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Supplier: Epoxies Etc...
Description: UV Cure 60-7106 is a one-component ultraviolet (UV) curable encapsulant, adhesive and coating. This is an electronic grade material designed for applications requiring a low Coefficient of Thermal Expansion (CTE).
- Viscosity: 70,000 to 90,000 cP
- Coeff. of Thermal Expansion (CTE): 19.444444444444443 µin/in-F
- Dielectric Strength: 449.9999999999993 kV/in
- Dielectric Constant (Relative Permittivity): 3.5
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C,
- Viscosity: 690 cP
- Dielectric Strength: 533 kV/in
- Features: Electrical Insulation / Dielectric Material, Electronics, Encapsulating / Potting
- Industry: Semiconductors / IC Packaging
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ECCOBOND EN 1350, Epoxy, Encapsulant LOCTITE® ECCOBOND EN 1350 encapsulant is designed for thermal sensor assembly applications. Non-conductive Fast cure at low temperatures Low temperature cure High temperature resistance Water resistant
- Coeff. of Thermal Expansion (CTE): 15 µin/in-F
- Type: Electrical Insulation / Dielectric
- Chemical System: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: Accuris
Description: ENCAPSULANT, SILICONE DIELECTRIC GEL, LOW TEMPERATURE RESISTANT **TO BE USED WITH FORD WSS-M99P1111-A**
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Supplier: Epoxies Etc...
Description: 20-2100 is a high performance two component flexible urethane system. This easy to use polyurethane is very low in viscosity and ideal for potting or encapsulating delicate electronic components. 20-2100 exhibits very low shrinkage, stress, and exotherm throughout the cure cycle. This
- Viscosity: 1,600 cP
- Use Temperature: -67 to 266 F
- Coeff. of Thermal Expansion (CTE): 83.33333333333333 µin/in-F
- Tensile Strength (Break): 1,600 psi
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Supplier: CHT USA Inc.
Description: CHT's QSil 216 is a 2-part, platinum cure, optically clear silicone encapsulant designed for optical applications. QSil 216 features a 10:1 mix ratio by weight and its low viscosity profile enables excellent flow around components and is excellent for potting complex parts. The
- Use Temperature: -67 to 399.2 F
- Thermal Conductivity: 0.18 W/m-K
- Elongation: 100 %
- Tensile Strength (Break): 749.8404594767085 psi
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Supplier: CHT USA Inc.
Description: CHT's QSil 223 is a 2-part, platinum cure, optically clear silicone encapsulant and is designed for optical applications. It features a convenient 1:1 mix ratio by weight and its low viscosity profile enables excellent flow around components and is ideal for potting complex parts. The
- Use Temperature: -67 to 399.2 F
- Thermal Conductivity: 0.18 W/m-K
- Dielectric Strength: 500.00000000000006 kV/in
- Index of Refraction: 1.405
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Supplier: Ellsworth Adhesives
Description: minimal shrinkage, low viscosity, and good dielectric properties. 200 mL Cartridge. This is a Dow product repackaged by KitPackers, an authorized repackager of Dow. Please note mixer will not be shipped with this product. Review related products below and purchase separately.
- Viscosity: 1,540 cP
- Thermal Conductivity: 0.3 W/m-K
- Dielectric Strength: 525 kV/in
- Features: Encapsulating / Potting
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Supplier: Ellsworth Adhesives
Description: Dow SYLGARD™ 182 Silicone Elastomer Clear is a two component, heat curing encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides flexibility, low stress, easy to repair, long
- Viscosity: 4,575 cP
- Thermal Conductivity: 0.16 W/m-K
- Dielectric Strength: 475 kV/in
- Features: Electrical Power / HV, Encapsulating / Potting
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Supplier: Ellsworth Adhesives
Description: ELANTAS PDG CONATHANE EN-9 Polyurethane Encapsulant is a two-component polyurethane system used for cable and connector potting and molding. It has superior hydrolytic stability, thermal shock resistance, high dielectric strength, and a low dissipation factor. Part B, 1 qt Can.
