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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND and OMEGATHERM products are compounded and packaged for convenient, easy mixing and application. Each formulation exhibits important characteristics necessary for accurate, fast, reliable temperature measurement. These are: good adhesion and strength, high temperature rating,
- Use Temperature: 392 F
- Thermal Conductivity: 2.3076464 W/m-K
- Cure / Technology: Air Setting / Film Drying, Single Component System
- Features: Electrical Insulation / Dielectric, Encapsulating / Potting, Grease / Paste, Thermal / Heat Conductive
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Supplier: OMEGA Engineering, Inc.
Description: OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals,
- Use Temperature: 392 F
- Thermal Conductivity: 2.3076464 W/m-K
- Cure / Technology: Air Setting / Film Drying, Single Component System
- Substrate Compatibility: Ceramic / Glass, Metal, Paper / Paperboard, Plastic
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Description: The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m·K. ◆ Low thermal impedance, with a minimum of 0.015 ℃*in²/W at 30psi. ◆ Minimum
- Use Temperature: 302 F
- Thermal Conductivity: 2 W/m-K
- Industry: Electronics
- Features: Grease / Paste, Thermal / Heat Conductive
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Supplier: Shiu Li Technology Co., Ltd
Description: Thermal Conductive Putty | LiPOLY S-putty is a thermally conductive putty that is great for filling small air gaps. The thermal conductivity is between 2.0~6.0 W/m*K. The high deformation material can fill gaps closely, cover high tolerance, overcome issues
- Use Temperature: -76 to 356 F
- Thermal Conductivity: 3.5 W/m-K
- Dielectric Strength: 300 kV/in
- Industry: Electronics
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Supplier: Techsil Limited
Description: MG 8463 is a high end conductive silicone grease formulated for improving electrical connections between sliding surfaces and parts. It provides superior lubrication, inhibits corrosion, and repels humidity. Typical applications include lubrication of switches or circuit
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST TGR 4000, High Performance Thermal Interface Compound for Copper-Based Heat Sinks BERGQUIST® TGR 4000 is a thermally conductive grease compound designed for use as a thermal interface material between a computer processor and a copper-based heat sink.
- Features: Thermal / Heat Conductive
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Supplier: Allied Electronics, Inc.
Description: Designed for use with heat sinks to effectively dissipate heat generated by electronic devices and circuitry. Ideally used to cool CPUs (over clocking), chipset and graphics cards. Formulated with Boron Nitride, this grease gives super high thermal conductivity without the
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Industrial Adhesives - High Tg, Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® H74FSupplier: Epoxy Technology
Description: including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Viscosity: 45,000 to 75,000 cP
- Use Temperature: 662 F
- Thermal Conductivity: 0.5 W/m-K
- Coeff. of Thermal Expansion (CTE): 18.333333333333332 to 60 µin/in-F
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Description: Excellent wetting properties ensure that there is no risk of spillage after thermal cycling, making them a viable alternative to thermal grease/thermal paste. ◆ Self-adhesive for easy application and rework. ◆ Complies with RoHS, Halogen-Free, and REACH environmental and
- Use Temperature: -40 to 257 F
- Thermal Conductivity: 4 W/m-K
- Dielectric Constant (Relative Permittivity): 4
- Industry: Electronics
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Supplier: Chemence Inc.
Description: KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that when
- Viscosity: 150,000 cP
- Features: Die Bonding Adhesive / Compound, Grease / Paste
- Industry: Electronics
- Substrate Compatibility: Plastic
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Description: The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m·K. ◆ Low thermal impedance, with a minimum of 0.015 ℃*in²/W at 30psi. ◆ Minimum
- Use Temperature: 302 F
- Thermal Conductivity: 3 W/m-K
- Industry: Electronics
- Features: Grease / Paste, Thermal / Heat Conductive
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Supplier: Epoxy Technology
Description: including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Viscosity: 12,000 to 17,000 cP
- Use Temperature: 617 F
- Thermal Conductivity: 1.7 W/m-K
- Coeff. of Thermal Expansion (CTE): 15 to 75.55555555555556 µin/in-F
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating
- Viscosity: 150,000 cP
- Use Temperature: -58 to 356 F
- Thermal Conductivity: 2 W/m-K
- Features: Die Bonding Adhesive / Compound, Gel, Grease / Paste, Specialty / Other, Thermal / Heat Conductive
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY N-putty2-s series is a non-silicon thermally conductive material without volatilization of low molecular siloxane, and low total volatile gas. With a thermal conductivity of 5.0 W/m*K, the high deformation can perfectly fill small air gaps to eliminate tolerances. It also
- Viscosity: 15,000,000 cP
- Use Temperature: -76 to 302 F
- Thermal Conductivity: 5 W/m-K
- Dielectric Strength: 304.80000000000064 kV/in
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Supplier: Epoxies Etc...
