High Temperature Dielectric Materials

Description: At Jaro Corp, we manufacture and apply our own dielectric coating: JARO 650 Series Polyimide. This coating is a proprietary polyimide thermo set material, offering outstanding characteristics which include: Remarkable resistance to high temperatures. It also performs well

• Chemistry: Other
• Dielectric Strength: 1.22E8 V/m
• Features: Chemical / Oil Resistant, Dielectric, Heat Resistant / High Temperature, Weather / UV Resistant, Other
• Form: Aerosol

Description: A machinable glass ceramic material with exceptional engineering qualities is called Macor. Unlike other ceramic materials, Macor can be machined using standard metalworking tools. This problem-solving substance blends the technical ceramic's efficiency with the high-performance

• Density: 2.6 g/cc
• Dielectric Strength: 4.00E7 V/m
• Max Use Temperature: 1000 C
• Shape / Form: Plate / Board (e.g., Fiberboard)

Description: size and dielectric layer thickness, the xCaTiO\u2083 - (1-x)CaMeO\u2083 system is a strong candidate for integration into future power electronics applications. To further improve the high temperature, high field reliability of these material systems, rare earth

Description: High Temperature Co-fired Ceramic (HTCC) is a popular material choice for hermetic packaging due to its desirable electrical properties, high mechanical strength and good thermal conductivity. AdTech Ceramics manufactures its proprietary HTCC blend which allows for

Description: Dielectric Sheet is a cellular based laminate impregnated with thermosetting resins. Manufactured under high pressure and temperature into dense, uniform sheets having good electrical and mechanical properties. This material conforms to Nema XX thickness and flatness

• Material Type / Grade: UL Approved

Description: Dynatex Dielectric Grease is a silicon dioxide thickened, very high molecular weight dimethyl polysiloxane-based material. It is an extremely stiff, tacky, tenacious compound with excellent water repellency even to seawater. It has outstanding high-temperature and vacuum

• Operating / Use Temperature: 40 to 400 F
• Type: Grease / Gel

Description: Mechanical Strength Pressures over 10,000 PSI High Temperature Usage Low Dielectric Loss Mass Spectrometer Leak Tested High Chemical Stability

• Feedthrough Type: Electrical

Description: , sealing, encapsulating, assembling, bonding. Is a thick or thin film of cement required? This dictates whether or not an air set or a chemical set cement can be used. 2. Thermal Considerations What is the maximum temperature that the cement must withstand? What degree of thermal

• Coeff. of Thermal Expansion (CTE): 2.6 to 12.4 µin/in-F
• Cure Type / Technology: Single Component System, Two Component System
• Dielectric Constant (Relative Permittivity): 3 to 7
• Dielectric Strength: 1.3 to 101 kV/in

Description: Application Potting, sealing, encapsulating, assembling, bonding. Is a thick or thin film of cement required? This dictates whether or not an air set or a chemical set cement should be used. 2. Thermal Considerations What is the maximum temperature that the cement must withstand? What

• Coeff. of Thermal Expansion (CTE): 6.2 to 13 µin/in-F
• Cure Type / Technology: Single Component System, Two Component System
• Dielectric Constant (Relative Permittivity): 3.4 to 6
• Dielectric Strength: 1.3 to 51 kV/in

Description: We have served the optical market since 301 was introduced in 1969.? Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser, telescope,

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 18.89 to 71.67 µin/in-F
• Dielectric Constant (Relative Permittivity): 2.59
• Features: Thermal Insulation / Heat Insulating, Electrical Insulation / Dielectric Material

Description: Confidence in EV Battery Materials: Boyd’s Lab Reliable, high-performance battery materials are essential as demand for electric vehicles (EVs) surges. Boyd’s new EV battery materials test lab offers a faster, more comprehensive material testing solution to meet

• Industry Applications: Aerospace / Aviation, Automotive, Health Care / Medical, Military, Semiconductors / Electronics
• Materials: Fuel Cell / Battery Materials
• Regional Preference: North America, United States Only, Southwest US Only, Midwest US Only

Description: IEC 62631-3-4:2019 covers procedures for the determination of insulation resistance and volume resistivity of insulating materials by applying DC-voltage and temperatures up to 800 °C. The typical application materials include high temperature mica plate and

