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Supplier: Aaeon Systems Inc.
Description: Applications Factory Automation Industrial Automation Network Security Features Intel Core 2 Quad/ Core 2 Duo LGA775 Processor, FSB 800/1066/1333 MHz Intel Q35 Dual-Channel DDR2 800/667 Memory (Up To 4 GB) 10/100Base-TX Ethernet & Gigabit Ethernet x 2 (Optional)
- Memory Capacity: 0.256 GB
- Chipset: Intel® Chipset
- Processor / CPU: Intel® Core™2 Duo
- On Board Features: On-board Ethernet Controller, Parallel Interface (PC printer port, Centronics®), Serial Interface (RS232, RS422, RS485)
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Supplier: Aaeon Systems Inc.
Description: interface, customers can get four additional COM ports. Concerning the USB ports, GENE-9310 features a total of five USB 2.0 ports. Two are standard ports, and two are internal pin headers with the last one is extended from the extension card. The Intel Core 2 Duo processor and the
- RAM: 224 MB
- Operating Temperature: 32 to 140 F
- Operating Humidity: 0 to 90 %
- Chipset: Intel® Chipset
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Supplier: Advantech
Description: connectivity and two UART interfaces can be leveraged to interface to legacy devices and consoles. 4th Generation Intel® Core™ processor up to 4 cores / 8 threads Intel® QM87 PCH Triple independent display support OpenVPX MOD6-PAY-4F1Q2U2T-12.2.1-2 profile compliant Onboard and
- Operating System: LynxOS®
- Technology: VPX
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Supplier: Win Source Electronics
Description: Manufacturer: Renesas Electronics America Inc Win Source Part Number: 1318691-R5F10368ASP#35 Category: Integrated Circuits (ICs)>Embedded>Microcontrollers Packaging: Tube Core Processor: RL78 Speed: 24MHz Standard Package: 80 Mounting: Surface Mount Core Size:
- Clock Speed: 24 MHz
- Internal RAM Size: 8 KB
- Supply Voltage (Vcc): 1.8 to 5.5 volts
- Number of I/O Ports: 14
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Supplier: Advantech
Description: The MIC-6313 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ and Intel® Xeon® Processor E3 Lv4 embedded platform. To enable the highest performance available in the 6U VPX form factor for workstation and compute intense
- Operating System: LynxOS®
- Technology: VPX
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Supplier: Acme Chip Technology Co., Limited
Description: 32-BIT DSC, 56800EX CORE, 64KB F
- Clock Speed: 100 MHz
- Operating Temperature: -40 to 125 C
- Features: Other
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Description: 32-BIT DSC, 56800EX CORE, 64KB F
- Clock Speed: 100 MHz
- Operating Temperature: -40 to 105 C
- Features: Other
- Package Type: QFP
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Supplier: Advanced Micro Devices, Inc.
Description: The Six-Core AMD Opteron™ Processor provides up to 30% more performance in the same socket 1207 footprint than previous generation quad-core AMD Opteron processors. This upgrade enables a performance improvement for edge-of-enterprise markets including storage and
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Supplier: Aaeon Systems Inc.
Description: The GENE-9655 adopts the Intel® GME965 + ICH8M chipset and has the Socket-P that can accept an Intel® Core™ 2 Duo/ Celeron® M (65nm) processor, such as the 2.2GHz T7500. The board can also be ordered with the option to have an Intel® BGA processor embedded on it in place of the
- RAM: 384 MB
- Operating Temperature: 32 to 140 F
- Operating Humidity: 0 to 90 %
- Chipset: Intel® Chipset
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Supplier: Win Source Electronics
Description: Manufacturer: Renesas Electronics America Win Source Part Number: 062360-R5F35L23JFE Packaging: Tray Core Processor: M16C/60 Number of I/O: 71 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH Data Converters: A/D 27x10b Family Name: R5F35L23 Categories: Integrated
- Clock Speed: 32 MHz
- Internal RAM Size: 96 KB
- Supply Voltage (Vcc): 3 to 5.5 volts
- Number of I/O Ports: 71
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1077441-MC56F81746VLF Category: Integrated Circuits (ICs)>Embedded - DSP (Digital Signal Processors) Series: 56F8xxx Voltage - I/O: 3.30V Package: Tray Standard Package: 250 Mounting: SMD (SMT) Interface: I2C, SCI, SPI Clock Rate: 100MHz Non-Volatile Memory:
- Clock Speed: 100 MHz
- Operating Temperature: -40 to 105 C
- Interface Type: I²C, SCI, SPI
- Features: Other
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Supplier: Aaeon Systems Inc.
