LED Silicone Encapsulants

Description: PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high

• Viscosity: 400 cP
• Thermal Conductivity: 0.5 W/m-K
• Coeff. of Thermal Expansion (CTE): 3,055.5555555555557 µin/in-F
• Dielectric Strength: 635.0000000000014 kV/in

Description: Dow SYLGARD™ 567 Primerless Silicone Encapsulant Black is a two component material that is used in potting applications for automotive assemblies, power supplies, high voltage resistor packs, LED lighting, industrial controls, and connectors. It offers unprimed adhesion, heat

• Viscosity: 1,540 cP
• Thermal Conductivity: 0.3 W/m-K
• Dielectric Strength: 525 kV/in
• Features: Encapsulating / Potting

Description: Dow SYLGARD™ 184 Silicone Elastomer Clear is a two component, room temperature and heat curing encapsulant that is used as protective coating for LED lighting, power supplies, transformers, sensors, amplifiers, and connectors. It provides flowability, flame resistance, and good

• Viscosity: 3,500 cP
• Thermal Conductivity: 0.16 W/m-K
• Dielectric Strength: 350 kV/in
• Features: Electrical Power / HV, Encapsulating / Potting

Description: Dow SYLGARD™ 184 Silicone Elastomer Clear is a two component, flowable encapsulant that is used for amplifiers, connectors, power supplies, LED lighting, sensors, transformers, high voltage resistor packs, and industrial controls. It offers good dielectric properties, flame

• Viscosity: 3,500 cP
• Tensile Strength (Break): 1,025 psi
• Dielectric Strength: 475 kV/in
• Features: Electrical Power / HV, Encapsulating / Potting

Description: Dow SYLGARD™ 184 Silicone Elastomer Clear is a two component, room temperature and heat curing, encapsulant that is used as protective coating for LED lighting, power supplies, transformers, sensors, amplifiers, and connectors. It provides flowability, flame resistance, and good

• Viscosity: 3,500 cP
• Thermal Conductivity: 0.16 W/m-K
• Dielectric Strength: 350 kV/in
• Features: Electrical Power / HV, Encapsulating / Potting

Description: CHT’s TufGel 336 is a 2-part, tough, black silicone gel designed for electronic potting applications to provide protection from moisture, vibration and thermal or mechanical shock. TufGel 336 can also function as a contrast enhancement material in LED applications. TufGel 336 is also

• Viscosity: 390 cP
• Use Temperature: -67 to 399.2 F
• Dielectric Strength: 450.00000000000006 kV/in
• Industry: Automotive, OEM / Industrial

Description: A thixotropic two-part silicone potting compound specifically crafted to safeguard LED drivers and a range of other components. Product Overview SC4003 is a thixotropic two-part silicone potting and encapsulating resin designed for the Indian market. Primarily developed for the

• Features: Electronics, Encapsulating / Potting, RTV / Room Temperature Curing
• Industry: Semiconductors / IC Packaging
• Chemical System: Silicone
• Cure / Technology: Two Component System

Description: required. Widely used in LED assemblies applications. Cures at room temperature to a high strength silicone rubber suitable for the protection of electronic components and assemblies against shock, vibration, moisture, ozone, dust, chemicals, and other environmental hazards. Product

• Use Temperature: -60 to 204 F
• Features: Encapsulating / Potting, Medical / Food (Sanitary / FDA)
• Chemical System: Rubber Based / Elastomeric, Silicone

Description: required. Widely used in LED assemblies applications. Cures at room temperature to a high strength silicone rubber suitable for the protection of electronic components and assemblies against shock, vibration, moisture, ozone, dust, chemicals, and other environmental hazards. Product

• Use Temperature: -60 to 204 F
• Features: Electronics, Medical / Food (Sanitary / FDA)
• Chemical System: Rubber Based / Elastomeric, Silicone

Description: required. Widely used in LED assemblies applications. Cures at room temperature to a high strength silicone rubber suitable for the protection of electronic components and assemblies against shock, vibration, moisture, ozone, dust, chemicals, and other environmental hazards. Product

• Use Temperature: -60 to 204 F
• Features: Electronics, Encapsulating / Potting, Medical / Food (Sanitary / FDA)
• Chemical System: Rubber Based / Elastomeric, Silicone

Description: required. Widely used in LED assemblies applications. Cures at room temperature to a high strength silicone rubber suitable for the protection of electronic components and assemblies against shock, vibration, moisture, ozone, dust, chemicals, and other environmental hazards. Product

• Use Temperature: -60 to 204 F
• Features: Electronics, Encapsulating / Potting, Medical / Food (Sanitary / FDA)
• Chemical System: Rubber Based / Elastomeric, Silicone

Description: MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its

• Applied Thickness / Gap Fill: 1 inch
• Use Temperature: -120 to 400 F
• Tensile Strength (Break): 400 to 700 psi
• Elongation: 50 to 100 %

Description: Master Bond MasterSil 323 is a two component, addition cured system for bonding, sealing and potting applications.

