Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: ACCRAbond, Inc.
Description: INSTAbond® 808 A two-component general purpose potting compound for electrical components. Properties include enhancement of mecahnical strength, low dielectrics, vibration and shock resistance of assembled components.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
-
Supplier: Epoxies Etc...
Description: 20-2365 is a new low viscosity polyurethane designed for low stress on sensitive components during and after cure. This filled polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. 20-2365 has
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 90 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
-
Supplier: Epoxies Etc...
Description: 20-3205 is a two part room temperature curing epoxy system. It provides a low mixed viscosity and excellent electrical insulation properties.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
-
-
Supplier: Epoxies Etc...
Description: 20-3006 is a unique two component, electronic grade, flexible epoxy potting compound. This system was engineered to provide electrical insulation, chemical protection, and thermal shock resistance. The flexibility of 20-3006 provides low stress on surface mount and other
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
-
Supplier: Hapco, Inc.
Description: Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds.
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 1.67 to 1.73
- Dielectric Strength: 390 kV/in
-
Supplier: Epoxies Etc...
Description: 20-2353 is a low durometer (Shore A 50) potting, casting, and encapsulating compound. This twopart system is engineered to provide low stress on electronic components and to resist moisture. 20- 2353 provides excellent hydrolytic stability, low moisture
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 127 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
-
Supplier: Hapco, Inc.
Description: A tough, REPAIRABLE, shock resistant potting compound for short and long run productions. DI-PAK E-4568 has excellent insulating properties, a very low moisture vapor transmission rate, can be operated from -60°C to +100°C, and performs in both wet and dry environments. It can
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 1.3
- Dielectric Strength: 710 kV/in
-
Supplier: Techsil Limited
Description: Offers self-adhesion properties Non-corrosive to metals and sensitive substrates No cure-by products Low linear shrinkage Outstanding performance over a wide thermal range Technical Properties Uncured Consistency: Flowable self-levelling Colour: White Cured Shore Hardness: 12 Shore A
- Chemical / Polymer System Type: Silicone
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
-
Supplier: Techsil Limited
Description: RTV615 is crystal clear potting silicone from Momentive Performance materials which is widely known for its optical clarity benefits. Ideal for evaluation in applications such as potting solar cells for maximum light transmission and on electronic assemblies where component
- Chemical / Polymer System Type: Silicone
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
- Use Temperature: -60 to 204 F
-
Supplier: Techsil Limited
Description: TSE3331 is a two part, heat curing silicone from Momentive Performance Materials designed for potting and encapsulation where flammability and/or thermal conductivity is of concern. It provides excellent flame retardant properties and very stable dielectric properties over a broad
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermal Compound / Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
-
Supplier: Hapco, Inc.
Description: Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 4.1 to 4.4
- Dielectric Strength: 400 kV/in
-
Supplier: Hapco, Inc.
Description: Shore 90-95 A, elastomeric coatings that have been specifically designed to reproduce exact surface details. DI-COAT E-4599 is excellent for electrical insulation applications requiring non or low sag materials. DI-COAT E-4599 are formulated to withstand high wear continuous service.
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 2.6 to 2.7
- Dielectric Strength: 350 kV/in
-
Encapsulants and Potting Compounds - Momentive RTV627 Grey Potting Silicone 2lb / 908gm -- MOSI17149Supplier: Techsil Limited
Description: RTV627 is a two part silicone rubber compound from Momentive Performance Materials designed for potting and encapsulation applications. It is especially favoured where flammability is of concern. Supplied in a matched kit which is designed for use at a 1:1 ratio by weight or volume
- Chemical / Polymer System Type: Silicone
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
-
Supplier: Master Bond, Inc.
Description: Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient of thermal expansion.
- Applied Thickness / Gap Fill: 0.0030 to 0.0060 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 7.22E6 to 8.89E6 µin/in-F
- Composition: Unfilled
-
Supplier: CHT USA Inc.
