-
Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical,
- Viscosity: 1,800 to 3,600 cP
- Use Temperature: 572 F
- Thermal Conductivity: 12.6 to 26.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 21.11111111111111 to 52.22222222222222 µin/in-F
-
Supplier: Master Bond, Inc.
Description: performance properties including high thermal conductivity, superior dimensional stability, physical properties, toughness and electrical insulation. EP30FLAO is a low viscosity epoxy with excellent flow characteristics making it ideal as a thermally conductive potting
- Viscosity: 10,000 to 15,000 cP
- Use Temperature: -60 to 275 F
- Thermal Conductivity: 0.288 to 0.432 W/m-K
- Coeff. of Thermal Expansion (CTE): 17 µin/in-F
-
Supplier: Techsil Limited
Description: thermal. 8329TCS epoxy has many uses, its excellent conductivity improves thermal management for modern high powered devices which in turn increases their long term reliability. Ideal for thermal management applications where superior bonding strength is
- Industry: Electronics
- Features: Epoxy (EP), Thermal / Heat Conductive
- Cure / Technology: Thermosetting / Crosslinking
-
-
Supplier: Techsil Limited
Description: thermal. 8329TCM epoxy has many uses, its excellent conductivity improves thermal management for modern high powered devices which in turn increases their long term reliability. Ideal for thermal management applications where superior bonding strength is
- Industry: Electronics
- Features: Epoxy (EP), Thermal / Heat Conductive
- Cure / Technology: Thermosetting / Crosslinking
-
Supplier: Master Bond, Inc.
Description: properties including high thermal conductivity, excellent electrical insulation properties, good physical strength properties and a high degree of flexibility. EP37-3FLFAN has low viscosity with excellent flow characteristics making it ideal as a thermally conductive
- Viscosity: 60,000 to 80,000 cP
- Use Temperature: -452.47 to 250 F
- Thermal Conductivity: 3.6056975 W/m-K
- Coeff. of Thermal Expansion (CTE): 33.333333333333336 to 36.11111111111111 µin/in-F
-
Supplier: Newark, An Avnet Company
Description: Epoxy - High Thermal Conductivity Epoxy, Flame-Retardant, Certified UL 746A file# E334302 Kit
-
Supplier: Master Bond, Inc.
Description: For advanced PCB assembly and heat sink bonding applications, Master Bond offers EP48TC, a specially formulated adhesive that features ultra low thermal resistance of 5-7 x 10-6 K•m2/W. This system uses high thermal conductive fillers and is capable of being applied in
- Use Temperature: -100 to 300 F
- Thermal Conductivity: 2.88 to 3.6 W/m-K
- Coeff. of Thermal Expansion (CTE): 7.22 to 8.33 µin/in-F
- Tensile Strength (Break): 6,000 to 7,000 psi
-
Supplier: Epoxies Etc...
Description: 70-3811 is a two component, aluminum filled epoxy system. This system is used for making heat resistance tools, parts, or bonds that require the highest thermal conductivity and heat resistance. We have developed this extremely conductive epoxy by formulating it with a
- Viscosity: 48,000 cP
- Use Temperature: -103 to 572 F
- Thermal Conductivity: 2.1634185 W/m-K
- Tensile Strength (Break): 14,500 psi
-
Supplier: Protavic America, Inc.
Description: Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities
- Viscosity: 2,000 cP
- Thermal Conductivity: 2.5 to 3 W/m-K
- Coeff. of Thermal Expansion (CTE): 22.22222222222222 to 55.55555555555556 µin/in-F
- Substrate Compatibility: Ceramic / Glass, Metal
-
Supplier: Master Bond, Inc.
Description: EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional
- Viscosity: 400,000 cP
- Use Temperature: -80 to 400 F
- Thermal Conductivity: 5.7 to 6.5 W/m-K
- Coeff. of Thermal Expansion (CTE): 13,333,333.333333332 to 15,555,555.555555556 µin/in-F
-
Supplier: Henkel Corporation - Electronics
Description: HYSOL ECCOBOND 281 BLK one component epoxy adhesive is formualted for use in applications requiring excellent thermal conductivity. It has high thermal conductivity, good chemical resistance and is electrically insulating. It is designed to not flow
- Industry: Electronics
- Features: Thermally Conductive
-
Supplier: Newark, An Avnet Company
Description: Epoxy - High Thermal Conductivity, Flame-Retardant, Certified UL 746A file# E334302 (MTO = 8) Kit
-
Supplier: Epoxies Etc...
