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Supplier: ACCRAbond, Inc.
Description: INSTAbond® 808 A two-component general purpose potting compound for electrical components. Properties include enhancement of mecahnical strength, low dielectrics, vibration and shock resistance of assembled components.
- Features: Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: Epoxies Etc...
Description: 20-3205 is a two part room temperature curing epoxy system. It provides a low mixed viscosity and excellent electrical insulation properties.
- Thermal Conductivity: 0.37499254 W/m-K
- Dielectric Strength: 454.99999999999955 kV/in
- Dielectric Constant (Relative Permittivity): 4.3
- Viscosity: 30 to 20,000 cP
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Supplier: Epoxies Etc...
Description: 20-2365 is a new low viscosity polyurethane designed for low stress on sensitive components during and after cure. This filled polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. 20-2365 has
- Viscosity: 150 to 6,000 cP
- Use Temperature: -85 to 275 F
- Thermal Conductivity: 0.50479765 W/m-K
- Coeff. of Thermal Expansion (CTE): 90 µin/in-F
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Supplier: Epoxies Etc...
Description: 10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding
- Viscosity: 800 to 2,000 cP
- Use Temperature: -58 to 302 F
- Thermal Conductivity: 0.4326837 W/m-K
- Tensile Strength (Break): 10,500 psi
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Encapsulants and Potting Compounds - Thermally conductive polyurethane potting compound -- 50-2368FRSupplier: Epoxies Etc...
Description: 50-2368 FR is a thermally conductive polyurethane potting compound. This is a faster gelling version of 50-2366 FR. 50-2368 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. This system
- Viscosity: 150 to 17,000 cP
- Use Temperature: -85 to 275 F
- Thermal Conductivity: 1.1538232 W/m-K
- Tensile Strength (Break): 2,200 psi
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Supplier: CHT USA Inc.
Description: CHT's QSil 216 is a 2-part, platinum cure, optically clear silicone encapsulant designed for optical applications. QSil 216 features a 10:1 mix ratio by weight and its low viscosity profile enables excellent flow around components and is excellent for potting complex parts. The
- Use Temperature: -67 to 399.2 F
- Thermal Conductivity: 0.18 W/m-K
- Elongation: 100 %
- Tensile Strength (Break): 749.8404594767085 psi
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Supplier: Master Bond, Inc.
Description: Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient of thermal expansion.
- Applied Thickness / Gap Fill: 0.003 to 0.006 inch
- Viscosity: 40,000 to 80,000 cP
- Use Temperature: -100 to 400 F
- Coeff. of Thermal Expansion (CTE): 7,222,222.222222222 to 8,888,888.888888888 µin/in-F
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Supplier: CHT USA Inc.
Description: CHT's QSil 223 is a 2-part, platinum cure, optically clear silicone encapsulant and is designed for optical applications. It features a convenient 1:1 mix ratio by weight and its low viscosity profile enables excellent flow around components and is ideal for potting complex parts. The
- Use Temperature: -67 to 399.2 F
- Thermal Conductivity: 0.18 W/m-K
- Dielectric Strength: 500.00000000000006 kV/in
- Index of Refraction: 1.405
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Supplier: Hapco, Inc.
Description: Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds.
- Use Temperature: 176 F
- Thermal Conductivity: 0.21634185 W/m-K
- Elongation: 41 %
- Tensile Strength (Break): 460 psi
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C,
- Viscosity: 690 cP
- Dielectric Strength: 533 kV/in
- Features: Electrical Insulation / Dielectric Material, Encapsulating / Potting
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Techsil Limited
Description: TSE3331 is a two part, heat curing silicone from Momentive Performance Materials designed for potting and encapsulation where flammability and/or thermal conductivity is of concern. It provides excellent flame retardant properties and very stable dielectric properties over a broad
- Use Temperature: -55 to 200 F
- Industry: Electronics
- Features: Encapsulating / Potting, Rubber Based / Elastomeric, Thermal Compound / Heat Conductive
- Chemical System: Silicone
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Supplier: Hapco, Inc.
Description: Shore 90-95 A, elastomeric coatings that have been specifically designed to reproduce exact surface details. DI-COAT E-4599 is excellent for electrical insulation applications requiring non or low sag materials. DI-COAT E-4599 are formulated to withstand high wear continuous service.