Description: CHT's QSil 216 is a 2-part, platinum cure, optically clear silicone encapsulant designed for optical applications. QSil 216 features a 10:1 mix ratio by weight and its low viscosity profile enables excellent flow around components and is excellent for potting complex parts. The
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Two Component System, Specialty / Other
- Dielectric Strength: 500 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
-
Supplier: CHT USA Inc.
Description: CHT's QSil 223 is a 2-part, platinum cure, optically clear silicone encapsulant and is designed for optical applications. It features a convenient 1:1 mix ratio by weight and its low viscosity profile enables excellent flow around components and is ideal for potting complex parts. The
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Two Component System, Specialty / Other
- Dielectric Strength: 500 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
-
Supplier: Dupont Molykote
Description: Silicone-based compound, heavy consistency APPLICATIONS Lubrication for control and pressure plug valves, water softener and faucet valves. Sealant for vacuum and pressure systems. Sealant for outdoor equipment (also shipboard) subject to washing and
- Applications: Automotive / Transportation, Electrical / Electronic, Marine, Food Grade / Contact (FDA H1)
- Chemistry / Constituents: Silicone, Synthetic / Semi-synthetic
- Density / Specific Gravity (@15.6°C, 60°F): 1 specific gravity
- Dielectric Strength: 1.77E7 V/m
-
Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C,
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Single Component System
- Dielectric Strength: 533 kV/in
-
Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 925 is a high purity, one-component addition curing RTV-2 silicone gel. Special features Low ion content Low volatile content Low viscosity Good mechanical damping properties Application SEMICOSIL® 925 is a
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System
- Dielectric Constant (Relative Permittivity): 2.5
-
Supplier: Ellsworth Adhesives
Description: Dow SYLGARD™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. 0.9 kg Kit.
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Two Component System
- Dielectric Strength: 425 kV/in
-
Supplier: Ellsworth Adhesives
Description: Dow SYLGARD™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. Part B, 18.1 kg Pail.
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Two Component System
- Dielectric Strength: 425 kV/in
-
Supplier: Ellsworth Adhesives
Description: Dow SYLGARD™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. 7.2 kg Kit.
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Two Component System
- Dielectric Strength: 425 kV/in
-
Supplier: Wacker Chemical Corp.
Description: low viscosity modular system allows flexible adjustment of pot life and curing time by selection among different catalysts (no lot binding between base and catalyst) fast curing at room temperature with Catalyst PT-F long pot life at room temperature with Catalyst PT
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: UV / Radiation Cured (also EB, Light), Two Component System
- Dielectric Constant (Relative Permittivity): 2.7
-
Supplier: Master Bond, Inc.
Description: Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting.
- Applied Thickness / Gap Fill: 0.0030 to 0.0060 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 3.89E7 to 4.44E7 µin/in-F
- Composition: Unfilled
-
Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 911 A/B is a pourable, addition-curing, two-part silicone rubber that cures to a soft silicone gel. Special features two-part, 1 : 1 mixing ratio thixotropic rapid heat cure forms a soft gel on vulcanization low content of
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
-
Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 924 is a pourable,thermally curable, addition-curing one-part silicone rubber that cures to a very soft silicone gel. Special features one-part, ready-to-use thixotropic flow forms a soft gel on vulcanization low content of volatiles
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
-
Supplier: Master Bond, Inc.
Description: Master Bond Supreme 112 is a two part epoxy for bonding, sealing, potting, and impregnation applications with a high glass transition temperature of 190-195°C and very low viscosity.
- Applied Thickness / Gap Fill: 0.0030 to 0.0050 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
-
Supplier: DuPont Electronics & Imaging
Description: polyimide film for high speed digital and high frequency flexible circuit applications. Its use in flex interconnect applications provide exceptional electrical performance. Copper Clad Features: Certified to IPC 4203A/13 Available in dielectric thicknesses of 2, 3, and
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Electrical Insulation / Dielectric
- Dielectric Constant (Relative Permittivity): 2.3 to 2.6
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
-
Supplier: Sauereisen, Inc.