Description: Features Easy to achieve high number of layers Fine Line, small diameter via capabilities Various layer thicknesses available Capable of offering a Cavity structure Capable of creating surface resistors with trimming options Low resistance conductor material available for internal and

• Applications: Other
• Material Type: Alumina / Aluminum Oxide

Description: optimal performance where electrical insulative materials are needed. Its Tg exceeds 350°F, increasing the customer’s processing window through improved thermal mechanical properties. This makes it suitable for processing high-temperature composite prepregs, such as those found in

• Application: Other
• Bulk Density: 6 lbs/ft³
• Foam Type: Closed Cellular, Rigid
• Form / Shape: Stock Shape (Bar, Sheet, etc.), Board / Block / Bun

Description: We have served the optical market since 301 was introduced in 1969.? Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser, telescope,

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 28.33 to 99.44 µin/in-F
• Composition: Two Component System
• Cure Type / Technology: Thermosetting / Crosslinking

Description: LyTherm® Premium Grade Paper is a lightweight refractory material processed from highly washed, spun, high purity alumina silica fibers formed into a highly flexible sheet. It is recommended for continuous use at temperatures up to 2300°F(1260°C) in applications requiring

• Applications: Fire Proofing / Thermal Protection, Other
• Electrical Resistivity: 55 Ohm-cm
• Overall Thickness: 0.0625 to 0.3750 inch
• Overall Width / OD: 12 to 24 inch

Description: or form Temperature stability Low thermal conductivity Low heat storage Resilient Light Weight Thermal shock resistant High heat reflectance Good dielectric strength Excellent corrosion resistance Applications: Parting plane in

• Applications: Fire Proofing / Thermal Protection, Other
• Electrical Resistivity: 50 Ohm-cm
• Fabric Strength: 4.85 to 5.29 lbs/in
• Overall Thickness: 0.0312 inch

Description: or form Temperature stability Low thermal conductivity Low heat storage Resilient Light Weight Thermal shock resistant High heat reflectance Good dielectric strength Excellent corrosion resistance Applications: Parting plane in

• Applications: Fire Proofing / Thermal Protection, Other
• Electrical Resistivity: 50 Ohm-cm
• Fabric Strength: 11.46 to 13.23 lbs/in
• Overall Thickness: 0.1250 inch

Description: or form Temperature stability Low thermal conductivity Low heat storage Resilient Light Weight Thermal shock resistant High heat reflectance Good dielectric strength Excellent corrosion resistance Applications: Parting plane in

• Applications: Fire Proofing / Thermal Protection, Other
• Electrical Resistivity: 50 Ohm-cm
• Fabric Strength: 5.95 to 7.05 lbs/in
• Overall Thickness: 0.0625 inch

Description: A number of alternative capacitor technologies have been studied and high-temperature extruded polymer film capacitors hold the promise to meet the critical needs for temperature, energy density, reliability, cost and availability. Polymer resins capable of continuous use up to 200°C

Description: SEMICOSIL® 925 is a high purity, one-component addition curing RTV-2 silicone gel. Special features Low ion content Low volatile content Low viscosity Good mechanical damping properties Application SEMICOSIL® 925 is a

• Compound Type: Encapsulating / Potting
• Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing
• Dielectric Constant (Relative Permittivity): 2.5
• Dielectric Strength: 559 kV/in

Description: 20-3066 is a 100% solids epoxy system which exhibits outstanding high temperature resistance. In addition to its' high temperature resistance, 20-3066 also has excellent chemical, solvent, and moisture resistance.

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Two Component System, Unfilled
• Cure Type / Technology: Thermosetting / Crosslinking
• Dielectric Constant (Relative Permittivity): 0.4000

Description: Birk Manufacturing has increased its product offering by introducing a new line of thin-film high temperature (HT) flexible heaters. These high-performance heating elements are capable of operating at temperatures up to 300°C. Their lightweight, low mass design allows for

• Heater Type: Other
• Maximum Operating (Sheath) Temperature: 572 F
• Sleeve (Sheath) Material: Polyimide

Description: 20-3660 is an electronic grade, 100% solids, epoxy resin system. In addition to it’s high temperature resistance, 20-3660 also provides outstanding physical properties at elevated temperatures.

