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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND and OMEGATHERM products are compounded and packaged for convenient, easy mixing and application. Each formulation exhibits important characteristics necessary for accurate, fast, reliable temperature measurement. These are: good adhesion and strength, high temperature
- Use Temperature: 392 F
- Thermal Conductivity: 2.3076464 W/m-K
- Cure / Technology: Air Setting / Film Drying, Single Component System
- Features: Electrical Insulation / Dielectric, Encapsulating / Potting, Grease / Paste, Thermal / Heat Conductive
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Supplier: OMEGA Engineering, Inc.
Description: OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most
- Use Temperature: 392 F
- Thermal Conductivity: 2.3076464 W/m-K
- Cure / Technology: Air Setting / Film Drying, Single Component System
- Substrate Compatibility: Ceramic / Glass, Metal, Paper / Paperboard, Plastic
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Description: The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m·K. ◆ Low thermal impedance, with a minimum of 0.015 ℃*in²/W at 30psi. ◆ Minimum
- Use Temperature: 302 F
- Thermal Conductivity: 2 W/m-K
- Industry: Electronics
- Features: Grease / Paste, Thermal / Heat Conductive
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Supplier: Epoxy Technology
Description: including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the
- Viscosity: 1,400 to 2,200 cP
- Use Temperature: 482 F
- Thermal Conductivity: 1 W/m-K
- Coeff. of Thermal Expansion (CTE): 17.22222222222222 to 78.88888888888889 µin/in-F
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP21AN is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. It has an exceptionally forgiving 1:1 mix ratio by weight or volume. Accelerated cures
- Use Temperature: -60 to 250 F
- Thermal Conductivity: 3.17 W/m-K
- Coeff. of Thermal Expansion (CTE): 10 to 11 µin/in-F
- Tensile Strength (Break): 5,000 psi
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Supplier: Techsil Limited
Description: MG 8463 is a high end conductive silicone grease formulated for improving electrical connections between sliding surfaces and parts. It provides superior lubrication, inhibits corrosion, and repels humidity. Typical applications include lubrication of switches or circuit
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Supplier: Allied Electronics, Inc.
Description: Designed for use with heat sinks to effectively dissipate heat generated by electronic devices and circuitry. Ideally used to cool CPUs (over clocking), chipset and graphics cards. Formulated with Boron Nitride, this grease gives super high thermal conductivity without the
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Industrial Adhesives - High Tg, Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® H74FSupplier: Epoxy Technology
Description: including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the
- Viscosity: 45,000 to 75,000 cP
- Use Temperature: 662 F
- Thermal Conductivity: 0.5 W/m-K
- Coeff. of Thermal Expansion (CTE): 18.333333333333332 to 60 µin/in-F
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Supplier: Chemence Inc.
Description: KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that when
- Viscosity: 150,000 cP
- Features: Die Bonding Adhesive / Compound, Grease / Paste
- Industry: Electronics
- Substrate Compatibility: Plastic
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Description: The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m·K. ◆ Low thermal impedance, with a minimum of 0.015 ℃*in²/W at 30psi. ◆ Minimum
- Use Temperature: 302 F
- Thermal Conductivity: 3 W/m-K
- Industry: Electronics
- Features: Grease / Paste, Thermal / Heat Conductive
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Description: The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m·K. ◆ Low thermal impedance, with a minimum of 0.015 ℃*in²/W at 30psi. ◆ Minimum
- Use Temperature: 302 F
- Thermal Conductivity: 4 W/m-K
- Industry: Electronics
- Features: Grease / Paste, Thermal / Heat Conductive
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains
- Viscosity: 150,000 cP
- Use Temperature: -58 to 356 F
- Thermal Conductivity: 2 W/m-K
- Features: Die Bonding Adhesive / Compound, Gel, Grease / Paste, Specialty / Other, Thermal / Heat Conductive
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Supplier: Epoxy Technology
Description: including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the
- Viscosity: 40,000 to 60,000 cP
- Use Temperature: 572 F
- Thermal Conductivity: 0.7 W/m-K
- Coeff. of Thermal Expansion (CTE): 9.444444444444445 to 52.77777777777778 µin/in-F
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Supplier: Epoxies Etc...
