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Supplier: Belmont Metals, Inc.
Description: Solders Featuring Body solders, Lead-base, Lead-free solders, Low melting solders, Miter-Al-braze (MAB), Tin-Antimony solders, Tin-base, Tin-Cadmium solders, Tin-Lead solders, Tin-Zinc solders Soldering is a process in
- Features: Solid Wire
- Solder Alloy: Tin-Lead (Sn-Pb)
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Supplier: Belmont Metals, Inc.
Description: Solders Featuring Body solders, Lead-base, Lead-free solders, Low melting solders, Miter-Al-braze (MAB), Tin-Antimony solders, Tin-base, Tin-Cadmium solders, Tin-Lead solders, Tin-Zinc solders Soldering is a process in
- Features: Other
- Solder Alloy: Tin-Lead (Sn-Pb)
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Supplier: Indium Corporation
Description: SMQ®51-SC is a dispensing solder paste designed and formulated specifically for die-attach processes. Considerable care has been taken to produce a product that gives reliable dispensing of a consistent size deposit in automated dispensing equipment. When used with high temperature
- Features: Other
- Product Form: Paste
- Solder Alloy: Tin-Lead (Sn-Pb)
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Supplier: Belmont Metals, Inc.
Description: Solders Featuring Body solders, Lead-base, Lead-free solders, Low melting solders, Miter-Al-braze (MAB), Tin-Antimony solders, Tin-base, Tin-Cadmium solders, Tin-Lead solders, Tin-Zinc solders Soldering is a process in
- Features: Other, Solid Wire
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview Kester Tin-Lead (SnPb) is the industry standard bar solder for use in high tech electronic applications where lower surface tension and hole filling ability are essential. The purity of our solder meets the requirements of IPC/J-STD-006C and will conform
- Solder Alloy: Tin-Lead (Sn-Pb)
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Supplier: Accuris
Description: Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-free Solder
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Supplier: Indium Corporation
Description: Lead (Pb)-containing solders have been used for many years for wafer and substrate-bumping applications. Most recently, these solders have been replaced by Sn-based Pb-free solders; however, the majority of cutting-edge applications, such as copper pillar/microbump, have
- Solder Alloy: Lead Free
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview ALPHA High Lead Die Attach Preforms are constructed with 99.99% (4N) purity PbSn, PbSnAg, and PbSb alloys. To minimize oxidation during storage and shipping, these products are packaged in glass jars flooded with Argon and are hermetically sealed. These products are
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Supplier: Lake Shore Cryotronics, Inc.
Description: This solder has a higher lead content than normal electronics solder, and can be used for connecting hardware for use at cryogenic temperatures. Its higher melting point also makes it perfect for soldering leads to silicon diode, platinum, or rhodium-iron temperature
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Supplier: Accuris
Description: (R) Standard for Developing a Lead-Free Control Plan to Manage the Risks of Lead-Free Solders and Finishes in Aerospace, Defense, and High-Performance Soldered Electronic Products
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Supplier: Accuris
Description: Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-free Solder and F inishes
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Supplier: SAE International
Description: This standard defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that ADHP electronic systems containing Pb-free solder, piece parts, and PBs will satisfy the applicable requirements for performance, reliability, airworthiness,
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Supplier: SAE International
Description: GEIA-STD-0005-1, "Performance Standard for High Performance Electronic Systems Containing Pb-Free Solder." This document also contains lessons learned from previous experience with Pb-Free aerospace electronic systems. The lessons learned give specific references to solder
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Supplier: Indium Corporation
Description: Indium Corporation bar solder is a high purity material manufactured to provide consistent and reliable performance manufactured per J-STD. Bars are rectangular in shape (1.66 lbs./ each). 15 bars per box. 25 lbs. per box Minimum order quantity is 25 lbs.
- Features: Other
- Solder Alloy: Tin-Lead (Sn-Pb)
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Supplier: SAE International
Description: Pb-free solder and assembly processes. This standard does not include detailed descriptions of the processes to be documented in an LFCP, but lists high-level requirements for ADHP soldered electronic products using Pb-free materials and assembly processes, such as requirements for
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Supplier: Allied Electronics, Inc.
