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Description: . More Materials: Our Advanced Ceramics include: Alumina (Al2O3) Ceramics Zirconia (ZrO2) Ceramics Beryllia (BeO) Ceramics Aluminum Nitride (AlN) Ceramics Silicon Nitride (Si3N4) Ceramics Hot Pressed Boron Nitride (HBN
- Density: 2.6 g/cc
- Dielectric Strength: 4.00E7 V/m
- Max Use Temperature: 1000 C
- Shape / Form: Plate / Board (e.g., Fiberboard)
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Fiber Optic Cables - Corning Cable STT-Drop Dielectric 2 Fiber Count Dielectric.. -- 002EB4-14101A20Supplier: TelephoneStuff.com
Description: single-tube design - Crush resistance supports Fiber protection and signal integrity - RDUP listed - Fiber Count: 002 - Fiber Code = E: Single-Mode - RoHS Compliant - Jacket: 4 = Dielectric strength members/PE jacket - Fiber Placement: 1 = All fibers in same tube (standard
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Supplier: Accuris
Description: Peel Strength, Flexible Dielectric Materials
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Supplier: ASTM International
Description: 1.1 This test method covers testing to determine the "Dielectric Strength" of dielectric overfoot and overshoe footwear. Testing is done over the maximum possible area of the dielectric footwear without permitting flashover between electrodes. 1.2 The use and maintenance
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Supplier: TelephoneStuff.com
Description: flooding compound and provides efficient and craft-friendly cable preparation - SZ-stranded, loose tube design isolates fibers from installation and environmental rigors and facilitates midspan access - Stable performance over a wide temperature range - Dielectric central strength
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Supplier: Accuris
Description: Electrical relays \x96 Tests and Measurements Part 7-4: Dielectric strength test
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Supplier: Accuris
Description: Electrical relays \x96 Tests and measurements \x96 Part 4: Dielectric strength test
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Supplier: SAE International
Description: Mn and/or rare earth-doped xCaTiO\u2083 - (1-x)CaMeO\u2083 dielectrics, where Me=Hf or Zr and x=0.7, 0.8, and 0.9 were developed to yield materials with room temperature relative permittivities of \u0395 r ~ 150-170, thermal coefficients of capacitance (TCC) of \u00b1 15.8% to \u00b1
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Supplier: Tradeport Electronics Group
Description: AC dielectric strength testing (AC Hipot) with DC dielectric strength testing (DC Hipot), insulation resistance (to 65 Gigohms) and earth continuity measurement all in one feature-rich automated instrument. This compact dielectric analyzer lets you measure four
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Supplier: ASTM International
Description: 1.1 This test method covers the determination of dielectric breakdown voltage and dielectric strength of solid electrical insulating materials under direct-voltage stress. 1.2 Since some materials require special treatment, reference shall also be made to ASTM specifications or
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Supplier: ASTM International
Description: particular options to be used (see ). 1.4 It may be used at various temperatures, and in any suitable gaseous or liquid surrounding medium. 1.5 This test method is not intended for measuring the dielectric strength of materials that are fluid under the conditions of test. 1.6
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Supplier: ASTM International
Description: be used (see 5.5). 1.4 It may be used at various temperatures, and in any suitable gaseous or liquid surrounding medium. 1.5 This test method is not intended for measuring the dielectric strength of materials that are fluid under the conditions of test. 1.6 This test method is
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Supplier: Fairview Microwave Inc.
