Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: Protavic America, Inc.
Description: The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids which allow package 10 withstand 260C Pb-free reflow temperature. More over
- Chemical / Polymer System Type: Specialty / Other
- Coeff. of Thermal Expansion (CTE): 54.44 to 70 µin/in-F
- Features: Thermal Compound / Interface (Thermally Conductive), Electrically Conductive Compound (Adhesive, Grease), Flexible / Dampening, Laminating / Composites
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging, Other
-
Supplier: Techsil Limited
Description: LOCTITE® HY 4080GY™ is a two component, grey structural hybrid adhesives that provides toughness and excellent adhesion to metals, composites and plastics. This product provides fast fixture at room temperature and high operational strength within the first hour. It offers good
-
Supplier: ODG (Origin Data Global)
Description: HYBRID ADHESIVE SEALANT FAST CUR
-
-
Supplier: ODG (Origin Data Global)
Description: HYBRID ADHESIVE SEALANT FAST CUR
-
Supplier: R. S. Hughes Company, Inc.
Description: Loctite 4090 yellow epoxy/cyanocrylate hybrid adhesive is compatible with plastic, rubber and metal materials with a 24 hr cure time. Provides a 3-5 min working time. Works in a mix ratio of 1:1. Delivers great performance with tensile strength of 1025 psi. Minimum to maximum operating
- Chemical / Polymer System Type: Epoxy (EP)
- Features: Leveling / Filling Compound
- Use Temperature: -65 to 302 F
- Viscosity: 27000 cP
-
Supplier: Techsil Limited
Description: LOCTITE® HY 4070™ is a hybrid adhesive which provides a fast fixture at room temperature in bond gaps up to 5mm. This product offers excellent bonding characteristics to a variety of substrates including some plastics, rubbers, and metals. LOCTITE® HY 4070™ is
-
Supplier: Techsil Limited
Description: resistance which makes it suitable for applications in high temperature/humidity environments. The thixotropic nature of this product makes it suitable for applications where good gap filling properties on rough and poorly fitting surfaces are required. The technology behind LOCTITE® HY 4090™
-
Description: LOCTITE® ABLESTIK QMI529HT-LV conductive die attach adhesive has been formulated for use in high throughput die attach applications Electrically conductive Thermally conductive Good dispensing characteristics Hydrophobic
- Coeff. of Thermal Expansion (CTE): 34.44 µin/in-F
- Features: Electrically Conductive Compound (Adhesive, Grease)
- Industry: Electronics, OEM / Industrial
- Tensile Strength (Break): 107037 psi
-
Supplier: DigiKey
Description: HYBRID ADHESIVE SEALANT FAST CUR
- Chemical / Polymer System Type: Silicone
-
Supplier: DigiKey
Description: HYBRID ADHESIVE SEALANT FAST CUR
-
Supplier: Protavic America, Inc.
Description: PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Dielectric Constant (Relative Permittivity): 4.7 to 4.8
- Dielectric Strength: 635 kV/in
-
Supplier: Protavic America, Inc.
Description: PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Dielectric Constant (Relative Permittivity): 4.7 to 4.8
- Dielectric Strength: 635 kV/in
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 8301, Epoxy hybrid, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 8301 electrically conductive die attach adhesive is designed for high reliability package applications. Electrically conductive Thermally conductive Snap
-
Supplier: Henkel Corporation - Industrial
Description: Transparent, cloudy colorless to pale yellow cyanoacrylate/acryli c hybrid gel adhesive that provides a fast fixture at room temperature. LOCTITE® HY 4070 is a 2-part, transparent, cloudy colorless to pale yellow cyanoacrylate/acryli c hybrid gel adhesive that provides a
- Applied Thickness / Gap Fill: 0.1970 inch
- Cure Type / Technology: Two Component System
- Substrate / Material Compatibility: Metal, Plastic, Rubber / Elastomer, Wood / Wood Product
-
Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 2000, Proprietary Hybrid Chemistry, Electrically Conductive Die Attach Adhesive LOCTITE® ABLESTIK 2000 electrically conductive die attach adhesive is designed for Pb-free PBGA and Array BGA packaging. This product is able to withstand the high reflow
- Coeff. of Thermal Expansion (CTE): 36.11 µin/in-F
-
Supplier: Henkel Corporation - Industrial
Description: Cyanoacrylate/acryli c hybrid structural adhesive paste that provides toughness and excellent adhesion to metals, composites and plastics. LOCTITE® HY 4080 is a 2-part, opaque to slightly yellow, cyanoacrylate/acryli c hybrid structural bonding adhesive that provides
-
Supplier: Ellsworth Adhesives
Description: Henkel Loctite HY 4090 Hybrid Adhesive Off-White is a two component, one part epoxy and one part cyanoacrylate, structural instant adhesive. This high performance adhesive can be used on a variety of substrates such as plastic, rubber, and metals. It offers low blooming,
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Elongation: 3.6 %
- Substrate / Material Compatibility: Metal, Plastic, Rubber / Elastomer
-
Supplier: Ellsworth Adhesives
Description: Henkel Loctite HY 4090GY Hybrid Adhesive Gray is a two component, one part epoxy and one part cyanoacrylate, structural instant adhesive. This high performance adhesive can be used on a variety of substrates such as plastic, rubber, and metals. It offers a fast
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Elongation: 3.6 %
- Substrate / Material Compatibility: Metal, Plastic, Rubber / Elastomer
-
Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our UV
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 25 to 76.67 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (EB, Light), Single Component System
- Index of Refraction: 1.53
-
Supplier: Hapco, Inc.
