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Supplier: Aaeon Systems Inc.
Description: Applications Factory Automation Industrial Automation Network Security Features Intel Core 2 Quad/ Core 2 Duo LGA775 Processor, FSB 800/1066/1333 MHz Intel Q35 Dual-Channel DDR2 800/667 Memory (Up To 4 GB
- Chipset Type: Intel® Chipset
- Memory Capacity: 0.2560 GB
- On Board Features: Parallel Interface (PC printer port, Centronics®)?, Serial Interface (RS232, RS422, RS485)?, On-board Ethernet Controller?
- Processor / CPU Type: Intel® Core™2 Duo
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Supplier: Aaeon Systems Inc.
Description: interface, customers can get four additional COM ports. Concerning the USB ports, GENE-9310 features a total of five USB 2.0 ports. Two are standard ports, and two are internal pin headers with the last one is extended from the extension card. The Intel Core 2 Duo processor and the
- Chipset Type: Intel® Chipset
- Features: Watchdog Timer?, RJ-45 Connectors?
- Operating Humidity: 0.0 to 90 %
- Operating Temperature: 32 to 140 F
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Supplier: Aaeon Systems Inc.
Description: The FSB-960H adopts Intelfs dual-core processor at current speeds up to 3GHz with FSB 1333MHz to meet a wide range of performance requirements. In a PICMG 1.3 SHB Express form factor the FSB-960H system host board takes full advantage of the Intel Q35 Express chipset for
- Chipset Type: Intel® Chipset
- Features: Watchdog Timer?, RJ-45 Connectors?
- Operating Temperature: 32 to 140 F
- Ports: Serial Ports, Parallel Ports, USB
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1355879-MC56F81646VL F Category: Integrated Circuits (ICs) - Embedded - DSP (Digital Signal Processors) Temperature Range - Operating: -40°C ~ 105°C (TA) Fake Threat In the Open Market: 54 pct. Mfr: NXP USA Inc. Series: 56F8xxx
- Clock Speed: 100 MHz
- Interfaces: SPI, SCI, Other
- Operating Temperature: -40 to 105 C
- Supply Voltage: Other
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1077441-MC56F81746VL F Category: Integrated Circuits (ICs)>Embedded - DSP (Digital Signal Processors) Series: 56F8xxx Voltage - I/O: 3.30V Package: Tray Standard Package: 250 Mounting: SMD (SMT) Interface: I2C, SCI, SPI Clock Rate
- Clock Speed: 100 MHz
- Interfaces: I²C, SPI, SCI, Other
- Operating Temperature: -40 to 105 C
- Supply Voltage: Other
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Supplier: Aaeon Systems Inc.
Description: The GENE-9655 adopts the Intel® GME965 + ICH8M chipset and has the Socket-P that can accept an Intel® Core? 2 Duo/ Celeron® M (65nm) processor, such as the 2.2GHz T7500. The board can also be ordered with the option to have an Intel® BGA processor embedded on it in place of
- Chipset Type: Intel® Chipset
- Features: Watchdog Timer?, RJ-45 Connectors?
