Products & Services
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Supplier: Protavic America, Inc.
Description: PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 3056 µin/in-F
- Composition: Unfilled
- Compound Type: Electrically Conductive, Thermal Compound / Thermally Conductive
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Supplier: Ellsworth Adhesives
Description: Dow SYLGARD™ 567 Primerless Silicone Encapsulant Black is a two component material that is used in potting applications for automotive assemblies, power supplies, high voltage resistor packs, LED lighting, industrial controls, and connectors. It offers unprimed adhesion, heat
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Dielectric Strength: 525 kV/in
- Form / Function: Encapsulant / Potting Compound
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Supplier: Ellsworth Adhesives
Description: Dow SYLGARD™ 184 Silicone Elastomer Clear is a two component, flowable encapsulant that is used for amplifiers, connectors, power supplies, LED lighting, sensors, transformers, high voltage resistor packs, and industrial controls. It offers good dielectric properties, flame
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Dielectric Strength: 475 kV/in
- Electrical / Electronics Applications: Electrical Power / HV (Coils, Motors)
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Supplier: Ellsworth Adhesives
Description: Dow SYLGARD™ 184 Silicone Elastomer Clear is a two component, room temperature and heat curing, encapsulant that is used as protective coating for LED lighting, power supplies, transformers, sensors, amplifiers, and connectors. It provides flowability, flame resistance, and good
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Dielectric Strength: 350 kV/in
- Electrical / Electronics Applications: Electrical Power / HV (Coils, Motors)
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Supplier: Ellsworth Adhesives
Description: Dow SYLGARD™ 184 Silicone Elastomer Clear is a two component, room temperature and heat curing encapsulant that is used as protective coating for LED lighting, power supplies, transformers, sensors, amplifiers, and connectors. It provides flowability, flame resistance, and good
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Dielectric Strength: 350 kV/in
- Electrical / Electronics Applications: Electrical Power / HV (Coils, Motors)
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Supplier: Techsil Limited
Description: required. Widely used in LED assemblies applications. Cures at room temperature to a high strength silicone rubber suitable for the protection of electronic components and assemblies against shock, vibration, moisture, ozone, dust, chemicals, and other environmental hazards. Product
- Chemical / Polymer System Type: Silicone
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
- Use Temperature: -60 to 204 F
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Supplier: CHT USA Inc.
Description: CHT’s TufGel 336 is a 2-part, tough, black silicone gel designed for electronic potting applications to provide protection from moisture, vibration and thermal or mechanical shock. TufGel 336 can also function as a contrast enhancement material in LED applications. TufGel 336 is also
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System, Specialty / Other
- Dielectric Strength: 450 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Techsil Limited
Description: required. Widely used in LED assemblies applications. Cures at room temperature to a high strength silicone rubber suitable for the protection of electronic components and assemblies against shock, vibration, moisture, ozone, dust, chemicals, and other environmental hazards. Product
- Chemical / Polymer System Type: Silicone
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Supplier: Techsil Limited
Description: required. Widely used in LED assemblies applications. Cures at room temperature to a high strength silicone rubber suitable for the protection of electronic components and assemblies against shock, vibration, moisture, ozone, dust, chemicals, and other environmental hazards. Product
- Chemical / Polymer System Type: Silicone
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Supplier: Techsil Limited
Description: required. Widely used in LED assemblies applications. Cures at room temperature to a high strength silicone rubber suitable for the protection of electronic components and assemblies against shock, vibration, moisture, ozone, dust, chemicals, and other environmental hazards. Product
- Chemical / Polymer System Type: Silicone
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Supplier: MacDermid Alpha Electronics Solutions
Description: A thixotropic two-part silicone potting compound specifically crafted to safeguard LED drivers and a range of other components. Product Overview SC4003 is a thixotropic two-part silicone potting and encapsulating resin designed for the Indian market. Primarily developed for the
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Form / Function: Encapsulant / Potting Compound
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Supplier: RS Components, Ltd.
Description: QSil216 is a 2-component, optically clear silicone elastomer system specially designed for electronic potting applications. Supplied in an easy to use twin pack there is no need for weighing with all the mixing contained within the package. It offers good protection against impact damage and
- Form / Function: Specialty / Other, Encapsulant / Potting Compound
- Thermal Conductivity: 0.1800 W/m-K
- Use Temperature: -76 to 399 F
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Supplier: RS Components, Ltd.
Description: Optically clear, flexible two part encapsulating compound. Ideal for use in the LED industry where optical clarity is vital. Suited for applications where thin films are required. Moisture cure nature. Low viscosity. Excellent electrical properties. Wide temperature range. Chemical and water
- Chemical / Polymer System Type: Specialty / Other
- Form / Function: Conformal / Encapsulating Coating
- Use Temperature: -76 to 392 F
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Supplier: Aremco Products, Inc.