Description: 50-1220 is a one component thermal grease. This heavy filled Heat Sink Compound promotes high thermal conductivity, low bleed, and high temperature stability.
- Thermal Conductivity: 1.1538232 W/m-K
- Electrical Resistivity: 2,000,000,000,000,000 ohm-cm
- Dielectric Strength: 209.99999999999991 kV/in
- Dielectric Constant: 5
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ TC-5622 Thermally Conductive Compound Gray is a one component, silicone grease like material with low bleed and high temperature stability. It offers low thermal resistance, solventless formulation, and can be easily applied. 1 kg.
- Viscosity: 95,000 cP
- Thermal Conductivity: 4.3 W/m-K
- Cure / Technology: Single Component System
- Features: Thermal / Heat Conductive
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Supplier: Xoxide
Description: to temperatures up to 240?? Features: Extended Temperature limits: Peak: -20?? to 180??. The high-density, specifically designed for modern high-power CPUs and high-performance heat-sinks or water-cooling solutions. Silicon-based thermal grease has moderate
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Supplier: Epoxy Technology
Description: including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Viscosity: 300,000 to 400,000 cP
- Use Temperature: 572 F
- Thermal Conductivity: 0.5 W/m-K
- Coeff. of Thermal Expansion (CTE): 8.88888888888889 to 37.77777777777778 µin/in-F
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Supplier: Epoxy Technology
Description: including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Viscosity: 40,000 to 70,000 cP
- Use Temperature: 482 F
- Thermal Conductivity: 1.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 32.77777777777778 to 120 µin/in-F
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. EP21ANHT is recommended for high temperature applications where service temperatures
- Use Temperature: -60 to 400 F
- Thermal Conductivity: 2.882 to 3.603 W/m-K
- Coeff. of Thermal Expansion (CTE): 10 to 11 µin/in-F
- Tensile Strength (Break): 5,000 psi
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ TC-5026 Thermally Conductive Compound Gray is a one component grease like silicone material. It offers high thermal conductivity, low bleed, and high temperature stability. 1 kg Bottle.
- Viscosity: 100,000 cP
- Thermal Conductivity: 2.9 W/m-K
- Dielectric Strength: 227 kV/in
- Features: Thermal / Heat Conductive
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Supplier: Epoxies Etc...
Description: The 50-2185FR Potting and Encapsulating Compound has been formulated to provide a low glass transition temperature, low durometer, high thermal conductivity, and flame retardancy. This system offers excellent heat transfer, low exotherm and excellent electrical properties. 50-2185FR
- Viscosity: 27,000 cP
- Use Temperature: -58 to 248 F
- Thermal Conductivity: 1.22593715 W/m-K
- Tensile Strength (Break): 800 psi
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures.
- Use Temperature: -76 to 356 F
- Thermal Conductivity: 0.55 W/m-K
- Dielectric Strength: 254.00000000000054 kV/in
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
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Supplier: Xoxide
Description: Tuniq TX-2 High Performance Thermal Compound achieves the best interface between your CPU and the heatsinks by its unique designed molecular size and shape. Without any metal or electric conductive, Tuniq TX-2 High Performance Thermal Compound is safe, reliable and
- Features: Thermally Conductive
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Supplier: Master Bond, Inc.
Description: EP21TDCANHT is a two component, flexible, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally high peel strength and tensile lap shear. It has a very convenient mix
- Use Temperature: -100 to 350 F
- Thermal Conductivity: 3.17 to 3.458 W/m-K
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Tensile Strength (Break): 7,000 psi
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP21AN is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. It has an exceptionally forgiving 1:1 mix ratio by weight or volume. Accelerated cures are
- Use Temperature: -60 to 250 F
- Thermal Conductivity: 3.17 W/m-K
- Coeff. of Thermal Expansion (CTE): 10 to 11 µin/in-F
- Tensile Strength (Break): 5,000 psi
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Supplier: Master Bond, Inc.
Description: Master Bond X-5TC is an aluminum oxide filled, thermally conductive elastomer-based, one component adhesive for high performance bonding and sealing. This thermally conductive adhesive bonds well in both shear and peel to similar and dissimilar surfaces including metals, woods,
- Use Temperature: -75 to 250 F
- Thermal Conductivity: 1.61535248 W/m-K
- Coeff. of Thermal Expansion (CTE): 18 µin/in-F
- Dielectric Strength: 450.00000000000006 kV/in
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Description: Excellent wetting properties ensure that there is no risk of spillage after thermal cycling, making them a viable alternative to thermal grease/thermal paste. ◆ Self-adhesive for easy application and rework. ◆ Complies with RoHS, Halogen-Free, and REACH environmental and
- Use Temperature: -40 to 257 F
- Thermal Conductivity: 3 W/m-K
- Dielectric Constant (Relative Permittivity): 3
- Industry: Electronics
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Supplier: Techsil Limited
Description: MG Chemicals 8617 Super Thermal Grease III is a low thermal resistance, non-corrosive grease. It uses an extremely thermal stable synthetic oil that is electrically insulating. This product is used to improve the thermal interface contact conductivity
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Supplier: Allied Electronics, Inc.
