Products & Services
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Supplier: Custom Silicon Solutions, Inc.
Description: This analog macro cell is a single supply, general-purpose operational amplifier. It contains a folded cascode, PCH differential input stage and a class AB output stage. The common mode input range extends from GND to (VPOS – 1.0V). The output stage is capable of driving off-chip loads of
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Supplier: Accuris
Description: INTEGRATED CIRCUIT DATA: COMPUTER-AIDED CHIP DEVELOPMENT
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Supplier: Accuris
Description: ON-CHIP ESD PROTECTION FOR INTEGRATED CIRCUITS
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1253419-SSL21101T/1, 518 Category: Integrated Circuits (ICs)>PMIC - LED Drivers Series: GreenChip™ Type: AC DC Offline Switcher Package: Tape & Reel (TR) Standard Package: 2,500 Mounting: SMD (SMT) Frequency: 51.2kHz ~ 122.9k
- Form Factor: Integrated Circuit (IC)
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1253420-SSL21084AT/1 ,118 Category: Integrated Circuits (ICs)>PMIC - LED Drivers Series: GreenChip™ Type: AC DC Offline Switcher Package: Tape & Reel (TR) Standard Package: 2,500 Mounting: SMD (SMT) Voltage - Output: 600V
- Form Factor: Integrated Circuit (IC)
- Output Voltage: 600 volts
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1253421-SSL5021BTS/1 X Category: Integrated Circuits (ICs)>PMIC - LED Drivers Series: GreenChip™ Type: DC DC Regulator Package: Tape & Reel Standard Package: 3,000 Mounting: SMD (SMT) Current - Output / Channel: 2A (Switch
- Form Factor: Integrated Circuit (IC)
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1253422-SSL5031CTS/1 X Category: Integrated Circuits (ICs)>PMIC - LED Drivers Series: GreenChip™ Type: AC DC Offline Switcher Package: Tape & Reel Applications: Lighting Standard Package: 3,000 Mounting: SMD (SMT
- Form Factor: Integrated Circuit (IC)
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Description: INTEGRATED CIRCUIT
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Supplier: Acme Chip Technology Co., Limited
Description: INTEGRATED CIRCUIT
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Supplier: Acme Chip Technology Co., Limited
Description: Integrated Circuits (ICs) - Ferrite Beads
- Bead Form Factor: Chip
- Impedance Range: 72 ohms
- Rated DC Current: 6000 milliamps
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Supplier: Acme Chip Technology Co., Limited
Description: INTEGRATED CIRCUIT
- Density: 1 kbits
- IC Package Type: BGA, Other
- Memory Category: EEPROM, Other
- Operating Temperature: -40 to 85 C
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Description: Integrated Circuits (ICs) - PMIC - Supervisors
- Operating Temperature: -40 to 85 C
- Package Type: Other
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Supplier: Acme Chip Technology Co., Limited
Description: Integrated Circuits (ICs) - PMIC - Supervisors
- Operating Temperature: -40 to 85 C
- Package Type: Other
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Supplier: Radwell International
Description: OPERATIONAL AMPLIFIER INTEGRATED CIRCUIT CHIP, COMMON MODE INPUT RANGE +- 10 V TYPICAL, 14 PINS. FREE 2 YEAR RADWELL WARRANTY
- Device Type: Operational Amplifiers
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Description: INTEGRATED CIRCUIT
- IC Package Type: SSOP
- Operating Temperature: -40 to 85 C
- Packing Method: Tape Reel, Bulk Pack, Other
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Description: Integrated Circuits (ICs) - Interface ICs - Pre-ordered Chips
- Device Type / Applications: Sensor Interface
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Supplier: Radwell International
Description: INTEGRATED CIRCUIT, AC/DC CONVERTER, 66 KHZ, 120 MA, SMD-8. FREE 2 YEAR RADWELL WARRANTY
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Supplier: Radwell International
Description: INTEGRATED CIRCUIT, DC/DC CONVERTER, 5 V INPUT, 12 V OUTPUT, 1 WATT, DIP-7. FREE 2 YEAR RADWELL WARRANTY
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Supplier: MACOM
Description: MACOM’s L-PICTM Transmitters are highly integrated silicon photonic devices that use patented Self-Aligned Etch Facet (SAEFT™) technology for precision assembly of MACOM’s EFT lasers to the silicon PIC. Mach-Zehnder modulators and a multiplexer circuit are
- Cable Type: Single Mode
- Data Rate: 28 to 56 Gbps
- Maximum Optical Output Power: -6.5 to 4 dBm
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Supplier: Utmel Electronic Limited
Description: WS2811 LED DRIVER CHIP - 10 PACK
- Features: RoHS Compliant
- Form Factor: Integrated Circuit (IC)
- Output Current: 18.5 milliamps
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Supplier: Microchip Technology, Inc.