Description: 50-3186 is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 is a perfect choice for applications requiring high thermal conductivity, low thermal
- Use Temperature: -40 to 446 F
- Thermal Conductivity: 1.38458784 W/m-K
- Coeff. of Thermal Expansion (CTE): 15.555555555555555 µin/in-F
- Tensile Strength (Break): 2,700 psi
-
Supplier: Epoxies Etc...
Description: 50-3182 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3182 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination of properties makes this
- Viscosity: 3,000 to 90,000 cP
- Use Temperature: -67 to 401 F
- Thermal Conductivity: 1.65862085 W/m-K
- Coeff. of Thermal Expansion (CTE): 16.666666666666668 µin/in-F
-
Supplier: Epoxies Etc...
Description: 50-3155 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3155 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination of properties makes this
- Viscosity: 3,000 to 15,000 cP
- Use Temperature: -67 to 401 F
- Thermal Conductivity: 3.6056975 W/m-K
- Coeff. of Thermal Expansion (CTE): 16.666666666666668 µin/in-F
-
Supplier: Graphene Laboratories, Inc.
Description: withstanding thermal cycling, mechanical stresses, and temperature variations without developing cracks or compromising the integrity of the bond. KEY FEATURES: High Viscosity: Improved gap sealing, gap filling, reduced flow, reduced risk of sagging. High Thermal
- Viscosity: 400,000 to 450,000 cP
- Use Temperature: 77 to 302 F
- Thermal Conductivity: 2.9 W/m-K
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Medical / Food (Sanitary / FDA)
-
Supplier: Ellsworth Adhesives
Description: ResinLab EP1330 Black is a one component, heat curing, epoxy polymer system that is used for staking, damming, potting, and bonding circuit board components, metals, and plastics. It offers high thermal conductivity, semi-free flowing, low shrinkage, and self leveling
- Viscosity: 475,000 cP
- Thermal Conductivity: 0.94 W/m-K
- Tensile Strength (Break): 7,000 psi
- Elongation: 0 to 1 %
-
Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 56C Silver, formerly Emerson and Cuming ECCOBOND, is two component, heat curing, epoxy adhesive resin that is used to replace hot soldering for electrical connections. It offers high strength bonds, non-flowing properties, long pot life, high
- Viscosity: 35 to 60 cP
- Thermal Conductivity: 3 W/m-K
- Features: Epoxy (EP)
- Cure / Technology: Two Component System
-
Supplier: Techsil Limited
Description: thermal. 8329TCM epoxy has many uses, its excellent conductivity improves thermal management for modern high powered devices which in turn increases their long term reliability. Ideal for thermal management applications where superior bonding strength is
- Features: Electrically Conductive, Epoxy (EP), Thermal / Heat Conductive
- Industry: Electronics
- Cure / Technology: Thermosetting / Crosslinking
-
Supplier: Allied Electronics, Inc.
Description: Features Conductive Silver Epoxy Provides Excellent Electrical and Thermal Conductivity Fully Cured Material Offers High Strength Bonds Extended Pot Life Provides Sixty Minute Work Time High-Strength Solderless Conductive Bonding Repairs Defective Traces and
-
Supplier: Ellsworth Adhesives
Description: ResinLab EP1121-4 Black is a two component, room and elevated temperature curing, highly filled epoxy that is used for applications with a high degree of thermal conductivity, flexibility and low CTE. It offers a thixotropic viscosity, high elongation and
- Viscosity: 500,000 cP
- Thermal Conductivity: 1.1 W/m-K
- Tensile Strength (Break): 1,900 psi
- Elongation: 15 %
-
Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 56C Silver, formerly Emerson and Cuming ECCOBOND, is two component, heat curing, epoxy adhesive resin that is used to replace hot soldering for electrical connections. It offers high strength bonds, non-flowing properties, long pot life, high
- Tensile Strength (Break): 870.221036143182 psi
- Features: Epoxy (EP)
- Cure / Technology: Two Component System
-
Supplier: Allied Electronics, Inc.
