High Dielectric Potting Compounds

Description: 20-2162 is a unique high performance two component urethane system. The 20-2162 is engineered for demanding applications where flow control is necessary to limit mold leaking, seeping around cable entries and substrate wicking. This product offers outstanding durability and adhesion to a

• Viscosity: 750 to 1,200 cP
• Thermal Conductivity: 0.297109474 W/m-K
• Tensile Strength (Break): 800 psi
• Elongation: 200 %

Description: Product Overview UR5118 is a highly water-resistant, RF polyurethane resin developed as an ultra-high-performance encapsulation and potting compound, offering a high level of protection in various operating environments while delivering excellent electrical properties.

• Use Temperature: -76 to 257 F
• Thermal Conductivity: 0.2 W/m-K
• Dielectric Strength: 457.20000000000095 kV/in
• Dielectric Constant (Relative Permittivity): 3.1

Description: 20-2145 is an unfilled, high performance, electronic grade urethane system. This material has a 1:1 mix ratio, is very low in viscosity, and offers outstanding physical, thermal, and electrical properties. 20-2145 has very good adhesion to most substrates, low exotherm during cure, low

• Viscosity: 1,300 cP
• Use Temperature: -58 to 257 F
• Thermal Conductivity: 0.40383812 W/m-K
• Tensile Strength (Break): 820 psi

Description: Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient of thermal expansion.

• Applied Thickness / Gap Fill: 0.003 to 0.006 inch
• Viscosity: 40,000 to 80,000 cP
• Use Temperature: -100 to 400 F
• Coeff. of Thermal Expansion (CTE): 7,222,222.222222222 to 8,888,888.888888888 µin/in-F

Description: Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of

• Use Temperature: -54 to 260 F
• Features: Electronics, Encapsulating / Potting
• Chemical System: Rubber Based / Elastomeric, Silicone

Description: Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of

• Use Temperature: -54 to 260 F
• Features: Electronics, Encapsulating / Potting
• Chemical System: Rubber Based / Elastomeric, Silicone

Description: Sauereisen Thermal Potting Cement No. 11 is primarily used where high electrical insulation and thermal conductivity are desired. No. 11 is a chemical-setting cement ideal for potting applications subject to high temperature and thermal shock. Thermal Potting

• Use Temperature: 2,200 F
• Thermal Conductivity: 0.70671671 W/m-K
• Coeff. of Thermal Expansion (CTE): 3.4 µin/in-F
• Tensile Strength (Break): 100 psi

Description: Sauereisen Zircon Potting Cement No. 13 is primarily used where high electrical insulation and thermal conductivity are desired. No. 13 cures by a chemical-set and is ideal for potting applications subject to high temperature and/or thermal shock. Formulated as an

• Use Temperature: 2,600 F
• Thermal Conductivity: 1.1538232 to 1.5865069 W/m-K
• Coeff. of Thermal Expansion (CTE): 2.5999999999999996 µin/in-F
• Tensile Strength (Break): 740 psi

Description: Master Bond Polymer System UV15X-5 is a newly developed one component, non-yellowing, UV curable urethane elastomer system possessing high flexibility and outstanding abrasion resistance. This high viscosity system can be used for bonding, sealing, coating and casting. Master Bond

• Viscosity: 240,000 cP
• Use Temperature: -80 to 250 F
• Thermal Conductivity: 0.029 W/m-K
• Coeff. of Thermal Expansion (CTE): 83 µin/in-F

Description: Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E

• Use Temperature: 266 F
• Thermal Conductivity: 0.41826091 W/m-K
• Elongation: 120 %
• Tensile Strength (Break): 1,200 psi

Description: 20-2100 is a high performance two component flexible urethane system. This easy to use polyurethane is very low in viscosity and ideal for potting or encapsulating delicate electronic components. 20-2100 exhibits very low shrinkage, stress, and exotherm throughout the cure cycle. This

• Viscosity: 1,600 cP
• Use Temperature: -67 to 266 F
• Coeff. of Thermal Expansion (CTE): 83.33333333333333 µin/in-F
• Tensile Strength (Break): 1,600 psi

Description: DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity) Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT

• Use Temperature: 248 F
• Thermal Conductivity: 0.21634185 W/m-K
• Elongation: 9.5 %
• Tensile Strength (Break): 6,370 psi

Description: Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented.

• Use Temperature: 257 F
• Thermal Conductivity: 0.21634185 W/m-K
• Elongation: 275 %
• Tensile Strength (Break): 1,800 psi

Description: Shore 90-95 A, elastomeric coatings that have been specifically designed to reproduce exact surface details. DI-COAT E-4599 is excellent for electrical insulation applications requiring non or low sag materials. DI-COAT E-4599 are formulated to withstand high wear continuous service.

