Hybrid Adhesive

Description: The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids which allow package 10 withstand 260C Pb-free reflow temperature. More over

• Viscosity: 7,500 to 10,500 cP
• Coeff. of Thermal Expansion (CTE): 54.44444444444444 to 70 µin/in-F
• Water Absorption: 0.15 %
• Features: Die Bonding Adhesive / Compound, Electrically Conductive, Flexible / Dampening, Gel, Laminating / Composites, Other, Specialty / Other, Thermal Compound / Interface (Thermally Conductive), Unfilled

Description: and impact loads while maintaining its high sheer strength over a wide temperature range in larger gaps. The technology behind LOCTITE® HY 4080GY™ Hybrid Adhesives combines the benefits of instant cyanoacrylate adhesive with a tough, methacrylate acrylic.

Description: suitable for applications in high temperature/humidity environments. The thixotropic nature of this product makes it suitable for applications where good gap filling properties on rough and poorly fitting surfaces are required. The technology behind LOCTITE® HY 4090™ Hybrid Adhesives

Description: LOCTITE® HY 4070™ is a hybrid adhesive which provides a fast fixture at room temperature in bond gaps up to 5mm. This product offers excellent bonding characteristics to a variety of substrates including some plastics, rubbers, and metals. LOCTITE® HY 4070™ is designed for applications

Description: Henkel Loctite HY 4070 is a two component, cyanoacrylate/acrylic hybrid adhesive that has the cure speed of an instant adhesive and the strength of a structural adhesive. It bonds well to a variety of substrates including metals, rubbers, and plastics. It offers a

• Viscosity: 1 to 1,300 cP
• Tensile Strength (Break): 2,117 psi
• Elongation: 4.9 %
• Chemical System: Acrylic / Polyacrylate

Description: Henkel Loctite HY 4090GY Hybrid Adhesive Gray is a two component, one part epoxy and one part cyanoacrylate, structural instant adhesive. This high performance adhesive can be used on a variety of substrates such as plastic, rubber, and metals. It offers a fast

• Viscosity: 4,000 to 40,000 cP
• Tensile Strength (Break): 1,025 psi
• Elongation: 3.6 %
• Chemical System: Epoxy (EP)

Description: Henkel Loctite HY 4090 Hybrid Adhesive Off-White is a two component, one part epoxy and one part cyanoacrylate, structural instant adhesive. This high performance adhesive can be used on a variety of substrates such as plastic, rubber, and metals. It offers low blooming,

• Viscosity: 4,000 to 40,000 cP
• Elongation: 3.6 %
• Chemical System: Epoxy (EP)
• Substrate Compatibility: Metal, Plastic, Rubber / Elastomer

Description: 3M Hybrid Sealant 730 Clear is a one component, UV resistant, moisture curing sealant that forms permanent elastic bonds. It is paintable when wet and bonds to a variety of materials including metals, plastics, fiberglass, and wood. 305 mL Cartridge.

• Tensile Strength (Break): 250 psi
• Elongation: 300 %
• Substrate Compatibility: Metal, Plastic, Wood / Wood Product
• Cure / Technology: Single Component System

Description: Loctite 4090 yellow epoxy/cyanocrylate hybrid adhesive is compatible with plastic, rubber and metal materials with a 24 hr cure time. Provides a 3-5 min working time. Works in a mix ratio of 1:1. Delivers great performance with tensile strength of 1025 psi. Minimum to maximum operating

• Viscosity: 27,000 cP
• Use Temperature: -65 to 302 F
• Chemical System: Epoxy (EP)
• Features: Leveling / Filling Compound

Description: Based on the innovative alpha-technology, the new GENIOSIL® XB hybrid polymers for the first time exploit the advantages of silane crosslinking for user-friendly, environmentally compatible structural adhesive bonds.Thanks to their low viscosity, the new hybrid polymers are easy

• Viscosity: 2 cP
• Industry: Building / Construction
• Substrate Compatibility: Ceramic / Glass, Metal, Wood / Wood Product
• Chemical System: Silicone

Description: THE SELECTION AND USE OF ORGANIC ADHESIVES IN HYBRID MICROCIRCUITS, SPECIFICATION FOR

Description: SPECIFICATION FOR THE SELECTION AND USE OF ORGANIC ADHESIVES IN HYBRID MICROCIRCUITS

Description: LOCTITE® ABLESTIK QMI529HT-LV conductive die attach adhesive has been formulated for use in high throughput die attach applications Electrically conductive Thermally conductive Good dispensing characteristics Hydrophobic

• Coeff. of Thermal Expansion (CTE): 34.44444444444444 µin/in-F
• Tensile Strength (Break): 107,037.187445611 psi
• Features: Electrically Conductive Compound (Adhesive, Grease)
• Industry: Electronics, OEM / Industrial

Description: ADHESIVE, EPOXY HYBRID - TWO COMPONENT ROOM TEMPERATURE CURE OR INDUCTION CURING, STRUCTURAL

Description: HYBRID ADHESIVE SEALANT FAST CUR

Description: recyclability), was used in this paper as a model polymer. Because adhesive bonding opens the door to the design of hybrid structures composed of virtually any combination of dissimilar materials, often impossible to esthetically marry otherwise, the efficacy of polypropylene surface

Description: HYBRID ADHESIVE SEALANT FAST CUR

Description: Transparent, cloudy colorless to pale yellow cyanoacrylate/acrylic hybrid gel adhesive that provides a fast fixture at room temperature. LOCTITE® HY 4070 is a 2-part, transparent, cloudy colorless to pale yellow cyanoacrylate/acrylic hybrid gel adhesive that provides a