- Viscosity: 6,800 cP
- Tensile Strength (Break): 2,000 psi
- Elongation: 450 %
- Dielectric Strength: 750 kV/in
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Encapsulants and Potting Compounds - Techsil® RTV27905 Clr Silicone Gel Encapsulant 2kg -- TESI19128Supplier: Techsil Limited
Description: Techsil® RTV27905 is a soft, adherent, clear silicone elastomer gel which is designed for the encapsulation and protection of electronic components. It is a low viscosity, 2 component system that is easily mixed in a 1:1 ratio. RTV27905 belongs to a wider family of products in a similar range
- Features: Encapsulating / Potting
- Chemical System: Rubber Based / Elastomeric, Silicone
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Encapsulants and Potting Compounds - Techsil RTV27905 Clr Silicone Gel Encapsulant 10kg -- TESI19154Supplier: Techsil Limited
Description: Techsil® RTV27905 is a soft, adherent, clear silicone elastomer gel which is designed for the encapsulation and protection of electronic components. It is a low viscosity, 2 component system that is easily mixed in a 1:1 ratio. RTV27905 belongs to a wider family of products in a similar range
- Features: Encapsulating / Potting
- Chemical System: Rubber Based / Elastomeric, Silicone
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 925 is a high purity, one-component addition curing RTV-2 silicone gel. Special features Low ion content Low volatile content Low viscosity Good mechanical damping properties Application SEMICOSIL® 925 is a dielectric gel especially designed to seal, protect
- Viscosity: 700 cP
- Dielectric Strength: 558.8000000000012 kV/in
- Dielectric Constant (Relative Permittivity): 2.5
- Features: Electrical Insulation / Dielectric Material, Electronics, Encapsulating / Potting Compound, Flexible / Dampening, Liquid
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Supplier: Master Bond, Inc.
Description: MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation.
- Applied Thickness / Gap Fill: 1 inch
- Viscosity: 1,000 cP
- Use Temperature: -67 to 392 F
- Dielectric Strength: 500.00000000000006 kV/in
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Supplier: Epoxies Etc...
Description: 20-3221 is a very low viscosity epoxy potting, casting and encapsulating resin system. 20-3221 is a filled system resulting in excellent dimensional stability and low shrinkage.
- Use Temperature: -58 to 356 F
- Thermal Conductivity: 0.64902555 W/m-K
- Coeff. of Thermal Expansion (CTE): 28.499999999999996 µin/in-F
- Tensile Strength (Break): 7,500 psi
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Supplier: Master Bond, Inc.
Description: MasterSil 920-LO is an ideal material for the encapsulation of sensitive electronic and optical components, especially when low stress is a critical requirement. This neutral curing, non-corrosive, RTV silicone has very good flow properties and outstanding electrical insulation values, which
- Viscosity: 5,000 to 10,000 cP
- Use Temperature: -175 to 500 F
- Dielectric Strength: 450.00000000000006 kV/in
- Dielectric Constant (Relative Permittivity): 2.5
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Supplier: Epoxies Etc...
Description: 20-3036 is a light weight epoxy for potting, casting, and encapsulating electronic components and assemblies. It is formulated in a convenient 2:1 by weight mix ratio.
- Thermal Conductivity: 0.20191906 W/m-K
- Dielectric Strength: 390.0000000000004 kV/in
- Dielectric Constant (Relative Permittivity): 3.7
- Type: Electrical Insulation / Dielectric
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Supplier: Sauereisen, Inc.
Description: Sauereisen Low Expansion Cement No. 29 is an inorganic cement used for embedding heating elements, insulating thermocouples, coating resistors and coils, and mechanically sealing parts where high resistance to electricity, chemicals and thermal shock is required. A strong resistance to
- Use Temperature: 1,550 F
- Thermal Conductivity: 1.1538232 W/m-K
- Coeff. of Thermal Expansion (CTE): 4.6 µin/in-F
- Tensile Strength (Break): 425 psi
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Supplier: Master Bond, Inc.
Description: EP21LVSP6 is a two component system that is also well suited for potting and encapsulation applications. It offers a very convenient one to one mix ratio, by weight or volume and is formulated to cure at room temperature. It has a desirable combination of a long open time of 3-5 hours, low
- Use Temperature: -60 to 250 F
- Coeff. of Thermal Expansion (CTE): 27.779999999999998 to 30.560000000000002 µin/in-F
- Tensile Strength (Break): 7,000 to 8,000 psi
- Dielectric Strength: 400.00000000000006 to 450.00000000000006 kV/in
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Supplier: Master Bond, Inc.
Description: EP21LVFL is a two part epoxy for bonding, sealing, coating and potting. It features convenient handling, high elongation, a low modulus and withstands thermal cycling and shock.
