-
Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical,
- Coeff. of Thermal Expansion (CTE): 21.11 to 52.22 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled, Thermal / Heat Conductive
- Industry: Electronics, Photonics / Optoelectronics, Semiconductors / IC Packaging
-
Supplier: Protavic America, Inc.
Description: Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities
- Coeff. of Thermal Expansion (CTE): 22.22 to 55.56 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled, Flexible / Dampening, Thermal / Heat Conductive
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
-
Supplier: Techsil Limited
Description: and thermal. 8329TCM epoxy has many uses, its excellent conductivity improves thermal management for modern high powered devices which in turn increases their long term reliability. Ideal for thermal management applications where superior bonding strength is
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Thermal / Heat Conductive
- Industry: Electronics
-
-
Supplier: Protavic America, Inc.
Description: A silver filled, fast curing, solvent-free, single component electroconductive adhesive with a high silver content for LED applications. It has a pot life of 2 days and its rheology is well suited to application by microdispenser. It exhibits an excellent thermal stability and a
- Coeff. of Thermal Expansion (CTE): 27.78 to 94.44 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled, Thermal / Heat Conductive
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
-
Supplier: Techsil Limited
Description: and thermal. 8329TCS epoxy has many uses, its excellent conductivity improves thermal management for modern high powered devices which in turn increases their long term reliability. Ideal for thermal management applications where superior bonding strength is
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Thermal / Heat Conductive
- Industry: Electronics
-
Supplier: Master Bond, Inc.
Description: properties including high thermal conductivity, excellent electrical insulation properties, good physical strength properties and a high degree of flexibility. EP37-3FLFAN has low viscosity with excellent flow characteristics making it ideal as a thermally
- Coeff. of Thermal Expansion (CTE): 33.33 to 36.11 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 6.4 to 6.6
- Dielectric Strength: 400 kV/in
-
Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30C is a new, versatile two component nickel modified polymer system featuring high electrical conductivity, superior bonding strength and chemical resistance for EMI/RFI shielding as well as bonding and sealing applications. This electrically highly
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Strength: Over 400 kV/in
- Dissimilar Substrates: Yes
-
Supplier: Techsil Limited
Description: and thermal. 8329TCM epoxy has many uses, its excellent conductivity improves thermal management for modern high powered devices which in turn increases their long term reliability. Ideal for thermal management applications where superior bonding strength is
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive, Thermal / Heat Conductive
- Industry: Electronics
-
Supplier: Epoxies Etc...
Description: 70-3811 is a two component, aluminum filled epoxy system. This system is used for making heat resistance tools, parts, or bonds that require the highest thermal conductivity and heat resistance. We have developed this extremely conductive epoxy by formulating it with a
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Features: Encapsulating / Potting, Filled, Thermal / Heat Conductive
- Industry: Tooling / Mold Material
- Tensile Strength (Break): 14500 psi
-
Supplier: Master Bond, Inc.
Description: EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional
- Coeff. of Thermal Expansion (CTE): 1.33E7 to 1.56E7 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dissimilar Substrates: Yes
- Features: Electrical Insulating / Dielectric, Encapsulating / Potting, Non-corrosive Cure, Thermal / Heat Conductive
-
Supplier: Protavic America, Inc.
Description: PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150°C.
- Coeff. of Thermal Expansion (CTE): 12.22 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.32 to 4.4
- Features: Electrical Insulating / Dielectric, Encapsulating / Potting, Filled, Thermal / Heat Conductive
-
Supplier: Epoxies Etc...
Description: 50-3182 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3182 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination of properties makes this
- Coeff. of Thermal Expansion (CTE): 16.67 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 6.4
- Dielectric Strength: 560 kV/in
-
Supplier: Master Bond, Inc.
Description: Supreme 121AOND is a thermally conductive, electrically insulative epoxy with superior physical strength properties and a high glass transition temperature. It has a paste consistency and a long working life.
- Applied Thickness / Gap Fill: 0.0030 to 0.0050 inch
- Coeff. of Thermal Expansion (CTE): 25 to 27.78 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dissimilar Substrates: Yes
-
Supplier: Epoxies Etc...