Description: Application Server Features Intel Core 2 Duo/ Core 2 Quad LGA775 CPU, FSB 800/1066/1333 MHz Intel Q35 + Intel ICH9R (ICH9D0) DDR2 800/667 Memory Up To 4 GB 10/100Base-TX Ethernet x 2 (Gigabit Ethernet Optional) Integrated Intel Enhanced Graphics Core, VGA Support HD Codec
- RAM: 256 MB
- Operating Temperature: 32 to 140 F
- Chipset: Intel® Chipset
- Ports: Parallel Ports, Serial Ports, USB
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Supplier: Win Source Electronics
Description: Manufacturer: Renesas Electronics America Win Source Part Number: 062361-R5F35L2EDFE Packaging: Tray Core Processor: M16C/60 Number of I/O: 71 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Data Converters: A/D 27x10b Categories: Integrated Circuits Status:
- Clock Speed: 32 MHz
- Internal RAM Size: 256 KB
- Supply Voltage (Vcc): 2.7 to 5.5 volts
- Number of I/O Ports: 71
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Supplier: Advantech
Description: 15.6" All-in-One Touch Computer with Intel® Core™ i3/ N97 Processor Slimmer and Lighter design Low power and fanless system design Built-in Intel® N97/i3-N305 15.6" monitor with 16:9 widescreen display IP65-rated front panel for water and dust resistance Clean back cover design with 3
- Display Size: 15.6 inch
- General Features: Integrated BluetoothTM Technology, Touch Screen
- Processor: Intel®
- Features: Other
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Supplier: Advantech
Description: 15.6" All-in-One Touch Computer with 11th Gen Intel® Core™ i5/i3 Processor Slimmer and Lighter design Low power and fanless system design Built-in Intel® Core™ i5-1145G7E 15.6" monitor with 16:9 widescreen display IP65-rated front panel for water and dust resistance Clean back
- Display Size: 15.6 inch
- RAM: 8 GB
- General Features: Integrated BluetoothTM Technology, Touch Screen
- Processor: Intel®
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Description: XPedite8370 provides additional expansion capabilities by including an integrated XMC site, which includes a x8 PCI Express connection to the Intel® Core™ Ultra processor and X12d, X16s, and X8d I/O mapped directly to the VPX backplane connectors. Wind River VxWorks, X-ES
- RAM: 64,000 MB
- Communication Networks: Ethernet
- Features: Other
- Ports: Serial Ports, USB
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Supplier: Microchip Technology, Inc.
Description: and supporting collateral Additional Features Operating Conditions 3V to 3.6V, -40°C to +150°C Core: Dual 16-Bit dsPIC33CH CPUs Master Core 90 MIPS and Slave Core 100 MIPS Operation Independent Peripherals for Master Core and Slave Core Configurable Shared
- Pin Count: 36
- Clock Speed: 200 MHz
- MIPS: 100
- Operating Temperature: -40 to 150 C
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Supplier: Advanced Micro Devices, Inc.
Description: core performance with "Bulldozer" architecture. New 32 nanometer die shrink designed to reduce leakage for improved efficiency, increased clock rate headroom and better thermals. AMD Turbo CORE Technology AMD FX Processors come equipped with AMD Turbo CORE Technology.2
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Supplier: ELMA Electronic Inc.
Description: Ruggedize your SBC or bundle it in a fully integrated package including mezzanine options and OS integration sold and supported under a single assembly number. Features: 2nd generation Intel® Core™ i7 2.20 GHz (dual-core or quad-core) integrated processor Up
- CPU Speed: 2,200 MHz
- RAM: 16,000 MB
- Features: Other
- Computer Bus: VPX
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Supplier: Supermicro Computer, Inc.
Description: Key Features 1. Four Six-Core / Quad-Core AMD Opteron™ 8000 Series (Socket F) support; HT3.0 Link support 2. Up to 128GB Registered ECC DDR2 800/667/533 SDRAM in 16 DIMM 3. Intel® 82576 controllers, Dual-Port Gigabit Ethernet 4. 1x 2.5" Internal SATA Drive Support 5.
- Form Factor: Blade Server
- Server Type: Network Server
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Supplier: Infineon Technologies AG
Description: Infineon chipset: MCU, front-end MMIC and safe power supply Highly integrated solution for performance demanding radar applications Fully compatible with TC357TA for more cost effective solutions Radar cluster: LVDS radar interface Lock-stepped radar processor High bandwidth radar SRAM
- Internal RAM Size: 6,624 KB
- Number of A/D Converters: 34
- Operating Temperature: -40 to 125 C
- Bits: 32 Bit
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Supplier: WINSYSTEMS, INC.