Description: Cyanoacrylate Adhesive, 1.05 @ 75 ºF Specific Gravity Conductive Epoxy, Silver Epoxy Resin, Mild Odor Conductive Silver Epoxy Provides Excellent Electrical and Thermal Conductivity High Strength Conductive Bonding Repairs Defective Traces and Creates
-
Supplier: Henkel Corporation - Industrial
Description: BERGQUIST LIQUI BOND TLB EA1800, Thermally Conductive, Two-Part, Epoxy Based, Liquid-dispensable Adhesive BERGQUIST® LIQUI BOND TLB EA1800 is a two-component, epoxy based, liquid-dispensable adhesive. BERGQUIST LIQUI BOND TLB EA1800 has a thermal
- Use Temperature: 40 to 257 F
- Thermal Conductivity: 1.8 W/m-K
- Chemical System: Silicone
- Features: Thermal / Heat Conductive
-
Epoxy Adhesives - Thermally Conductive, Non-Electrically Conductive, Low Viscosity Epoxy -- G6E-TSALSupplier: Graphene Laboratories, Inc.
Description: This property allows for better coverage and reduces the chances of air entrapment, ensuring improved thermal contact between the bonded components. Thermal Conductivity (1.8 W/m·K): Our adhesive ensures efficient heat transfer from the heat-generating component to the
- Viscosity: 40,000 to 50,000 cP
- Use Temperature: 77 to 302 F
- Thermal Conductivity: 1.8 W/m-K
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Medical / Food (Sanitary / FDA)
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK CF 3366, Epoxy Film, Assembly LOCTITE® ABLESTIK CF 3366 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance suitable for extreme
- Thermal Conductivity: 7 W/m-K
- Features: Epoxy (EP), Thermal / Heat Conductive
-
Supplier: Protavic America, Inc.
Description: PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150°C.
- Viscosity: 40,000 cP
- Use Temperature: -55 to 150 F
- Thermal Conductivity: 1.15 W/m-K
- Coeff. of Thermal Expansion (CTE): 12.222222222222221 µin/in-F
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 84-1LMIT, Epoxy, Component assembly, Electrically Conductive Adhesive LOCTITE® ABLESTIK 84-1LMIT adhesive is designed for medium die attach applications. This adhesive is ideal for application by syringe dispensing or screen printing. Electrically
- Features: Epoxy (EP), Specialty / Other, Thermal / Heat Conductive
- Cure / Technology: Single Component System
-
Description: LOCTITE® ABLESTIK CF 3366 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance suitable for extreme environmental conditions. High adhesion strength at
- Thermal Conductivity: 7 W/m-K
- Features: Epoxy (EP)
- Industry: OEM / Industrial
- Cure / Technology: Thermosetting / Crosslinking
-
Supplier: Materion Corporation
Description: Silvertech PT-1 ensures a good bond strength and high thermal and electrical conductivity.
- Features: Die Bonding Adhesive / Compound, Electrically Conductive, Epoxy (EP)
- Industry: Electronics
- Cure / Technology: Two Component System
-
Supplier: Techsil Limited
Description: MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists
- Features: Electrically Conductive, Epoxy (EP), Thermal / Heat Conductive
- Industry: Electronics
- Cure / Technology: Thermosetting / Crosslinking
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Flexible Thixotropic High viscosity Long work life Easy handling High thermal conductivity Reduced stress
- Viscosity: 247,500 cP
- Features: Electrical Insulation / Dielectric, Epoxy (EP), Specialty / Other, Thermal / Heat Conductive
- Cure / Technology: Two Component System
-
Description: flexible films. High strength film with high thermal conductivity Thin bondline Uniform bondline control Good heat transfer
- Thermal Conductivity: 1.1 W/m-K
- Features: Epoxy (EP)
- Industry: OEM / Industrial
- Cure / Technology: Thermosetting / Crosslinking
-
Description: standards. This product can be cured at various temperatures. Please refer to the TDS for alternate cure schedules. High and stable adhesion at elevated temperatures – maintains adhesion strength up to temperatures as high as 175°C; extreme environment capable High electrical
- Viscosity: 7,500 cP
- Coeff. of Thermal Expansion (CTE): 11.38888888888889 µin/in-F
- Features: Epoxy (EP)
- Industry: OEM / Industrial
-
Supplier: Lake Shore Cryotronics, Inc.