• Applied Thickness / Gap Fill: 0.002 to 0.003 inch
• Use Temperature: -65 to 400 F
• Tensile Strength (Break): 200 to 250 psi
• Elongation: 150 to 250 %

Description: Passing both USP Class VI testing and ISO cytotoxicity specifications, MasterSil 910Med is formulated for bonding, sealing, coating in medical device applications. As an acetoxy type system, it bonds exceptionally well to a wide variety of substrates including metals, composites, ceramics, glass as

• Use Temperature: -75 to 400 F
• Tensile Strength (Break): 1,300 to 1,600 psi
• Elongation: 400 to 600 %
• Dielectric Constant (Relative Permittivity): 2.75

Description: MasterSil 972TC-LO is capable of transferring heat with a thermal conductivity of 7-9 BTU•in/ft²•hr•°F [1.01-1.30 W/(m•K)], while retaining superior dielectric properties. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics as well as many types of rubbers

• Viscosity: 30,000 to 40,000 cP
• Use Temperature: -120 to 400 F
• Thermal Conductivity: 1.01 to 1.3 W/m-K
• Tensile Strength (Break): 150 to 400 psi

Description: Enhanced flow properties aid potting of tight units and delicate electronics with effective heat dissipation and thermal performance. Product Overview SC4004 is a thixotropic silicone potting compound developed for the Indian electronics market. Its thixotropic nature provides excellent flow

• Features: Electronics, Encapsulating / Potting, Thermal Compound / Heat Conductive
• Industry: Semiconductors / IC Packaging
• Chemical System: Silicone

Description: Konform silicone coating 400ml

• Industry: Aerospace
• Form / Function: Conformal / Encapsulating Coating
• Features: Other, Specialty / Other
• Chemical System: Silicone

Description: Yes Label-Free Acc REACH & CLP : Yes Marine-Offshore-Shipbuilding Certified : No Silicone-Free : No UV-Stabilized : No Other Other Colors Available : No Product Use : Insulation Packaging Features Minimum Packaging Unit : 1 Packaging Quantity (L) : 5 Potting Resin Packaging Method :

• Features: Encapsulant / Potting Compound, Specialty / Other
• Chemical System: Silicone

Description: ELASTOSIL® RT 604 A/B is a pourable, addition curing two-part silicone rubber that vulcanizes at room temperature. Special features two-part, 9 : 1 mixing ratio very low viscosity rapid heat cure low hardness crystal clear Application general purpose Encapsulant

• Viscosity: 200 to 1,000 cP
• Features: Electronics, Encapsulating / Potting, Liquid, RTV / Room Temperature Curing
• Industry: OEM / Industrial
• Chemical System: Rubber Based / Elastomeric, Silicone

Description: PTS-46323™ is a two-component ONE TO ONE MIX RATIO silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible

• Viscosity: 8,000 to 10,000 cP
• Use Temperature: -55 to 200 F
• Thermal Conductivity: 1.3 W/m-K
• Dielectric Strength: 635.0000000000014 kV/in

Description: LOCTITE 5293 is a repairable, solvent-free, medium viscosity, UV / moisture cure silicone suited to brush, dip and selective coating.

• Viscosity: 600 cP
• Use Temperature: -40 to 392 F
• Form / Function: Conformal / Encapsulating Coating
• Features: Electronics

Description: No Description Provided

• Viscosity: 70,000 to 120,000 cP
• Tensile Strength (Break): 200 psi
• Elongation: 250 %
• Features: Ceramic / Glass, Composites, Conformal Coating, Electrical Insulation / Dielectric Material, Electrical Power / HV, Electronics, Encapsulating / Potting, Gap Filling Sealant / FIP Gasket, Liquid, Metal, Non-corrosive Cure, RTV / Room Temperature Curing

Description: No Description Provided

• Viscosity: 20,000 to 35,000 cP
• Tensile Strength (Break): 50 to 100 psi
• Elongation: 245 to 300 %
• Features: Ceramic / Glass, Composites, Conformal Coating, Electrical Insulation / Dielectric Material, Electrical Power / HV, Electronics, Encapsulating / Potting, Liquid, Metal, Non-corrosive Cure, RTV / Room Temperature Curing

