizable, up to 84 inches) Smallest etching line width and spacing: 20μm, 20μm Mass production etching speed: 5000mm/s Able to etch strict 90° angles; no material distortion produced Automated Solution for Processing Entire Rolls: Roll to
- Type: Complete / Turnkey System
- Options / Components: Laser Head / Focusing Unit, Laser Optics / Beam Delivery, Laser System Enclosure, Monitoring Sensors / System
- Laser Operation: Laser Marking
- Workpiece Material: Metal / Conductive Materials, Semiconductors / Electronics
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Supplier: Jiangyin Deli Laser Solutions Co., Ltd.
Description: Advantages: Single step operation 24hour/day and 7days/week reliable production with minimum maintenances No need of extra toxic and polluting materials High accuracy and good resolutions Very high process speed Features: X-Y-Z- θ four dimensional adjustment for automatic positioning CCD assisted
- Type: Complete / Turnkey System
- Options / Components: Laser Head / Focusing Unit, Laser Optics / Beam Delivery, Laser System Enclosure, Monitoring Sensors / System
- Laser Operation: Laser Marking
- Workpiece Material: Metal / Conductive Materials, Semiconductors / Electronics
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Supplier: Plasma Etch, Inc.
Description: The generous aluminum chamber accommodates a properly sized active processing surface with our standard configurations having as few as 6 or as many as 24 plasma processing levels, each 24” by 18.” Our oxygen service vacuum pump and booster is equipped with a two point purge system to minimize any
- Features: Automated Loading, Gas Control Unit, Integral Process Controller, Other
- Materials Processed: Compound Semiconductors / GaAs, Metal, Tungsten / Refractory Metal
- Type: Factory / Free Standing
- Vacuum / Pressure Range: Medium (< 1, >10-3 torr)
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Supplier: Plasma Etch, Inc.
Description: Benefits to you are better adhesion or marking, cleaner parts with less labor and reduced chemical expense by eliminating unwelcome and often expensive chemical waste associated with cleaning and priming. The large all aluminum chamber accommodates a generously sized active processing surface, our
- Features: Automated Loading, Gas Control Unit, Integral Process Controller, Other
- Materials Processed: Compound Semiconductors / GaAs, Metal, Tungsten / Refractory Metal
- Type: Factory / Free Standing
- Vacuum / Pressure Range: Medium (< 1, >10-3 torr)
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Supplier: Eco-Tec, Inc.
Description: Etching or chemical milling with caustic soda is often the greatest operating expense in aluminum finishing. And with the increased focus on environmental concerns in all facets of business, anodizers can look at recycling in their plants to reduce process chemical costs, waste treatment
- Application: Liquid
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Supplier: JST Manufacturing, Inc.
Description: JST offers affordable semi-automated systems in both rotary and linear transfer designs. Rotary Transfer stations can accomodate single or dual rotary arms. JST's robot uses DC servo motors for efficient transfers with high reliability. This servomotor technology provides precise position
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Supplier: Jiangyin Deli Laser Solutions Co., Ltd.
Description: Uses roll-to-roll feeding and unloading for improved processing speeds and more efficient material usage High processing stability and yield rates Save on labor costs and improve production efficiency Technical Specifications (Etching): Size of working area: 600mm×600mm (customizable)
- Type: Complete / Turnkey System
- Options / Components: Laser Head / Focusing Unit, Laser Optics / Beam Delivery, Laser System Enclosure, Monitoring Sensors / System
- Laser Operation: Laser Marking
- Workpiece Material: Metal / Conductive Materials, Semiconductors / Electronics
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Supplier: LPKF Laser & Electronics North America
Description: The LPKF ProtoLaser S is a NIR laser with a 25 µm focused beam diameter developed for HF and microwave circuits, as well as digital and analog designs. Rapid surface metal removal is achieved with an LPKF developed laser delamination process or with ablation settings. A wide range of substrates can
- X-axis Travel / Length Capacity: 9 inch
- Y-axis Travel / Width Capacity: 12 inch
- Z-axis / Vertical Travel: 0.4 inch
- Type: Complete / Turnkey System
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Supplier: Jiangyin Deli Laser Solutions Co., Ltd.