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
• Dielectric Constant (Relative Permittivity): 3.5
• Dielectric Strength: 420 kV/in

Description: Machinable Glass Ceramic Rod Properties : Machinable Glass Ceramic rod with excellent compressive strength, high thermal insulating value, radiation immunity, and excellent dielectrical strength. Unlike plastics, whose temperature resistance and rigidity starts to fall off at as

• Material Type: Glass Ceramic, Silica / Silicate Materials
• Thermal Conductivity: 1.71 W/m-K

Description: . High purity sand deposits provide the raw material for bulk refractory grade, which is electric arc melted at extremely high temperatures. Optical and general purpose fused silica rods and tubing are drawn from a melt made from high purity chemicals. Fiber optic

• Material Type: Fused Silica, Silica / Silicate Materials
• Shape / Form: Fabricated / Custom Shape

Description: compound. These bonds retain their pertinent physical strength and chemical resistance properties after prolonged exposure to high temperatures. Typical lap shear strength are in the order of 2400-2500psi at ambient temperatures. After heat aging for 1000 hours at 500°F slightly

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Two Component System, Unfilled
• Cure Type / Technology: Thermosetting / Crosslinking
• Dielectric Constant (Relative Permittivity): 3.8

Description: products with complex shapes and high precision requirements. Although glass ceramics are brittle and hard materials, as long as the processing route and clamping mode are reasonably determined, the machining method is paid attention to, and the cutting parameters are accurately

• Material Type: Glass Ceramic, Silica / Silicate Materials
• Thermal Conductivity: 1.71 W/m-K

Description: . This material also offers electronic and semiconductor designers unmatched dielectric properties that are maintained over a wide frequency range. Unfilled UNITEM PEI is dark amber in color and semi-transparent. For applications that require improved stiffness, glass fiber

• Chemical / Polymer System Type: Polyetherimide (PEI)
• Elongation: 60 to 80 %
• Filler Material: Fiber Glass
• Form / Shape: Plate, Rod / Round Stock

Description: industries. This material also offers electronic and semiconductor designers unmatched dielectric properties that are maintained over a wide frequency range. Unfilled UNITEM PEI is dark amber in color and semi-transparent. For applications that require improved stiffness, glass

• Chemical / Polymer System Type: Polyetherimide (PEI)
• Elongation: 60 to 80 %
• Filler Material: Unfilled
• Form / Shape: Plate, Rod / Round Stock

Description: substrates and metal-dielectric hybrid coating. The BB.HR2 coating covers wavelengths from the UV to the visible to the IR. UV Fused Silica Substrates Fused Silica is synthetic amorphous silicon dioxide of extremely high purity. This non-crystalline, colorless silica glass combines

• Diameter/Width: 50.8 mm
• Mirror Coatings: Dielectric, Other Mirror Coating
• Mirror Materials: Fused Silica, Other Mirror Material
• Mirror Shape: Round, Other

Description: substrates and metal-dielectric hybrid coating. The BB.HR2 coating covers wavelengths from the UV to the visible to the IR. UV Fused Silica Substrates Fused Silica is synthetic amorphous silicon dioxide of extremely high purity. This non-crystalline, colorless silica glass combines a

• Diameter/Width: 25.4 mm
• Mirror Coatings: Dielectric, Other Mirror Coating
• Mirror Materials: Fused Silica, Other Mirror Material
• Mirror Shape: Round, Other

Description: optical qualities. Our cold mirrors exhibit high reflectance over the entire visible range and excellent transmission in the infrared. Manufactured using special proprietary techniques and coated with a multi layer dielectric coatings, they are the most durable commercially available

• Mirror Coatings: Dielectric

Description: Low thermal expansion Good thermal shock resistance Low dielectric constant and loss tangent Excellent machinability Chemically inert Corrosion resistant Not wet by most molten metals Extremely high working temperature

• Material Type: Boron Nitride
• Shape / Form: Tube / Sheath - Immersion (Closed End)

Description: use Tungsten steel drill when pursuit of high efficiency . Thread Tapping: The tapping of machinable ceramics is somewhat different from the tapping of metal materials. The gaps between the holes and the holes to be tapped should be larger than those of the metal

