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Supplier: OMEGA Engineering, Inc.
Description: products. OMEGABOND and OMEGATHERM products are compounded and packaged for convenient, easy mixing and application. Each formulation exhibits important characteristics necessary for accurate, fast, reliable temperature measurement. These are: good adhesion and strength, high
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Material Form: Grease / Paste
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Supplier: OMEGA Engineering, Inc.
Description: OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Material Form: Grease / Paste
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 18.33 to 72.22 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 17.22 to 78.89 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Description: The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m·K. ? Low thermal impedance, with a minimum of 0.015 ?*in²/W at 30psi
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Material Form: Grease / Paste
- Thermal Conductivity: 3 W/m-K
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Description: The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m·K. ? Low thermal impedance, with a minimum of 0.015 ?*in²/W at 30psi
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Material Form: Grease / Paste
- Thermal Conductivity: 2 W/m-K
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Description: The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m·K. ? Low thermal impedance, with a minimum of 0.015 ?*in²/W at 30psi
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Material Form: Grease / Paste
- Thermal Conductivity: 4 W/m-K
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Conductive Compounds - High Tg, Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® H74FSupplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 18.33 to 60 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 13.89 to 72.22 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Fujipoly® America Corp.
Description: line applications. Sarcon® SG-07NS and SG-26NS are non-silicone, polysynthetic-based thermal greases that have high thermal conductivity properties. Infused with heat-conductive metal oxides, this nonmigrating material operates consistently in high
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Dielectric Strength: 386 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP21AN is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. It has an exceptionally forgiving 1:1 mix ratio by weight or volume. Accelerated
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 10 to 11 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Single Component System, Specialty / Other
- Dielectric Strength: 635 kV/in
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Conductive Compounds - High Thermal Conductivity Non-Silicone Greases -- SARCON® SG-50NS and SG-60NSSupplier: Fujipoly® America Corp.
Description: Fujipoly® USA introduces new 5 and 6W/m-K SARCON® thermally conductive greases to the North American market. SARCON® SG-50NS and SG-60NS greases offer excellent stability over wide temperature ranges with low thermal resistance. They feature exceptionally
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Material Form: Grease / Paste
- Thermal Conductivity: 5 to 6 W/m-K
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. EP21ANHT is recommended for high temperature applications where service
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 10 to 11 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Techsil Limited
Description: MG 8463 is a high end conductive silicone grease formulated for improving electrical connections between sliding surfaces and parts. It provides superior lubrication, inhibits corrosion, and repels humidity. Typical applications include lubrication of switches or circuit
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Supplier: Graphene Laboratories, Inc.
Description: capable of withstanding thermal cycling, mechanical stresses, and temperature variations without developing cracks or compromising the integrity of the bond. KEY FEATURES: High Viscosity: Improved gap sealing, gap filling, reduced flow, reduced risk of sagging. High
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Fujipoly® America Corp.
Description: line applications. Sarcon® SG-07NS and SG-26NS are non-silicone, polysynthetic-based thermal greases that have high thermal conductivity properties. Infused with heat-conductive metal oxides, this nonmigrating material operates consistently in high
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Thermally Conductive
- Dielectric Strength: 314 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ TC-5622 Thermally Conductive Compound Gray is a one component, silicone grease like material with low bleed and high temperature stability. It offers low thermal resistance, solventless formulation, and can be easily applied. 1 kg.
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Thermal Conductivity: 4.3 W/m-K
- Viscosity: 95000 cP
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Supplier: Techsil Limited
Description: MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical
- Chemical / Polymer System Type: Epoxy (EP)
- Features: Thermal Compound / Interface (Thermally Conductive), Electrically Conductive Compound (Adhesive, Grease)
- Industry: Electronics
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Supplier: Xoxide
Description: Tuniq TX-2 High Performance Thermal Compound achieves the best interface between your CPU and the heatsinks by its unique designed molecular size and shape. Without any metal or electric conductive, Tuniq TX-2 High Performance Thermal Compound is safe, reliable and
- Compound Type: Thermally Conductive
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Supplier: Master Bond, Inc.
Description: EP21TDCANHT is a two component, flexible, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally high peel strength and tensile lap shear. It has a very
- Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ TC-5026 Thermally Conductive Compound Gray is a one component grease like silicone material. It offers high thermal conductivity, low bleed, and high temperature stability. 1 kg Bottle.
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 227 kV/in
- Thermal Conductivity: 2.9 W/m-K
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Supplier: Epoxies Etc...
Description: The 50-2185FR Potting and Encapsulating Compound has been formulated to provide a low glass transition temperature, low durometer, high thermal conductivity, and flame retardancy. This system offers excellent heat transfer, low exotherm and excellent electrical properties.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.3
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Description: The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m·K. ? Low thermal impedance, with a minimum of 0.015 ?*in²/W at 30psi
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Material Form: Grease / Paste
- Thermal Conductivity: 5 W/m-K
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST GAP FILLER TGF 2000, Thermally Conductive, High Performance, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 2000 is a high performance, thermally conductive liquid gap filling material supplied as a two-component, room or elevated
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 0.0070
- Material Form: Gap Filling Compound
- Thermal Conductivity: 2 W/m-K
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Supplier: Master Bond, Inc.
