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Supplier: Materion Corporation
Description: Materion Microelectronics & Services’ alloys are alloyed, cast and fabricated to meet the exacting standards of the microelectronic and various demanding applications. All of our alloys are available in a variety of shapes and forms.
- Features: Cast (Continuous, Centrifugal), Non-ferrous - Any Type
- Applications: Electronics / RF-Microwave
- Type: Metal / Metal Alloys, All Types
- Nonferrous: Other / Miscellaneous Nonferrous (UNS M)
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Description: Qnnect, formerly Hermetic Solutions Group manufactures high-quality domed can lids (typically used as both the lid and the side wall of a hermetic microelectronic package) to support our customers using platform headers.
- Features: Other
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Description: Lids with integrated windows, manufactured by Qnnect, formerly Hermetic Solutions Group, allow light to be transmitted from or received by optical components residing within the hermetic package.
- Features: Other
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Description: The lid and the lidding process are often considered to be one of the least exciting aspects of hermetic microelectronic packaging. There are often many technical challenges in the design and manufacture of a new device and, unless a radical new packaging technique is also being
- Features: Other
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Supplier: Materion Corporation
Description: A Visi-Lid™ assembly is a filter/lid sub assembly, suitable for hermetically sealing detectors or bolometers. Each window assembly is spectrally and hermetically tested to assure compliance. This is a turnkey solution which avoids the having to perform the sub assembly and eliminates
- Window Shape: Circular, Rectangular, Square
- Window Material: Germanium, Sapphire
- Windows Features: None
- Features: Specialty / Other
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Supplier: Accuris
Description: Standard Test Method for Hermeticity of Hybrid Microcircuit Packages Prior to Lidding
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Supplier: ASTM International
Description: 1.1 The hermetic integrity of hybrid microcircuit packages is an important material or parts acceptance requirement. Determination of this parameter should be made before the hybrid circuit is assembled and sealed inside the package. 1.2 This test method covers a test for leaks in a package
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Supplier: ASTM International
Description: 1.1 The hermetic integrity of hybrid microcircuit packages is an important material or parts acceptance requirement. Determination of this parameter should be made before the hybrid circuit is assembled and sealed inside the package. 1.2 This test method covers a test for leaks in a package
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Supplier: AMADA Weld Tech
Description: The Autoflow system is flexible enough to meet the ever-increasing demands of lid placement and seam sealing applications. It can be configured either as a stand-alone unit or as part of a fully integrated automated manufacturing line. The computer-controlled precision tacking and
- Output Current Range: 50 to 2,400 amps
- Equipment Type: Complete System, Monitor / Controller
- Features: Current, Current / Power, Other Brazing / Soldering Unit, Other Welding Processes
- Process Capability: Welding Equipment
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Description: and other telecommunication technology. Other offerings within our product portfolio include hermetic package lids as well as getter solutions which help to maintain the purity of the atmosphere within a hermetically sealed device. With a rich history of supporting customers the
- Package Material: Aluminum, Tungsten
- Features: Other
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Supplier: OptiSpac, Inc.
Description: Package Applications Optispac specializes in various packages manufacturing with strong R&D, efficient operation and excellent services. Simplicity, safety and easy to feed in are our principle for design. Pack your dreams with our packages! Microwave Packages Application T/R subassembly, MPM,
- Package Material: AlSiC, Aluminum, Ceramic, Copper, Stainless Steel, Steel, Tungsten
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Supplier: OptiSpac, Inc.
Description: Package Applications Optispac specializes in various packages manufacturing with strong R&D, efficient operation and excellent services. Simplicity, safety and easy to feed in are our principle for design. Pack your dreams with our packages! HIC Packages The application of HIC packages are for
- Package Material: AlSiC, Aluminum, Ceramic, Copper, Stainless Steel, Steel, Tungsten
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Supplier: OptiSpac, Inc.
Description: The package adopts metal cavity brazing or melt seal feed through assembly, optical tube structure. WSS package cavity is usually large, generally using the Kovar alloy plate 6-side welding cavity structure (if the cavity is small, low cost aluminum alloy overall processing structure can be
- Package Material: Aluminum, Copper, Tungsten
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Supplier: OptiSpac, Inc.
Description: TOSA/ROSA package usually uses the Kovar metal ring frame gold tin brazing light window, high temperature brazing ceramic feed through component, metal heat dissipation bottom plate structure. This type of packaging package products have high integrated density, small volume and low cost, and can
- Package Material: Copper, Tungsten
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Supplier: RS Components, Ltd.
Description: LIGHTGRAY, TRANSPARENT LID, HERMETIC ENC
- Length / Height: 2.40551311 inch
- Width/Diameter: 2.41338713 inch
- Depth: 1.57874101 inch
- Height: 2.40551311 inch
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Supplier: Richardson RFPD
Description: Crystal oscillator Ceramic package with a seam sealed metal lid, hermetically sealed
- Oscillation Frequency: 10 MHz
- Total Frequency Stability: 50 ppm
- Package / Form Factor: Surface Mount Technology (SMT)
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Supplier: Advanced Technical Ceramics Company
Description: AdTech’s line of Platinum co-fired packages combines the HTCC material system with platinum metal conductors. Screen printing Pt with hermetic vias using multilayer capability addresses harsh environmental and biocompatible applications.