Description: purchasing requirements. Since 1992, Fairview (originally Sun Moon Electronics or SM Electronics for short) has been recognized for delivering unsurpassed quality, but our true strength lies on our customer service. We go to great lengths to get you the component you need as rapidly as
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Supplier: 3X Ceramic Parts Company Limited
Description: Dielectric Constant / 9 9.6 Dielectric Strength KV/mm 8.3 8.7 Thermal Shock Resistance ? T ( °C ) 220 180-200 Tensile Strength @ 25 °C MPa 200 248
- Coeff. of Thermal Expansion (CTE): 7.9 to 8.5 µm/m-C
- Dielectric Constant (Relative Permittivity): 9 to 9.6 #
- Dielectric Strength: 8.30E6 to 8.70E6 V/m
- Material Type: Alumina / Aluminum Oxide
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Supplier: 3X Ceramic Parts Company Limited
Description: Strength Mpa 2100 1800 Elastic Modulus Gpa >330 440 Poisson's Ratio / 0.24 0.17 Hardness kg/mm2 1100 2800 Fracture Toughness KIC Mpa *m 1/2 2.6 3.9 Thermal Heat Conductivity W/ m*k 170-180 120 Coefficient of Thermal Expansion 10-6/K 4.5 3 Specific Heat j/kg*K 740
- Coeff. of Thermal Expansion (CTE): 3 to 4.5 µm/m-C
- Dielectric Constant (Relative Permittivity): 9.66 to 10.6 #
- Loss Tangent (tan δ ): 3.00E-4 #
- Material Type: Aluminum Nitride
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Supplier: 3X Ceramic Parts Company Limited
Description: .6 3.9 Thermal Heat Conductivity W/ m*k 170-180 120 Coefficient of Thermal Expansion 10-6/K 4.5 3 Specific Heat j/kg*K 740 / Thermal Shock Resistance °C / 230-260 Max UseTemperature °C / 1550 Electrical Dielectric Strength ac-kv/mm 42-44.53 / Dielectric Constant /
- Coeff. of Thermal Expansion (CTE): 3 to 4.5 µm/m-C
- Dielectric Constant (Relative Permittivity): 9.66 to 10.6 #
- Loss Tangent (tan δ ): 3.00E-4 #
- Material Type: Aluminum Nitride
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Supplier: 3X Ceramic Parts Company Limited
Description: rigidity, high strength and high hardness. 2. Strong corrosion resistance, can be used in strong acid and strong alkali. 3. High temperature resistant, silicon nitride ceramic balls under 1000 ? environment can be normal use. 4. Non-magnetic and electrical insulation
- Coeff. of Thermal Expansion (CTE): 3.3 µm/m-C
- Dielectric Constant (Relative Permittivity): 8 #
- Material Type: Silicon Nitride
- Thermal Conductivity: 15 to 20 W/m-K
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Description: mechanical reliability and transmission parameters are maintained. The ADSS cable consists of single mode optical fibres contained in one or more protective dielectric fibre optic units surrounded by or attached to suitable dielectric strength members and sheaths. The cable does
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Description: reliability and transmission parameters are maintained. The ADSS cable consists of single mode optical fibres contained in one or more protective dielectric fibre optic units surrounded by or attached to suitable dielectric strength members and sheaths. The cable does not
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Supplier: Zippertubing Co. (The)
Description: tape for bundling and securing of wires and cables or any application requiring a flame retardant material with good dielectric strength, high and low temperature flexibility and resistance to moisture and outdoor conditions. ZT-TAPE® is the perfect mate to Zippertubing’s
- Adhesive: Acrylic
- Backing: Specialty / Other
- Performance Features: Dielectric / Insulating
- Temperature Resistance: -55 to 107 C
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Supplier: FX PCB Co., Ltd.
Description: 3, Mechanical Stability Ceramics have mechanical strength and stability under thermal stress, which can enhance durability and reliability. It is more suitable in harsh environments with different kinds of temperature Embedded Ceramic PCB in Fr4 Manufacturer Embedded
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Features: Electrically Conductive, Electrically Insulating / Dielectric, EMI / RFI Shielding Material, Anti-static / ESD Control
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
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Supplier: FX PCB Co., Ltd.
Description: Description Rigid Fr4 PCB Manufactures FX PCB is a Rigid Fr4 PCB Manufacturer that can supply all your rigid PCBs in a short time with lower costs. There are different materials for your choice to meet specific design requirements, and our team will give you suggestions
- Materials of Construction: Specialty / Other
- Thickness: 0.0079 to 0.3150 inches
- Type: Rigid
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Supplier: Henkel Corporation - Industrial
Description: . For more information on mixed properties when used with other available catalysts, please contact your local technical service representative for assistance and recommendations. Flame retardant Halogen free High thermal conductivity High dielectric strength
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 21.67 µin/in-F
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
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Supplier: Ikonix USA
Description: provides you with customizable features and unmatched functionality! Model 8204 is a 4-in-1 Electrical Safety Compliance Analyzer that performs AC Hipot, DC Hipot, 40 Amp Ground Bond and Insulation Resistance testing in a single instrument.