Description: 50-3155 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3155 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination of properties makes this
- Coeff. of Thermal Expansion (CTE): 16.67 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 6.4
- Dielectric Strength: 560 kV/in
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK CF 3366, Epoxy Film, Assembly LOCTITE® ABLESTIK CF 3366 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance suitable for extreme
- Features: Thermal / Heat Conductive
- Thermal Conductivity: 7 W/m-K
-
Supplier: Epoxies Etc...
Description: 50-3186 is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 is a perfect choice for applications requiring high thermal conductivity, low
- Coeff. of Thermal Expansion (CTE): 15.56 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Thermal / Heat Conductive
- Industry: Electronics
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 550K, Epoxy Film, Assembly LOCTITE® ABLESTIK 550K is designed for substrate attach and heat sink bonding High thermal conductivity Low cure temperature Suitable for an array of difficult-to-bond substrates
- Dielectric Constant (Relative Permittivity): 0.0
- Features: Thermal / Heat Conductive
- Thermal Conductivity: 0.8000 W/m-K
-
Supplier: Techsil Limited
Description: MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive, Thermal / Heat Conductive
- Industry: Electronics
-
Supplier: Materion Corporation
Description: Silvertech PT-1™ is a two-component, Silver-filled conductive epoxy proven to work exceptionally well for the specific needs of the sputtering target industry. Designed to replace metallic solder bonding where high operating temperatures are a concern, or where metallic solder may be
- Cure Type / Technology: Two Component System
- Features: Electrically Conductive
- Industry: Electronics
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 563K, Epoxy Film, Assembly LOCTITE® ABLESTIK 563K adhesive film is suitable for bonding "hot" devices onto heat sinks where electrical insulation and good heat transfer are required. It exhibits low squeeze out during bonding. This product provides high strength
- Features: Thermal / Heat Conductive
- Thermal Conductivity: 1.1 W/m-K
-
Supplier: Graphene Laboratories, Inc.
Description: and fillers, ensuring high performance and adaptability to a wide range of conditions. Moreover, a defining feature of the G6E-TSHV™ Epoxy is its incorporation of a proprietary graphene additive. Loading the adhesive with graphene enhances its cracking resistance, making it more
- Cure Type / Technology: Two Component System, Room Temperature Curing
- Features: Electrically Conductive, Filled
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Medical / Food (Sanitary / FDA), Other
- Thermal Conductivity: 2.9 W/m-K
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Flexible Thixotropic High viscosity Long work life Easy handling High thermal conductivity Reduced stress
- Cure Type / Technology: Two Component System
- Features: Electrical Insulating / Dielectric, Thermal / Heat Conductive
- Viscosity: 247500 cP
-
Description: LOCTITE® ABLESTIK CF 3366 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance suitable for extreme environmental conditions. High adhesion strength at
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry: OEM / Industrial
- Thermal Conductivity: 7 W/m-K
-
Description: LOCTITE® ABLESTIK 84-1LMIT1 adhesive is designed for medium die attach applications. It is designed for screen printing using 325 mesh. Electrically conductive High thermal conductivity Solvent-free formulation Low viscosity
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry: Electronics, OEM / Industrial
- Viscosity: 22000 cP
-
Epoxy Adhesives - Thermally Conductive, Non-Electrically Conductive, Low Viscosity Epoxy -- G6E-TSALSupplier: Graphene Laboratories, Inc.
