Hermetic Lids

Description: Materion Microelectronics & Services’ alloys are alloyed, cast and fabricated to meet the exacting standards of the microelectronic and various demanding applications. All of our alloys are available in a variety of shapes and forms.

• Applications: Electronics / RF-Microwave
• Features: Cast (Continuous, Centrifugal, etc.)
• Metal / Alloy Types: Other / Miscellaneous Nonferrous (UNS M)

Description: Qnnect, formerly Hermetic Solutions Group manufactures high-quality domed can lids (typically used as both the lid and the side wall of a hermetic microelectronic package) to support our customers using platform headers.

• Materials: Other

Description: Lids with integrated windows, manufactured by Qnnect, formerly Hermetic Solutions Group, allow light to be transmitted from or received by optical components residing within the hermetic package.

• Materials: Other

Description: The lid and the lidding process are often considered to be one of the least exciting aspects of hermetic microelectronic packaging. There are often many technical challenges in the design and manufacture of a new device and, unless a radical new packaging technique is also being

• Materials: Other

Description: The package adopts metal cavity brazing or melt seal feed through assembly, optical tube structure. WSS package cavity is usually large, generally using the Kovar alloy plate 6-side welding cavity structure (if the cavity is small, low cost aluminum alloy overall processing structure can be

• Materials: Aluminum, Copper, Tungsten

Description: Package Applications Optispac specializes in various packages manufacturing with strong R&D, efficient operation and excellent services. Simplicity, safety and easy to feed in are our principle for design. Pack your dreams with our packages! HIC Packages The application of HIC packages are for auto,

• Materials: Aluminum, AlSiC, Ceramic, Copper, Stainless Steel, Steel, Tungsten

Description: Package Applications Optispac specializes in various packages manufacturing with strong R&D, efficient operation and excellent services. Simplicity, safety and easy to feed in are our principle for design. Pack your dreams with our packages! Fiber Optics Packages The application of fiber optics

• Materials: Aluminum, AlSiC, Ceramic, Copper, Stainless Steel, Steel, Tungsten

Description: The package is made of ceramic cavity internal brazing metal hot sink, external no wire packaging structure, synchronous matching with high reliable germanium window or sapphire window cover plate. Cover plate sealing can be selected as soft and hard brazing or glass melting sealing process. This

• Materials: Ceramic

Description: Materion Microelectronics and Services maintains specially designed tools to stamp preforms from material with clad overlays built and maintained by our in-house, tool and die shop. Materion has a vast tooling library of specially designed tools to stamp preforms from material with clad overlays

• Applications: Electronics / RF-Microwave
• Clad / Bimetal: Yes
• Metal / Alloy Types: Other / Miscellaneous Nonferrous (UNS M)
• Shape / Form: Semi-finished Shape / Mill Stock, Bar Stock, Squares / Square Bar

Description: Visi-Lid™, an optical assembly, passes light at specified wavelengths. In its simplest form, the assembly consists of an A/R coated and glass metalized window of sapphire, silicon or germanium with a solder frame tack welded to the metalized portion. More complex assemblies require

• Antireflection Coating: Yes
• Materials: Germanium, Sapphire, UV Grade Fused Silica

Description: A Visi-Lid™ assembly is a filter/lid sub assembly, suitable for hermetically sealing detectors or bolometers. Each window assembly is spectrally and hermetically tested to assure compliance. This is a turnkey solution which avoids the having to perform the sub assembly

• Coating: None
• Materials: Germanium, Sapphire, Specialty / Other
• Window Shape: Circular, Square, Rectangular

Description: market has expanded to include bio-medical detectors, blood analysis detectors and other telecommunication technology. Other offerings within our product portfolio include hermetic package lids as well as getter solutions which help to maintain the purity of the atmosphere within a

• Materials: Aluminum, Tungsten, Other

Description: Standard Test Method for Hermeticity of Hybrid Microcircuit Packages Prior to Lidding

Description: The Autoflow system is flexible enough to meet the ever-increasing demands of lid placement and seam sealing applications. It can be configured either as a stand-alone unit or as part of a fully integrated automated manufacturing line. The computer-controlled precision tacking and seam

• Brazing & Soldering: Other Brazing / Soldering Unit
• Equipment Type: Welding Equipment
• Frictional / Specialty Processes: Other Welding Processes
• Output Current Range: 50 to 2400 amps

Description: 1.1 The hermetic integrity of hybrid microcircuit packages is an important material or parts acceptance requirement. Determination of this parameter should be made before the hybrid circuit is assembled and sealed inside the package. 1.2 This test method covers a test for leaks in a

Description: 1.1 The hermetic integrity of hybrid microcircuit packages is an important material or parts acceptance requirement. Determination of this parameter should be made before the hybrid circuit is assembled and sealed inside the package. 1.2 This test method covers a test for leaks in a

Description: AdTech’s line of Platinum co-fired packages combines the HTCC material system with platinum metal conductors. Screen printing Pt with hermetic vias using multilayer capability addresses harsh environmental and biocompatible applications.