- Operating Humidity: 0.0 to 90 %
- Operating Temperature: 32 to 140 F
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Supplier: Win Source Electronics
Description: Manufacturer: NXP USA Inc. Win Source Part Number: 1321870-MC56F81666VL F Category: Integrated Circuits (ICs)>Embedded>DSP (Digital Signal Processors) Packaging: Tray Voltage - I/O: 3.30V Standard Package: 250 Mounting: Surface Mount Interface: I2C, SCI
- Clock Speed: 100 MHz
- Interfaces: I²C, SPI, SCI, Other
- Operating Temperature: -40 to 105 C
- Package Type: QFP, Other
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1355544-MC56F81766VL F Category: Integrated Circuits (ICs) - Embedded - DSP (Digital Signal Processors) Temperature Range - Operating: -40°C ~ 105°C (TA) Fake Threat In the Open Market: 45 pct. Mfr: NXP USA Inc. Series: 56F8xxx
- Clock Speed: 100 MHz
- Interfaces: SPI, SCI, Other
- Operating Temperature: -40 to 105 C
- Supply Voltage: Other
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Description: 32-BIT DSC, 56800EX CORE, 64KB F
- Clock Speed: 100 MHz
- Interfaces: Other
- Operating Temperature: -40 to 105 C
- Package Type: QFP
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Description: DSP, 56800E CORE, 16-EXT BIT, 12
- Clock Speed: 80 MHz
- Interfaces: Other
- Operating Temperature: -40 to 105 C
- Package Type: QFP
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Supplier: Acme Chip Technology Co., Limited
Description: 32-BIT DSC, 56800EX CORE, 128KB
- Clock Speed: 100 MHz
- Interfaces: Other
- Operating Temperature: -40 to 125 C
- Package Type: Other
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Supplier: Advantech
Description: Advantech’s MIC-6311 is a single processor VPX blade based on the 4th generation Intel® Core™ i3/i5/i7 platform. It enables the highest performance available in 6U VPX form factor with two SRIOx4 ports in the VPX data plane and two PCI Express x8 gen. 3 lanes in the VPX
- Operating System: LynxOS®
- Technology: VPX
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Supplier: Advantech
Description: and consoles. 4th/ 5th Generation Intel® Core™ processor, up to 4 cores / 8 threads Intel® QM87 PCH Triple independent display support OpenVPX MOD6-PAY-4F1Q2U2T-12 .2.1-2 profile compliant Onboard and SO-DIMM DDR3L-1600, up to 16
- Operating System: LynxOS®
- Technology: VPX
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Supplier: Advantech
Description: The MIC-6314 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ embedded platform with increased cache size and efficiency, as well as instruction set improvements. The MIC-6314 provides two configurable PCIE x 8 ports in
- Operating System: LynxOS®
- Technology: VPX
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Supplier: ARM Inc.
Description: driver debug with process/thread awareness and module listing Streamline: Software profiling and performance analysis extended to also support SMP configurations, native Android applications and libraries, and the following cores: Cortex™-A9 ARM1136JF
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Supplier: Microchip Technology, Inc.
Description: System developers designing high-end embedded control applications can benefit from a new Digital Signal Controller (DSC) with two dsPIC DSC cores in a single chip. The dsPIC33CH has one core that is designed to function as a master while the other is designed as a slave. The slave
- Clock Speed: 200 MHz
- Data Bus: 16-Bit
- Interfaces: I²C
- MIPS: 100
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Supplier: Microchip Technology, Inc.
Description: System developers designing high-end embedded control applications can benefit from a new Digital Signal Controller (DSC) with two dsPIC DSC cores in a single chip. The dsPIC33CH has one core that is designed to function as a master while the other is designed as a slave. The slave
- Clock Speed: 200 MHz
- Data Bus: 16-Bit
- Interfaces: I²C
- MIPS: 100
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Supplier: Microchip Technology, Inc.
Description: System developers designing high-end embedded control applications can benefit from a new Digital Signal Controller (DSC) with two dsPIC DSC cores in a single chip. The dsPIC33CH has one core that is designed to function as a master while the other is designed as a slave. The slave
- Clock Speed: 200 MHz
- Data Bus: 16-Bit
- Interfaces: I²C
- MIPS: 100
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Supplier: Microchip Technology, Inc.
Description: System developers designing high-end embedded control applications can benefit from a new Digital Signal Controller (DSC) with two dsPIC DSC cores in a single chip. The dsPIC33CH has one core that is designed to function as a master while the other is designed as a slave. The slave
- Clock Speed: 200 MHz
- Data Bus: 16-Bit
- Interfaces: I²C
- MIPS: 100
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Supplier: Advanced Micro Devices, Inc.
Description: The Six-Core AMD Opteron™ Processor provides up to 30% more performance in the same socket 1207 footprint than previous generation quad-core AMD Opteron processors. This upgrade enables a performance improvement for edge-of-enterprise markets including storage and
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Supplier: Advantech
Description: Using 4th generation Intel® Core™ i3/i5/i7 processors based on 22nm process technology supporting up to four cores / eight threads at 2.4GHz and 6MB last level cache, the MIC-3396 blade boosts computing performance deploying the latest virtualization, techniques and CPU
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Supplier: QUALCOMM, Incorporated
Description: With an advanced 10-nanometer design, the Qualcomm® Snapdragon™ 835 mobile platform can support phenomenal mobile performance. It is 35% smaller and uses 25% less power than previous designs, and is engineered to deliver exceptionally long battery life, lifelike VR and AR experiences
- Clock Speed: 2450 MHz
- Data Bus: 64 Bit
- Serial Interfaces: USB
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Supplier: Infineon Technologies AG
Description: supply Highly integrated solution for performance demanding radar applications Fully compatible with TC357TA for more cost effective solutions Radar cluster: LVDS radar interface Lock-stepped radar processor High bandwidth
- DMA Channels: Yes
- Data Bus: 32 Bit
- Internal RAM Size: 6624 KB
- Internal ROM Type: Flash
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Supplier: WINSYSTEMS, INC.