Description: EP29LPAO is a two component thermally conductive, electrically insulative epoxy well suited for potting and encapsulating, even in large volumes. This product has low exotherm, a long working life of 7-9 hours at room temperature for a 100 gram mass and ambient/low
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 12.22 to 13.33 µin/in-F
- Composition: Unfilled
- Compound Type: Thermally Conductive
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures.
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing
- Dielectric Strength: 254 kV/in
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Supplier: Graphene Laboratories, Inc.
Description: Our G6E-TSAL™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials . It is designed to provide efficient heat transfer between components or surfaces, while also providing the
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Chemence Inc.
Description: KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that
- Chemical / Polymer System Type: Silicone
- Composition: Single Component System
- Form: Grease / Paste
- Industry: Electronics
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Supplier: Epoxies Etc...
Description: 50-1220 is a one component thermal grease. This heavy filled Heat Sink Compound promotes high thermal conductivity, low bleed, and high temperature stability.
- Chemical / Polymer System Type: Silicone
- Dielectric Constant: 5
- Dielectric Strength: 210 kV/in
- Electrical Resistivity: 2.00E15 ohm-cm
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Supplier: Xoxide
Description: Introducing Arctic Silver 5 - With its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new level of performance and stability. Arctic Silver 5 is optimized for use between modern high-power
- Compound Type: Thermally Conductive
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Supplier: Xoxide
Description: Introducing Arctic Silver 5 With its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new level of performance and stability. Arctic Silver 5 is optimized for use between modern high-power
- Compound Type: Thermally Conductive
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Supplier: Fujipoly® America Corp.
Description: insulative, high heat conductive silicone material. SARCON ® GHR is a composite of Heat Conductive Silicone Rubber and Fiberglass. SARCON ® GHR has excellent mechanical and physical characteristics. Usable Over a Wide Temperature Range. ( – 60 °C ~ 182 °C / – 76
- Applied Thickness / Gap Fill: 0.0118 to 0.0335 inch
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Material Form: Gap Filling Compound
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Supplier: Epoxies Etc...
Description: 50-3186 is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 is a perfect choice for applications requiring high thermal conductivity, low thermal expansion,
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 15.56 µin/in-F
- Composition: Unfilled
- Compound Type: Thermally Conductive
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Supplier: Xoxide
Description: exposure to temperatures up to 240?? Features: Extended Temperature limits: Peak: -20?? to 180??. The high-density, specifically designed for modern high-power CPUs and high-performance heat-sinks or water-cooling solutions. Silicon-based thermal
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Supplier: Techsil Limited
Description: -regulated in all sizes Silicone Free Very high thermal conductivity (1.0 W/m*K) Excellent operating temperature range (-68°C - +165°C) High dielectric strength Non-bleeding Non-conductive Long service life Safe on plastics Provides excellent corrosion resistance
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Supplier: Protavic America, Inc.
Description: ACH 20120 reaches high electrical conductivity and good thermal conductivity for heat removing Its specific reactivity combines both Latency al room temperature and fast curing cycle.
- Chemical / Polymer System Type: Specialty / Other
- Coeff. of Thermal Expansion (CTE): 54.44 to 70 µin/in-F
- Features: Thermal Compound / Interface (Thermally Conductive), Electrically Conductive Compound (Adhesive, Grease), Flexible / Dampening, Laminating / Composites
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging, Other
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 340 Heat Sink Compound White is a one component, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, non-curing, thermally conductive, low bleed, and has high temperature stability.
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Dielectric Strength: 210 kV/in
- Thermal Conductivity: 0.6700 W/m-K
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 340 Heat Sink Compound White is a one component, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, non-curing, thermally conductive, low bleed, and has high temperature stability. 9
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Dielectric Strength: 210 kV/in
- Thermal Conductivity: 0.6700 W/m-K
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Supplier: Chemence Inc.
Description: KSC1802 is a low viscosity, high performance, thermally conductive, liquid gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1802 is supplied as a two part, 1:1 mix ratio silicone that
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Features: Gap Filling Sealant / FIP Gasket, Grease / Paste
- Industry: Electronics
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Supplier: Epoxies Etc...
Description: 20-3660 is an electronic grade, 100% solids, epoxy resin system. In addition to it’s high temperature resistance, 20-3660 also provides outstanding physical properties at elevated temperatures.