• Materials: Ceramic

Description: Crystal oscillator Ceramic package with a seam sealed metal lid, hermetically sealed

• Oscillation Frequency: 25 MHz
• Package / Form Factor: Surface Mount Technology (SMT)
• Total Frequency Stability: 50 ppm

Description: 3.3V surface mount oscillator in a ceramic package, with a hermetically sealed metal lid.

• Oscillation Frequency: 12 MHz
• Package / Form Factor: Surface Mount Technology (SMT)
• Total Frequency Stability: 50 ppm

Description: 3.3V surface mount oscillator in a ceramic package, with a hermetically sealed metal lid.

• Oscillation Frequency: 50 MHz
• Package / Form Factor: Surface Mount Technology (SMT)
• Total Frequency Stability: 50 ppm

Description: 3.3V surface mount oscillator in a ceramic package, with a hermetically sealed metal lid.

• Oscillation Frequency: 14.31 MHz
• Package / Form Factor: Surface Mount Technology (SMT)
• Total Frequency Stability: 50 ppm

Description: The CC5V-T1A is a low frequency SMT Quartz Crystal Unit that incorporates a tuning fork Quartz Crystal Resonator. It operates under vacuum in a hermetically sealed ceramic package with ceramic lid.

Description: FEATURES: Miniature RF boxes with dished top cover Lids can be soldered flush or proud for hermetic sealing Mild steel with electrolytic tin-plating for easy soldering

• Depth: 0.3740 inch
• Length / Height: 2.5 inch
• Width/Diameter: 1.73 inch

Description: Rad hard, 250V, 3.7A, single, N-channel MOSFET, R5 in a SMD-0.2C package - 100 krad(Si) TID, QIRL Features Single event effect (SEE) hardened Low RDS(on) Low total gate charge Simple drive requirements Hermetically sealed

• Package Type: Other
• Polarity: N-Channel, Other
• V_(BR)DSS: 250 volts

Description: Hermetically sealed Ceramic package Surface mount Light Weight ESD rating: Class 1B per MIL-STD-750, Method 1020 Potential Applications DC-DC converters Motor drives Similar Parts IRHNMC

• Package Type: Other
• Polarity: N-Channel, Other
• Q_G: 9.1 nC
• V_(BR)DSS: 250 volts

Description: require internal vacuum levels on the order of 1 millitorr over the life of the device. Sealing of these MEMS packages requires specialized thermal processing in high vacuum system. Hermetic Package Sealing. Hermetic package sealing uses solder or glass to create a barrier to moisture

• Application: Brazing / Soldering, Curing, Industrial, Other
• Computer Interface: Yes
• Configuration: Top Loading
• Controller Type: Programmable

Description: From IQD, this CFPS-73 Crystal Clock Oscillator comes in a ceramic package with hermetically sealed metal lid, offering a good standard of environmental resistance to vibration and shock. This oscillator comes in a standard 7 x 5mm size. Output Frequency = 80 MHz Output Level = HCMOS

• Oscillation Frequency: 80 MHz
• Package / Form Factor: Surface Mount Technology (SMT), Other
• Total Frequency Stability: -50 to 50 ppm

Description: From IQD, this CFPS-73 Crystal Clock Oscillator comes in a ceramic package with hermetically sealed metal lid, offering a good standard of environmental resistance to vibration and shock. This oscillator comes in a standard 7 x 5mm size. Output Frequency = 40 MHz Output Level = HCMOS

• Oscillation Frequency: 40 MHz
• Output Type: HCMOS
• Package / Form Factor: Surface Mount Technology (SMT), Other
• Supply Voltage: 3.3 V, Other

Description: coatings such as BBAR, short or long pass cutoff filters, V or double V coating designs, high reflectors, as well as solderable metallization. With solderable sapphire metallization windows can be mounted in lids for SWIR camera arrays as well as frames or flanges for hermetic or high

• Coating: Antireflective, Conductive
• Materials: Sapphire
• Window Shape: Circular, Square, Rectangular
• Window Type: Plane Windows

Description: Seam sealers are used for lid placement and seam sealing applications to encase electronic components such as crystal devices, MEMS, sensors, optical devices, and other optoelectronic packaging applications. Similar to our other welding products, our seam sealer systems deliver an electric

• Applications & Materials Processed: Semiconductor Manufacturing
• Coating System Type: Other

Description: of lid and package, getter firing and sealing of MEMS packages. The 3150 utilizes a turbo-molecular drag pump for effective pumping of hydrogen gas molecules. An optional cryogenic water pump may be added to the system for processes requiring extremely low levels of residual water vapor

• Coating System Type: Factory / Free Standing 
• Features: Integral Process Controller?
• Technology / Process: Other
• Vacuum / Pressure Range: High Vacuum (< 10-3, >10-8 torr)

Description: element is hermetically sealed at the wafer level by bonding a second silicon lid wafer to the device using a glass frit. A separate ASIC device packaged with the sense element provides signal conditioning, and intelligent user-programmable application algorithms. The accelerometer is

• Number of Axes: Triaxial
• Operating Temperature: -40 to 185 F