• Material Type: Glass Ceramic, Silica / Silicate Materials
• Thermal Conductivity: 1.71 W/m-K

Description: Dow DOWSIL™ Q3-6575 Dielectric Gel Clear is a two component, heat curing, low temperature, silicone gel that is used for protecting and sealing electronic devices from high voltages, moisture, mechanical and thermal shock. 1:1 mix ratio by weight or volume. 0.9 kg Kit.This is a

• Compound Type: Encapsulating / Potting
• Cure Type / Technology: Two Component System
• Dielectric Strength: 457 kV/in
• Features: Electrical Insulation / Dielectric Material

Description: We have served the optical market since 301 was introduced in 1969.? Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser, telescope,

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 29.44 to 81.11 µin/in-F
• Dielectric Constant (Relative Permittivity): 3.84
• Features: Thermal Insulation / Heat Insulating, Electrical Insulation / Dielectric Material

Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 17.22 to 78.89 µin/in-F
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
• Dielectric Constant (Relative Permittivity): 5.69

Description: 1.1 These test methods cover the determination of relative (Note 0) complex permittivity (dielectric constant and dissipation factor) of nonmagnetic solid dielectric materials. Note 0The word "relative" is often omitted. 1.1.1 Test Method A is for specimens precisely formed to

Description: 1.1 These test methods cover the determination of relative (Note 0) complex permittivity (dielectric constant and dissipation factor) of nonmagnetic solid dielectric materials. Note 0The word "relative" is often omitted. 1.1.1 Test Method A is for specimens precisely formed to

Description: 1.1 These test methods cover the determination of relative (Note 1) complex permittivity (dielectric constant and dissipation factor) of nonmagnetic solid dielectric materials. Note 1-The word “relative” is often omitted. 1.1.1 Test Method A is for specimens precisely

Description: 1.1 These test methods cover the determination of relative (Note 1) complex permittivity (dielectric constant and dissipation factor) of nonmagnetic solid dielectric materials. Note 1: The word "relative" is often omitted. 1.1.1 Test Method A is for specimens precisely formed

Description: Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F which gives it a higher resistance to elevated temperatures than most polysulfide systems.

• Applied Thickness / Gap Fill: 0.0040 to 0.0060 inch
• Chemical / Polymer System Type: Polysulfide, Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 3.06E7 to 3.33E7 µin/in-F
• Composition: Unfilled

Description: any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and bonded assemblies must exhibit superior dimensional stability. Shrinkage after cure is exceptionally low-0.0003 inches/in. EP30HT combines high temperature

• Chemical / Polymer System Type: Epoxy (EP)
• Coating Type: Electrical Insulation / Dielectric
• Coeff. of Thermal Expansion (CTE): 22 µin/in-F
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals,

• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Single Component System
• Features: Electrical Insulation / Dielectric
• Material Type: Grease / Paste

Description: Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300°F to 350°F for 60-90 minutes. Upon cure, EP13 readily attains

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Single Component System, Unfilled
• Cure Type / Technology: Thermosetting / Crosslinking
• Features: Electrical Insulation / Dielectric Material, Specialty / Other

Description: Dow DOWSIL™ Q3-6575 Dielectric Gel Clear is a two component, heat curing, low temperature, silicone gel that is used for protecting and sealing electronic devices from high voltages, moisture, mechanical and thermal shock. 1:1 mix ratio by weight or volume. 35 kg Kit.

• Compound Type: Encapsulating / Potting
• Cure Type / Technology: Two Component System
• Dielectric Strength: 457 kV/in
• Elongation: 300 %

Description: temperature of 800°C and a peak temperature of 1000°C. Its coefficient of thermal expansion readily matches most metals and sealing glasses. It is non-wetting, exhibits zero porosity, and unlike ductile materials, won't deform. It is an excellent insulator at high

• Applications: Electrical / HV Parts, Electronics / RF-Microwave, Other
• Coeff. of Thermal Expansion (CTE): 93 µm/m-C
• Dielectric Constant (Relative Permittivity): 5.67 to 6.03 #
• Dielectric Strength: 6.24E7 V/m