- Package Material: Ceramic
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Supplier: TEKO Enclosures, Inc.
Description: FEATURES: Miniature RF boxes with dished top cover Lids can be soldered flush or proud for hermetic sealing Mild steel with electrolytic tin-plating for easy soldering
- Length / Height: 2.5 inch
- Width/Diameter: 1.732 inch
- Depth: 0.512 inch
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Supplier: PUI - Projections Unlimited, Inc.
Description: The CC5V-T1A is a low frequency SMT Quartz Crystal Unit that incorporates a tuning fork Quartz Crystal Resonator. It operates under vacuum in a hermetically sealed ceramic package with ceramic lid.
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Supplier: PUI - Projections Unlimited, Inc.
Description: The CC1A-T1A is a high frequency SMT Quartz Crystal Unit that incorporates an AT-cut Quartz Crystal Resonator. It operates under vacuum in a hermetically sealed ceramic package with ceramic lid.
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Supplier: Pall Water
Description: Features 100% Polypropylene construction UV inhibitor for long-lasting, all-weather operation and durability Easily convertible between bag filter and cartridge filter housing Filtration media available in 1-800 micron ratings Twist-off lid design requires no tools for quick and easy
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Supplier: Allied Electronics, Inc.
Description: A flux for metals as effective as acid or chloride types but non-corrosive. Solders even hard-to-solder metals such as aluminum, zinc-based alloys, steel, etc. Ideal for soldering bus and ground wires to aluminum and steel chassis, to hermetically seal lids to metal cases, for pot-tinning of
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Supplier: Infineon Technologies AG
Description: MIL-STD-750, Method 1020 Potential Applications Isolated DC-DC converters Motor drives Electric propulsion Thermal management Similar Parts IRHNMC57214SE SMD-0.2 package ceramic lid, 100 krad(Si) TID, COTS IRHNMC57214SESCS SMD-0.2 package ceramic lid, 100 krad(Si) TID, QPL, Screening
- V(BR)DSS: 250 volts
- QG: 9.1 nC
- Features: MOSFET, Other, Power MOSFET
- Polarity: N-Channel
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Supplier: Infineon Technologies AG
Description: Class 1B per MIL-STD-750, Method 1020 Potential Applications DC-DC converters Motor drives Similar Parts IRHNMC57214SE SMD-0.2 package ceramic lid, 100 krad(Si) TID, COTS IRHNMC57214SESCS SMD-0.2 package ceramic lid, 100 krad(Si) TID, QPL, Screening Level S IRHNM57214SE SMD-0.2
- V(BR)DSS: 250 volts
- QG: 9.1 nC
- Features: MOSFET, Other, Power MOSFET
- Polarity: N-Channel
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Supplier: Infineon Technologies AG
Description: MIL-STD-750, Method 1020 Potential Applications Isolated DC-DC converters Motor drives Electric propulsion Thermal management Similar Parts IRHNMC57214SE SMD-0.2 package ceramic lid, 100 krad(Si) TID, COTS IRHNMC57214SESCS SMD-0.2 package ceramic lid, 100 krad(Si) TID, QPL, Screening
- V(BR)DSS: 250 volts
- QG: 9.1 nC
- Features: MOSFET, Other, Power MOSFET
- Polarity: N-Channel
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Supplier: Gavish, Inc.
Description: short or long pass cutoff filters, V or double V coating designs, high reflectors, as well as solderable metallization. With solderable sapphire metallization windows can be mounted in lids for SWIR camera arrays as well as frames or flanges for hermetic or high vacuum applications.