Description: HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS Hapflex™ 700/800 products are colorless, high strength elastomers available in hardnesses ranging from 65A to 72D. Hapflex™ 700/800 products exhibit high tensile strength, high tear strength, and excellent
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Rubber Based / Elastomeric
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Industry: Electronics, OEM / Industrial, Tooling / Mold Material
- Viscosity: 4000 cP
-
Supplier: Hapco, Inc.
Description: HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS Hapflex™ 700/800 products are colorless, high strength elastomers available in hardnesses ranging from 65A to 72D. Hapflex™ 700/800 products exhibit high tensile strength, high tear strength, and excellent
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Rubber Based / Elastomeric
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Industry: Electronics, OEM / Industrial, Tooling / Mold Material
- Viscosity: 4300 cP
-
Supplier: Hapco, Inc.
Description: HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS The Hapflex™ 500 Series offers soft durometer elastomers ranging from 45 - 95 Shore A. All are relatively fast, room curing, flexible systems that can be accelerated with moderate heat for faster cycle times. Most
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Rubber Based / Elastomeric
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Industry: OEM / Industrial, Tooling / Mold Material
- Viscosity: 1850 cP
-
Supplier: Ellsworth Adhesives
Description: Henkel Loctite HY 4070 is a two component, cyanoacrylate/acryli c hybrid adhesive that has the cure speed of an instant adhesive and the strength of a structural adhesive. It bonds well to a variety of substrates including metals, rubbers, and plastics. It offers a
- Chemical / Polymer System Type: Acrylic / Polyacrylate
- Cure Type / Technology: Two Component System
- Elongation: 4.9 %
- Substrate / Material Compatibility: Metal, Plastic, Rubber / Elastomer
-
Supplier: Hapco, Inc.
Description: HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS The Hapflex™ 600 series are relatively fast, semi-rigid, room temperature curing systems. This series yields harder durometers ranging from 50 - 70 Shore D. Most 600 Series products are offered in 2 speeds
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Rubber Based / Elastomeric
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Industry: OEM / Industrial, Tooling / Mold Material
- Viscosity: 2550 cP
-
Supplier: Ellsworth Adhesives
Description: 3M Hybrid Sealant 730 Clear is a one component, UV resistant, moisture curing sealant that forms permanent elastic bonds. It is paintable when wet and bonds to a variety of materials including metals, plastics, fiberglass, and wood. 305 mL Cartridge.
- Cure Type / Technology: Single Component System
- Elongation: 300 %
- Substrate / Material Compatibility: Metal, Plastic, Wood / Wood Product
- Tensile Strength (Break): 250 psi
-
Supplier: Wacker Chemical Corp.