Description: This epoxy is used to permanently attach test samples or temperature sensors to sample holders. It is a 100% solid, two component, low temperature curing, silver-filled epoxy which features very high electrical and thermal conductivity combined with excellent
Find Suppliers by Category Top
Featured Products Top
-
Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
has made available EP21TCHT-1. Curable at room temperatures, EP21TCHT-1 has high thermal conductivity and superior electrical insulation properties. It has a service operating temperature range of 4K to 400°F. It also has a remarkably low thermal expansion coefficient. EP21TCHT-1 is NASA (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Supreme 121AOND Product Information Two part toughened epoxy for bonding, sealing and encapsulation features good thermal conductivity Key Features Paste (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
controllers, drive systems, and power units. Thermal potting adhesives are typically two-component composite materials based on silicone, epoxy, or polyurethane resins, filled with high thermal conductivity powders. These materials offer excellent (read more)
Browse Silicone Adhesives and Sealants Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
conductive adhesives for use in electronics and other industrial applications where heat dissipation is a requirement. They will also continue to bond substrates in addtion to providing effective heat dissipation. High thermal conductivity Strong (read more)
Browse Elastomers and Rubber Compounds Datasheets for CHT USA Inc. -
Master Bond EP3UF-1 is a one part epoxy that requires no mixing and is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
volume resistivity of 5-15 ohm-cm and a thermal conductivity of 2.88-3.46 W/(m•K) at room temperature. It is a non-metallic system designed for heat sensitive electronic applications where high levels of conductivity are desired. (read more)
Browse Conductive Compounds Datasheets for Master Bond, Inc. -
Master Bond EP17HTS-DA has a paste consistency and an unlimited working life at room temperature. Its key performance properties include high temperature resistance and high Tg, excellent electrical conductivity, withstands thermal cycling, shock and vibration, and superior heat conductivity. It is NASA low outgassing and meets Mil Std 883. (read more)
Browse Conductive Compounds Datasheets for Master Bond, Inc. -
This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. It offers a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m·K)] and a volume resistivity exceeding 1014 ohm-cm. EP3UF also (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
high temperature electrical potting compounds and powdered epoxies for electrical insulating and electric conductivity as well as UV curable adhesives for temporary metal maskants and insulating coatings. (read more)
Browse Epoxy Adhesives Datasheets for Beacon Adhesives, Inc.
More Information Top
Indicates content that may require registration and/or purchase.
-
Thermal Management for LED Applications
DM6030 Series high thermal conductivity epoxy adhesive pastes, data sheet, DieMat Inc. 2005.
-
An X-band high power amplifier module package using selectively anodized aluminum substrate
mm2 ) were also mounted on the aluminum substrate by high thermal conductivity adhesive epoxy from DIEMAT (DM6030Hk).
-
The High Voltage Design Of A Space Qualified Detector For Space Telescope
This bonding step was done using Stycast 2850 Ft, an epoxy adhesive having high thermal conductivity .
-
Laminar heat transfer of non-Newtonian nanofluids in a circular tube
To measure the wall temperatures, ten K-type thermocouples were mounted on the tube by an epoxy adhesive with high thermal conductivity at axial positions of 100, 150, 200, 350, 550, 800, 1,100, 1,400, 1,700, and 2,000 mm …
-
Heat transfer correlations for air-water two-phase flow of different flow patterns in a horizontal pipe
T- type thermocouple wires were cemented with Omegabond 101, an epoxy adhesive with high thermal conductivity and electrical resistivity, to the outs ide wall of the stainless steel test section.
-
8.1.08 -- Aremco-Bond 568 Thermally Conductive Adhesive Now Available
Master Bond Inc., Hackensack, N.J. has introduced Supreme 11AOHT, a two component room temperature curing epoxy adhesive with high thermal conductivity and excellent electrical insulation properties.
-
Conductive, Electrically Isolating Epoxy Resists High Temperatures
Hackensack, NJ - Master Bond Inc., Hackensack, N.J. has introduced Supreme 11AOHT, a two component room temperature curing epoxy adhesive with high thermal conductivity and excellent electrical insulation properties.
-
Process characterization of highly conductive silver paste die attach materials for thin die on QFN
The first silver paste die attach materials (DA1) was used as a reference which is silver-loaded epoxy adhesive with high thermal conductivity of 60W/mK and electrical conductivity of 16Ms/m.
-
Heat-Transfer Calculations > Calculation of Local Inside-Wall Convective Heat-Transfer Parameters from Measurements of Local Outside-Wall Temperatures along an...
T-type thermocouples are cemented with an epoxy adhesive having high thermal conductivity and electrical resistivity to the outside wall of the test section at uniform intervals of 254 mm (refer to Fig. 23.3).
-
Thermal aspects of GaAs power FET attachment using isotropically conductive adhesive
In our experiments, the chip is attached to a chip carrier using high thermal conductivity Ag/ Epoxy adhesive paste (DIEMAT DM6030Hk).