- Applied Thickness / Gap Fill: 0.003 to 0.005 inch
- Viscosity: 10,000 to 14,000 cP
- Use Temperature: -100 to 250 F
- Coeff. of Thermal Expansion (CTE): 19.444444444444443 to 22.22222222222222 µin/in-F
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Encapsulants and Potting Compounds - Momentive RTV577 Low Temperature Silicone +DBT 1lb -- MOSI02084Supplier: Techsil Limited
Description: DETAILS RTV577 is a low temperature silicone rubber compound from Momentive Performance Materials. It offers excellent release properties and also good adhesion capabilities with the use of a primer. This grade with cure at room temperature and retains its elastomeric properties across a wide
- Use Temperature: -115 to 204 F
- Features: Encapsulating / Potting
- Chemical System: Rubber Based / Elastomeric, Silicone
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® 808 A two-component general purpose potting compound for electrical components. Properties include enhancement of mecahnical strength, low dielectrics, vibration and shock resistance of assembled components.
- Features: Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: Dymax
Description: has a low dielectric constant for high-frequency applications. This encapsulating material may be used in attaching FPCs to various substrates including PCB and glass. Dymax materials have no solvents added and cure upon exposure to light. Their ability to cure in seconds results in
- Viscosity: 4,500 cP
- Features: Encapsulant / Potting Compound, Other
- Cure / Technology: UV / Radiation Cured (also EB, Light)
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Supplier: Hapco, Inc.
Description: Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds.
- Use Temperature: 176 F
- Thermal Conductivity: 0.21634185 W/m-K
- Elongation: 41 %
- Tensile Strength (Break): 460 psi
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Supplier: Hapco, Inc.
Description: Shore 90-95 A, elastomeric coatings that have been specifically designed to reproduce exact surface details. DI-COAT E-4599 is excellent for electrical insulation applications requiring non or low sag materials. DI-COAT E-4599 are formulated to withstand high wear continuous service.
- Use Temperature: 194 F
- Elongation: 325 %
- Tensile Strength (Break): 2,500 psi
- Dielectric Strength: 350.0000000000002 kV/in
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Supplier: Henkel Corporation - Electronics
Description: excellent adhesion performance to a variety of substrates, excellent resistance to a variety of environmental stimuli, low viscosity, high dielectric strength and improved flexibility at low temperatures. These naturally occurring raw materials maintain a wide operating
- Use Temperature: -40 to 284 F
- Elongation: 600 %
- Water Absorption: 0.4 %
- Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Henkel Corporation - Electronics
Description: excellent adhesion performance to a variety of substrates, excellent resistance to a variety of environmental stimuli, low viscosity, high dielectric strength and improved flexibility at low temperatures. These naturally occurring raw materials maintain a wide operating
- Use Temperature: -40 to 302 F
- Elongation: 600 %
- Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Features: Electronics, Encapsulant / Potting Compound, Pellets / Solid Form, UL Approved
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Supplier: Henkel Corporation - Electronics
Description: excellent adhesion performance to a variety of substrates, excellent resistance to a variety of environmental stimuli, low viscosity, high dielectric strength and improved flexibility at low temperatures. These naturally occurring raw materials maintain a wide operating
- Use Temperature: -13 to 257 F
- Elongation: 600 %
- Dielectric Strength: 1,529.9999999999995 kV/in
- Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Henkel Corporation - Electronics
Description: excellent adhesion performance to a variety of substrates, excellent resistance to a variety of environmental stimuli, low viscosity, high dielectric strength and improved flexibility at low temperatures. These naturally occurring raw materials maintain a wide operating
- Use Temperature: -40 to 257 F
- Elongation: 400 %
- Dielectric Strength: 609.6000000000013 kV/in
- Dielectric Constant (Relative Permittivity): 2.6 to 3.8
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Supplier: Sauereisen, Inc.