Description: 3.3V/70mA output. The regulator is short-circuit protected and also includes thermal shutdown. The regulator has been specifically designed to operate in the automotive environment and will survive reverse battery conditions, +43V load dump transients and double-battery jump starts. The
- IC Package Type: DIP / CDIP / PDIP, SOIC / SOP, Other
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Supplier: ams
Description: The AS1113 is a, SPI interfaced, 50mA 16 channel direct LED driver and offers on-chip diagnostics. It can detect open/short LED position during operation and offers a (flickerfree) low current diagnostic mode
- Form Factor: Integrated Circuit (IC)
- Input Voltage: 3 to 5.5 volts
- Number of Channels: 16 #
- Output Current: 50 milliamps
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Supplier: Skyworks Solutions, Inc.
Description: Please note: this product is being discontinued and is not recommended for new designs. The SKY81452 is a highly integrated, high efficiency LED backlight solution for tablets, notebook computers, monitors, and other portable devices. An integrated boost converter provides a high
- Efficiency: 93 %
- Form Factor: Integrated Circuit (IC)
- Input Voltage: 2.5 to 5.5 volts
- Number of Channels: 6 #
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Supplier: RS Components, Ltd.
Description: LYTSwitch-3 single-stage LED driver ICs with combined power factor correction and constant current outputs from Power Integrations. These devices incorporates a high-voltage power MOSFET and discontinuous mode, variable frequency, variable on-time controller integrated into a single
- Form Factor: Integrated Circuit (IC)
- Input Voltage: 185 volts
- Output Current: 4350 milliamps
- Output Power: 12.6 watts
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Supplier: Radwell International
Description: INTEGRATED CIRCUIT, SWITCHING CONTROLLER, 1 OUTPUT, SOIC-8. FREE 2 YEAR RADWELL WARRANTY
- Regulator Category: Switching Regulator
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Featured Products Top
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Reliable SOP-8 Integrated Circuit for Versatile Applications The WSP4984 by WINSOK is a dependable SOP-8 packaged integrated circuit designed for engineers and (read more)
Browse IC Interfaces Datasheets for LIXINC Electronics Co., Limited -
At Smiths Interconnect, we are constantly striving to exceed the evolving demands of the semiconductor industry. The Davinci 112 test socket, and expansion of the DaVinci Series, is designed to tackle some of the most complex challenges in testing Application Specific Integrated Circuits (ASICs (read more)
Browse IC Sockets and Headers Datasheets for Molex Signal Tech Industrial Ltd. -
and Integrated Circuits (ICs) that are essential for testing and repairing boards once you've identified the problem areas. Finding the right replacement parts quickly is critical to bringing your electronics back to life. (read more)
Browse Safety Labels and Signs Datasheets for ODG (Origin Data Global) -
The AL4 pressure sensor is a digital output low pressure sensor. It is composed of a silicon piezoresistive pressure sensing chip and a signal conditioning integrated circuit (read more)
Browse Pressure Sensors Datasheets for Angst+Pfister Sensors and Power -
' of gadgets. Integrated circuits put many parts into one chip for smaller devices. The semiconductor industry is growing fast with AI (read more)
Browse Microcontrollers (MCU) Datasheets for ODG (Origin Data Global) -
The AD3 board-level differential pressure sensor is comprised of a silicon piezo-resistive pressure sensing chip and a sensor signal conditioning integrated circuit. This sensor can (read more)
Browse Pressure Sensors Datasheets for Angst+Pfister Sensors and Power -
The AP4/AG4 gauge pressure sensor series is composed of a silicon piezeoresistive pressure sensing chip and a signal conditioning integrated circuit. The low-level signal from the sensing chip is amplified, temperature-compensated, calibrated and finally converted to digital data proportional (read more)
Browse Pressure Sensors Datasheets for Angst+Pfister Sensors and Power -
Chip resistors are integrated circuit (IC) devices that oppose the flow of electrical current, and are primarily used to protect (read more)
Browse Resistors Datasheets for ASAP Semiconductor LLC -
XFdtd is a full-wave electromagnetic simulation tool that contains an integrated schematic editor and circuit solver. The electromagnetic simulation accounts for the full-wave interactions between the antenna (read more)
Browse Finite-difference time-domain (FDTD) Software Datasheets for Remcom (USA) -
The WSP4067, manufactured by WINSOK, is an active lifecycle integrated circuit designed for professional industrial use. Packaged in a space (read more)
Browse IC Interfaces Datasheets for LIXINC Electronics Co., Limited
Conduct Research Top
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Application: Reed Relays Carry Out Switching Functions in Performance Boards Used in Integrated Circuits
Chip makers use new performance boards for every new chip they develop. Since most integrated circuit/chip makers generally have large factories devoted to the testing of their chips.