Description: Sauereisen Low Expansion Cement No. 29 is an inorganic cement used for embedding heating elements, insulating thermocouples, coating resistors and coils, and mechanically sealing parts where high resistance to electricity, chemicals and thermal shock is required. A strong resistance to
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 4.6 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
-
Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30HV is a low viscosity, two component epoxy system for high performance bonding, sealing, coating and casting. It is formulated to cure at room temperature or more rapidly at elevated temperatures. It has an easy to use, non-critical 4 to 1 mix ratio by weight.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
-
Supplier: Henkel Corporation - Industrial
Description: and low temperature cure Sag resistant paste Resilient Long pot life Flexible epoxy Excellent chemical and humidy resistance Non-conductive
- Compound Type: Electrical Insulation / Dielectric
- Viscosity: 9500 cP
-
Supplier: Protavic America, Inc.
Description: The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit boards. When applied in thin layers, < 0.01� it acts as an adhesive and provides excellent thermal contact between dissimilar
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
-
Supplier: RS Components, Ltd.
Description: Two part epoxy resin potting and encapsulating compound supplied in handy 250g duo-sachet pack for easy mixing and pouring with no mess. Fast curing, low viscosity epoxy resin for RF applications. The cured product is tough and exhibits good adhesion to a variety of substrates.
- Form / Function: Specialty / Other, Encapsulant / Potting Compound
- Use Temperature: -58 to 302 F
-
Supplier: Henkel Corporation - Electronics
Description: encapsulation, excellent adhesion performance to a variety of substrates, excellent resistance to a variety of environmental stimuli, low viscosity, high dielectric strength and improved flexibility at low temperatures. These naturally occurring raw materials maintain a wide
- Chemical / Polymer System Type: Polyamide
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermoplastic / Hot Melt
- Dielectric Strength: 1530 kV/in
-
Supplier: MacDermid Alpha Electronics Solutions
Description: for marine electronic devices. Additionally, its low water absorption allows for potential use both above and below the surface. Specialized fillers maintain a low dielectric constant, making it perfect for sensors. UR5118 is an excellent choice for applications subject to radio
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Form / Function: Encapsulant / Potting Compound
- Industry Applications: Aerospace, Automotive
Find Suppliers by Category Top
Featured Products Top
-
-component polyurethanes that assure consistent cure and performance even in small “shot-size” potting applications (Bectron® PK materials). Dielectric gels that provide outstanding electronic protection with very low stress on (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
Master Bond EP30LP-2 is an optically clear epoxy with superb light transmission properties. This low viscosity, electrical insulator also features outstanding dimensional stability. Featuring easy handling, this compound has a convenient two to one mix ratio by weight or (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
MG Chemicals 832FXC is a clear, flexible epoxy potting compound designed to minimize physical stress on delicate components. Ideal for low-temperature, arctic, or temperature-cycling environments, it maintains flexibility and stability through rapid thermal changes. Its transparency allows easy (read more)
Browse Industrial Enclosures Datasheets for New Yorker Electronics Co., Inc. -
product line consists of advanced adhesives, sealants, coatings, potting/encapsulation compounds and impregnation resins. Each compound is designed to meet specific application needs and requirements. Master Bond manufactures over 3,000 grades of specially designed formulations. We also offer replacements for competitors’ discontinued products. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
QSil-553 2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to (read more)
Browse Conductive Compounds Datasheets for CHT USA Inc. -
reliability is crucial. The material’s dielectric features include a low dielectric constant and a low loss tangent. These features reduce signal loss and promote clean RF transmission. It prevents unwanted energy loss and interference, helping to keep systems stable. This (read more)