Description: SEMICOSIL® 925 is a high purity, one-component addition curing RTV-2 silicone gel. Special features Low ion content Low volatile content Low viscosity Good mechanical damping properties Application SEMICOSIL® 925 is a dielectric gel especially designed to seal, protect and preserve the

• Viscosity: 700 cP
• Dielectric Strength: 558.8000000000012 kV/in
• Dielectric Constant (Relative Permittivity): 2.5
• Features: Electrical Insulation / Dielectric Material, Electronics, Encapsulating / Potting Compound, Flexible / Dampening, Liquid

Description: 20-1615 is a two component, room temperature curing silicone rubber compound. This silicone system is clear, odorless, and low in viscosity. 20-1615 is an excellent choice for potting electronic assemblies that require shock and vibration resistance. It also protects assemblies from

• Viscosity: 6,000 cP
• Use Temperature: -175 to 401 F
• Thermal Conductivity: 0.207688176 W/m-K
• Coeff. of Thermal Expansion (CTE): 182.99999999999997 µin/in-F

Description: LOCTITE STYCAST 5952-1, Silicone, Potting or Encapsulant LOCTITE® STYCAST 5952-1 is designed for encapsulation of heat generating devices. It is also recommended for applications requiring a non-corrosive casting and coating. Electrically non-conductive Good elongation strength

• Viscosity: 60,000 cP
• Thermal Conductivity: 0.8 W/m-K
• Tensile Strength (Break): 580 psi
• Type: Electrical Insulation / Dielectric

Description: (Known as Hysol ECCOCOAT SC3613 ) Heat curable, optically clear, high purity, one-component coating to be applied by brush, dip or flow coating.

• Viscosity: 3,500 cP
• Use Temperature: -40 to 392 F
• Form / Function: Conformal / Encapsulating Coating
• Features: Electronics

Description: Hi-temp, prevents dusting of fibrous insulation materials

• Viscosity: 600 to 1,200 cP
• Use Temperature: 1,100 F
• Industry: Automotive, OEM / Industrial
• Features: Ceramic / Glass, Electrical Insulation / Dielectric Material, Electronics, Encapsulating / Potting Compound, Filled / Reinforced, Gap Filling Sealant / FIP Gasket, Liquid, Other

Description: Potting, encapsulant elastomer Properties Viscosity 3500 Hardness Sha 48 Description a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL™ ESA 7252 QC A & B is supplied as a viscous liquid which is

• Viscosity: 3,000 to 3,500 cP
• Thermal Conductivity: 0.42 W/m-K
• Coeff. of Thermal Expansion (CTE): 4.444444444444445 µin/in-F
• Tensile Strength (Break): 333.584730521553 psi

Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper

• Use Temperature: 392 F
• Thermal Conductivity: 2.3076464 W/m-K
• Features: Air Setting / Film Drying, Encapsulating / Potting, Grease / Paste, Thermal / Heat Conductive
• Type: Electrical Insulation / Dielectric

Description: Two-Component, Medium Viscosity, Addition Cure, Potting/Encapsulating Silicone Compound Properties Viscosity 44000 Hardness Sha 29 Description Bluesil V-217 is a clear, two component, medium viscosity, addition cure silicone compound. It is designed for potting and encapsulating

• Viscosity: 44,000 cP
• Form / Function: Conformal / Encapsulating Coating
• Features: Electronics, Encapsulating / Potting, Grease / Paste
• Chemical System: Silicone

Description: KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that when mixed will cure

• Viscosity: 150,000 cP
• Form / Function: Die Bonding Adhesive / Compound
• Features: Electronics, Grease / Paste, Plastic
• Chemical System: Silicone

Description: Loctite 5290 is used for protecting printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. This product is typically used in applications with an operating range of -53 °C to 204 °C.

• Viscosity: 300 cP
• Features: Anaerobic, Electronics
• Form / Function: Conformal / Encapsulating Coating
• Chemical System: Silicone

Description: OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,

• Use Temperature: 392 F
• Thermal Conductivity: 2.3076464 W/m-K
• Features: Air Setting / Film Drying, Ceramic / Glass, Encapsulating / Potting, Grease / Paste, Metal, Paper / Paperboard, Plastic, Thermal / Heat Conductive
• Type: Electrical Insulation / Dielectric

Description: ELASTOSIL® RT 607 A/B is a pourable, addition curing RTV-2 silicone rubber. Special features two-part, 9 : 1 mixing ratio low viscosity rapid heat cure high hardness excellent heat stability flame retardant Application general purpose Encapsulant

• Viscosity: 200 to 15,000 cP
• Tensile Strength (Break): 435.110518071591 psi
• Elongation: 100 %
• Features: Electronics, Encapsulating / Potting, Liquid, RTV / Room Temperature Curing