• Applied Thickness / Gap Fill: 0.197 inch
• Substrate Compatibility: Metal, Plastic, Rubber / Elastomer, Wood / Wood Product
• Cure / Technology: Two Component System

Description: LOCTITE ABLESTIK 8301, Epoxy hybrid, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 8301 electrically conductive die attach adhesive is designed for high reliability package applications. Electrically conductive Thermally conductive Snap curable Low stress High

Description: LOCTITE ABLESTIK 958-7, Epoxy, Die attach LOCTITE® ABLESTIK 958-7 electrically conductive epoxy adhesive is designed for hybrid die attach. This adhesive provides better adhesion to gold than other versions of ABLEBOND 958 adhesive series. Electrically conductive Good

• Viscosity: 90,000 cP
• Chemical System: Epoxy (EP)
• Cure / Technology: Single Component System

Description: 2-part, general purpose, thixotropic, cyanoacrylate/epoxy hybrid adhesive with very fast fixture at room temperature. LOCTITE® HY 4090 GY is a grey, 2-part, general purpose, thixotropic, cyanoacrylate/epoxy hybrid adhesive with very fast fixture at room temperature. It

Description: Hybrid (bolted/bonded) joining is becoming one of the innovative joining processes for light weight structures in the transport industry, especially in the aerospace industry where weight reduction and high joining requirements are permanent challenges. Combining the adhesive bonding

Description: the requirements, both technical and ecological, that are made of modern adhesives and sealants. These hybrid binders can be used to formulate adhesives and sealants with no health risks from solvents, isocyanates or tin, and which therefore meet the requirements of the

• Viscosity: 1.0069 cP
• Industry: Building / Construction
• Chemical System: Silicone
• Cure / Technology: Single Component System

Description: PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include

• Viscosity: 8,000 to 10,000 cP
• Use Temperature: -67 to 392 F
• Thermal Conductivity: 1.3 W/m-K
• Coeff. of Thermal Expansion (CTE): 111.11111111111111 µin/in-F

Description: Product Overview STAYSTIK 581 is a thermoplastic adhesive designed for a variety of electronic applications, offering excellent bonding performance. It is well suited for substrate attachment in hybrid or Multi-Chip Modules (MCMs). Its reworkable formulation provides key advantages in

• Industry: Electronics, Semiconductors / IC Packaging
• Features: Film / Sheet
• Cure / Technology: Thermoplastic / Hot Melt, Thermosetting / Crosslinking

Description: fiber including: carbon, glass, aramid, hybrid materials, etcetera. Equipment includes: • Uni-tape production at 1m width • Woven fabric prepreg at 12″ to 62″ width • Adhesive filming at 50" width • Towpreg production • Large capacity resin mixing facility • Large capacity 0°F and 40°F

• Use Temperature: 180 F
• Industry: Aerospace
• Chemical System: Epoxy (EP)
• Features: Flame Retardant (e.g. UL 94 Rated), Specialty / Other

Description: hybrid light-curable formulation has a built-in moisture/contact cure feature that enables complete adhesive curing in dark areas. HLC-M-1004 cures rapidly with broad-spectrum light and is LED optimized at 405 nm, and it can also cure at a very low intensity (~ 20 mW/cm2). The

• Viscosity: 1,300 cP
• Features: Other
• Cure / Technology: UV / Radiation Cured (EB, Light)

Description: fiber including: carbon, glass, aramid, hybrid materials, etcetera. Equipment includes: • Uni-tape production at 1m width • Woven fabric prepreg at 12″ to 62″ width • Adhesive filming at 50" width • Towpreg production • Large capacity resin mixing facility • Large capacity 0°F and 40°F

• Use Temperature: 180 F
• Industry: Aerospace, Marine
• Chemical System: Epoxy (EP)
• Features: Other, Specialty / Other

Description: spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.  More recently, solar cells require our UV curing resin

• Viscosity: 3,000 to 7,000 cP
• Use Temperature: 662 F
• Coeff. of Thermal Expansion (CTE): 25 to 76.66666666666667 µin/in-F
• Index of Refraction: 1.5259

Description: Product Overview ATROX 850HT1 is a thermosetting conductive die attach adhesive with extremely high thermal conductivity, designed for high power semiconductor packages. Its low resin bleed out and low condensable organics ensure excellent package reliability.

• Features: Die Bonding Adhesive / Compound, Electrically Conductive, Grease / Paste, Thermal Compound / Interface (Thermally Conductive)
• Industry: Electronics, Semiconductors / IC Packaging
• Cure / Technology: Thermosetting / Crosslinking

Description: Composition • Adhesive film, selection according to requirement • Basic membrane with potentiometer resistance • Spacers between upper and lower membrane • Collector membrane as wiper tap for hand or wiper actuation

• Sensor Technology: Linear Potentiometer

Description: These static mixer nozzles from LOCTITE® are designed for use with the 400g hybrid cartridges. Ideal for the dispensing of multi-component adhesives, they ensure the correct proportions of adhesive is pushed through a matrix which works to combine the material until ready to

Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market

• Viscosity: 3,000 to 7,000 cP
• Use Temperature: 662 F
• Coeff. of Thermal Expansion (CTE): 25 to 76.66666666666667 µin/in-F
• Index of Refraction: 1.5259

Description: HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS The Hapflex™ 500 Series offers soft durometer elastomers ranging from 45 - 95 Shore A. All are relatively fast, room curing, flexible systems that can be accelerated with moderate heat for faster cycle times. Most 500 Series products are

• Viscosity: 3,900 cP
• Industry: OEM / Industrial, Tooling / Mold Material
• Chemical System: Polyurethane (PU, PUR), Rubber Based / Elastomeric
• Cure / Technology: Room Temp. Cure / Vulcanizing, Two Component System