Description: The Best Choice for Lead-Free Wave Soldering SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of
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Supplier: Allied Electronics, Inc.
Description: The Best Choice for Lead-Free Wave Soldering SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of
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Supplier: Henkel Corporation - Electronics
Description: Multicore LF318 solder paste is a halide-free, no clean, pin testable Pb-free solder paste which has excellent humidity resistance and a broad process window both for reflow and printing. View or Download the High Reliability PB-Free Solder Alloy
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Supplier: Allied Electronics, Inc.
Description: The Best Choice for Lead-Free Wave Soldering SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of
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Supplier: Allied Electronics, Inc.
Description: The Best Choice for Lead-Free Wave Soldering SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of
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Supplier: Littelfuse, Inc.
Description: and termination methods Devices compatible with high-volume electronics assembly Lead-free, halogen-free, and RoHS compliant
- Features: Resettable
- Approvals / Standards: RoHS Compliant
- Mounting: Solderable (with leads)
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Supplier: Littelfuse, Inc.
Description: Components. Overcurrent and overvoltage circuit protection devices Resettable and single-use overcurrent devices Wide range of form factor and termination methods Products meet applicable automotive industry standards Devices compatible with high-volume electronics assembly Lead-free,
- Features: Resettable
- Approvals / Standards: RoHS Compliant
- Mounting: Solderable (with leads)
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Supplier: Littelfuse, Inc.
Description: Components. Overcurrent and overvoltage circuit protection devices Resettable and single-use overcurrent devices Wide range of form factor and termination methods Products meet applicable automotive industry standards Devices compatible with high-volume electronics assembly Lead-free,
- Features: Resettable
- Approvals / Standards: RoHS Compliant
- Mounting: Solderable (with leads)
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Supplier: Henkel Corporation - Electronics
Description: MulticoreLF328 is a halide-free no-clean Pb-free solder paste that has excellent humidity resistance and a broad process window for both reflow and printing. Offers high tack to resist component movement during high-speed placement, long printer abandon times and excellent
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Supplier: Bonomi North America, Inc.
Description: High Flow Rate Spring Loaded Lead Free Brass Check Valve w/ Solder Ends
- Valve Size: 2 inch
- Pressure Rating: 175 to 400 psi
- Media Temperature: 10 to 210 F
- Primary Material: Brass / Bronze
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Description: IEC/PAS 62647-1:2011(E) defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that aerospace and high performance electronic systems containing Pb-free solder, piece parts, and boards will satisfy the applicable
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Supplier: Cleaning Technologies Group
Description: Benefits and Applications Ultrasonic energy introduced into a dip solder pot eliminates the need for flux while enhancing many soldering processes. It also provides a means to bond solder to a number of materials including aluminum and glass that are difficult or impossible to
- Equipment Type: Complete System
- Features: Hot Dip Soldering
- Process Capability: Soldering Equipment
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Supplier: Watts
Description: Series LFU5B-Z3 Lead Free* High Performance Water Pressure Reducing Valves are used in commercial, industrial, and residential applications to reduce incoming water pressure for protection of plumbing system components and to reduce water consumption. It consists of a Lead Free*
- Valve Size: 0.5 to 2 inch
- Valve Type: Pressure Relief Valves
- Media: Water
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Supplier: Metcal
Description: New Dual Port Simultaneous Soldering and Rework System highly effective for soldering applications including: lead-free, high mass components or boards, thermally sensitive components requiring low operating temperature, high volume production soldering and touch-up soldering
- Equipment Type: Complete System
- Process Capability: Rework / Desoldering, Soldering Equipment
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Supplier: Nordson EFD
Description: low-temperature and high-temperature reflow and leaded and lead-free alloys in all flux types and alloy particle sizes. Whether soldering electrical connections in recessed areas on PCBs or tabbing and stringing solar cells, EFD makes pastes that exceed soldering expectations. To help
- Features: Other
- Product Form: Paste
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Supplier: Henkel Corporation - Electronics
Description: (Known as Multicore LF318 No-Clean Solder Paste: Lead-Free (97SC AGS 88.5) ) LOCTITE LF 318 97SCAGS88.5 BU is a halide-free, no clean, pin testable Pb-free solder paste which has excellent humidity resistance and a broad process window both for reflow and printing. View or
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Supplier: MacDermid Alpha Electronics Solutions
Description: A no-clean solder paste that meets the demands of tin-lead soldering when lead-free components are present in circuit assembly. Product Overview ALPHA OM-5300 is a zero halogen, no clean solder paste developed to meet the demands of tin lead soldering when
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview ALPHA OM-377 is a lead-free, no-clean solder paste engineered for superior electrochemical reliability in fine-pitch, low-standoff SMT assemblies. Optimized for high-density PCB applications and ultra-miniaturized components down to 01005, it delivers excellent
- Solder Alloy: Lead Free
- Product Form: Paste, Powder
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Description: IEC/PAS 62647-23:2011(E) provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional
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Description: reliability, safety, airworthiness, configuration control, affordability, maintainability, and supportability of high performance aerospace systems (subsequently referred to as AHP) both during and after the transition to Pb-Free electronics.