- Use Temperature: 194 F
- Elongation: 325 %
- Tensile Strength (Break): 2,500 psi
- Dielectric Strength: 350.0000000000002 kV/in
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Supplier: Dupont Molykote
Description: plastic O-rings, gaskets and seals. FEATURES Wide service temperature range (-40°C/-40°F to 200°C/392°F) Excellent water resistance Compatible with many plastics and elastomers Low vapor pressure Low volatility Meets several global standards for water contact
- Operating / Use Temperature: -40 to 399.2 F
- Dielectric Strength: 17,716,535.4330708 V/m
- Density / Specific Gravity (@15.6°C, 60°F): 1 specific gravity
- Industry Applications: Automotive / Transportation, Electrical / Electronic, Food Grade / Contact (FDA H1), Marine
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 925 is a high purity, one-component addition curing RTV-2 silicone gel. Special features Low ion content Low volatile content Low viscosity Good mechanical damping properties Application SEMICOSIL® 925 is a dielectric gel especially designed to seal, protect
- Viscosity: 700 cP
- Dielectric Strength: 558.8000000000012 kV/in
- Dielectric Constant (Relative Permittivity): 2.5
- Features: Electrical Insulation / Dielectric Material, Encapsulating / Potting Compound, Flexible / Dampening, Liquid
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Supplier: Techsil Limited
Description: RTV615 is crystal clear potting silicone from Momentive Performance materials which is widely known for its optical clarity benefits. Ideal for evaluation in applications such as potting solar cells for maximum light transmission and on electronic assemblies where component
- Use Temperature: -60 to 204 F
- Features: Encapsulating / Potting, Rubber Based / Elastomeric
- Industry: Medical / Food (Sanitary / FDA)
- Chemical System: Silicone
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Supplier: Techsil Limited
Description: Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of
- Use Temperature: -54 to 260 F
- Industry: Electronics
- Features: Encapsulating / Potting, Rubber Based / Elastomeric
- Chemical System: Silicone
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Supplier: Techsil Limited
Description: RTV627 is a two part silicone rubber compound from Momentive Performance Materials designed for potting and encapsulation applications. It is especially favoured where flammability is of concern. Supplied in a matched kit which is designed for use at a 1:1 ratio by weight or volume.
- Use Temperature: -60 to 204 F
- Industry: Electronics
- Features: Encapsulating / Potting, Rubber Based / Elastomeric
- Chemical System: Silicone
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Supplier: Master Bond, Inc.
Description: chemical resistance, which is an unusual blend of properties. EP41S-LO is certified to meet ASTM E595 for NASA low outgassing specifications. This lower viscosity system has a 100 to 20 non-critical mix ratio by weight. It sets up quickly after mixing and typically can be removed from a
- Viscosity: 3,000 to 15,000 cP
- Use Temperature: -60 to 250 F
- Tensile Strength (Break): 300,000 to 350,000 psi
- Industry: Aerospace, Electrical Power / HV, Electronics, OEM / Industrial, Photonics / Optoelectronics, Semiconductors / IC Packaging
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Supplier: Master Bond, Inc.
Description: Master Bond Supreme 112 is a two part epoxy for bonding, sealing, potting, and impregnation applications with a high glass transition temperature of 190-195°C and very low viscosity.
- Applied Thickness / Gap Fill: 0.003 to 0.005 inch
- Viscosity: 50 to 200 cP
- Use Temperature: -80 to 550 F
- Tensile Strength (Break): 11,000 to 12,000 psi
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Supplier: Ellsworth Adhesives
Description: Dow SYLGARD™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. 0.9 kg Kit.
- Viscosity: 465 cP
- Dielectric Strength: 425.00000000000006 kV/in
- Features: Electrical Insulation / Dielectric Material, Encapsulating / Potting
- Industry: Electronics
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ Q3-6575 Dielectric Gel Clear is a two component, heat curing, low temperature, silicone gel that is used for protecting and sealing electronic devices from high voltages, moisture, mechanical and thermal shock. 1:1 mix ratio by weight or volume. 0.9 kg Kit.This is a Dow
- Viscosity: 750 cP
- Dielectric Strength: 457.20000000000095 kV/in
- Features: Electrical Insulation / Dielectric Material, Encapsulating / Potting
- Chemical System: Silicone
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Supplier: Master Bond, Inc.
Description: Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting.
- Applied Thickness / Gap Fill: 0.003 to 0.006 inch
- Viscosity: 800 to 1,200 cP
- Use Temperature: -452.47 to 250 F
- Coeff. of Thermal Expansion (CTE): 38,888,888.88888889 to 44,444,444.44444444 µin/in-F
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Supplier: Ellsworth Adhesives
Description: Dow SYLGARD™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. 7.2 kg Kit.
- Viscosity: 465 cP
- Dielectric Strength: 425.00000000000006 kV/in
- Features: Electrical Insulation / Dielectric Material, Encapsulating / Potting
- Industry: Electronics
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Supplier: Sauereisen, Inc.