- AC Current: 0.0 to 40 amps
- Display: Digital Meter
- Features: Memory / Storage, Multiple Test Setup, Selectable Output Frequency, Other
- Interfaces: GPIB, RS232, Printer Port, Other
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Supplier: CSA Group
Description: as optical fibre mechanical reliability and transmission parameters are maintained. The ADSS cable consists of single mode optical fibres contained in one or more protective dielectric fibre optic units surrounded by or attached to suitable dielectric strength members and
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Supplier: Techsil Limited
Description: /potting resins. Overtec 5 FR has excellent chemical resistance and thermal durability, with an upper heat resistance of 135c, and a lower temperature flexibility of -35c. Overtec 5FR has good chemical and water resistance, in addition to excellent electrical resistance and
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Supplier: RS Components, Ltd.
Description: ,Decoratio n of point of sale media,Sealing double glazing units,Available in 50mm widths, and a choice of either, 30, 40 or 50 micron thickness,Peel off backing,Flame retardant Total Thickness = 0.09mm Foil Thickness = 0.05mm Width = 50mm Length = 50m Adhesion Strength = 4
- Peel Strength / Adhesion: 2.28 lbs/in
- Performance Features: Dielectric / Insulating
- Temperature Resistance: -20 to 110 C
- Thickness: 0.0035 inches
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Supplier: Techsil Limited
Description: /potting resins. Overtec 5 FR has excellent chemical resistance and thermal durability, with an upper heat resistance of 135c, and a lower temperature flexibility of -35c. Overtec 5FR has good chemical and water resistance, in addition to excellent electrical resistance and
- Cure Type / Technology: Thermoplastic / Hot Melt
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Supplier: Henkel Corporation - Industrial
Description: packages, and stacked die. This material is hydrophobic and stable at high temperatures. These features produce a void-free bond line with excellent interfacial adhesive strength to a wide variety of organic and metal surfaces, including solder mask, BT, FR, polyimide, and Au. The
- Coeff. of Thermal Expansion (CTE): 54.44 µin/in-F
- Cure Type / Technology: Single Component System
- Features: Electrically Insulating / Dielectric
- Substrate / Material Compatibility: Plastic
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Supplier: AENOR
Description: Electrical relays - Tests and measurements - Part 4: Dielectric strength test
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Supplier: Techsil Limited
Description: /potting resins. Overtec 5 FR has excellent chemical resistance and thermal durability, with an upper heat resistance of 135c, and a lower temperature flexibility of -35c. Overtec 5FR has good chemical and water resistance, in addition to excellent electrical resistance and
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Supplier: Techsil Limited
Description: /potting resins. Overtec 5 FR has excellent chemical resistance and thermal durability, with an upper heat resistance of 135c, and a lower temperature flexibility of -35c. Overtec 5FR has good chemical and water resistance, in addition to excellent electrical resistance and
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Supplier: Hapco, Inc.
Description: Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented.
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 2.9 to 3.1
- Dielectric Strength: 350 kV/in
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Supplier: RS Components, Ltd.
Description: = Non-Conductive Adhesion Strength = 4.5 N/cm Adhesive Material = Thermosetting Acrylic Material Plating = None Tensile Strength = 40N/cm Maximum Temperature Resistance = +155°C
- Adhesive: Acrylic
- Peel Strength / Adhesion: 2.57 lbs/in
- Performance Features: Dielectric / Insulating
- Temperature Resistance: 155 C
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Supplier: RS Components, Ltd.
Description: = Non-Conductive Adhesion Strength = 4.5 N/cm Adhesive Material = Thermosetting Acrylic Material Plating = None Tensile Strength = 40N/cm Maximum Temperature Resistance = +155°C
- Adhesive: Acrylic
- Peel Strength / Adhesion: 2.57 lbs/in
- Performance Features: Dielectric / Insulating
- Temperature Resistance: 155 C
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Supplier: RS Components, Ltd.