• Use Temperature: 194 F
• Elongation: 325 %
• Tensile Strength (Break): 2,500 psi
• Dielectric Strength: 350.0000000000002 kV/in

Description: SEMICOSIL® 925 is a high purity, one-component addition curing RTV-2 silicone gel. Special features Low ion content Low volatile content Low viscosity Good mechanical damping properties Application SEMICOSIL® 925 is a dielectric gel especially designed to seal, protect and preserve the

• Viscosity: 700 cP
• Dielectric Strength: 558.8000000000012 kV/in
• Dielectric Constant (Relative Permittivity): 2.5
• Features: Electrical Insulation / Dielectric Material, Electronics, Encapsulating / Potting Compound, Flexible / Dampening, Liquid

Description: Dow DOWSIL™ Q3-6575 Dielectric Gel Clear is a two component, heat curing, low temperature, silicone gel that is used for protecting and sealing electronic devices from high voltages, moisture, mechanical and thermal shock. 1:1 mix ratio by weight or volume. 0.9 kg Kit.This is a Dow

• Viscosity: 750 cP
• Dielectric Strength: 457.20000000000095 kV/in
• Features: Electrical Insulation / Dielectric Material, Encapsulating / Potting Compound
• Chemical System: Silicone

Description: RTV627 is a two part silicone rubber compound from Momentive Performance Materials designed for potting and encapsulation applications. It is especially favoured where flammability is of concern. Supplied in a matched kit which is designed for use at a 1:1 ratio by weight or volume.

• Use Temperature: -60 to 204 F
• Features: Electronics, Encapsulating / Potting
• Chemical System: Rubber Based / Elastomeric, Silicone

Description: RTV615 is crystal clear potting silicone from Momentive Performance materials which is widely known for its optical clarity benefits. Ideal for evaluation in applications such as potting solar cells for maximum light transmission and on electronic assemblies where component

• Use Temperature: -60 to 204 F
• Features: Encapsulating / Potting, Medical / Food (Sanitary / FDA)
• Chemical System: Rubber Based / Elastomeric, Silicone

Description: Master Bond Supreme 112 is a two part epoxy for bonding, sealing, potting, and impregnation applications with a high glass transition temperature of 190-195°C and very low viscosity.

• Applied Thickness / Gap Fill: 0.003 to 0.005 inch
• Viscosity: 50 to 200 cP
• Use Temperature: -80 to 550 F
• Tensile Strength (Break): 11,000 to 12,000 psi

Description: Dow DOWSIL™ Q3-6575 Dielectric Gel Clear is a two component, heat curing, low temperature, silicone gel that is used for protecting and sealing electronic devices from high voltages, moisture, mechanical and thermal shock. 1:1 mix ratio by weight or volume. 35 kg Kit.

• Viscosity: 750 cP
• Elongation: 300 %
• Dielectric Strength: 457.20000000000095 kV/in
• Features: Electrical Insulation / Dielectric Material, Encapsulating / Potting Compound

Description: Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting.

• Applied Thickness / Gap Fill: 0.003 to 0.006 inch
• Viscosity: 800 to 1,200 cP
• Use Temperature: -452.47 to 250 F
• Coeff. of Thermal Expansion (CTE): 38,888,888.88888889 to 44,444,444.44444444 µin/in-F

Description: 20-3660 is an electronic grade, 100% solids, epoxy resin system. In addition to it’s high temperature resistance, 20-3660 also provides outstanding physical properties at elevated temperatures.

• Use Temperature: -4 to 446 F
• Thermal Conductivity: 0.54806602 W/m-K
• Tensile Strength (Break): 14,000 psi
• Dielectric Strength: 419.99999999999983 kV/in

Description: Dow DOWSIL™ 3-4155 HV Dielectric Gel Clear-Green is a two component, high viscosity, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It cures quickly at room temperature, offers flexibility, thermal

• Viscosity: 1,925 cP
• Dielectric Strength: 400.00000000000006 kV/in
• Features: Electrical Insulation / Dielectric Material, Electrical Power / HV, Encapsulating / Potting
• Chemical System: Silicone

Description: DuPont Duroptix™ OE-6636 Optical Resin Clear is a two component, heat curing, silicone encapsulant that is used for applications in the LED and Optical markets. It provides excellent dielectric properties, thermal stability, high purity, and moisture resistance. 1.5 kg Kit.

