Low Dielectric Encapsulants

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  • Flashover inhibition by encapsulation
    Therefore, for low dielectric constant encapsulants (< lo), s i q l e multi-stage electrostatic accelerators can be constructed with f i e l d distribu- tions that are consistent with the requirements for aperture focusing [3].
  • NANO materials and composites for electronic and photo packaging
    These include the use of polymers as adhesives (both conductive and non- conductive), interlayer dielectrics (low-k, low loss dielectrics ), encapsulants (discrete and wafer level packaging), embedded passives (high-k and high-Q materials), superhydrophobic self- cleaning lotus effect surfaces, etc.
  • Nanocomposite for Advanced Packaging of Microelectronics
    These include the use of polymers as adhesives (both conductive and non- conductive), interlayer dielectrics (low-k, low loss dielectrics ), encapsulants (discrete and wafer level packaging), embedded passives (high-k and high-Q materials), superhydrophobic self-cleaning lotus effect surfaces, and …
  • Characterization of Parylene-N as Flexible Substrate and Passivation Layer for Microwave and Millimeter-Wave Integrated Circuits
    Passivation layers used as encapsulants should have low loss and low dielectric constant in order to minimize the impact on the RF performance of the encapsulated circuits.
  • Finite element modeling of syntactic foam
    RSF encapsulants with low thermal expansion coeffi- cients and high dielectric strengths are used to isolate electronic boards within metal enclosures for protection from shock, vibration, moisture, thermal and electrical environments.
  • Power Electronics for Renewable and Distributed Energy Systems
    Components: Magnetics, dielectrics , conductors, encapsulants Thermal Characteristics: Low energy loss density, required low heat extraction .
  • Thermal stress analysis of tape automated bonding packages and interconnections
    4)Encapsulants: New materials providing a higher glass transition temperature, lower coefficients of thermal expan- sion, void-free curing, and low dielectric constant should be synthesized and developed for TAB encapsulants .
  • Recent advances on nano-materials for advanced packaging applications
    … use of polymers as: resists (for deep submicron lithography), adhesives (both conductive and non conductive for die attach and assembly interconnects), interlayer dielectrics (low k, low loss dielectrics for high speed and low loss signal transmission), encapsulants (discrete and wafer level …
  • [Front matter]
    … use of polymers as: resists( for deep submicron lithography), adhesives (both conductive and non conductive for die attach and assembly interconnects), interlayer dielectrics(low k, low loss dielectrics for high speed and low loss signal transmission), encapsulants (discrete and wafer level …
  • Plenary speech
    … use of polymers as: resist ( for deep submicron lithography), adhesives (both conductive and non conductive for die attach and assembly interconnects), interlayer dielectrics(low k, low loss dielectrics for high speed and low loss signal transmission), encapsulants (discrete and wafer level …