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Supplier: WDI Wise Device Inc.
Description: The LSCM has the advantages of a confocal laser scanning microscope with the size and price of an IR camera. The combination of high contrast imaging, infrared capabilities, extremely small size and low cost enables many new applications.
- Applications: Semiconductor Wafers, CVD / PVD Films, Packaged ICs / Ceramic Substrates, Photolithography / Patterning
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Measurement Capability: Defects / ADC, Thickness - Film / Layer, Other
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Supplier: WDI Wise Device Inc.
Description: This is the only commercially available microscope guaranteeing transmission of more then 80% for all four YAG laser harmonics: 266, 355, 532, and 1064nm - without compromising the review channel fidelity. The MIC4 microscope is instrumental in laser repair of TFT arrays over the
- Applications: CVD / PVD Films, Electroplated Films, Packaged ICs / Ceramic Substrates, Photolithography / Patterning, Other
- Form Factor: Monitor / Instrument
- Measurement Capability: Defects / ADC, Other
- Mounting / Loading: Floor Mounted / Stand-alone
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Description: This document describes laser radiation hazards arising in laser processing machines, as defined in 3.7. It also specifies the safety requirements relating to laser radiation hazards, as well as the information to be supplied by the manufacturers of such equipment (in addition
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Description: dealing with noise as a hazard from laser processing machines are not included in ISO 11553-1:2005. They will be included in a subsequent amendment. ISO 11553-1:2005 is not applicable to laser products, or equipment containing such products, which are manufactured solely and expressly
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Description: . Requirements dealing with noise as a hazard from laser processing machines are not included in ISO 11553-1:2005. They will be included in a subsequent amendment. ISO 11553-1:2005 is not applicable to laser products, or equipment containing such products, which are manufactured solely
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Description: information provided with such machines. Excluded from the requirements of this document are: photolithography; holography; equipment used in medical applications; data storage; laser printers; and copiers.
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Supplier: CSA Group
Description: . Requirements dealing with noise as a hazard from laser processing machines are not included in ISO 11553-1:2005. They will be included in a subsequent amendment. ISO 11553-1:2005 is not applicable to laser products, or equipment containing such products, which are manufactured solely
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Supplier: WDI Wise Device Inc.
Description: WDI's Laser Auto-Focus ATF6 sensor is an active optical device (incorporating a class II semiconductor laser) designed to provide focusing servo systems with fast feedback signals needed to quickly and accurately focus all types of infinity corrected microscopes.
- Applications: Semiconductor Wafers, CVD / PVD Films, Photolithography / Patterning
- Form Factor: Sensor / Sensing Element
- Non-contact: Yes
- Non-destructive: Yes
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Supplier: Bullen Ultrasonics, Inc.
Description: photolithography step. The material removal mechanism is based on propagation and intersection of cracks generated by the impact of abrasive particles on the brittle materials.
- CNC Machining: Yes
- Capabilities: Drilling, Milling, Laser Machining, Electrode EDM, Wire EDM, Other
- Location: North America, United States Only, Midwest US Only
- Materials: Carbide, Ceramics, Composites, Diamond / PCD, Glass, Glass Ceramics, Quartz, Sapphire / Ruby, Other
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Supplier: Linde North America, Inc.
Description: For over twenty years, the excimer laser industry has relied on our SPECTRA™ lithography gases. SPECTRA gases were used in the development of the earliest lasers for lithography and are now the most widely used excimer gases for DUV photolithography in the semiconductor industry
- Applications: Other
- Composition: Gas Mixture
- Product Forms: Gas
- Supply Options: Gas Cylinder
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Supplier: Conax Technologies
Description: application shown is the introduction of a laser into a photolithography tool used for interferometry measurements. Interferometers are used to accurately control stage movement for the proper positioning of the wafer and reticle stages relative to each other. The need for high
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Description: Novaclad® HDI is built upon the rock of our proprietary adhesiveless laminate that leverages vacuum deposition, additive copper processes, and photolithography to enable fine line circuitry coupled with laser-drilled micro-vias. Novaclad HDI circuitry withstands the toughest conditions
- Applications: Aerospace Equipment, Automotive Equipment, Commercial Equipment, Industrial Equipment, Medical Equipment, Military Equipment
- Component Mounting: Surface Mount, Through-Hole
- Features: Single Sided, Double Sided, Shielding
- Surface Finish: Gold, Nickel, Silver, Tin
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Description: photolithography to form circuit patterns. electroplating is used to fill in the gaps and thicken the metal circuit layer, and the solderability and oxidation resistance of the substrate is improved through surface treatment, finally remove the dry film and etch the seed layer to complete the
- Applications: Other
- Material Type: Specialty Ceramic
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Supplier: SPIE - Education
Description: Applications of micro and nano-scale optics are widespread in essentially every industry that uses light in some way. A short list of sample application areas includes communications, solar power, biomedical sensors, laser-assisted manufacturing, and a wide range of consumer electronics
- Industry: Electronics
- Modality: Internet / Online, On-site / In Plant
- Technology / Subject: Design / Engineering Methods (ESDU, DFx, etc.), Electronics, Nanomaterials / Nanotechnology, Photonics / Optics
- Type: Course
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Description: fabricate components for CVD, ion implants, photolithography, and semiconductors. Industrial furnaces and thermal couple protectors use alumina tubes. Traditionally, alumina ceramics are ideal for products such as injector tubes, gas nozzles, and insulators. Because of its high hardness,
- Material Type: Alumina / Aluminum Oxide
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Supplier: Edmund Optics Inc.