Description: Sauereisen Electric Insulating Cement No. 12 is an inorganic cement used for applications requiring high dielectric strength and volume resistivity through 2200oF. No. 12 offers low shrinkage and coefficient of thermal expansion making it an excellent cement for bonding or potting
- Use Temperature: 2,200 F
- Thermal Conductivity: 1.26920552 to 1.5865069 W/m-K
- Coeff. of Thermal Expansion (CTE): 3.1 µin/in-F
- Tensile Strength (Break): 290 psi
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Supplier: Techsil Limited
Description: resins. Overtec 5 FR has excellent chemical resistance and thermal durability, with an upper heat resistance of 135c, and a lower temperature flexibility of -35c. Overtec 5FR has good chemical and water resistance, in addition to excellent electrical resistance and dielectric strength. The
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Supplier: DuPont Electronics & Imaging
Description: high frequency flexible circuit applications. Its use in flex interconnect applications provide exceptional electrical performance. Copper Clad Features: Certified to IPC 4203A/13 Available in dielectric thicknesses of 2, 3, and 4 mils Available in copper thicknesses of 12, 18 and 35 microns
- Dielectric Constant (Relative Permittivity): 2.3 to 2.6
- Water Absorption: 0.3 %
- Features: Electrically Insulating / Dielectric, Electronics, Encapsulating / Potting, Film / Sheet, Specialty / Other
- Industry: OEM / Industrial
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Supplier: MacDermid Alpha Electronics Solutions
Description: marine, automotive, or aerospace applications. Excellent Electrical Properties Low Dielectric Constant Excellent Resistance to Sea Water Very Low Viscosity Tough and Tear Resistant Low Water Absorption Excellent Oxidation Resistance Excellent Adhesion
- Industry: Aerospace, Automotive, Semiconductors / IC Packaging
- Features: Electronics, Encapsulating / Potting, Marine
- Chemical System: Polyurethane (PU, PUR)
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Supplier: DuPont Electronics & Imaging
Description: reliability System Features: >225°C IPC service temperature Excellent thermal resistance UL 94V-0 Low loss characteristics Excellent punching and drilling performance Excellent dielectric thickness tolerance/electrical performance High adhesion Halogen-free Low outgassing
- Use Temperature: 437 F
- Coeff. of Thermal Expansion (CTE): 36.11111111111111 µin/in-F
- Tensile Strength (Break): 23,931.0784939375 psi
- Elongation: 170 %
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Supplier: Allied Electronics, Inc.
Description: Environmental Specifications. Inductance: Measured at 1 V with no DC current. Current Rating: Maximum continuous operating current (DC or RMS) based on 50°C temperature rise. Dielectric Rating: 2500 VRMS, 60 Hz, applied for one minute between winding and outer circumference to within 0.250"
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Flashover inhibition by encapsulation
Therefore, for low dielectric constant encapsulants (< lo), s i q l e multi-stage electrostatic accelerators can be constructed with f i e l d distribu- tions that are consistent with the requirements for aperture focusing [3].
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NANO materials and composites for electronic and photo packaging
These include the use of polymers as adhesives (both conductive and non- conductive), interlayer dielectrics (low-k, low loss dielectrics ), encapsulants (discrete and wafer level packaging), embedded passives (high-k and high-Q materials), superhydrophobic self- cleaning lotus effect surfaces, etc.
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Nanocomposite for Advanced Packaging of Microelectronics
These include the use of polymers as adhesives (both conductive and non- conductive), interlayer dielectrics (low-k, low loss dielectrics ), encapsulants (discrete and wafer level packaging), embedded passives (high-k and high-Q materials), superhydrophobic self-cleaning lotus effect surfaces, and …
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Characterization of Parylene-N as Flexible Substrate and Passivation Layer for Microwave and Millimeter-Wave Integrated Circuits
Passivation layers used as encapsulants should have low loss and low dielectric constant in order to minimize the impact on the RF performance of the encapsulated circuits.
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Finite
element modeling of syntactic foam
RSF encapsulants with low thermal expansion coeffi- cients and high dielectric strengths are used to isolate electronic boards within metal enclosures for protection from shock, vibration, moisture, thermal and electrical environments.
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Power Electronics for Renewable and Distributed Energy Systems
Components: Magnetics, dielectrics , conductors, encapsulants Thermal Characteristics: Low energy loss density, required low heat extraction .
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Thermal stress analysis of tape automated bonding packages and interconnections
4)Encapsulants: New materials providing a higher glass transition temperature, lower coefficients of thermal expan- sion, void-free curing, and low dielectric constant should be synthesized and developed for TAB encapsulants .
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Recent advances on nano-materials for advanced packaging applications
… use of polymers as: resists (for deep submicron lithography), adhesives (both conductive and non conductive for die attach and assembly interconnects), interlayer dielectrics (low k, low loss dielectrics for high speed and low loss signal transmission), encapsulants (discrete and wafer level …
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[Front matter]
… use of polymers as: resists( for deep submicron lithography), adhesives (both conductive and non conductive for die attach and assembly interconnects), interlayer dielectrics(low k, low loss dielectrics for high speed and low loss signal transmission), encapsulants (discrete and wafer level …
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Plenary speech
… use of polymers as: resist ( for deep submicron lithography), adhesives (both conductive and non conductive for die attach and assembly interconnects), interlayer dielectrics(low k, low loss dielectrics for high speed and low loss signal transmission), encapsulants (discrete and wafer level …