• Elongation: 100 %
• Tensile Strength (Break): 565 psi
• Dielectric Strength: 939.800000000002 kV/in
• Viscosity: 5,100 to 13,000 cP

Description: Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS 1. Type of Application Potting,

• Use Temperature: 1,796 to 2,597 F
• Thermal Conductivity: 0.5769116 to 1.5865069 W/m-K
• Coeff. of Thermal Expansion (CTE): 6.2 to 12.999999999999998 µin/in-F
• Tensile Strength (Break): 325 to 1,500 psi

Description: HT can be used as a coverfilm, offering good coverage over circuits, or as a bonding material for multilayer flex applications. This material system is ideal for multilayer flex and rigid flex applications which require high operating temperature performance, advanced material performance,

• Use Temperature: 437 F
• Coeff. of Thermal Expansion (CTE): 36.11111111111111 µin/in-F
• Tensile Strength (Break): 23,931.0784939375 psi
• Elongation: 170 %

Description: OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics,

• Use Temperature: 392 F
• Thermal Conductivity: 2.3076464 W/m-K
• Features: Air Setting / Film Drying, Ceramic / Glass, Encapsulating / Potting, Grease / Paste, Metal, Paper / Paperboard, Plastic, Thermal / Heat Conductive
• Type: Electrical Insulation / Dielectric

Description: We have served the optical market since 301 was introduced in 1969.  Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser, telescope,

• Viscosity: 4,000 to 6,000 cP
• Use Temperature: 662 F
• Coeff. of Thermal Expansion (CTE): 53.33333333333333 to 97.22222222222221 µin/in-F
• Dielectric Constant (Relative Permittivity): 3.48

Description: LOCTITE STYCAST E 2534 FR CAT 9, Epoxy, Potting LOCTITE® STYCAST E 2534 FR CAT 9 epoxy potting compound complies with recent demands on environmentally friendly products and does not contain brominated flame retardants. LOCTITE STYCAST E 2534 FR CAT 9 can be used with a variety

• Use Temperature: 40 to 302 F
• Thermal Conductivity: 1.5 W/m-K
• Coeff. of Thermal Expansion (CTE): 21.666666666666668 µin/in-F
• Viscosity: 350,000 cP

Description: has a low dielectric constant for high-frequency applications. This encapsulating material may be used in attaching FPCs to various substrates including PCB and glass. Dymax materials have no solvents added and cure upon exposure to light. Their ability to cure in seconds results in

• Viscosity: 4,500 cP
• Features: Encapsulant / Potting Compound, Other
• Cure / Technology: UV / Radiation Cured (also EB, Light)

Description: "Elastomer - RTV 2 - polyaddition heat curing - High optical clarity Solventless, Very low viscosity, Quick curing, Long potlife, Good thermal resistance, Excellent dielectric performances " Properties Viscosity 4000 Hardness Sha 52 Description Potting of electronic,

• Thermal Conductivity: 0.16 W/m-K
• Tensile Strength (Break): 899.228404014621 psi
• Elongation: 115 %
• Viscosity: 750 to 4,000 cP

Description: excellent adhesion performance to a variety of substrates, excellent resistance to a variety of environmental stimuli, low viscosity, high dielectric strength and improved flexibility at low temperatures. These naturally occurring raw materials maintain a wide operating temperature

• Use Temperature: -40 to 302 F
• Elongation: 600 %
• Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
• Features: Electronics, Encapsulant / Potting Compound, Pellets / Solid Form, UL Approved

Description: 170°C), are UL approved and are available in customizable color options. TECHNOMELT PA 341 High dielectric for high-voltage applications. Applications: Increased Hardness Performance Temperature: -25°C to 125°C Color: Blaze Orange Shore Hardness: 92A

• Use Temperature: -13 to 257 F
• Elongation: 600 %
• Dielectric Strength: 1,529.9999999999995 kV/in
• Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive

Description: excellent adhesion performance to a variety of substrates, excellent resistance to a variety of environmental stimuli, low viscosity, high dielectric strength and improved flexibility at low temperatures. These naturally occurring raw materials maintain a wide operating temperature

• Use Temperature: -40 to 284 F
• Elongation: 600 %
• Water Absorption: 0.4 %
• Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive

Description: Sauereisen Insultemp Cement No. 10 is primarily used where high electrical insulation and thermal conductivity are desired. No. 10 is a phosphate-bonded material that cures by a chemical-set and is ideal for potting applications subject to high temperature and/or thermal shock.

• Use Temperature: 2,400 F
• Thermal Conductivity: 1.442279 to 2.3076464 W/m-K
• Coeff. of Thermal Expansion (CTE): 5 µin/in-F
• Tensile Strength (Break): 300 psi