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Dielectric Constant (Relative Permittivity): 3.5
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY PK605DM is a two-pack liquid gap filler, fast cured at room temperature or elevated temperature. With a thermal conductivity of 5.0 W/m*K, PK605DM provides high thermal conductivity and low thermal impedance. It is ideally suited for dispensing using
- Applications: Electrical / Electronic
- Chemistry / Constituents: Silicone, Specialty / Other
- Function: Heat Transfer Fluid
- Operating / Use Temperature: -67 to 401 F
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY PK223DM is a two-part liquid gap filler, fast cured at room temperature or elevated temperature. With a thermal conductivity of 2.0 W/m*K, PK223DM provides high thermal conductivity and low thermal impedance. It is ideally suited for dispensing using
- Applications: Electrical / Electronic
- Chemistry / Constituents: Silicone, Specialty / Other
- Function: Heat Transfer Fluid
- Operating / Use Temperature: -76 to 392 F
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Supplier: Protavic America, Inc.
Description: PVIC ACE34033 electrically conductive die attach adhesive is designed for high reliability semiconductor packaging application. This high purity adhesive has been engineered for use in high throughput in-line die attach oven cure and its superb rheology allows minimum
- Chemical / Polymer System Type: Epoxy (EP)
- Features: Thermal Compound / Interface (Thermally Conductive), Electrically Conductive Compound (Adhesive, Grease)
- Filled / Reinforced: Yes
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: PVIC ACE34030 electrically conductive die attach adhesive is designed for high reliability semiconductor or LED packaging application. This high purity adhesive has been engineered for use in high throughput in-line die attach oven cure and its superb rheology allows
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 35 to 147 µin/in-F
- Features: Thermal Compound / Interface (Thermally Conductive), Electrically Conductive Compound (Adhesive, Grease)
- Filled / Reinforced: Yes
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Supplier: Techsil Limited
Description: MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical
- Chemical / Polymer System Type: Epoxy (EP)
- Features: Thermal Compound / Interface (Thermally Conductive), Electrically Conductive Compound (Adhesive, Grease)
- Industry: Electronics
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Supplier: MacDermid Alpha Electronics Solutions
Description: -Creep Characteristics Very High Thermal Conductivity: 0.9 W/m.K Wide Operating Temperature -50°C to +130°C Low Evaporation Weight Loss Low Toxicity
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Material Form: Grease / Paste
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EP35AOLV is a thermally conductive, electrically insulating compound that withstands aggressive chemicals, such as those found in downhole oil and gas processing. EP35AOLV exhibits superior protection against corrosion in various harsh environments and helps prolong longevity of critical (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
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plays several crucial roles: Efficient Heat Dissipation:While LEDs offer high efficiency and long lifespan, they also generate significant heat. By using thermal conductive silicone gel, the operating temperature of LEDs is reduced, ensuring better (read more)
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. Reduced Response Times and Immersion Depth Utilizing a special, thermally conductive metallization construction encased in thin wall tubing, IST’s RealProbeTemp provides an unequaled probe assembly with a fast response time and reduced (read more)
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Visualization study of flow condensation in hydrophobic microchannels
To reduce the thermal resistance, high - temperature thermally conductive grease is coated on contact surface between chip and cooler.
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High Temperature Embedded SiC Chip Module (ECM) for Power Electronics Applications
A high temperature adhesive material, such as nano silver [10] or high temperature thermal grease , is used for heat conduction between the base substrate and the active ECM part.
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Measurement of the effective thermal conductivity of particulate materials by the steady-state heat flow method in a cuvette
In other cases, for example at higher temperature , thermal grease , layers of heat- conducting powder or fiber may be a more universal means. . Meas.
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Effects of temperature on surface adhesion in MEMS structures
To improve heat conduction between the chuck and the die, a high temperature thermal grease (AOS Thermal Compounds, 52027KB) was used.
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Uncertainty analysis on the design of thermal conductivity measurement by a guarded cut-bar technique
A conducting medium at the interfaces should be used to reduce thermal resistance such as highly thermally conductive grease , or for higher temperatures , a thin metal foil.
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Temperature measurements in a flow using laser induced fluorescence of oxygen
The heat transfer coefficient between the cell arms and the copper was enhanced by adding a thermal conductive paste : the Omegatherm 201 High temperature -high thermally conductive paste silicone grease 400 "F k = 16 1014 jI.cm BTU.in/hr.ft 2 .
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Liquid Metal-Filled Micro Heat Pipes for Thermal Management of Solid-State Devices
The metal plate was then pasted onto the cold plate using CHEMPLEX 1381, a Si-based thermal grease specially blended with thermally conductive fine metal oxide powders to provide high thermal conductivity and high temperature stability.
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AN EXPERIMENTAL INVESTIGATION OF LIQUID METAL MHPs
The metal plate was then pasted onto the cold plate using CHEMPLEX 1381, a silicon based grease like material specially blended with thermally conductive fine metal oxide powders to provide high thermal conductivity and high temperature stability.
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Silicone Thermal Interface Materials for Under-Hood Electronics
From a thermal standpoint, conductive grease is well suited for TIM applications, but greases can be subject to pump-out at higher temperatures , especially after repeated thermal cycles.
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Progress Report on BSST-Led US Department of Energy Automotive Waste Heat Recovery Program
After several iterations, high-thermal- conductivity aluminum nitride substrates with minimal high - temperature thermal grease (that converted to a powder after exposure to operating temperature) was used as the electrically isolating, thermally conductive interface.