Description: WinSystems’ SBC35-C398DL dual-core single board computer combines high performance multimedia graphics with a rich mix of industrial I/O. The Freescale i.MX 6DL processor’s integrated power management provides excellent efficiency and allows operation from -40° to +85°C without
- CPU Speed: 800 MHz
- RAM: 2,000 MB
- Cache Memory (L1 & L2): 512 KB
- Operating Temperature: -40 to 185 F
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Supplier: QUALCOMM, Incorporated
Description: camera Image Sensor Processor Qualcomm Spectra™ 180 image sensor processor 2x Image Sensor Processor (ISP) 14-bit Qualcomm® Clear Sight™ camera features Camera Features Hybrid Autofocus Optical Zoom Hardware Accelerated Face Detection HDR Video Recording Video Video Capture Up
- Clock Speed: 2,450 MHz
- Data Bus: 64 Bit
- Serial Interface: USB
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Description: River VxWorks BSP X-ES Enterprise Linux (XEL) BSP Contact factory for availability of Microsoft Windows drivers and other operating systems Technical Specs Processor Supports 13th Gen Intel® Core™ i7 series (formerly Raptor Lake-P) processors Memory 64 GB of LPDDR5 ECC SDRAM 256
- RAM: 64,000 MB
- Communication Networks: Ethernet
- Features: Other
- Ports: Serial Ports
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Supplier: ELMA Electronic Inc.
Description: The IC-INT-VPX3c is based on the Intel ® Core™ i7 processor Ivy Bridge and its companion chipset QM77. This generation of 64-bit multi-core mobile processors offers unmatched technology for intelligent performance. Its optimized multicore architecture provides better
- CPU Speed: 1,700 to 2,500 MHz
- RAM: 8,000 MB
- Communication Networks: Ethernet
- Features: Other
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Description: The XPand6241 is a true Commercial-Off-The-Shelf (COTS) rugged system based on the 13th Gen Intel® Core™ i7 series (formerly Raptor Lake-P) of processors and a Gigabit Ethernet switch hosting an XChange6300 Cisco IOS-XE® Gigabit Ethernet Embedded Services Router. With a compact design,
- Features: Bus Interfaces / Adapters
- Interface to: Ethernet
- Technology: VPX
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Supplier: Cirrus Logic, Inc.
Description: processor. The WM8326 is designed to operate as a system PMIC supporting the ARM9™, ARM11™ and ARM Cortex-A™ processors, but is also capable of supporting the majority of application and mobile processors at the heart of a wide range of low-power consumer multimedia
- Pin Count: 81
- Number of Supplies: 4
- Features: Manual Reset, Watchdog Timer (WDT)
- Type: QFN
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Supplier: WINSYSTEMS, INC.
Description: WinSystems’ SBC35-C398S low power single board computer combines high performance multimedia graphics with a rich mix of industrial I/O. The Freescale i.MX 6S processor’s integrated power management provides excellent efficiency and allows operation from -40° to +85°C without active
- CPU Speed: 800 MHz
- RAM: 1,000 MB
- Cache Memory (L1 & L2): 512 KB
- Operating Temperature: -40 to 185 F
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Supplier: Neousys Technology Inc.
Description: compact system capable of operating reliably at 60°C under 100% GPU load. Nuvo-5095GC is based on Intel® Skylake platform, supporting 35W/65W 6th-Gen ® Core™ processors and up to 32GB of DDR4 memory. It offers rich I/O functions, such as GbE, USB 3.0 and COM ports to connect to
- Speed: 2,300 to 4,000 MHz
- RAM: 32 GB
- Cache Memory (L1 & L2): 6,000 to 8,000 KB
- Operating Temperature: -13 to 140 F
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Supplier: Cirrus Logic, Inc.
Description: The EP9315 is a highly integrated system-on-chip processor that paves the way for next-generation consumer and industrial electronic products. The EP9315 features an advanced 200 MHz ARM920T processor design with a memory management unit (MMU) that supports Linux®, Windows CE®
- Clock Frequency: 200 MHz
- Number of I/Os: 16 #
- Data Bus: 32 Bit
- Processor Core: ARM
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Supplier: Global American, Inc.
Description: The LE-380-G embedded controller is based on the low-power dual-core AMD T56N CPU and a discrete-level GPU(AMD Radeon HD 6320), provides one DDR3-1333 SO-DIMM SDRAM up to 4GB and an array of video interface including VGA, DVI and 18-bit single channel LVDS. The T56N APU supports single or
- RAM: 4,000 MB
- Operating Temperature: 32 to 140 F
- Operating Humidity: 0 to 90 %
- Features: CompactFlashTM, Other, Real Clock Timer
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Supplier: Cirrus Logic, Inc.