Description: temperature of 800°C and a peak temperature of 1000°C. Its coefficient of thermal expansion readily matches most metals and sealing glasses. It is non-wetting, exhibits zero porosity, and unlike ductile materials, won't deform. It is an excellent insulator at high

• Applications: Electrical / HV Parts, Electronics / RF-Microwave, Other
• Coeff. of Thermal Expansion (CTE): 93 µm/m-C
• Dielectric Constant (Relative Permittivity): 5.67 to 6.03 #
• Dielectric Strength: 6.24E7 V/m

Description: Aremco offers a broad range of machinable and fully-dense ceramic materials for applications in which high temperature insulation, thermal shock resistance and high dielectric strength are required. Aremcolox? and Super-Heat ceramics include compositions based on

• Applications: Chemical / Materials Processing, Dielectric / Electrical Insulation, Electrical / HV Parts, Electronics / RF-Microwave, Refractory / High Temperature Materials
• Density: 2.77 g/cc
• Dielectric Constant (Relative Permittivity): 6.8 #
• Glass Type: Glass Ceramic

Description: processing. Pyralux® HT can be used as a coverfilm, offering good coverage over circuits, or as a bonding material for multilayer flex applications. This material system is ideal for multilayer flex and rigid flex applications which require high operating temperature

• Chemical / Polymer System Type: Specialty / Other
• Coeff. of Thermal Expansion (CTE): 36.11 µin/in-F
• Dielectric Constant (Relative Permittivity): 3.2
• Dielectric Strength: 4089 to 6985 kV/in

Description: P66000 UPE ultra high molecular weight polyethylene film is made of UPE film as the base material and coated with special double-sided PET adhesive on one side. It is characterized by excellent abrasion resistance, low temperature resistance, electrical insulation, chemical

• Chemical / Polymer System Type: Polyethylene (PE)
• Elongation: 50 %
• Material Type / Grade: Dielectric / Electrically Insulating
• Overall Thickness: 0.0051 inch

Description: production manufacturing. Whatever your ceramic part design description is: Ceramic Support Rod, Spacer, Bushing, Standoff, Isolator, Insulator, Insert; Threaded or Epoxied, or High Temperature Fixturing, San Jose Delta has the resources to deliver your parts on time, competitively

• Applications: Abrasive / Erosive Wear Protection, Dielectric / Electrical Insulation, Electrical / HV Parts, Electronics / RF-Microwave, Refractory / High Temperature Materials, Wear Parts / Tooling
• Coeff. of Thermal Expansion (CTE): 8.5 µm/m-C
• Compressive / Crushing Strength: 303000 psi
• Density: 3.77 g/cc

Description: temperature of 800°C and a peak temperature of 1000°C. Its coefficient of thermal expansion readily matches most metals and sealing glasses. It is non-wetting, exhibits zero porosity, and unlike ductile materials, won't deform. It is an excellent insulator at high

• Applications: Electrical / HV Parts, Electronics / RF-Microwave, Other
• Coeff. of Thermal Expansion (CTE): 93 µm/m-C
• Dielectric Constant (Relative Permittivity): 5.67 to 6.03 #
• Dielectric Strength: 6.24E7 V/m

Description: -purity, sturdy, repeatable performance for high-temperature, processes including: Diffusers Insulators Susceptors Other custom thermal components INSULATORS Ceramic insulators combine strong dielectric properties with thermal stability and

• Insulator Type / Application: Disc Type Insulator
• Material: Ceramic
• Service: Indoor Insulator

Description: Dow DOWSIL™ 3-4155 HV Dielectric Gel Clear-Green is a two component, high viscosity, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It cures quickly at room temperature, offers flexibility,

• Compound Type: Encapsulating / Potting
• Cure Type / Technology: Two Component System
• Dielectric Strength: 400 kV/in
• Features: Electrical Insulation / Dielectric Material

Description: in high volume manual assemblies. BERGQUIST HI FLOW THF 1600P is designed for use as a thermal interface material between electronic power devices requiring electrical isolation to the heat sink. BERGQUIST suggests the use of spring clips to assure constant pressure with the interface

• Chemical / Polymer System Type: Silicone
• Features: Phase Change
• Thermal Conductivity: 1.6 W/m-K
• Use Temperature: 302 F