Description: Technical Specifications for LTCC: Processable materials: low temperature co-fired ceramic (LTCC) Processing aperture: ≥20μm Processing precision: ±5μm Working area: 400mmX400mm Processing speed: 1000-2000 holes per second Technical Specification for Laser Exposure: Working area: 800mmX800mm
- Type: Complete / Turnkey System
- Options / Components: Laser Head / Focusing Unit, Laser Optics / Beam Delivery, Laser System Enclosure, Monitoring Sensors / System
- Laser Operation: Laser Marking
- Workpiece Material: Metal / Conductive Materials, Semiconductors / Electronics
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Supplier: HORIBA Instruments, Inc.
Description: plasma behavior to the creation of databases of measured data and remote control of manufacturing equipment. The programmable structure of the measurement recipe enables setting of multiple detection conditions and sequential processing. This allows the monitor to be used not only for
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Supplier: ASTM International
Description: materials, operations, and equipment. This standard does not purport to address all of the safety problems associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory
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Supplier: Technic, Inc.
Description: chemistry and equipment. Applications Base and precious metals plating Copper flash plate, panel plate, pattern plate Developing, etching, stripping Chemical cleaning MP100 Advantages Edge-to-edge processing forms a continuous flow through the plating cell eliminating edge effects and
- Machinery Type: Continuous Web - Reel to Reel
- Process / Technology: Electroplating
- Application / Industry: Printed Circuit Boards (PCB)
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Supplier: JTEKT North America, Inc.
Description: field and non-magnetic ceramics are used for it. Bearing for etching equipment The bearing of the etching equipment is exposed to the etching solution during operation and therefore those made of ceramics resistant to corrosion and those coated with PTFE are
- Features: Other
- Primary Bearing Category: Radial Ball Bearing
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Supplier: 3X Ceramic Parts Company Limited
Description: aluminum oxide low. Therefore, high-purity alumina ceramics are prepared as chamber materials. As a plasma etching resistant cavity material, it has the following characteristics. (1) The production equipment is simple, the degree of automation is high, and the production process cost
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Supplier: Shenzhen Jewellok Technology Co., Ltd.
Description: automation is vital for processes like Wet Etching and Cleaning (WEC), where even a 1% deviation in concentration can damage sensitive circuitry. Integration and Efficiency By combining these systems into a single Automatic Liquid Supply Equipment suite, semiconductor fabs achieve a
- Body Material: Stainless Steel
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Supplier: Hitachi High Technologies America, Inc.
Description: Conductor Etch System M-8000 Series is utilized for hard mask and silicon etching for 32nm and beyond. Hitachi High-Tech developed new process flows, such as double patterning and new material etch processes such as high-k dielectric/metal gate through JDP (Joint Development Program) with
- Applications: Etching - Plasma / Wet
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: Terra Universal, Inc.
Description: Terra’s comprehensive range of constant-temperature baths, etching baths, dump risers, and other processing equipment is ideally suited for the high-purity requirements of the semiconductor industry. Microprocessor controls ensure the integrity of your operations.
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Supplier: Chemetall
Description: Oakite 360 L is an efficient, highly alkaline aluminum etchant which combines uniform etching with light cleaning action, When etching aluminum, a light foam blanket will form to reduce mist. Depth of etch is easy to control. Sequestrants minimize scale build-up on equipment.
- Type: Cleaner / Cleaning Agent, Strong / Corrosive Alkaline (12.5 to 14 pH)
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Supplier: Linemaster Switch Corporation
Description: System Measuring Machine Medical Equipment Musical Instruments Photographic Equipment Pipe Turning Rolls Positioner/Turntable Pump Saw Sewer Cleaning Equipment Sharpener Tapping Machine Tester Turntable TV Studio Equipment Twisting Machines Vaper Blast Dri-honer
- Maximum Current: 10 amps
- Maximum AC Voltage: 250 volts
- Pedal Material: Metal
- Function: Momentary Contact
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Supplier: Linemaster Switch Corporation
Description: System Measuring Machine Medical Equipment Musical Instruments Photographic Equipment Pipe Turning Rolls Positioner/Turntable Pump Saw Sewer Cleaning Equipment Sharpener Tapping Machine Tester Turntable TV Studio Equipment Twisting Machines Vaper Blast Dri-honer
- Maximum Current: 10 amps
- Maximum AC Voltage: 250 volts
- Pedal Material: Metal
- Function: Momentary Contact
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Supplier: Plasma Etch, Inc.
