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Supplier: OMEGA Engineering, Inc.
Description: products. OMEGABOND and OMEGATHERM products are compounded and packaged for convenient, easy mixing and application. Each formulation exhibits important characteristics necessary for accurate, fast, reliable temperature measurement. These are: good adhesion and strength, high temperature
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Material Form: Grease / Paste
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST TGR 4000, High Performance Thermal Interface Compound for Copper-Based Heat Sinks BERGQUIST® TGR 4000 is a thermally conductive grease compound designed for use as a thermal interface material between a computer processor and a copper-based heat
- Compound Type: Thermally Conductive
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Supplier: OMEGA Engineering, Inc.
Description: OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Material Form: Grease / Paste
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 18.33 to 72.22 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Description: The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m·K. ? Low thermal impedance, with a minimum of 0.015 ?*in²/W at 30psi
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Material Form: Grease / Paste
- Thermal Conductivity: 3 W/m-K
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Description: The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m·K. ? Low thermal impedance, with a minimum of 0.015 ?*in²/W at 30psi
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Material Form: Grease / Paste
- Thermal Conductivity: 2 W/m-K
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Description: , ensuring efficient heat transfer. ? Excellent wetting properties ensure that there is no risk of spillage after thermal cycling, making them a viable alternative to thermal grease/thermal paste. ? Self-adhesive for easy application and rework. ? Complies with RoHS, Halogen
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 4
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Thermal Conductivity: 4 W/m-K
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Conductive Compounds - High Tg, Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® H74FSupplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 18.33 to 60 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 13.89 to 72.22 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 8.89 to 37.78 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Shiu Li Technology Co., Ltd
Description: Thermal Conductive Putty | LiPOLY S-putty is a thermally conductive putty that is great for filling small air gaps. The thermal conductivity is between 2.0~6.0 W/m*K. The high deformation material can fill gaps closely, cover high tolerance, overcome
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Dielectric Strength: 300 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Fujipoly® America Corp.
Description: line applications. Sarcon® SG-07NS and SG-26NS are non-silicone, polysynthetic-based thermal greases that have high thermal conductivity properties. Infused with heat-conductive metal oxides, this nonmigrating material operates consistently in high
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Dielectric Strength: 386 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Description: The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m·K. ? Low thermal impedance, with a minimum of 0.015 ?*in²/W at 30psi
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Material Form: Grease / Paste
- Thermal Conductivity: 4 W/m-K
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Single Component System, Specialty / Other
- Dielectric Strength: 635 kV/in
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST SIL PAD TSP K900, The Original, Thermally Conductive, Polyimide-Based Insulator BERGQUIST® SIL PAD® TSP K900 uses a specially developed film which has high thermal conductivity, high dielectric strength and is very durable. BERGQUIST SIL PAD TSP K900
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 0.0050
- Thermal Conductivity: 0.9000 W/m-K
- Use Temperature: 140 to 356 F
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Conductive Compounds - High Thermal Conductivity Non-Silicone Greases -- SARCON® SG-50NS and SG-60NSSupplier: Fujipoly® America Corp.
Description: Fujipoly® USA introduces new 5 and 6W/m-K SARCON® thermally conductive greases to the North American market. SARCON® SG-50NS and SG-60NS greases offer excellent stability over wide temperature ranges with low thermal resistance. They feature exceptionally low bleed
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Material Form: Grease / Paste
- Thermal Conductivity: 5 to 6 W/m-K
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. EP21ANHT is recommended for high temperature applications where service
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 10 to 11 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Techsil Limited
Description: MG 8463 is a high end conductive silicone grease formulated for improving electrical connections between sliding surfaces and parts. It provides superior lubrication, inhibits corrosion, and repels humidity. Typical applications include lubrication of switches or circuit
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Supplier: Protavic America, Inc.
Description: A silver filled, fast curing, solvent-free, single component electroconductive adhesive with a high silver content for LED applications. It has a pot life of 2 days and its rheology is well suited to application by microdispenser. It exhibits an excellent thermal stability and a
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 27.78 to 94.44 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Protavic America, Inc.