Description: and fillers, ensuring high performance and adaptability to a wide range of conditions. Moreover, a defining feature of the G6E-TSAL™ Epoxy is its incorporation of a proprietary graphene additive. Loading the adhesive with graphene enhances its cracking resistance, making it more
- Cure Type / Technology: Two Component System, Room Temperature Curing
- Features: Electrically Conductive, Filled
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Medical / Food (Sanitary / FDA), Other
- Thermal Conductivity: 1.8 W/m-K
-
Description: associated with flexible films. High strength film with high thermal conductivity Thin bondline Uniform bondline control Good heat transfer
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry: OEM / Industrial
- Thermal Conductivity: 1.1 W/m-K
-
Supplier: Ellsworth Adhesives
Description: ResinLab EP1330 Black is a one component, heat curing, epoxy polymer system that is used for staking, damming, potting, and bonding circuit board components, metals, and plastics. It offers high thermal conductivity, semi-free flowing, low shrinkage, and self leveling
- Cure Type / Technology: Single Component System
- Dielectric Strength: 440 kV/in
- Elongation: 0.0 to 1 %
- Substrate / Material Compatibility: Metal, Plastic
-
Description: High electrical and thermal conductivity – superior grounding and minimum thermal resistance to heat sink Compatible with temperature-sensitiv e substrates and components – cures at a low temperature of 125°C Flexible – allows use of material combinations with CTE
- Coeff. of Thermal Expansion (CTE): 11.39 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry: OEM / Industrial
- Viscosity: 7500 cP
-
Supplier: Henkel Corporation - Electronics
Description: HYSOL ECCOBOND 281 BLK one component epoxy adhesive is formualted for use in applications requiring excellent thermal conductivity. It has high thermal conductivity, good chemical resistance and is electrically insulating. It is designed to not flow
- Industry: Electronics
-
Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 56C Silver, formerly Emerson and Cuming ECCOBOND, is two component, heat curing, epoxy adhesive resin that is used to replace hot soldering for electrical connections. It offers high strength bonds, non-flowing properties, long pot life, high
- Cure Type / Technology: Two Component System
- Tensile Strength (Break): 870 psi
-
Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 56C Silver, formerly Emerson and Cuming ECCOBOND, is two component, heat curing, epoxy adhesive resin that is used to replace hot soldering for electrical connections. It offers high strength bonds, non-flowing properties, long pot life, high
- Cure Type / Technology: Two Component System
- Thermal Conductivity: 3 W/m-K
- Viscosity: 35 to 60 cP
-
Supplier: Ellsworth Adhesives
Description: AI Technology EG7655 is an alumina filled, reworkable, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e. alumina to aluminum, silicon to copper). EG7655's
- Cure Type / Technology: Two Component System
- Dielectric Strength: 750 kV/in
- Thermal Conductivity: 1.7 W/m-K
- Viscosity: 280000 cP
-
Supplier: Hi-Tech Seals, Inc.
Description: . Unlike epoxies acrylics require no direct mixing. Acrylics offer unique performance capabilities. High peel and high impact strengths are combined to deliver tough, durable, shock resistant bonds. Acrylics withstand weathering effects well. Acrylic adhesives do not
- Coeff. of Thermal Expansion (CTE): 3.94E-4 µin/in-F
- Cure Type / Technology: Reactive / Moisture Cured, Two Component System
- Dielectric Constant (Relative Permittivity): 12.34 to 14.92
- Dielectric Strength: 38.1 kV/in
-
Supplier: Lake Shore Cryotronics, Inc.