Description: Built as an extension of our MK-II platform, it offers you the same repeatability, reliability and long life, as well as low maintenance costs. The Reactive Ion Etch (RIE) electrode offers the highest directional plasma effect. Etching with our roll to roll plasma etcher in the large all
- Materials Processed: Compound Semiconductors / GaAs, Metal, Tungsten / Refractory Metal
- Features: Gas Control Unit, Integral Process Controller, Other
- Vacuum / Pressure Range: Medium (< 1, >10-3 torr)
- Process: Plasma Etching / Cleaning
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Supplier: Gems Sensors & Controls
Description: Low Particle Generation-One piece Molded Design Corrosion Resistant 1 to 4 Actuation Levels in a Single Unit Lengths to 24" (610 mm) Applications: Semiconductor Process Equipment Pure Chemical Delivery System Wafer Cleaning and Etching Systems Cabinet Leak Sensing
- Number of Switch Points: 1 to 4 (#)
- Maximum Operating Pressure: 50 psi
- Material Temperature Range: -40 to 250 F
- Features: Electromechanical Switch, Normally Closed (NC), Normally Open (NO), Single Pole, Single Throw (SPST)
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Supplier: IPC International, Inc.
Description: Examines the procedure for preparing microsections using automatic equipment for the critical grinding and polishing steps. Provides a thorough examination of the microsection process steps, including coupon removal, thermal stressing, mounting, grinding, polishing, and etching the
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Supplier: Epilog Laser Corp.
Description: The Fusion Galvo by Epilog Laser combines fast engraving of metals with quick and efficient project setup. This innovative laser machine produces a variety of marks on metal, including deep engraving, polished white marks, and deep black annealed etching. Project setup is fast and easy using
- Printing / Marking Width: 152 mm
- Features: Application Software Included, Industrial Metal Housing, Other, Programmable
- Operation: Electric
- Media Handling: Glass / Ceramics, Metals, Plastics, Textiles / Composites
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Supplier: IPC International, Inc.
Description: Part 1 explains the qualities of a properly prepared microsection, and provides an overview of evaluation equipment. Also discusses the role of etching and thermal stressing in specimen evaluation. Part 2 examines evaluation criteria and measurement techniques for through-holes,
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Supplier: Plasma Etch, Inc.
Description: As in all Plasma Etch systems a capacitive parallel plate design is used for the most effective plasma generation. Competitive units with glass/quartz barrel chambers cannot penetrate the vacuum containment vessel and therefore are restricted to inductive coupling using an RF coil wrapped around
- Materials Processed: Compound Semiconductors / GaAs, Metal, Tungsten / Refractory Metal
- Features: Integral Process Controller, MEMS, Medical, Other, Photovoltaic / Solar, Research / Surface Analysis, Semiconductor Manufacturing
- Type: Laboratory / Benchtop
- Vacuum / Pressure Range: Medium (< 1, >10-3 torr)
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Supplier: Walter Surface Technologies
Description: Mode: polishing & etching Redesigned pump and tank for maximum efficiency New Quick-Connect system allows you to quickly change between 4 m and 9 m long wand assemblies (9m wand sold separately)
- Wash Tank Capacity: 0.5015625 gallons
- Machine Mounting: Benchtop / Pedestal
- Machine Type: Complete Machine / Turnkey System
- Source: Electric
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Supplier: Walter Surface Technologies
Description: surface. FEATURES Switchable output: AC Mode: cleaning & marking - DC Mode: polishing & etching Easily cleans MIG welds, TIG & spot welds Exclusive quick-change brush system to easily change out accessories and reduce downtime Ability to clean larger and hard to reach areas with our new
- Wash Tank Capacity: 0.5015625 gallons
- Machine Mounting: Benchtop / Pedestal
- Machine Type: Complete Machine / Turnkey System
- Source: Electric
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Supplier: Progressive Surface
Description: This abrasive blasting machine is a single piece flow grit system for etching industrial turbine blades up to 15" (380 mm) in length and 8" (203 mm) diameter using aluminum oxide sand blasting media. Using only 35 ft (3.25 m) of floorspace, this design lends itself to cellular manufacturing
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Supplier: Terra Universal, Inc.