Description: AC Outlet Analyzer and Wrist Strap Tester Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballasts and thermocouple wells. High thermal conductivity, high dielectric constant, high
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EP35AOLV is a thermally conductive, electrically insulating compound that withstands aggressive chemicals, such as those found in downhole oil and gas processing. EP35AOLV exhibits superior protection against corrosion in various harsh environments and helps prolong longevity of critical (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
affects its stability and overall system performance. In this context, thermal grease, with its excellent thermal conductivity and ease of use, has become the ideal choice for optimizing the heat dissipation of energy storage battery packs. High temperatures are one of the main causes of battery (read more)
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why thermal grease remains a practical choice for CPU cooling and other high-power electronic assemblies. SG560-50 thermal grease is designed to improve contact between the CPU and heatsink by (read more)
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Master Bond EP3UF-1 is a one part epoxy that requires no mixing and is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi. (read more)
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Thermal cycling screening (optional) 7. Conclusion This 26-channel ultra-lightweight high-precision conductive slip ring is an engineered product specifically developed for aerospace (read more)
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. EP21TDCS-LO is engineered to maintain high-strength conductive bonds between dissimilar materials at temperatures as low as 4K, while passing NASA low-outgassing specifications. Its simple one-to-one mix ratio, 30–40 minute working time, and flexible cure schedule (read more)
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of robots demand enhanced heat dissipation, protection, and operational stability. Thermal conductive potting adhesives, which combine thermal conductivity, electrical insulation, and structural encapsulation, have become an indispensable thermal management solution in modules such as robotic (read more)
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In power modules, inductors, and other compact electronic assemblies, thermal conductive insulating film plays a critical role in balancing electrical insulation and heat dissipation. But in real applications, its (read more)
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vital role in ensuring the performance and longevity of automotive lighting modules. Properties of Thermal Conductive Silicone Gel Thermal conductive silicone gel is a high-performance material designed to efficiently transfer and dissipate heat in lighting modules (read more)
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, making it suitable for various sizes and shapes of Bluetooth speakers, and it features self-adhesiveness, eliminating the need for additional surface adhesives and simplifying the assembly process. More importantly, SHEEN thermal conductive silicone sheets have high compressibility and (read more)
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Application of phase-change materials in Pentium (R) III and Pentium (R) III XeonTM processor cartridges
… E.C. cartridge application, the post- melting thickness for the PCM with a fiber mesh carrier is about 3-4 mils due to the mesh thickness constraint, while the post-assembly thickness for the high thermal conductive grease is about 1-2 …
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Heat Drain Effects From HTS Tapes to High Thermal Conduction Plastics for Conduction-Cooled Magnets
In the DFRP experiment, the high thermal conduction grease was not used, however the DFRP’s data and the AlN’s data are near.
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Effect of magnetic field on the forced convection heat transfer and pressure drop of a magnetic nanofluid in a miniature heat sink
To improve the heat transfer efficiency, the contact surface between the heat sink and the heater block is covered with a layer of high thermal conductive grease .
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Thermal Conductivity29/Thermal Expansion 17
High thermal conductive grease ensures good thermal exchanges between the different elements.
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Adhesives & Sealants - China Adhesives & Sealants Manufacturers, Suppliers, Buyers, Sellers, Products Directory - Page 4
Related Products:High Quality,thermal grease, high conductive thermal grease .
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Advanced cooling system using miniature heat pipes in mobile PC
High conductive thermal grease was used between the heat source and the aluminum heat block.
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Improving heat sinking in ambient environment for the shape memory alloy (SMA)
Conversely, when the heat sink is used, heat from the surface of the SMA is spread to a larger surface area of the outer metal tube via the high thermal conducting silicone grease .
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Thermal management analysis of high-power electronic modules using Cu bonded AlN substrates
We applied high thermal conductive silicon grease (Si-grease) between the substrates and the AI plate in order to ensure sufficient heat conduction.
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Exciton photoconductivity in Ge‐doped GaSe crystals
In order to minimize the deformation, samples were gently stuck to the sample holder with high thermal conductive Apiezone N grease .
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Investigation of NbTiN Thin Films and AlN Tunnel Barriers With Ellipsometry for Superconducting Device Applications
Wafers were attached to a substrate block using Apiezon-L ultra high vacuum grease for thermal conduction and a clamping ring to gently secure the wafers to the block.