Description: = Non-Conductive Adhesion Strength = 4.5 N/cm Adhesive Material = Thermosetting Acrylic Material Plating = None Tensile Strength = 40N/cm Maximum Temperature Resistance = +155°C
- Adhesive: Acrylic
- Peel Strength / Adhesion: 2.57 lbs/in
- Performance Features: Dielectric / Insulating
- Temperature Resistance: 155 C
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closed-cell polyurethane foam does not absorb water, ensuring signal performance. Standard densities are available in 3, 4 and 6 pounds per cubic foot, and other densities can be provided to meet specific dielectric constant and loss tangent requirements. These foams’ electrical properties have (read more)
Browse Foams and Foam Materials Datasheets for General Plastics Manufacturing Co. -
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retardant. Shrink Ratio--4:1 (75%). Shrinkage begins when exposed to 120°C. Longitudinal shrinkage: 10%. Dielectric Strength: 400V/Mil min. Uses: Strain reliefs, jacketing material, component insulation, seal & protect wire splices, breakouts or connectors-to-cable terminations. OPER. TEMP.: -55°C to +135°C. Meets MIL-I-23053/4, Class 3, UL VW-1, CSA OFT (jacket only), ASTM D638. (read more)
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Silicon nitride ceramic substrate is a high-performance ceramic material with Si?N? as the main component, with high strength, high thermal conductivity, wear resistance, and excellent insulation. It is made by casting, sintering, and other processes, with controllable thickness (0.25 mm-1.00 mm (read more)
Browse Silicon Nitride and Silicon Nitride Ceramics Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
Insulation Resistance ≥ 500MΩ @ 500VDC Dielectric Strength ≥ 500V @ 50Hz (between circuits) (read more)
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LED Light PCB Assembly involves soldering electronic components onto a printed circuit board to build efficient lighting solutions. Choosing the right material is essential and should account for fire resistance, dielectric constant, loss factor, tensile strength (read more)
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transparent fillers. It keeps the FR4’s mechanical strength, heat resistance, and electrical insulation. We can make a 1-6-layer transparent FR4 PCB, and the copper thickness can be made from 1-3oz. It is easy to produce, and the cost is low. However, the transparency is limited (read more)
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warping after soldering processes. FR4 as the representative of glass fiber epoxy resin, plays an important role in the electronics industry due to its excellent flame retardancy, high strength, heat resistance, and dielectric properties. It is the most popular material used for single sided (read more)
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resistance using resin chemistry and flame-retardant chemicals. FR-3700 uses cross-linked resin to improve strength-to-weight ratios and resist friability (a foam’s tendency to crumble or degrade during machining or under load). This chemistry allows for clean edges and precise cuts, especially (read more)
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More Information Top
Indicates content that may require registration and/or purchase.
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Effects of X-Ray Radiation on Solid Insulating Materials
It can be seen that the dielectric strength of FR4 composites is reduced from 27 kV/mm to 24 kV/mm which is 11 % reduction after .
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Temperature effects on electrical characterization of high dielectric constant substrates
It was observed that dielectric strength of the HK and FR4 substrate were obtained about 200 and 114kV/cm, respectively, at 125 o C with electrode area of .
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An alignment insensitive separable electromagnetic coupler for high-speed digital multidrop bus applications
Fig. 11 shows a sim- ulated set of transfer functions from a bus transmitter to a re- ceiver over a variety of system configurations including FR4 dielectric constant and loss coefficient, coupler strength (i.e., magnitude of coupling coefficient), position along …
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INTRODUCTION TO INDUSTRIAL LAMINATES: Plastic Distributor & Fabricator
G10/ FR4 has extremely high mechanical strength , good dielectric loss properties, and good electric strength properties, both wet and dry.
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Development of reliable 70 T pulsed magnets
G10 (Nema grade FR4 ) is a glass–fibre reinforced laminate with high strength and good dielectric properties. .
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Area bonding conductive epoxy adhesive preforms for grid array and MCM substrate attach
Titis paper presents bond strength, coitductivily, dielectric strength , humidity and thenital shock results for daisy chain test circuits and other componertts attached to FR4 boards.
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Analysis of a low power passive RFID tag based on advanced CMOS process for wide area application
Some dielectric material, such as FR4 is composed of glass fibers and resin, where the fibers are provided for strength and durability.
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2.4 GHz Bluetooth module with integral passives in multi-dielectric layer printed-circuit boards
As shown in Fig 1, we have used the 350um FR4 CCL (Copper-clad Laminate) as core to provide mechanical strength , 50um Mitsui MR600RCC Low-Dk ( dielectric constant) material on outer layers for high frequency signal propagation, and inductor designs, and …
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Fiberglass and Glass Technology
Table 4.1 Key properties of fiberglass and resin used in a typical FR4 laminate board Dielectric Elastic Modulus Tensile Strength .
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Guide to Mitigating Spacecraft Charging Effects
… and not typical values; actual resistivity values may differ by many orders of magnitude (e.g., FR4 ). Note that dielectric strength is always specified as a function of thickness and may be extrapolated to other thicknesses roughly as the inverse square root of the thickness.