Description: Based on the innovative alpha-technology, the new GENIOSIL® XB hybrid polymers for the first time exploit the advantages of silane crosslinking for user-friendly, environmentally compatible structural adhesive bonds.Thanks to their low viscosity, the new hybrid polymers are easy
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Industry: Building / Construction
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Wood / Wood Product
-
Supplier: SAE International
Description: recyclability), was used in this paper as a model polymer. Because adhesive bonding opens the door to the design of hybrid structures composed of virtually any combination of dissimilar materials, often impossible to esthetically marry otherwise, the efficacy of polypropylene surface
-
Description: performance fiber including: carbon, glass, aramid, hybrid materials, etcetera. Equipment includes: • Uni-tape production at 1m width • Woven fabric prepreg at 12? to 62? width • Adhesive filming at 50" width • Towpreg production
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Specialty / Other
- Features: Flame Retardant (e.g. UL 94 Rated)
- Industry: Aerospace
-
Supplier: Accuris
Description: THE SELECTION AND USE OF ORGANIC ADHESIVES IN HYBRID MICROCIRCUITS, SPECIFICATION FOR
-
Supplier: Merrimac Industries, Inc.
Description: processing. The Multi-Mix PICO® HJD-Z series provides a 3 dB, hybrid junction with low insertion loss, high isolation, and high power handling in a small outline. Accurate phase and amplitude balance, make them ideal for use in PCS power amplifiers, beamforming networks, matching baluns
- Coupler Type: Uni-Directional
- Frequency Range: 1930 to 1990 MHz
- Insertion Loss: 0.3500 dB
- Package Type: Surface Mount Technology (SMT)
-
Supplier: Techsil Limited
Description: These static mixer nozzles from LOCTITE® are designed for use with the 11gm hybrid cartridges. Ideal for the dispensing of multi-component adhesives, they ensure the correct proportions of adhesive is pushed through a matrix which works to combine the material until ready to
-
Supplier: Hoffmann + Krippner Inc.
Description: (input) or wiper (tap) • Temperature range: -40C°(-40°F) to +125° C (257°F) • Simple adjustment to customer design Composition • Adhesive film, selection according to requirement • Basic membrane with potentiometer resistance • Spacers between upper and lower membrane • Collector membrane as
-
Supplier: Hoffmann + Krippner Inc.
Description: (input) or wiper (tap) • Temperature range: -40C°(-40°F) to +125° C (257°F) • Simple adjustment to customer design Composition • Adhesive film, selection according to requirement • Basic membrane with potentiometer resistance • Spacers between upper and lower membrane • Collector membrane as
-
Description: controls, innovative bonding technologies, hybrid bonded/bolted joints, non-destructive testing and failure modelling of adhesively bonded joints. Edited by Dr. Alessandro Pegoretti, Professor of Materials Science and Technology at the University of Trento, Italy, Adhesive
-
Supplier: MacDermid Alpha Electronics Solutions
Description: substrate attachment in hybrid or multi-chip modules (MCMs). Its reworkable formulation provides key advantages in applications where thermoset adhesives are typically less effective.
- Features: Electrically Conductive Compound (Adhesive, Grease)
- Filled / Reinforced: Yes
- Industry: Electronics, Semiconductors / IC Packaging
Find Suppliers by Category Top
Featured Products Top
-
components and impart gloss, shine and water repellence to aftermarket car care products. They can be used under the bonnet, on the drive train, in the cabin and on the bodywork in both conventional and electric & hybrid vehicles of all types. Silicone product types include, adhesives, sealants (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc. -
adhesive transfer tapes are offered in high temperature acrylic and ultra-high temperature silicone, and are supplied with double liners for ease of handling and die cutting. Applications Aerospace, avionics and military electronics Hybrid and electric vehicles Electronic systems for energy applications (read more)
Browse Datasheets for Polyonics -
A comprehensive industry-authored white paper detailing adhesives and sealants in HEVs and BEVs, including battery cells, modules, packs, and motors. Additionally the white paper provides links to guides for body construction, paint, and vehicle assembly of hybrid and battery electric vehicles (read more)
Browse Standards and Technical Documents Datasheets for Adhesives.org -
The Technical Edge Unlike standard adhesives that act as insulators, our thermal tape creates a high-performance bridge between components (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
Assembly ESD-Safe Flame Retardant Adhesive Transfer Bonding In Harsh Environments Polyonics double-coated bonding and assembly tapes are ideal for assembling components in high temperature and harsh (read more)