Description: The EP9302 is a high-performance system-on-chip design that includes a 200 MHz ARM9 processor and is ideal for a range of industrial and consumer electronic applications. The EP9302 features an advanced ARM920T processor design with a memory management unit (MMU) that supports Linux®,
- Clock Frequency: 200 MHz
- Number of I/Os: 16 #
- Data Bus: 32 Bit
- Processor Core: ARM
-
Description: This book provides a thorough introduction to the Texas Instruments MPS432™ microcontroller. The MPS432 is a 32-bit processor with the ARM Cortex M4F architecture and a built-in floating point unit. At the core, the MSP432 features a 32-bit ARM Cortex-M4F CPU, a RISC-architecture
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Supplier: Cirrus Logic, Inc.
Description: The EP9301, an attractively priced ARM9 processor, has a high-performance design that is ideal for many entry-level consumer and industrial electronic products. The EP9301 features an advanced 166 MHz ARM920T processor design with a memory management unit (MMU) that supports Linux®,
- Clock Frequency: 166 MHz
- Number of I/Os: 16 #
- Data Bus: 32 Bit
- Processor Core: ARM
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Supplier: Global American, Inc.
Description: The BluStar DS-7701, Configurable Mini-ITX Embedded System, with 2nd Generation Intel® Core™ processors featuring 1 x GbE LAN, DVI-D and VGA dual display, up to 16GB DDR3 memory, 2 x 2.5” HDD/SSD or 1 x 3.5" HDD and 5 x RS232, x 1 RS232/422/485. The new 2nd Generation Intel®
- RAM: 16 GB
- Computer Type: Desktop / Tower
- Processor: Intel®
- Operating System: Microsoft®
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Federal Register > Thursday, April 18, 2013 > [78 FR 23226] 36(b)(1) Arms Sales Notification
Sensitive elements include: F - 35 Integrated Core Processor utilizing Commercial Off the Shelf (COTS) Hardware and Module Design to maximize growth and allow for efficient Management of DMS and Technology Insertion, if additional processing is needed, a second ICP will be installed …
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Future integrated modular avionics for jet fighter mission computers
Brian was one of the chief Architects for the F - 35 Integrated Core Processor Mission Computer.
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http://dspace.mit.edu/bitstream/handle/1721.1/43853/263025866-MIT.pdf?sequence=2
The most advanced mission computers in development and operation today are the common integrated processor (CIP) for the F-22 Raptor, the integrated core processor for the F - 35 Lightning II, and the modular mission computer for the F-16 Block 60 …
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Airframe parts production gives JSF shape
- Lockheed Martin has delivered the second group of advanced Integrated Core Processor (ICP) modules for the F - 35 Joint Strike Fighter under a US$300 million System Development and Demonstration (SDD) contract.
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Lockheed Martin F-35 Lightning II
Radar Northrop Grumman MIRFS/MFA (multifunction integrated RF system/multifunction nose array) combines AN/APG-81 active electronically scanned array (AESA) radar, electronic warfare and communications functions planned for production F - 35 . Flight Lockheed Martin Tactical Defense Systems Integrated Core Processor (ICP) incorporating open system architecture.
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Not so hidden dragon - China's J-20 assessed
Though undoubtedly the electronics and IT industry have taken leaps and bounds since the F-22 was developed (many smart phones now boast a 1Ghz processor and a dual core phone is just about to … … in sensor fusion and in integration . As the US is finding out to its cost with F - 35 , software is the trickiest part to get right.
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Infotech@Aerospace Conferences > Addressing the Complex Integration Issues of Net Centric, Multi-Sensor Information Fusion
The F - 35 program uses a simulation called Joint Strike Fighter (JSF) Integrated Avionics Performance Prediction and Analysis (IAPPA) Fusion Simulation or JIFS to address these integration and development risks. When necessary, the design also allows distributing the simulation over multi- core processors or over multiple computers to provide faster execution times.
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Lockheed Martin contracted to deliver Block 3F software for F-35
The F - 35 's software and capability blocks are broken down into Block 1A - initial training, Block 1B - advanced training 1, Block 2A - advanced training 2, Block 2B (initial combat capability), Block 3i (initial full capability), and Block 3F (full combat capability). Block 3i provides the same tactical capabilities as Block 2B, with the principal difference being the implementation of the updated Integrated Core Processor .
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Lockheed Martin to supply JSF with transceivers | News | The Engineer
The F - 35 JSF mission system is said to rely on fibre optics to share data between the various subsystems in near real time. Tactical Systems is also responsible for the Integrated Core Processor , which is the aircraft's central computer system.
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Israel, U.S. Agree To $450 Million In F-35 EW Work | AWIN content from Aviation Week
Replacing core avionics with new systems at such a profound level of integration is unlikely, as it would require extensive testing by all F - 35 operators with no obvious gain for the developer. … layers for the integration of new applications—unified hardware, comprising a powerful general-purpose processor (GPP) and large …
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