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Test and Diagnosis of Analogue, Mixed-Signal and RF Integrated Circuits: The System on Chip Approach
Test and Diagnosis of Analogue, Mixed-Signal and RF Integrated Circuits: The System on Chip Approach. Providing a comprehensive discussion of automatic testing, diagnosis and tuning of analogue, mixed-signal and RF integrated circuits and systems, this book reports systematically on state
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Power Distribution Networks with On-Chip Decoupling Capacitors
Power Distribution Networks with On-Chip Decoupling Capacitors. Dedicated to distributing power in high speed, highly complex integrated circuits, this book provides insight into the behavior and design of integrated circuit-based power distribution systems.
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Measuring the Volume of Integrated Circuit Chipping After the Dicing Process Using a Digital Microscope
process. In the packaging process, the diced chips are secured to a metallic plate called a lead frame and packaged with plastic or ceramic components, creating an integrated circuit. The IC chips are eventually mounted to printed circuit boards (PCBs).
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Wireless Communication Circuits and Systems
Wireless Communication Circuits and Systems. This new book examines integrated circuits, systems and transceivers for wireless and mobile communications. It covers recent developments in key RF, IF, analogue, mixed-signal components and single-chip transceivers in CMOS technology systematically.
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Application: Switching Performance PCB's Used In IC's - Reed Relay
Chip makers use new performance boards for every new chip they develop. Since most integrated. circuit/chip makers generally have large factories devoted to the testing of their chips. Hundreds of testers are typically used on a 24 hour/7 days a week basis. Each tester may be well over $1,000,000
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What is a PLCC Socket?
Plastic leaded chip carriers (PLCC) sockets are a type of chip carrier used to form connections between integrated circuits (ICs) and printed circuit boards (PCBs).
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Application: IC Testing - Reed Relay
, etc, integrated circuits are at work getting the job done. Chip designers continue to develop new integrated circuits that are smaller, faster acting and have more switching gates. These millions of gates per chip all need to be tested for satisfactory operation. Test equipment, some of which costs
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Smart Computing Article - Laplink to latency
ICs (integrated circuits) can hold millions of transistors on one tiny chip, which today is no larger than the very first single transistor itself. LSIs hold between 100 and 5,000 transistors. Those in the computing and microprocessor industries use the term LSI to refer to a certain classification
More Information Top
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High-resolution H1-H2 single-beam reflection holography using DuPont photopolymer holographic recording film
We report an experimental study of the use of DuPont photopolymer Holographic Recording Film to record high resolution reflection holograms of an integrated circuit chip with an initial film-to-object separation of 1.5 millimeters.
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Microchannel cooling of face down bounded chips
electrical and mechanical attachment of integrated circuit chips to circuit boards.
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Managing Technological Innovation: Competitive Advantage from Change 2nd Edition
Today in personal computers, we use integrated circuit chips called DRAMs (dynamic random access memory), with a storage capacity of millions of bits (64M, for example).
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Three dimensional, multi-chip module
Thus, the board level computing elements (e.g., packaged dice or integrated circuit chips ) must shrink, just as the size of the basic integrated circuit computing elements had 25 .
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Electronic packaging
Integrated circuitry allows many of the discrete circuit elements such as resistors and diodes to be embedded into individual, relatively small components known as integrated circuit chips or die.
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Digital Radio Systems on a Chip
Today, a handset has less than a dozen of integrated circuit chips and cost per handset is down to $100-200 dollars.
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High-resolution reflection holography using DuPont photopolymer holographic recording film
The goals of this work are to investigate techniques for recording images of the three dimensional surfaces of objects, such as integrated circuit chips , without the use of imaging optics and step and repeat techniques, and to investigate techniques for reconstructing these …
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