Description: Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 22.22 to 55.56 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Graphene Laboratories, Inc.
Description: Our G6E-TSHV™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials . It is designed to provide efficient heat transfer between components or surfaces, while also providing the
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Fujipoly® America Corp.
Description: line applications. Sarcon® SG-07NS and SG-26NS are non-silicone, polysynthetic-based thermal greases that have high thermal conductivity properties. Infused with heat-conductive metal oxides, this nonmigrating material operates consistently in high
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Thermally Conductive
- Dielectric Strength: 314 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ TC-5622 Thermally Conductive Compound Gray is a one component, silicone grease like material with low bleed and high temperature stability. It offers low thermal resistance, solventless formulation, and can be easily applied. 1 kg.
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Thermal Conductivity: 4.3 W/m-K
- Viscosity: 95000 cP
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Supplier: Nordson EFD
Description: Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to
- Chemical / Polymer System Type: Specialty / Other
- Composition: Unfilled
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY N-putty2-s series is a non-silicon thermally conductive material without volatilization of low molecular siloxane, and low total volatile gas. With a thermal conductivity of 5.0 W/m*K, the high deformation can perfectly fill small air gaps to eliminate tolerances.
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Thermally Conductive
- Dielectric Strength: 305 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
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Supplier: Shiu Li Technology Co., Ltd
Description: Thermal Conductive Putty | LiPOLY H-putty is a tolerance filled, thermally conductive putty that maintains high compressibility with low stress, high reliability, and will not flow vertically. Our H-putty can replace thermals pads in design gaps of
- Applications: Electrical / Electronic
- Chemistry / Constituents: Silicone
- Dielectric Strength: 1.18E7 V/m
- Function: Heat Transfer Fluid
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Supplier: Xoxide
Description: Tuniq TX-2 High Performance Thermal Compound achieves the best interface between your CPU and the heatsinks by its unique designed molecular size and shape. Without any metal or electric conductive, Tuniq TX-2 High Performance Thermal Compound is safe, reliable and
- Compound Type: Thermally Conductive
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Supplier: Techsil Limited
Description: MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical
- Chemical / Polymer System Type: Epoxy (EP)
- Features: Thermal Compound / Interface (Thermally Conductive), Electrically Conductive Compound (Adhesive, Grease)
- Industry: Electronics
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Supplier: Master Bond, Inc.
Description: EP21TDCANHT is a two component, flexible, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally high peel strength and tensile lap shear. It has a very convenient mix
- Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ TC-5026 Thermally Conductive Compound Gray is a one component grease like silicone material. It offers high thermal conductivity, low bleed, and high temperature stability. 1 kg Bottle.
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 227 kV/in
- Thermal Conductivity: 2.9 W/m-K
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Supplier: Epoxies Etc...
Description: The 50-2185FR Potting and Encapsulating Compound has been formulated to provide a low glass transition temperature, low durometer, high thermal conductivity, and flame retardancy. This system offers excellent heat transfer, low exotherm and excellent electrical properties. 50-2185FR
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.3
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP21AN is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. It has an exceptionally forgiving 1:1 mix ratio by weight or volume. Accelerated
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 10 to 11 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Master Bond, Inc.
Description: EP29LPAO is a two component thermally conductive, electrically insulative epoxy well suited for potting and encapsulating, even in large volumes. This product has low exotherm, a long working life of 7-9 hours at room temperature for a 100 gram mass and ambient/low temperature curing
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 12.22 to 13.33 µin/in-F
- Composition: Unfilled
- Compound Type: Thermally Conductive
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST GAP FILLER TGF 2000, Thermally Conductive, High Performance, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 2000 is a high performance, thermally conductive liquid gap filling material supplied as a two-component, room or elevated
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 0.0070
- Material Form: Gap Filling Compound
- Thermal Conductivity: 2 W/m-K
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Supplier: Graphene Laboratories, Inc.