Description: , including FTIR spectroscopy and microscopy, photolithography, thin film measurement, semiconductor inspection, and laser etching.Contact our Applications Engineering Department to discuss custom coatings, tube length configurations and cover glass corrections.
- Field of View: 1.2 mm
- Lens Type: Objective Lens
- Magnification: 15 X
- Numerical Aperture: 0.5000 NA
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Supplier: Edmund Optics Inc.
Description: , including FTIR spectroscopy and microscopy, photolithography, thin film measurement, semiconductor inspection, and laser etching.Contact our Applications Engineering Department to discuss custom coatings, tube length configurations and cover glass corrections.
- Field of View: 1.2 mm
- Lens Type: Objective Lens
- Magnification: 15 X
- Numerical Aperture: 0.2800 NA
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Supplier: Edmund Optics Inc.
Description: , including FTIR spectroscopy and microscopy, photolithography, thin film measurement, semiconductor inspection, and laser etching.Contact our Applications Engineering Department to discuss custom coatings, tube length configurations and cover glass corrections.
- Field of View: 1.2 mm
- Lens Type: Objective Lens
- Magnification: 15 X
- Numerical Aperture: 0.2800 NA
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Supplier: Edmund Optics Inc.
Description: with standard microscope objectives, these components are ideal for applications requiring high throughput and excellent resolution in the UV or IR, including FTIR spectroscopy, ellipsometry, photolithography, and semiconductor inspection.The objectives feature an infinite conjugate design
- Lens Type: Objective Lens
- Magnification: 15 X
- Numerical Aperture: 0.2800 NA
- Working Distance: 23.75 mm
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Supplier: Electro Optical Components, Inc.
Description: using liquid phase epitaxy (LPE) and metalorganic chemical vapor deposition (MOCVD), photolithography, assembling, characteristics testing and producing of related electronic devices. IBSG produces the full line of light emitting diodes, laser diodes and photodiodes for mid-infrared
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Supplier: Deposition Sciences, Inc.
Description: photolithography. IsoDyn™ Low Pressure Chemical Vapor Deposition (LPCVD) The LPCVD process is a thermally driven organo-metallic process that is configured to deposit multi-layers of silicon dioxide, tantalum oxide, and titanium dioxide. LPCVD is a high-temperature process
- Coating: Antireflection, Beamsplitter, Dielectric, Filter, Mirror, Other
- Regional Preference: North America, United States Only
- Substrate Materials: Glass, Other
- Substrate Fabrication: Yes
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Package Applications Excitation Bioanalytical Photolithography, Curing and others WORLD STAR TECH Innovative Laser Solution Provider, offering product (read more)
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consistent, reliable laser output critical for high-precision tasks. Wide Range of Applications: Ideal for laser marking, photolithography, medical procedures, and advanced material processing. (read more)
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contamination. In a typical application, a laser is introduced into a photolithography tool used for interferometry measurements. Interferometers are used to accurately control stage movement for the proper positioning of the wafer and reticle stages relative to each other. The need for high accuracy (read more)
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methods such as photolithography or laser direct imaging (LDI). Etching Process: Remove extra copper with chemical etching to form the circuit pattern. Lamination Rigid Lamination: laminate the pre-treatment inner (read more)
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More Information Top
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The Design Of Excimer Lasers For Use In Microlithography
That early work was done using a contact printing technique, and demonstrated many of the attributes of excimer laser photo- lithography .
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Industrial Applications Of Excimer Lasers
Excimer laser photolithography : .
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Industrial Applications Of Excimer Lasers
Excimer laser photolithography : .
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CCD Image Sensors in Deep-Ultraviolet
In addition to being technologically important in the microelectronics sec- tor, SiO2 has unique optical features that are favorable for use as DUV optics (e.g., glasses and lenses) in DUV excimer laser photolithography systems [53].
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Towards registered single quantum dot photonic devices
The registration process involves the fabrication of alignment markers at cryogenic temperatures by utilizing two-photon absorption (TPA) laser photolithography of SU-8 photoresist [7, 8].
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Impact on Diffraction Efficiency of Binary Optical Elements for Spot Exposure Superposing Ratio
In fabrication of free form optical surfaces, spot exposure is a typical mode in laser photolithography .
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A Negative Aqueous Developable Electron-Beam Resist Under Deep UV Exposure
14- F.N. Goodall and R.A. Lawes, "Excimer laser photolithography with 1:1 Wynne Dison optics ", SPIE vol.
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Japanese marketplace
Before I came to this show I talked to a couple people who are in the laser photolithography market.
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