Description: This epoxy is used to permanently attach test samples or temperature sensors to sample holders. It is a 100% solid, two component, low temperature curing, silver-filled epoxy which features very high electrical and thermal conductivity combined with excellent
Find Suppliers by Category Top
Featured Products Top
-
Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
has made available EP21TCHT-1. Curable at room temperatures, EP21TCHT-1 has high thermal conductivity and superior electrical insulation properties. It has a service operating temperature range of 4K to 400°F. It also has a remarkably low thermal expansion coefficient. EP21TCHT-1 is NASA (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Supreme 121AOND Product Information Two part toughened epoxy for bonding, sealing and encapsulation features good thermal conductivity Key Features Paste (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
controllers, drive systems, and power units. Thermal potting adhesives are typically two-component composite materials based on silicone, epoxy, or polyurethane resins, filled with high thermal conductivity powders. These materials offer excellent (read more)
Browse Silicone Adhesives and Sealants Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
conductive adhesives for use in electronics and other industrial applications where heat dissipation is a requirement. They will also continue to bond substrates in addtion to providing effective heat dissipation. High thermal conductivity Strong (read more)
Browse Elastomers and Rubber Compounds Datasheets for CHT USA Inc. -
Master Bond EP3UF-1 is a one part epoxy that requires no mixing and is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
volume resistivity of 5-15 ohm-cm and a thermal conductivity of 2.88-3.46 W/(m•K) at room temperature. It is a non-metallic system designed for heat sensitive electronic applications where high levels of conductivity are desired. (read more)
Browse Conductive Compounds Datasheets for Master Bond, Inc. -
Master Bond EP17HTS-DA has a paste consistency and an unlimited working life at room temperature. Its key performance properties include high temperature resistance and high Tg, excellent electrical conductivity, withstands thermal cycling, shock and vibration, and superior heat conductivity. It is NASA low outgassing and meets Mil Std 883. (read more)
Browse Conductive Compounds Datasheets for Master Bond, Inc. -
This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. It offers a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m·K)] and a volume resistivity exceeding 1014 ohm-cm. EP3UF also (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
applications where minimal flow is required. It has a low tensile modulus of 250-500 psi, and a high elongation of 90-100% at room temperature. Its toughness and flexibility allow it to withstand rigorous thermal cycling, making it well-suited for applications where low stress is critical. The system (read more)
Browse UV Curing Adhesives Datasheets for Master Bond, Inc.
More Information Top
Indicates content that may require registration and/or purchase.
-
Thermal Management for LED Applications
DM6030 Series high thermal conductivity epoxy adhesive pastes, data sheet, DieMat Inc. 2005.
-
An X-band high power amplifier module package using selectively anodized aluminum substrate
mm2 ) were also mounted on the aluminum substrate by high thermal conductivity adhesive epoxy from DIEMAT (DM6030Hk).
-
The High Voltage Design Of A Space Qualified Detector For Space Telescope
This bonding step was done using Stycast 2850 Ft, an epoxy adhesive having high thermal conductivity .
-
Laminar heat transfer of non-Newtonian nanofluids in a circular tube
To measure the wall temperatures, ten K-type thermocouples were mounted on the tube by an epoxy adhesive with high thermal conductivity at axial positions of 100, 150, 200, 350, 550, 800, 1,100, 1,400, 1,700, and 2,000 mm …
-
Heat transfer correlations for air-water two-phase flow of different flow patterns in a horizontal pipe
T- type thermocouple wires were cemented with Omegabond 101, an epoxy adhesive with high thermal conductivity and electrical resistivity, to the outs ide wall of the stainless steel test section.
-
8.1.08 -- Aremco-Bond 568 Thermally Conductive Adhesive Now Available
Master Bond Inc., Hackensack, N.J. has introduced Supreme 11AOHT, a two component room temperature curing epoxy adhesive with high thermal conductivity and excellent electrical insulation properties.
-
Conductive, Electrically Isolating Epoxy Resists High Temperatures
Hackensack, NJ - Master Bond Inc., Hackensack, N.J. has introduced Supreme 11AOHT, a two component room temperature curing epoxy adhesive with high thermal conductivity and excellent electrical insulation properties.
-
Process characterization of highly conductive silver paste die attach materials for thin die on QFN
The first silver paste die attach materials (DA1) was used as a reference which is silver-loaded epoxy adhesive with high thermal conductivity of 60W/mK and electrical conductivity of 16Ms/m.
-
Heat-Transfer Calculations > Calculation of Local Inside-Wall Convective Heat-Transfer Parameters from Measurements of Local Outside-Wall Temperatures along an...
T-type thermocouples are cemented with an epoxy adhesive having high thermal conductivity and electrical resistivity to the outside wall of the test section at uniform intervals of 254 mm (refer to Fig. 23.3).
-
Thermal aspects of GaAs power FET attachment using isotropically conductive adhesive
In our experiments, the chip is attached to a chip carrier using high thermal conductivity Ag/ Epoxy adhesive paste (DIEMAT DM6030Hk).