Description: Our G6E-TSAL™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials . It is designed to provide efficient heat transfer between components or surfaces, while also providing the
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Protavic America, Inc.
Description: Silver filled epoxy system for tantalum & ceramic termination coating. This product is commonly used for flexible termination of capacitors and offers high strength and flexibility. This product is the "gold" standard for flexible termination. Solvent adjusted. Please contact us for product
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Chemence Inc.
Description: KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that
- Chemical / Polymer System Type: Silicone
- Composition: Single Component System
- Form: Grease / Paste
- Industry: Electronics
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Supplier: Epoxies Etc...
Description: 50-1220 is a one component thermal grease. This heavy filled Heat Sink Compound promotes high thermal conductivity, low bleed, and high temperature stability.
- Chemical / Polymer System Type: Silicone
- Dielectric Constant: 5
- Dielectric Strength: 210 kV/in
- Electrical Resistivity: 2.00E15 ohm-cm
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Supplier: Xoxide
Description: Introducing Arctic Silver 5 - With its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new level of performance and stability. Arctic Silver 5 is optimized for use between modern high-power
- Compound Type: Thermally Conductive
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Supplier: Xoxide
Description: Introducing Arctic Silver 5 With its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new level of performance and stability. Arctic Silver 5 is optimized for use between modern high-power
- Compound Type: Thermally Conductive
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Supplier: Fujipoly® America Corp.
Description: Features for Sarcon HR / Sarcon GHR / Sarcon GHR-AD High Heat Conductivity. SARCON ® HR is Fujipoly's originally developed High Heat Conductive Silicone Rubber. Fine, high heat conductive ceramic particles are mixed with insulative silicone rubber to produce this
- Applied Thickness / Gap Fill: 0.0118 to 0.0335 inch
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Material Form: Gap Filling Compound
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Supplier: Xoxide
Description: PTI-G3606 is Silicon-base thermal grease with excellent heat-conductive filler and effective thermal grease for any heat sink device where efficient cooling is required, such as CPU power transistor, and SCRs to heat sink or chassis. It will not dry out, harden, or
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Supplier: Indium Corporation
Description: Indium Corporation’s Solder Thermal Interface Materials radically improve: Heat dissipation efficiency in electronic devices Thermal conductance for high power devices – with densities in excess of 1000 watts End-of-life performance at the thermal
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Semiconductors / IC Packaging
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Supplier: Techsil Limited
Description: -regulated in all sizes Silicone Free Very high thermal conductivity (1.0 W/m*K) Excellent operating temperature range (-68°C - +165°C) High dielectric strength Non-bleeding Non-conductive Long service life Safe on plastics Provides excellent corrosion resistance
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Supplier: Protavic America, Inc.
Description: ACH 20120 reaches high electrical conductivity and good thermal conductivity for heat removing Its specific reactivity combines both Latency al room temperature and fast curing cycle.