Description: Hi-temp, prevents dusting of fibrous insulation materials
- Chemical / Polymer System Type: Silicone
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Aremco Products, Inc.
Description: Exceptional electrical, moisture & chemical resistance
- Chemical / Polymer System Type: Silicone
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Chemence Inc.
Description: KSC2040 is a thermally conductive silicone RTV adhesive rubber developed for heat sink applications. KSC2040 is a 1-part silicone that when applied to the substrate enables adhesion to parts and heat transfer of the bonded assembly within minutes. When cured, the elastomer resists
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Die Bonding Adhesive / Compound
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Supplier: Chemence Inc.
Description: KS130 is a fast curing silicone RTV adhesive rubber developed for the bonding of "difficult to bond" plastics like Tygon™.KS130 is a one part silicone that when applied to the substrate enables handling of the bonded assembly within an hour. When cured, the elastomer resists
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Form / Function: Die Bonding Adhesive / Compound
- Industry Applications: OEM / Industrial
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Supplier: Chemence Inc.
Description: KSC1802 is a low viscosity, high performance, thermally conductive, liquid gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1802 is supplied as a two part, 1:1 mix ratio silicone that when mixed
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Gap Filling Compound, Die Bonding Adhesive / Compound
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Supplier: Chemence Inc.
Description: KS715 is a fast curing, high strength, silicone RTV adhesive rubber product engineered for applications requiring fast development of physical properties and excellent adhesion. When cured, the elastomer resists weathering, ozone, moisture, UV and high temperatures. KS715 works well in manual
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Form / Function: Die Bonding Adhesive / Compound
- Industry Applications: OEM / Industrial
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Supplier: Novagard Solutions
Description: Non-corrosive, single component silicone coating & encapsulating compound
- Chemical / Polymer System Type: Silicone
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Reactive / Moisture Cured, Single Component System
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Supplier: Protavic America, Inc.
Description: PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermal Compound / Thermally Conductive
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Supplier: Novagard Solutions
Description: Non-corrosive, single component alkoxy cure silicone sealant/adhesive
- Chemical / Polymer System Type: Silicone
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System
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Supplier: Protavic America, Inc.
Description: PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Protavic America, Inc.
Description: PTS-46323™ is a two-component ONE TO ONE MIX RATIO silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible
- Chemical / Polymer System Type: Silicone
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Novagard Solutions
Description: Non-corrosive, single component silicone coating
- Chemical / Polymer System Type: Silicone
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, UV / Radiation Cured (also EB, Light), Reactive / Moisture Cured, Single Component System
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Description: Used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. This product is usually used from -53°C to 204°C.
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: UV / Radiation Cured (also EB, Light), Reactive / Moisture Cured
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Conformal / Encapsulating Coating
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System
- Form / Function: Encapsulant / Potting Compound
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Description: For gasket and sealing applications. The product has high resilience. This product is usually used from -53°C to 250°C.
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: UV / Radiation Cured (also EB, Light), Reactive / Moisture Cured
- Form / Function: Conformal / Encapsulating Coating
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Supplier: OMEGA Engineering, Inc.
Description: OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System
- Form / Function: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 813J01 BIPAX, Silicone, Non-corrosive, Encapsulant LOCTITE® ABLESTIK 813J01 BIPAX exhibits very low stress upon cure thus preventing component cracking and other stress-related problems. This adhesive can be cured at room temperature in thick or thin sections. It is
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System
- Viscosity: 40000 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 4640, Silicone, Flexible, Potting or Encapsulant LOCTITE® STYCAST 4640 RTV condensation cure silicone rubber syntactic foam is engineered to yield a flexible, low density material with a low dielectric constant and dissipation factor. It is designed for airborne
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Tensile Strength (Break): 200 psi
- Use Temperature: 85 to 500 F
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Supplier: Aremco Products, Inc.
Description: used to improve moisture resistance. Two-part systems consist of a powder and liquid binder system. Materials set at room temperature in several hours, then cured at ~250 °F in 2-4 hours. Sil-Bond™, a silicone-ceramic potting compound for optimal moisture resistance, is now offered
- Chemical / Polymer System Type: Silicone, Ceramic / Inorganic Cement
- Composition: Filled
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Master Bond, Inc.
Description: Mastersil 323Med is a two part, addition cured silicone that passes ISO 10933-5 for cytotoxicity used in medical device manufacturing.