Description: Ideal for etching, stripping and cleaning Ultra-pure, 99.995% contaminant-free processing vessel is ideal for critical chemistries Externally bonded 5-sided circuit heating element provides efficient, even heating for improved process yields Redundant safety features minimize potential damage
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Supplier: Timken Company (The)
Description: Timken's Thin Dense Chrome bearings are specifically designed to provide increased performance in harsh corrosion environments. Like AquaSpexx®, TDC bearings are proven to prevent rust and etching beyond that of standard bearings. Design Attributes The TDC coating is uniquely designed with a
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Supplier: Dapra Corporation
Description: etching, die or roll stamping, laser markers and messy ink printers. FEATURES: • Mark parts directly in CNC milling equipment • No electric or pneumatic input required • Use standard CNC engraving software • Mark alphanumeric text, symbols and logos • Use existing machine tool
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Supplier: Ushio America, Inc.
Description: This ultraviolet irradiation device is used for photoresist curing in LSI manufacturing lines. Equipped with a super high-pressure UV lamp and an excimer lamp, this system is used for various applications such as enhancing plasma resistance during dry etching, photoresist outgassing and burn
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Featured Products Top
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Challenge: Semiconductor manufacturing involves complex processes—including photolithography, etching, deposition, ion implantation, polishing, and cleaning—to produce functional chips, which are then packaged, tested, and (read more)
Browse Wastewater Treatment Equipment Datasheets for KINTEP NEW POWER -
Precision photo chemical etching is characterized by detailed specifications that call for conformance to identified dimensions, tolerances and inspection requirements. These factors have implications with regard to pricing. By contrast, (read more)
Browse Electrochemical, Photochemical, and Chemical Milling Services Datasheets for Conard Corporation (The) -
Silicon carbide carrier disk, silicon carbide etching disk, ICP etching disk Silicon carbide tray for LED etching (SiC tray) φ 600mm is a special accessory for deep silicon etching (ICP etching machine) Wafer carrier, also known as wafer carrier and silicon (read more)
Browse Silicon Carbide and Silicon Carbide Ceramics Datasheets for 3X Ceramic Parts Company Limited -
Photochemical machining is the industry's preferred moniker for this metal fabrication process. It is also readily called photo or chemical etching, The process derived from the then-nascent printed circuit board industry in the 1950s. The fabrication steps are nearly identical (read more)
Browse Electrochemical, Photochemical, and Chemical Milling Services Datasheets for Conard Corporation (The) -
A Fascinating Non-Conventional Metal Fabricating Option Photo etching, also known as photochemical machining or chemical milling, is a fascinating process that lies at the intersection of science and art. It's a technique used in various industries, from aerospace to (read more)
Browse Electrochemical, Photochemical, and Chemical Milling Services Datasheets for Conard Corporation (The) -
Photo etching is an effective solution for producing precision parts that are used in sensing, detecting and measuring applications. These types of components interact mechanically with “the outside world” and electrically with the system or device to which they “report”. (read more)
Browse Electrochemical, Photochemical, and Chemical Milling Services Datasheets for Conard Corporation (The) -
Remove PFAS from equipment articles such as plasma chamber furniture, vacuum and abatement systems, and sealing systems. Ducoya is designed to form replaceable OEM parts in semiconductor manufacturing equipment that operate in extreme environments, particularly plasma etching and (read more)
Browse Thermoplastics and Thermoplastic Resins Datasheets for Duvelco Limited -
The Benefits of Photo Etching for Super-Critical CO? Stirling Engine Designs sCO? Stirling engines operate under extreme conditions to maximize energy extraction from a given heat source. This requires components like heat exchangers (read more)
Browse Machine Shop Services Datasheets for Conard Corporation (The) -
Photo etching has a number of process capabilities that make it a desirable fabrication method for these purposes. One hole or a million- they are all free! Filtration devices have applications in many industrial (read more)
Browse Machine Shop Services Datasheets for Conard Corporation (The) -
Photochemical etching is an ideal process for perforated metal products, such as: Grids, screens, meshes, filters, separators, microfilters, grilles, lighting diffusers and more Unlike mechanical perforating methods such as punching, stamping or laser cutting, photochemical machining of (read more)
Browse Electrochemical, Photochemical, and Chemical Milling Services Datasheets for Conard Corporation (The)
Conduct Research Top
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What is Photo Etching?