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ALPHA HRL3 is a lead-free, low temperature, high reliability alloy for use application where low temperature processing is desired. ALPHA HRL3 is available in solder sphere format for ball mount application. The alloy was designed to exhibit improved drop shock and thermal (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
standards, including flammability requirements. The project demanded high precision, durability, and compliance with aerospace regulations. Mars Metal engineered and produced custom-sewn 20 lb lead shot bags with # 8 chilled lead shot sewn into them. The lead shot density was 436 lbs. per cubic (read more)
Browse Lead, Tin, and Low Melting Alloys Datasheets for MarsMetal -
Options include: Substrate material Inner solder Cold and hot side metalization Type of lead wires Mounting of the micro-coolers to the different types of headers, sockets, and housings. (read more)
Browse Gas Sensors Datasheets for Electro Optical Components, Inc. -
Stainless Steel ensuring low contact resistance and superior solder joints where lead-free soldering or reflow processes are employed. Click Here to learn more about all of Keystone's High Performance Battery Holders for Cylindrical Battery's (read more)
Browse Battery Holders Datasheets for Keystone Electronics Corp. -
1-1886HCSP2 is available in a lead-free, RoHS compliant 2.5x2.5 mm chip scale surface mount package (CSP2) and is compatible with standard leaded and lead-free PCB reflow soldering processes. (read more)
Browse RF Mixers Datasheets for Marki Microwave LLC -
specifically designed without polarity tabs which typically restrict proper connectivity of 10450 lithium cells. Spring contacts are made from Steel with Nickel Plating assuring low contact resistance and superior solder joints where lead-free soldering or reflow processes are employed. This new (read more)
Browse Battery Holders Datasheets for Keystone Electronics Corp. -
TEMPERATURE SOLDER Aluminum melts at a relatively low 660ºC (1220ºF), which combined with its high heat capacity makes it almost impossible to solder using general-purpose solders. At Ambrell, we adjust the solder to your brazing application needs. In all cases, avoid (read more)
Browse Induction Heaters Datasheets for Ambrell Induction Heating Solutions -
factor. The MM1-0626SSM is available in a lead-free, RoHS compliant QFN surface mount package and is compatible with standard leaded and lead-free PCB reflow soldering processes. The MM1-0626SSM is a superior alternative to Marki Microwave surface mount M1 and M3 mixers. Datasheet (read more)
Browse RF Mixers Datasheets for Marki Microwave LLC -
/reel) Compatible with automated SMT assembly Compatible with lead-free IR reflow, wave soldering, and hand soldering (read more)
Browse Circuit Protection Components Datasheets for VICFUSE -
propensity for whiskering while providing a lower melting point for reflow and a higher resistance to mechanical stress. The process is suited for high-speed electrodeposition producing smooth surface morphology, and solderable reflowed bumps with tight control alloy compositions. “To (read more)
Browse Plating Chemicals and Anodizing Chemicals Datasheets for MacDermid Alpha Electronics Solutions
Conduct Research Top
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High Melting Lead-Free Mixed BiAgX (R) Solder Paste System
Although lead-free soldering has been main stream in the industry since 2006 with the replacement of the eutectic SnPb system by the SnAgCu system, the development of drop-in lead-free alternatives for high melting high lead solder alloys is still far from mature.