Browse Industrial Tapes Datasheets for Polyonics -
Assembly ESD-Safe Flame Retardant Adhesive Transfer Bonding In Harsh Environments Polyonics double-coated bonding and assembly tapes are ideal for assembling components in high temperature and harsh (read more)
Browse Industrial Tapes Datasheets for Polyonics -
efficiency. An ISO Class 8 environment is available for assembly services to ensure quality and consistency. UV Adhesive Application: creates robust bonds and seals. Rapid curing under ultraviolet light ensures a strong and durable connection between components (read more)
Browse Tubing Datasheets for New England Tubing Technologies
Conduct Research Top
-
Unique EPO-TEK (R) UV Hybrid Adhesives and their Applications
This paper discusses the advantages of a UV Hybrid Epoxy. A UV Hybrid Epoxy combines the fast tacking of a UV curing system with the long-term reliability of an epoxy. With this new adhesive line, parts can be aligned and positioned; or adhesive flow can be controlled with extreme accuracy
-
Hybrid Microelectronic Semiconductor Die Attached Adhesives and Encapsulants in Innovation
Microelectronics adhesives and encapsulants are needed during assembly. DeepMaterial has been actively involved in developing the best formulations that can be used to fabricate efficient, simple, faster, lighter, thinner, and smaller devices. Microelectronics have gained great popularity
-
Adhesive Bonding Instead of Welding or Bolting
Adhesive bonding involves the use of adhesive, like glue, to form a material bond between two or more assembly parts. In addition to regular applications, hybrid processes, in which the adhesive bond includes another function such as sealing or heat dissipation, are gaining importance. Traditional
-
Metal Migration Failures in a Hybrid Device: Interaction of Package Materials, Process Residuals, and Ambient Gases
This paper presents a case history of a failure analysis performed on hybrid devices that exhibited electrical failures during thermal cycle with bias. Electrical testing revealed resistive shorts between Vcc and ground bond pads on integrated circuits within the package. A dendritic growth
-
Conductive Adhesives for Thermal Management: Case Study Issues in Hybrid Microelectronics and Plastic IC Packaging (.pdf)
This paper discusses silver filled and boron nitride filled epoxies for heat-sinking and thermal transfer. Case studies of thermal resistance calculations have been presented with comparisons made against eutectic die-attach.
-
Best electronics assembly adhesives sealants glue with RFID bonding for semiconductor and microchip manufacturers
Electronic innovations are everywhere and, in every facet, of life. Today, everything is inspired by technology, and things keep getting better and better with time. We now have driver-assisted systems, electric and hybrid cars, smartphones, augmented reality headsets, on-screen entertainment
-
Novel Testing and Quality Control
to measure the rate of absorption of a hot melt into wax-coated carton stock; rheological characterization to predict the potential of a water-based adhesive to clog nozzles; measurement with a hybrid rheometer to compare the range of a group of hot melts; and loop tack testing for waterborne adhesives.
-
Combining Additive and Subtractive Techniques in the Design and Fabrication of Microfluidic Devices
Laminate construction of microfluidic devices offers a means to incorporate both additive and subtractive manufacturing techniques for the development of multiplexed fluidic devices that have, for example, porous membranes formed-in-place (FIP). Important applications for these hybrid devices
More Information Top
Indicates content that may require registration and/or purchase.
-
Environmental effects on the adhesion properties of nanostructured epoxy‐silica hybrids
The experimental hybrid adhesive was a two-part formulation.
-
Technological Aspects of Manufacturing and Numerical Modelling of Clinch-Adhesive Joints
In: da Silva LFM, Pirondi A, Öschner A (eds) Hybrid adhesive joints.
-
Chemical Engineering and Material Properties II
Study on UV-Curable Hybrid Adhesives with Adjustable Refractive Index .
-
Elastically Sticking
The most that Silan-Hybridklebstoffe is luftfeuchtigkeitshärtende in component systems, that are applied either manually or mechanically.
-
Materials and Manufacturing Technologies XIV
Joint Stress Optimization by the Hybrid Adhesive Lap Joint .
-
Handbook of Adhesion Technology
The classification covers high-temperature adhesives, sealants, conductive adhesives, nanocomposite adhesives, primers, solvent-activated adhesives, water-activated adhesives, and hybrid adhesives .
-
Development of matrix based transdermal delivery system for ketotifen
Due to good adhesion force and high perme- ability, acrylic-rubber hybrid adhesive was chosen.
-
Progress in Polymers in Concrete
Novel Epoxy-Silica Hybrid Adhesives for Concrete and Structural Materials: Properties and Durability Issues .