Description: 50-1220 is a one component thermal grease. This heavy filled Heat Sink Compound promotes high thermal conductivity, low bleed, and high temperature stability.
- Thermal Conductivity: 1.1538232 W/m-K
- Electrical Resistivity: 2,000,000,000,000,000 ohm-cm
- Dielectric Strength: 209.99999999999991 kV/in
- Dielectric Constant: 5
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Supplier: Xoxide
Description: to temperatures up to 240?? Features: Extended Temperature limits: Peak: -20?? to 180??. The high-density, specifically designed for modern high-power CPUs and high-performance heat-sinks or water-cooling solutions. Silicon-based thermal grease has
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Supplier: Epoxy Technology
Description: including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the
- Viscosity: 40,000 to 70,000 cP
- Use Temperature: 482 F
- Thermal Conductivity: 1.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 32.77777777777778 to 120 µin/in-F
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ TC-5622 Thermally Conductive Compound Gray is a one component, silicone grease like material with low bleed and high temperature stability. It offers low thermal resistance, solventless formulation, and can be easily applied. 1 kg.
- Viscosity: 95,000 cP
- Thermal Conductivity: 4.3 W/m-K
- Cure / Technology: Single Component System
- Features: Thermal / Heat Conductive
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. EP21ANHT is recommended for high temperature applications where service
- Use Temperature: -60 to 400 F
- Thermal Conductivity: 2.882 to 3.603 W/m-K
- Coeff. of Thermal Expansion (CTE): 10 to 11 µin/in-F
- Tensile Strength (Break): 5,000 psi
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ TC-5026 Thermally Conductive Compound Gray is a one component grease like silicone material. It offers high thermal conductivity, low bleed, and high temperature stability. 1 kg Bottle.
- Viscosity: 100,000 cP
- Thermal Conductivity: 2.9 W/m-K
- Dielectric Strength: 227 kV/in
- Features: Thermal / Heat Conductive
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Supplier: Epoxies Etc...
Description: The 50-2185FR Potting and Encapsulating Compound has been formulated to provide a low glass transition temperature, low durometer, high thermal conductivity, and flame retardancy. This system offers excellent heat transfer, low exotherm and excellent electrical properties.
- Viscosity: 27,000 cP
- Use Temperature: -58 to 248 F
- Thermal Conductivity: 1.22593715 W/m-K
- Tensile Strength (Break): 800 psi
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures.
- Use Temperature: -76 to 356 F
- Thermal Conductivity: 0.55 W/m-K
- Dielectric Strength: 254.00000000000054 kV/in
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
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Supplier: Xoxide
Description: Tuniq TX-2 High Performance Thermal Compound achieves the best interface between your CPU and the heatsinks by its unique designed molecular size and shape. Without any metal or electric conductive, Tuniq TX-2 High Performance Thermal Compound is safe, reliable and
- Features: Thermally Conductive
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Supplier: Master Bond, Inc.
Description: EP21TDCANHT is a two component, flexible, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally high peel strength and tensile lap shear. It has a very
- Use Temperature: -100 to 350 F
- Thermal Conductivity: 3.17 to 3.458 W/m-K
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Tensile Strength (Break): 7,000 psi
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY PK700DM is a two-part liquid gap filler, fast cured at room temperature or elevated temperature. With a thermal conductivity of 7.0 W/m*K, PK700DM provides high thermal conductivity and low thermal impedance. It is ideally suited for dispensing using
- Operating / Use Temperature: -76 to 392 F
- Thermal Conductivity: 7 W/m-K
- Applications: Electrical / Electronic
- Features: Grease / Gel
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Supplier: Epoxies Etc...
Description: 50-3186 is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 is a perfect choice for applications requiring high thermal conductivity, low thermal expansion, and
- Use Temperature: -40 to 446 F
- Thermal Conductivity: 1.38458784 W/m-K
- Coeff. of Thermal Expansion (CTE): 15.555555555555555 µin/in-F
- Tensile Strength (Break): 2,700 psi
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Supplier: Master Bond, Inc.