- Applied Thickness / Gap Fill: 0.0020 to 0.0030 inch
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 8.33 to 11.11 µin/in-F
- Compound Type: Electrical Insulation / Dielectric
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Supplier: TE Connectivity
Description: Isocyanate-Free : Yes Label-Free Acc REACH & CLP : Yes Marine-Offshore-Ship building Certified : No Silicone-Free : No UV-Stabilized : No Other
- Chemical / Polymer System Type: Silicone, Specialty / Other
- Form / Function: Encapsulant / Potting Compound
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 964 UV/CLEAR is an RTV-1 amine cure system that cures on contact with moisture in the air and/or through exposure to high energy ultraviolet light. Special features Solvent-free Sprayable CO2 accelerable UV activated cure Excellent adhesion to most substrates Flame retardant, UL 94V-0
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, UV / Radiation Cured (also EB, Light), Reactive / Moisture Cured, Single Component System
- Dielectric Constant (Relative Permittivity): 2.6
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Featured Products Top
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Its flexibility allows for stress minimization especially when bonding substrates with different coefficients of thermal expansion. It also utilizes a fluorescent dye for detection purposes, which enables easy visual inspection. LED405FL3 is a one part system that (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
electronic applications. CHT’s silicones perform in the following industries: Automotive Traction and railway Aviation and aerospace Defence/military sectors LED and lighting Telecommunication Measurement and control (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
Dymax light?curable encapsulants help simplify PCB assembly while improving reliability and long?term performance. Key advantages include: Faster throughput and less rework using UV or LED light?curing that (read more)
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Resilient Encapsulant for PCB and Electronic Assembly Engineered for rapid, reliable protection of complex electronic and microelectronic assemblies, this light-curable encapsulant enhances resistance to moisture, thermal cycling, and abrasion while maintaining (read more)
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Why are silicones used in LED & Lighting applications? Silicones have become widely used by LED design engineers to provide improved light performance, environmental protection and extended product life (read more)
Browse Datasheets for CHT USA Inc. -
applications? Silicones have become widely used by LED design engineers to provide improved light performance, environmental protection and extended product life. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants (read more)
Browse Datasheets for CHT USA Inc. -
Why are silicones used in LED & Lighting applications? Silicones have become widely used by LED design engineers to provide improved light performance, environmental protection and extended product life (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc. -
Master Bond LED401 is a breakthrough system based on LED technology. This adhesive, sealant, coating and encapsulant cures tack-free upon exposure to a 405 nm wavelength light source, without any oxygen inhibition (read more)
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applications? Silicones have become widely used by LED design engineers to provide improved light performance, environmental protection and extended product life. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants (read more)
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for today’s electronic applications. CHT’s silicones perform in the following industries: Automotive Traction and railway Aviation and aerospace Defence/military sectors LED and lighting Telecommunication (read more)
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Conduct Research Top
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Industries Association named Naoyuki Akikusa, chairman of Fujitsu Ltd., as its new chairman, at a time when the Japanese electronics industry is growing strongly. Dow Corning sees LED makers transitioning to silicones Dow Corning has launched an expanded family of silicone materials for the light emitting
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
transitioning to silicones Dow Corning has launched an expanded family of silicone materials for the light emitting diode market, including three new LED-protecting encapsulants and a moldable resin. Siano launches chipset for mobile digital TV Mobile digital television (MDTV) chip developer Siano
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Optical Transmission Properties of Adhesives
in the wavelengths between 800 and 1500 nm range. Other applications include LED lights, display panels, and optical lens coupling, which might need optically clear adhesives, sealants, and encapsulants which transmit in the visible range. There are rare cases where a manufacturer of night vision goggles may
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LED Package-use Encapsulation Material Report - 2013
• LED silicone encapsulants can largely be divided into phenyl types and methyl types.
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Low temperature curable epoxy siloxane hybrid materials for LED encapsulant
silicone LED encapsulants such as OE-6630 (Dow corning, Shore D hardness: about 40).
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Roll To Roll Plasma from Picomax Co., Ltd. , Korea
We develop POLYIMIDE VARNISH, SILICONE LED ENCAPSULANTS , THERMAL GREASE, GEL, HARD COATING and LESIN, which are raw materials for electrical materials with our own technical skills domestically.
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Roll To Roll Sputter from Picomax Co., Ltd. , Korea
We develop POLYIMIDE VARNISH, SILICONE LED ENCAPSULANTS , THERMAL GREASE, GEL, HARD COATING and LESIN, which are raw materials for electrical materials with our own technical skills domestically.
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Environmental and economical impact of LED lighting systems and effect of thermal management
This has led to a switch to silicones for LED encapsulants and phosphor binders.
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LED Package-use Encapsulation Material Report - 2013
With high output power, high brightness and superior thermal characteristics, demand for LED -use silicone encapsulants is forecast to nearly double to 855 tons by 2017, compared to 442 tons in 2012.
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Emerging Displays Report - Quantum Dot Display Technology - 2014
The figure below shows the photoluminescence efficiency according to the density of quantum dots when packed into an LED , using silicone encapsulants .
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High-Efficiency Nitride-Based Solid-State Lighting
Silicone -based LED encapsulants .
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Novel silicone materials for LED packaging
At the systems level manufacturers are beginning to specify silicone encapsulants to their LED suppliers.
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Highly transparent thermal stable silicone/titania hybrids with high refractive index for LED encapsulation
When compared with silicones used for LED encapsulants , the materials we prepared show better optical properties.