Description: WinSystems’ SBC35-C398DL dual-core single board computer combines high performance multimedia graphics with a rich mix of industrial I/O. The Freescale i.MX 6DL processor’s integrated power management provides excellent efficiency and allows operation from -40° to +85°C
- CPU Speed: 800 MHz
- Cache Memory (L1 & L2): 512 KB
- Chipset Type: Other
- Communication Networks: GPIB (IEEE 488, HPIB), Ethernet, CANbus
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Supplier: Supermicro Computer, Inc.
Description: Key Features 1. Four Six-Core / Quad-Core AMD Opteron™ 8000 Series (Socket F) support; HT3.0 Link support 2. Up to 128GB Registered ECC DDR2 800/667/533 SDRAM in 16 DIMM 3. Intel® 82576 controllers, Dual-Port Gigabit Ethernet 4. 1x 2.5" Internal SATA Drive Support 5.
- Form Factor: Blade Server
- Server Type: Network Server
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Supplier: Cirrus Logic, Inc.
Description: the converters and regulators as well as the sequencing of system clocks. The DC-DC converters deliver high performance and high efficiency across a wide range of operating conditions. They are optimised to support the high load current transients seen in modern processor core domains.
- Features: Watchdog Timer (WDT), Manual Reset
- Number of Supplies: 4
- Package Type: QFN
- Pin Count: 81
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Supplier: Neousys Technology Inc.
Description: this compact system capable of operating reliably at 60°C under 100% GPU load. Nuvo-5095GC is based on Intel® Skylake platform, supporting 35W/65W 6th-Gen ® Core™ processors and up to 32GB of DDR4 memory. It offers rich I/O functions, such as GbE, USB 3.0 and COM ports to
- Cache Memory (L1 & L2): 6000 to 8000 KB
- Features: RAID Controller
- Operating Temperature: -13 to 140 F
- Processor: Intel®
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Supplier: ELMA Electronic Inc.
Description: processor Up to 16GB ECC-protected DDR3-1333, soldered down Intel® QM67 platform controller hub (PCH) 256Kbytes F-RAM PCI Express Fat Pipe fabric 1000BASE-T or 1000BASE-BX control plane SATA, USB and serial interfaces Integrated 2D/3D
- CPU Speed: 2200 MHz
- I/O Bus Specifications: VPX
- Processor / CPU Type: Other
- RAM: 16000 MB
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Description: The XPedite8270 is a secure, high-performance, 3U VPX-REDI, single board computer aligned to the Sensor Open System Architecture (SOSA) standard. Based on the 13th Gen Intel® Core™ i7 series (formerly Raptor Lake-P) line of processors, the XPedite8270 is an ideal choice for
- Communication Networks: Ethernet
- I/O Bus Specifications: USB, VPX, Other
- Ports: Serial Ports, USB
- RAM: 64000 MB
-
Description: The XPand6241 is a true Commercial-Off-The-S helf (COTS) rugged system based on the 13th Gen Intel® Core™ i7 series (formerly Raptor Lake-P) of processors and a Gigabit Ethernet switch hosting an XChange6300 Cisco IOS-XE® Gigabit Ethernet Embedded Services Router. With a
- Interface to Other Buses: Ethernet
- Technology: VPX
-
Supplier: Cirrus Logic, Inc.