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Why Lead-Free Soldering is Better
It's been a year since the Waste Electrical and Electronic Equipment Directive and the Restriction of Hazardous Substances Directive (RoHS) have mandated that lead be eliminated from electronic systems. Consequently, this has led engineers to a high interest in using lead-free soldering alloys
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Solder Joint Analysis of Tin-Lead and Bismuth-based Lead-free PV Ribbons in High Throughput Manufacturing
applied it but also strongly impacts yield and throughput of the entire module factory. This paper analyses solder joints and factors affecting solder joints in high throughput manufacturing.
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How to Choose a Solder
hazardous materials) are banned from the European Union as part of the Restriction of Hazardous Substances (RoHS). Lead-free solder may contain many metals including silver, copper, tin, bismuth, indium, zinc and antimony. Hard solders have a high melting point and are usually made with a high
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AN103- HAND SOLDERING LARGE RADIAL LEADED CERAMIC CAPACITORS
During the hand soldering process, use caution when using a soldering iron on high voltage ceramic capacitors. The following application note is intended for a general reference on using a soldering iron.)
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What's the Ceramic Heater for Soldering Iron
Innovacera heating element is the PROCESS of MCH (Metal Ceramics Heater). It is the material of tungsten, molybdenum, molybdenum, manganese, and other high melting points Metal heating resistance paste is printed on 92 ~ 96% alumina flow ceramic green billet according to the requirements of heating
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Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering
This paper touches on identifying favorable flux properties, down-selecting low solids fluxes for lead-free selective wave soldering, the selective soldering process itself, and testing criteria. Topics reviewed will be the flux selection, optimizing the selective soldering process by varying
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Achieving High-Reliability Low-Cost Lead-Free SAC Solder Joints via Mn Doping
In this study, the reliability of low-Ag SAC alloy doped with Mn (SACm (R)) was evaluated under JEDEC drop, dynamic bending, thermal cycling, and cyclic bending test conditions and compared to eutectic SnPb, SAC105, and SAC305 alloys.
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Lead-free Electronics
-.in UBM is usually used with high lead solders as this alloy has limited Sn to react with UBM and leaves the users less worry of de-wetting.
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Lead-Free Solder Interconnect Reliability
Figure 17 is a plot of fracture energy versus temperature for Sn-5.0Ag solder and a high lead solder , 93.5Pb-5.0Sn-1.5Ag.
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An Investigation of Carboxylic Acids as Corrosion Inhibitors in Engine Coolant
These included the addition of a high lead solder specimen (97.0% lead, 2.5% tin, and 0.5% silver), a modified beaker, and the use of fine pumice for cleaningthe aluminum specimens.
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High Melting Lead-Free Mixed BiAgX Solder Paste System
…lead-free soldering has been main stream in the industry since 2006 with the replacement of the eutectic SnPb system by the SnAgCu system, the development of drop-in lead-free alternatives for high melting high lead solder alloys is still far…
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Advanced Flip Chip Packaging
This UBM structure, which is evaporated through a molybdenum shadow mask, has been demonstrated to be extremely reliable for high lead solders (97/3 and 95/5).
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Interfacial Reactions of Si Die Attachment with Zn-Sn and Au-20Sn High Temperature Lead-Free Solders
on Cu Substrates
This research was supported in part by a grant from the NEDO project ‘‘R&D of alternatives to high temperature high lead solder ’’.
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High-temperature lead-free solders: Properties and possibilities
This research was supported in part by a grant from the NEDO project R&D of Alternatives to High Tempera- ture High Lead Solder .
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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Lead-based solders se- lected include high lead solders such as 92.5Pb-5Sn-2.5Ag, 97.5Pb-2.5Sn, near eutectic Sn-Pb solders such as 60Sn-40Pb and 62Sn-36Pb-2Ag, lead free solders for 96.5Sn-3.5Ag and…
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