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Supplier: Accuris
Description: INTEGRATED CIRCUIT CHIP AND CELL GEOMETRY DATA BASE TAPE
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Supplier: Accuris
Description: INTEGRATED CIRCUIT CHIP AND CELL LOGIC SIMULATION AND TEST PATTERN VERIFICATION
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Supplier: Accuris
Description: INTEGRATED CIRCUIT CHIP AND CELL LOGIC SIMULATION AND TEST PATTERN VERIFICATION REPORT
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Supplier: Acme Chip Technology Co., Limited
Description: Integrated Circuits (ICs) - RF Chips
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Supplier: Accuris
Description: ON-CHIP ESD PROTECTION FOR INTEGRATED CIRCUITS
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Description: Integrated Circuits (ICs) - Interface ICs - Pre-ordered Chips
- Device Type: Sensor Interface
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Supplier: Win Source Electronics
Description: Manufacturer: AMIS Category: Integrated Circuits (ICs)>Embedded>System On Chip (SoC) Mounting Style: Through Hole Product Type: Passive, Cold Plate Technology: SRAM - Synchronous, SDR (ZBT)
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Supplier: Acme Chip Technology Co., Limited
Description: Integrated Circuits (ICs) - Interface ICs - Pre-ordered Chips
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Supplier: Win Source Electronics
Description: Alternative Parts (Cross-Reference): Cross Manufacturer: Microchip Technology Category: Integrated Circuits (ICs) Embedded System On Chip (SoC) Series: SmartFusion®2 Package: Tray Product Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB
- Processor Core: ARM
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Description: Integrated Circuits (ICs) - RF & Radio - RF Chips
- Features: Other
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Supplier: Win Source Electronics
Description: Alternative Parts (Cross-Reference): Cross Manufacturer: Vicor Corporation Category: Integrated Circuits(ICs) Packaging: Tray
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Description: IC RX CHIP SW 10GBPS
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Supplier: Acme Chip Technology Co., Limited
Description: 250UM VARIANT OF GN1459 HIGH-GAI
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Supplier: Win Source Electronics
Description: Win Source Part Number: 991197-GN1083-CHIP Category: Integrated Circuits (ICs)>Linear - Amplifiers - Special Purpose Type: Transimpedance Amplifier Package: Tray Applications: Ethernet Standard Package: 270 ECCN: EAR99 Fake Threat In the Open Market: 82 pct. MSL Level: 1
- Features: Other
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Supplier: Acme Chip Technology Co., Limited
Description: Integrated Circuits (ICs) - Ferrite Beads
- Bead Form Factor: Chip
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Description: Applies to film integrated circuits and to hybrid film integrated circuits both passive and active. Applies also to partly-completed F and HFICs supplied to customers for subsequent processing as well as to chip carrier circuits having more than one
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Description: Integrated Circuits (ICs) - Power Management ICs - Monitors & Reset Circuits
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Supplier: CSA Group
Description: Applies to film integrated circuits and to hybrid film integrated circuits both passive and active. Applies also to partly-completed F and HFICs supplied to customers for subsequent processing as well as to chip carrier circuits having more than one
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Featured Products Top
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Reliable SOP-8 Integrated Circuit for Versatile Applications The WSP4984 by WINSOK is a dependable SOP-8 packaged integrated circuit designed for engineers and (read more)
Browse IC Interfaces Datasheets for LIXINC Electronics Co., Limited -
The AL4 pressure sensor is a digital output low pressure sensor. It is composed of a silicon piezoresistive pressure sensing chip and a signal conditioning integrated circuit (read more)
Browse Pressure Sensors Datasheets for Angst+Pfister Sensors and Power -
The AD3 board-level differential pressure sensor is comprised of a silicon piezo-resistive pressure sensing chip and a sensor signal conditioning integrated circuit. This sensor can (read more)
Browse Pressure Sensors Datasheets for Angst+Pfister Sensors and Power -
The AP4/AG4 gauge pressure sensor series is composed of a silicon piezeoresistive pressure sensing chip and a signal conditioning integrated circuit. The low-level signal from the sensing chip is amplified, temperature-compensated, calibrated and finally converted to digital data proportional (read more)
Browse Pressure Sensors Datasheets for Angst+Pfister Sensors and Power -
Chip resistors are integrated circuit (IC) devices that oppose the flow of electrical current, and are primarily used to protect (read more)
Browse Resistors Datasheets for ASAP Semiconductor LLC -
XFdtd is a full-wave electromagnetic simulation tool that contains an integrated schematic editor and circuit solver. The electromagnetic simulation accounts for the full-wave interactions between the antenna (read more)
Browse Finite-difference time-domain (FDTD) Software Datasheets for Remcom (USA) -
The WSP4067, manufactured by WINSOK, is an active lifecycle integrated circuit designed for professional industrial use. Packaged in a space (read more)
Browse IC Interfaces Datasheets for LIXINC Electronics Co., Limited -
1. Product Overview The IMS ISL700_2A is a highly integrated CMOS photoelectric sensor that incorporates two photodiodes (PDs) and the corresponding signal processing circuits. It is widely used in background suppression photoelectric sensors based on the dual (read more)
Browse Photoelectric Sensors Datasheets for Intellisense Microelectronics Ltd. -
The ISL400DE is a highly integrated CMOS photoelectric sensor IC, widely used in diffuse reflection photoelectric sensors. The chip integrates the following features: PD photodiode receiver LED emitter driver Switched-capacitor signal amplifier Mode switching (read more)
Browse Photoelectric Sensors Datasheets for Intellisense Microelectronics Ltd. -
ADI's ADR1001 is a fully integrated, ultra-low drift, buried Zener precision voltage reference solution in a single chip. By integrating the entire signal conditioning circuitry required by the LTZ1000 into a single chip, the ADR1001 significantly reduces the overall solution (read more)
Browse Current Sensors Datasheets for DigiKey
Conduct Research Top
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Application: Reed Relays Carry Out Switching Functions in Performance Boards Used in Integrated Circuits
Chip makers use new performance boards for every new chip they develop. Since most integrated circuit/chip makers generally have large factories devoted to the testing of their chips.