- Chemical / Polymer System Type: Specialty / Other
- Coeff. of Thermal Expansion (CTE): 54.44 to 70 µin/in-F
- Features: Thermal Compound / Interface (Thermally Conductive), Electrically Conductive Compound (Adhesive, Grease), Flexible / Dampening, Laminating / Composites
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging, Other
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 340 Heat Sink Compound White is a one component, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, non-curing, thermally conductive, low bleed, and has high temperature stability. 142 g
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Dielectric Strength: 210 kV/in
- Thermal Conductivity: 0.6700 W/m-K
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 340 Heat Sink Compound White is a one component, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, non-curing, thermally conductive, low bleed, and has high temperature stability. 9 kg
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Dielectric Strength: 210 kV/in
- Thermal Conductivity: 0.6700 W/m-K
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EP35AOLV is a thermally conductive, electrically insulating compound that withstands aggressive chemicals, such as those found in downhole oil and gas processing. EP35AOLV exhibits superior protection against corrosion in various harsh environments and helps prolong longevity of critical (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
affects its stability and overall system performance. In this context, thermal grease, with its excellent thermal conductivity and ease of use, has become the ideal choice for optimizing the heat dissipation of energy storage battery packs. High temperatures are one of the main causes of battery (read more)
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why thermal grease remains a practical choice for CPU cooling and other high-power electronic assemblies. SG560-50 thermal grease is designed to improve contact between the CPU and heatsink by (read more)
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Master Bond EP3UF-1 is a one part epoxy that requires no mixing and is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi. (read more)
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Thermal cycling screening (optional) 7. Conclusion This 26-channel ultra-lightweight high-precision conductive slip ring is an engineered product specifically developed for aerospace (read more)
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. EP21TDCS-LO is engineered to maintain high-strength conductive bonds between dissimilar materials at temperatures as low as 4K, while passing NASA low-outgassing specifications. Its simple one-to-one mix ratio, 30–40 minute working time, and flexible cure schedule (read more)
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of robots demand enhanced heat dissipation, protection, and operational stability. Thermal conductive potting adhesives, which combine thermal conductivity, electrical insulation, and structural encapsulation, have become an indispensable thermal management solution in modules such as robotic (read more)
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In power modules, inductors, and other compact electronic assemblies, thermal conductive insulating film plays a critical role in balancing electrical insulation and heat dissipation. But in real applications, its (read more)
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vital role in ensuring the performance and longevity of automotive lighting modules. Properties of Thermal Conductive Silicone Gel Thermal conductive silicone gel is a high-performance material designed to efficiently transfer and dissipate heat in lighting modules (read more)
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, making it suitable for various sizes and shapes of Bluetooth speakers, and it features self-adhesiveness, eliminating the need for additional surface adhesives and simplifying the assembly process. More importantly, SHEEN thermal conductive silicone sheets have high compressibility and (read more)
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Indicates content that may require registration and/or purchase.
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Application of phase-change materials in Pentium (R) III and Pentium (R) III XeonTM processor cartridges
… E.C. cartridge application, the post- melting thickness for the PCM with a fiber mesh carrier is about 3-4 mils due to the mesh thickness constraint, while the post-assembly thickness for the high thermal conductive grease is about 1-2 …
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Heat Drain Effects From HTS Tapes to High Thermal Conduction Plastics for Conduction-Cooled Magnets
In the DFRP experiment, the high thermal conduction grease was not used, however the DFRP’s data and the AlN’s data are near.
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Effect of magnetic field on the forced convection heat transfer and pressure drop of a magnetic nanofluid in a miniature heat sink
To improve the heat transfer efficiency, the contact surface between the heat sink and the heater block is covered with a layer of high thermal conductive grease .
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Thermal Conductivity29/Thermal Expansion 17
High thermal conductive grease ensures good thermal exchanges between the different elements.
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Adhesives & Sealants - China Adhesives & Sealants Manufacturers, Suppliers, Buyers, Sellers, Products Directory - Page 4
Related Products:High Quality,thermal grease, high conductive thermal grease .
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Advanced cooling system using miniature heat pipes in mobile PC
High conductive thermal grease was used between the heat source and the aluminum heat block.
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Improving heat sinking in ambient environment for the shape memory alloy (SMA)
Conversely, when the heat sink is used, heat from the surface of the SMA is spread to a larger surface area of the outer metal tube via the high thermal conducting silicone grease .
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Thermal management analysis of high-power electronic modules using Cu bonded AlN substrates
We applied high thermal conductive silicon grease (Si-grease) between the substrates and the AI plate in order to ensure sufficient heat conduction.
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Exciton photoconductivity in Ge‐doped GaSe crystals
In order to minimize the deformation, samples were gently stuck to the sample holder with high thermal conductive Apiezone N grease .
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Investigation of NbTiN Thin Films and AlN Tunnel Barriers With Ellipsometry for Superconducting Device Applications
Wafers were attached to a substrate block using Apiezon-L ultra high vacuum grease for thermal conduction and a clamping ring to gently secure the wafers to the block.