Description: The EP9307 is a low-cost, integrated system-on-chip processor for applications that require a rich user interface. The EP9307 features an advanced 200 MHz ARM920T processor design with a memory management unit (MMU) that supports Linux®, Windows CE® and many other
- Clock Frequency: 200 MHz
- Data Bus: 32 Bit
- Interface: I2S, SPI, UART, USB
- Number of I/Os: 14 #
-
Description: This book provides a thorough introduction to the Texas Instruments MPS432™ microcontroller. The MPS432 is a 32-bit processor with the ARM Cortex M4F architecture and a built-in floating point unit. At the core, the MSP432 features a 32-bit ARM Cortex-M4F CPU, a RISC
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Description: and deliver the product. NOTE 3 The application activity model in annex F provides a graphical representation of the processes and information flows that are the basis for the definition of the scope of this part of ISO 10303. Figure 3 -- Functional usage of technical data
-
Supplier: OnLogic Inc.
Description: LOW LATENCY AI INFERENCE AT THE EDGE The JETAGX-F brings high-powered NVIDIA? processing to the edge with up to 275 Tera Operations per Second (TOPS), 2048 NVIDIA CUDA? cores and 64 Tensor cores. Choose 32 GB or memory, or step up to 64 GB to enable server-class
- Features: Integrated BluetoothTM Technology
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Federal Register > Thursday, April 18, 2013 > [78 FR 23226] 36(b)(1) Arms Sales Notification
Sensitive elements include: F - 35 Integrated Core Processor utilizing Commercial Off the Shelf (COTS) Hardware and Module Design to maximize growth and allow for efficient Management of DMS and Technology Insertion, if additional processing is needed, a second ICP will be installed …
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Future integrated modular avionics for jet fighter mission computers
Brian was one of the chief Architects for the F - 35 Integrated Core Processor Mission Computer.
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http://dspace.mit.edu/bitstream/handle/1721.1/43853/263025866-MIT.pdf?sequence=2
The most advanced mission computers in development and operation today are the common integrated processor (CIP) for the F-22 Raptor, the integrated core processor for the F - 35 Lightning II, and the modular mission computer for the F-16 Block 60 …
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Airframe parts production gives JSF shape
- Lockheed Martin has delivered the second group of advanced Integrated Core Processor (ICP) modules for the F - 35 Joint Strike Fighter under a US$300 million System Development and Demonstration (SDD) contract.
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Lockheed Martin F-35 Lightning II
Radar Northrop Grumman MIRFS/MFA (multifunction integrated RF system/multifunction nose array) combines AN/APG-81 active electronically scanned array (AESA) radar, electronic warfare and communications functions planned for production F - 35 . Flight Lockheed Martin Tactical Defense Systems Integrated Core Processor (ICP) incorporating open system architecture.
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Not so hidden dragon - China's J-20 assessed
Though undoubtedly the electronics and IT industry have taken leaps and bounds since the F-22 was developed (many smart phones now boast a 1Ghz processor and a dual core phone is just about to … … in sensor fusion and in integration . As the US is finding out to its cost with F - 35 , software is the trickiest part to get right.
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Infotech@Aerospace Conferences > Addressing the Complex Integration Issues of Net Centric, Multi-Sensor Information Fusion
The F - 35 program uses a simulation called Joint Strike Fighter (JSF) Integrated Avionics Performance Prediction and Analysis (IAPPA) Fusion Simulation or JIFS to address these integration and development risks. When necessary, the design also allows distributing the simulation over multi- core processors or over multiple computers to provide faster execution times.
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Lockheed Martin contracted to deliver Block 3F software for F-35
The F - 35 's software and capability blocks are broken down into Block 1A - initial training, Block 1B - advanced training 1, Block 2A - advanced training 2, Block 2B (initial combat capability), Block 3i (initial full capability), and Block 3F (full combat capability). Block 3i provides the same tactical capabilities as Block 2B, with the principal difference being the implementation of the updated Integrated Core Processor .
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Lockheed Martin to supply JSF with transceivers | News | The Engineer
The F - 35 JSF mission system is said to rely on fibre optics to share data between the various subsystems in near real time. Tactical Systems is also responsible for the Integrated Core Processor , which is the aircraft's central computer system.
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Israel, U.S. Agree To $450 Million In F-35 EW Work | AWIN content from Aviation Week
Replacing core avionics with new systems at such a profound level of integration is unlikely, as it would require extensive testing by all F - 35 operators with no obvious gain for the developer. … layers for the integration of new applications—unified hardware, comprising a powerful general-purpose processor (GPP) and large …
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