- Windows Features: Antireflective, Conductive
- Window Shape: Circular, Rectangular, Square
- Window Type: Plane Windows
- Window Material: Sapphire
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Supplier: Micro Crystal AG
Description: CC5V-T1A is a low frequency SMT Quartz Crystal Unit that incorporates a tuning fork Quartz Crystal Resonator. It operates under vacuum in a hermetically sealed ceramic package with ceramic lid. Key Specifications Frequency: 32.768 kHz Load Capacitance: 6.0 / 7.0 / 9.0 / 12.5 pF Series
- Oscillation Frequency: 0.032768 MHz
- Total Frequency Stability: 3 ppm
- Load Capacitance: 6 to 12.5 pF
- Drive Level: 0.001 milliwatts
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Supplier: Micro Crystal AG
Description: CM10V-T1A Low ESR is a low frequency SMD Quartz Crystal Unit that incorporates a tuning fork Quartz Crystal Resonator with Maximum ESR value of 70 kΩ for low power designs. It operates under vacuum in a hermetically sealed ceramic package with metal lid. Key Specifications Frequency: 32.768
- Oscillation Frequency: 0.032768 MHz
- Total Frequency Stability: 3 ppm
- Load Capacitance: 4 to 12.5 pF
- Drive Level: 0.0005 milliwatts
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Supplier: Sunstone Engineering
Description: Seam sealers are used for lid placement and seam sealing applications to encase electronic components such as crystal devices, MEMS, sensors, optical devices, and other optoelectronic packaging applications. Similar to our other welding products, our seam sealer systems deliver an electric
- Features: Other
- Applications: Semiconductor Manufacturing
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Supplier: Micro Crystal AG
Description: Resistance: 90 kΩ (typ) Drive Level: 0.5 µW (max) Aging: ±3.0 ppm/year (max) Operating Temperature: -40 to +85°C Package: 1.6 x 1.0 x 0.35 mm Features Ultra low profile (maximum height 0.35 mm) Outstanding hermetic sealing with gold-tin preform High stability and low aging guaranteed by
- Oscillation Frequency: 0.032768 MHz
- Total Frequency Stability: 3 ppm
- Load Capacitance: 4 to 12.5 pF
- Drive Level: 0.0005 milliwatts
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Supplier: Infineon Technologies AG
Description: Rad hard, 100V, 22A, single, N-channel MOSFET, R9 in a SMD-0.5 (ceramic lid) package - SMD-0.5, 100 krad TID, QPL Features Single event effect (SEE) hardened Low RDS(on) Fast switching Low total gate charge Simple drive requirements Hermetically sealed Ceramic package Light weight Surface
- V(BR)DSS: 100 volts
- QG: 48 nC
- Features: MOSFET, Other, Power MOSFET
- Polarity: N-Channel
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Supplier: ROHM Semiconductor USA, LLC
Description: hermetically sealed at the wafer level by bonding a second silicon lid wafer to the device using a glass frit. A separate ASIC device packaged with the sense element provides signal conditioning, and intelligent user-programmable application algorithms. The accelerometer is delivered in a 2 x
- Operating Temperature: -40 to 185 F
- Measurement Axes: Triaxial
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Supplier: ROHM Semiconductor USA, LLC
Description: hermetically sealed at the wafer level by bonding a second silicon lid wafer to the device using a glass frit. A separate ASIC device packaged with the sense element provides signal conditioning, and intelligent user-programmable application algorithms. The accelerometer is delivered in a 2 x
- Operating Temperature: -40 to 185 F
- Measurement Axes: Triaxial
Find Suppliers by Category Top
Conduct Research Top
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Application: Gas Tank Lid Monitoring Sensor (.pdf)
. Detecting if the lid and gas cap are in place designers have turned to the Reed Sensor which uses hermetically sealed reed switches, and are further packaged in a tough plastic encapsulation.
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Gold Tin Eutectic Solder - High Reliability
Gold tin eutectic solder (AuSn20, or 80%gold, 20%tin by weight) is used in a variety of applications requiring a high reliability, high melting solder joint. This includes die-attach and even lid-attach for hermetically-sealed ceramic packages. When used as a die-attach solder alloy for LED or RF
More Information Top
Indicates content that may require registration and/or purchase.
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http://www.sartorius.com/fileadmin/fm-dam/sartorius_media/Lab-Products-and-Services/Lab-Filtration/Cell-Culture/Centrifuges/Catalogues/Cata_Centrifuges_SL-1512...
verschließbar mit Hermetikdeckel 17893 | sealable with hermetic lid 17893 .
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2008 Index IEEE Transactions on Components and Packaging Technologies Vol. 31
Fluxless Hermetic Lid Sealing Using Electroplated Sn-Rich Solder; TCAPT Sept. 2008 719-725 Kim, J. S., Wang, P. J., and Lee, C. C., .
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http://etd.auburn.edu/bitstream/handle/10415/2332/Ping%20Zheng%20dissertaion%202010.pdf?sequence=2
thin film metallization, die attach materials and processing, wire bonding, and hermetic lid .
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Wafer-Level Packaging Technology for 10 Gbps TOSAs
However, this new platform adds a hermetic lid directly on the SiOB, complete with hermetic RF / DC and optical feedthroughs.
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Thermal performance of an MCM flip-chip assembly in liquid nitrogen
A standard hermetic lid increased the overall thermal resistance to nearly 4 K/W due to the presence of a 10 mil gas gap between the lid and the flip-chips.
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Biomass Conversion
Put the hermetic lid and seal the pan using a press (Fig. 1c).
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2006 IEEE MTT-S Exhibition Guide as of March 20
J. Alfano Microelectronic packaginig materials, hermetic lids , solder and braze alloys1 bonding wire.
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Comparative effects of vetiver oil, nootkatone and disodium octaborate tetrahydrate on Coptotermes formosanus and its symbiotic fauna
All the wood slices used for the experiment were prepared and treated on January 2000 and maintained in separate transparent plastic enclosures with non- hermetic lids in a dark room at room temperature (26°C).
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Process development for electron beam joining of ceramic and glass components
Controlled cool-down, Bonded, not Hermetic Lid cracked,suspected fromprevious damage.
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A fully integrated wafer-scale sub-mm3 FBAR-based wireless mass sensor
Since an IC wafer is used as the hermetic lid , it can theoretically use any type of IC process, reducing development cost and increasing design flexibility.