Description: produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents over the exceptionally wide temperature range of - 60°F to more than +500°F. It also produces superior seals &
- Use Temperature: -60 to 500 F
- Thermal Conductivity: 1.2980511 to 1.442279 W/m-K
- Tensile Strength (Break): 12,800 psi
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Marine, Military / Government (MIL-SPEC / GG), OEM / Industrial, Photonics / Optoelectronics, Semiconductors / IC Packaging, Tooling / Mold Material
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Supplier: Techsil Limited
Description: MG Chemicals 8617 Super Thermal Grease III is a low thermal resistance, non-corrosive grease. It uses an extremely thermal stable synthetic oil that is electrically insulating. This product is used to improve the thermal interface contact conductivity
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Supplier: SAE International
Description: Power electronics products such as inverters and converters involve the use of Thermal Interface Materials (TIMs) between high power packages and a heat exchanger for thermal management. Conventional TIMs such as thermal greases, gels, solders and phase change
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Supplier: Chemence Inc.
Description: KSC1802 is a low viscosity, high performance, thermally conductive, liquid gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1802 is supplied as a two part, 1:1 mix ratio silicone that when
- Viscosity: 11,000 to 14,000 cP
- Features: Die Bonding Adhesive / Compound, Gap Filling Sealant / FIP Gasket
- Industry: Electronics
- Type / Form: Grease / Paste
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Visualization study of flow condensation in hydrophobic microchannels
To reduce the thermal resistance, high - temperature thermally conductive grease is coated on contact surface between chip and cooler.
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High Temperature Embedded SiC Chip Module (ECM) for Power Electronics Applications
A high temperature adhesive material, such as nano silver [10] or high temperature thermal grease , is used for heat conduction between the base substrate and the active ECM part.
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Measurement of the effective thermal conductivity of particulate materials by the steady-state heat flow method in a cuvette
In other cases, for example at higher temperature , thermal grease , layers of heat- conducting powder or fiber may be a more universal means. . Meas.
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Effects of temperature on surface adhesion in MEMS structures
To improve heat conduction between the chuck and the die, a high temperature thermal grease (AOS Thermal Compounds, 52027KB) was used.
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Uncertainty analysis on the design of thermal conductivity measurement by a guarded cut-bar technique
A conducting medium at the interfaces should be used to reduce thermal resistance such as highly thermally conductive grease , or for higher temperatures , a thin metal foil.
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Temperature measurements in a flow using laser induced fluorescence of oxygen
The heat transfer coefficient between the cell arms and the copper was enhanced by adding a thermal conductive paste : the Omegatherm 201 High temperature -high thermally conductive paste silicone grease 400 "F k = 16 1014 jI.cm BTU.in/hr.ft 2 .
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Liquid Metal-Filled Micro Heat Pipes for Thermal Management of Solid-State Devices
The metal plate was then pasted onto the cold plate using CHEMPLEX 1381, a Si-based thermal grease specially blended with thermally conductive fine metal oxide powders to provide high thermal conductivity and high temperature stability.
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AN EXPERIMENTAL INVESTIGATION OF LIQUID METAL MHPs
The metal plate was then pasted onto the cold plate using CHEMPLEX 1381, a silicon based grease like material specially blended with thermally conductive fine metal oxide powders to provide high thermal conductivity and high temperature stability.
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Silicone Thermal Interface Materials for Under-Hood Electronics
From a thermal standpoint, conductive grease is well suited for TIM applications, but greases can be subject to pump-out at higher temperatures , especially after repeated thermal cycles.
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Progress Report on BSST-Led US Department of Energy Automotive Waste Heat Recovery Program
After several iterations, high-thermal- conductivity aluminum nitride substrates with minimal high - temperature thermal grease (that converted to a powder after exposure to operating temperature) was used as the electrically isolating, thermally conductive interface.