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Test and Diagnosis of Analogue, Mixed-Signal and RF Integrated Circuits: The System on Chip Approach
Test and Diagnosis of Analogue, Mixed-Signal and RF Integrated Circuits: The System on Chip Approach. Providing a comprehensive discussion of automatic testing, diagnosis and tuning of analogue, mixed-signal and RF integrated circuits and systems, this book reports systematically on state
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Power Distribution Networks with On-Chip Decoupling Capacitors
Power Distribution Networks with On-Chip Decoupling Capacitors. Dedicated to distributing power in high speed, highly complex integrated circuits, this book provides insight into the behavior and design of integrated circuit-based power distribution systems.
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Measuring the Volume of Integrated Circuit Chipping After the Dicing Process Using a Digital Microscope
process. In the packaging process, the diced chips are secured to a metallic plate called a lead frame and packaged with plastic or ceramic components, creating an integrated circuit. The IC chips are eventually mounted to printed circuit boards (PCBs).
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Wireless Communication Circuits and Systems
Wireless Communication Circuits and Systems. This new book examines integrated circuits, systems and transceivers for wireless and mobile communications. It covers recent developments in key RF, IF, analogue, mixed-signal components and single-chip transceivers in CMOS technology systematically.
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Application: Switching Performance PCB's Used In IC's - Reed Relay
Chip makers use new performance boards for every new chip they develop. Since most integrated. circuit/chip makers generally have large factories devoted to the testing of their chips. Hundreds of testers are typically used on a 24 hour/7 days a week basis. Each tester may be well over $1,000,000
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What is a PLCC Socket?
Plastic leaded chip carriers (PLCC) sockets are a type of chip carrier used to form connections between integrated circuits (ICs) and printed circuit boards (PCBs).
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Application: IC Testing - Reed Relay
, etc, integrated circuits are at work getting the job done. Chip designers continue to develop new integrated circuits that are smaller, faster acting and have more switching gates. These millions of gates per chip all need to be tested for satisfactory operation. Test equipment, some of which costs
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Smart Computing Article - Laplink to latency
ICs (integrated circuits) can hold millions of transistors on one tiny chip, which today is no larger than the very first single transistor itself. LSIs hold between 100 and 5,000 transistors. Those in the computing and microprocessor industries use the term LSI to refer to a certain classification
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High-resolution H1-H2 single-beam reflection holography using DuPont photopolymer holographic recording film
We report an experimental study of the use of DuPont photopolymer Holographic Recording Film to record high resolution reflection holograms of an integrated circuit chip with an initial film-to-object separation of 1.5 millimeters.
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Microchannel cooling of face down bounded chips
electrical and mechanical attachment of integrated circuit chips to circuit boards.
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Managing Technological Innovation: Competitive Advantage from Change 2nd Edition
Today in personal computers, we use integrated circuit chips called DRAMs (dynamic random access memory), with a storage capacity of millions of bits (64M, for example).
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Three dimensional, multi-chip module
Thus, the board level computing elements (e.g., packaged dice or integrated circuit chips ) must shrink, just as the size of the basic integrated circuit computing elements had 25 .
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Electronic packaging
Integrated circuitry allows many of the discrete circuit elements such as resistors and diodes to be embedded into individual, relatively small components known as integrated circuit chips or die.
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Digital Radio Systems on a Chip
Today, a handset has less than a dozen of integrated circuit chips and cost per handset is down to $100-200 dollars.
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High-resolution reflection holography using DuPont photopolymer holographic recording film
The goals of this work are to investigate techniques for recording images of the three dimensional surfaces of objects, such as integrated circuit chips , without the use of imaging optics and step and repeat techniques, and to investigate techniques for reconstructing these …
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