Browse Electrical Insulation and Dielectric Materials Datasheets for General Plastics Manufacturing Co. -
dielectric properties. For power management systems, which are critical to the operation and safety of EVs, our potting materials provide robust encapsulation that safeguards against thermal cycling, vibration, and electrical interference. This ensures long-term reliability, even in the harshest (read more)
Browse Conformal Coatings Datasheets for ELANTAS North America LLC -
sections. This silicone has excellent flexibility, with an elongation of 150-250% at room temperature, a Shore A hardness of 35-45 and a low tensile modulus of 100-175 psi at 75°F for stress relief. It is capable of withstanding rigorous thermal cycling and shock without cracking or exerting stress on components. Additionally, MasterSil 323 has a low dielectric constant of 2.8 at 75°F, 1 MHz. (read more)
Browse Silicone Adhesives and Sealants Datasheets for Master Bond, Inc. -
from harsh conditions such as humidity, extreme temperatures, mechanical loads, vibration and corrosive chemicals. The ELANTAS family of conformal coatings, potting resins and encapsulants is specially formulated to provide optimum protection and (read more)
Browse Electrical and Electronic Resins Datasheets for ELANTAS North America LLC -
coatings (VOC-free; urethane, epoxy, silicone) Potting and encapsulation compounds (filled and unfilled; urethane, epoxy, silicone) Follow us on: (read more)
Browse Conformal Coatings Datasheets for ELANTAS North America LLC
Conduct Research Top
-
Dielectric Materials for Use in Radomes
low dielectric constants, useful in radio and microwave frequencies. This makes them ideal for applications such as in conformal antennas, where the material must be applied around a radius. Microelectronics - Non-foamed polyurethanes are often used as "potting compounds" in electronics, where
More Information Top
Indicates content that may require registration and/or purchase.
-
The uosatmma and u.h.f. data beacons and antenna system
The inner conductors of the cables were then soldered and, before assembly of the junction, a thin layer of low -loss dielectric potting compound was applied to the PTFE insert to ensure proper support.
-
Filter design for modern communication systems
Fig 18 illustrates the best method for providing immunity from mechanical perturbations, and it shows a filter empty and also filled with a potting compound that has low loss and a low dielectric constant, consists essentially of air-cells and works …
-
A MINIATURE BROAD‐BAND ELECTRIC FIELD PROBE
In an effort to further reduce the probe’s interaction with the fields under study, materials of lower dielectric constant will be used for the probe substrate and the potting compound in an attempt to more closely match the probe to free …
-
The Mechanical and Electrical Properties of Polymers:An Elementary Molecular Approach
It is generally undersirable to throw away electrical energy as heat in electronic circuits, and materials where the dielectric loss factor is very low are therefore much sought after as materials for capacitor dielectrics , potting compounds , wire insulation, and the like.
-
Reliable Electronics Through Protective Coating Techniques
Since this was a part of the antenna system, it was further required that any potting compound used in this package have an extremely low -loss characteristic with a dielectric constant approaching that of air.
-
Journal of Spacecraft and Rockets > Thermodielectric radiometer.
Potting the film with a dielec- tric compound is necessary if the detector is to be used at low ambient pressures where shorting due to the ionization might occur.
-
Prevention of Electrical Breakdown in Spacecraft
Gas pockets in insulation, in potting compounds , or conformal coatings are particularly hazardous because the boundary between a solid dielectric and a gas of lower dielectric constant gives rise to an increase in electrical stress on the gas.
-
CR4 - Thread: High Voltage Potting Compounds and Related Machines
There are special low degassing potting compounds and you can also encapsulate and get the entire circuit welded in SS Case or other copper case leaving only exit points through ceramic high dielectric strength feed through.
-
Ferric Hydrogensulfate Catalysed Schmidt Reaction of Ketones to Amides under Solvent‐Free Conditions
tion1 involves the one- pot reaction of hydrogen azide with electrophiles, such as carbonyl compounds in benzene con- taining an excess amount of strong acids … … inorganic azides, which are poorly soluble in organic solvents with low dielectric constants, causes an increase …