Photo etching is a process used in the creation of integrated circuits, that combines photolithography with the etching process. Photolithography is used to form patterns on semiconductor substrates coated with photoresist, resulting in selective developing of the photo-resist, when exposed
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Laser Etching of ITO Glass and Thin Film Comparison
ITO coated glass and thin film etching process is an important procedure for solar cell, touch screen, optoelectronics and other industries. To ensure production efficiency, cost, and environmental protection, ITO laser etching is indispensable.
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Detection of hydrocarbon radicals during plasma etching
Optical emission spectroscopy is used to study and monitor the plasma etching of. hydrogenated amorphous carbon (a-C:H) thin films.
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Etching vs. Photo Anodization: Which is Better?
Etching and Photo Anodization are two popular processes for marking metal identification tags, nameplates, and placards. Which process is better?
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Laser Marking vs. Chemical/Acid Etching
Laser Marking and Engraving is a widely expanding marketplace as users have seen the benefits of using. lasers over conventional methods like Chemical/Acid Etching for direct part marking to simple gift. personalization.
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Engraving vs. Etching: Which Do I Need?
Engraving and etching are two of the most common processes for metal marking. This guide helps walk you through the pros and cons of each so you can know which is right for you.
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Laser Etching, Scribing, and Cleaning Equipment for Perovskite Batteries
New perovskite batteries have entered the field of vision of ordinary people from the research field of scientific researchers, and are initially produced and used in small areas in commerce. Our company is currently in the project of laser etching machine for perovskite batteries.
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Application of Laser Etching Technology in Solar Cell Manufacturing
Laser etching is an important tool for the production of thin-film solar cell modules, especially high-performance ultra-short pulse lasers, which can provide ultra-short pulses with a duration of only a few picoseconds, which not only can help manufacturers increase production, but also optimize
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Engineering Thin Medical Parts Through Photo Etching
Photo etching, also called chemical milling, photochemical machining. and chemical machining, offers many advantages for manufacturing. thin metal or polymer film medical parts, including improved accuracy,. low-cost tooling, inexpensive prototyping, burr free parts, and speed of. production
More Information Top
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Dry Etching Technology for Semiconductors
55 4 Dry Etching Equipment .........................................................................
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Displays Materials and Components Report - Thin Glass - 2013
eCony Glass substrate etching equipment and thin glass plate made .
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MEMS Materials and Processes Handbook
The overall etch results depend upon the specific material, etch chemistry, etch equipment , and various other parameters including masking materials, history of the chamber, and so on, thus it is nearly impossible to give specific process recipes that can be reliably reproduced …
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Introduction to Microfabrication 2nd Edition
Wet etching equipment consists of a heated quartz tank or bath plasma etching equipment consists of a vacuum chamber with a RF generator and a gas system.
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Defect reduction strategy for plasma etch
This paper discusses how to set up effective integrated short-loop patterned etch and blank resist-coated etch equipment monitors to isolate the contribution of different components of post-etch defects listed above.
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Concurrent engineering and the underlying structure of the design problem
This study looks at the development of three products (room air conditioners, cellular phones, and dry etching equipment ) to evaluate how well three contingency models characterize the underlying structure of the design problem and thus predict the operationalization of concurrent engineering.
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Practice knowledge Mikrosystemtechnik
By typical manufacturing facilities of the Mikrosystemtechnik (e.g., coating, Lithographie-, plasma etch installations ), many installation manufacturers offer in the meantime the sluice and production persecution systems.
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