Description: Sauereisen Low Expansion Cement No. 29 is an inorganic cement used for embedding heating elements, insulating thermocouples, coating resistors and coils, and mechanically sealing parts where high resistance to electricity, chemicals and thermal shock is required. A strong resistance to
- Use Temperature: 1,550 F
- Thermal Conductivity: 1.1538232 W/m-K
- Coeff. of Thermal Expansion (CTE): 4.6 µin/in-F
- Tensile Strength (Break): 425 psi
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Supplier: Dymax
Description: has a low dielectric constant for high-frequency applications. This encapsulating material may be used in attaching FPCs to various substrates including PCB and glass. Dymax materials have no solvents added and cure upon exposure to light. Their ability to cure in seconds results in
- Viscosity: 4,500 cP
- Features: Encapsulant / Potting Compound, Other
- Cure / Technology: UV / Radiation Cured (also EB, Light)
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Supplier: Sauereisen, Inc.
Description: Sauereisen Electric Insulating Cement No. 12 is an inorganic cement used for applications requiring high dielectric strength and volume resistivity through 2200oF. No. 12 offers low shrinkage and coefficient of thermal expansion making it an excellent cement for bonding or
- Use Temperature: 2,200 F
- Thermal Conductivity: 1.26920552 to 1.5865069 W/m-K
- Coeff. of Thermal Expansion (CTE): 3.1 µin/in-F
- Tensile Strength (Break): 290 psi
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST ES 2510, Epoxy, Dielectric Grade, Encapsulant and Potting LOCTITE® STYCAST ES 2510 is a dielectric grade epoxy encapsulant designed for general purpose applications. It is suitable for potting and encapsulating electrical devices that require flame
- Coeff. of Thermal Expansion (CTE): 35.55555555555556 µin/in-F
- Viscosity: 4,700 cP
- Chemical System: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: Henkel Corporation - Electronics
Description: excellent adhesion performance to a variety of substrates, excellent resistance to a variety of environmental stimuli, low viscosity, high dielectric strength and improved flexibility at low temperatures. These naturally occurring raw materials maintain a wide operating
- Use Temperature: -40 to 284 F
- Elongation: 600 %
- Water Absorption: 0.4 %
- Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Henkel Corporation - Electronics
Description: excellent adhesion performance to a variety of substrates, excellent resistance to a variety of environmental stimuli, low viscosity, high dielectric strength and improved flexibility at low temperatures. These naturally occurring raw materials maintain a wide operating
- Use Temperature: -40 to 302 F
- Elongation: 600 %
- Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Features: Electronics, Encapsulant / Potting Compound, Pellets / Solid Form, UL Approved
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Supplier: Henkel Corporation - Electronics
Description: excellent adhesion performance to a variety of substrates, excellent resistance to a variety of environmental stimuli, low viscosity, high dielectric strength and improved flexibility at low temperatures. These naturally occurring raw materials maintain a wide operating
- Use Temperature: -40 to 257 F
- Elongation: 400 %
- Dielectric Strength: 609.6000000000013 kV/in
- Dielectric Constant (Relative Permittivity): 2.6 to 3.8
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Supplier: Henkel Corporation - Electronics
Description: excellent adhesion performance to a variety of substrates, excellent resistance to a variety of environmental stimuli, low viscosity, high dielectric strength and improved flexibility at low temperatures. These naturally occurring raw materials maintain a wide operating
- Use Temperature: -13 to 257 F
- Elongation: 600 %
- Dielectric Strength: 1,529.9999999999995 kV/in
- Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: MacDermid Alpha Electronics Solutions
Description: marine, automotive, or aerospace applications. Excellent Electrical Properties Low Dielectric Constant Excellent Resistance to Sea Water Very Low Viscosity Tough and Tear Resistant Low Water Absorption Excellent Oxidation Resistance Excellent Adhesion
- Industry: Aerospace, Automotive, Semiconductors / IC Packaging
- Features: Electronics, Encapsulating / Potting, Marine
- Chemical System: Polyurethane (PU, PUR)
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Supplier: DuPont Electronics & Imaging
Description: high frequency flexible circuit applications. Its use in flex interconnect applications provide exceptional electrical performance. Copper Clad Features: Certified to IPC 4203A/13 Available in dielectric thicknesses of 2, 3, and 4 mils Available in copper thicknesses of 12, 18 and 35 microns
- Dielectric Constant (Relative Permittivity): 2.3 to 2.6
- Water Absorption: 0.3 %
- Features: Electrically Insulating / Dielectric, Encapsulating / Potting, Film / Sheet, Specialty / Other
- Industry: Electronics, OEM / Industrial
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Supplier: DuPont Electronics & Imaging
Description: reliability System Features: >225°C IPC service temperature Excellent thermal resistance UL 94V-0 Low loss characteristics Excellent punching and drilling performance Excellent dielectric thickness tolerance/electrical performance High adhesion Halogen-free Low outgassing
- Use Temperature: 437 F
- Coeff. of Thermal Expansion (CTE): 36.11111111111111 µin/in-F
- Tensile Strength (Break): 23,931.0784939375 psi
- Elongation: 170 %
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Supplier: Bluestar Silicones USA Corp.
Description: "Elastomer - RTV 2 - polyaddition heat curing - High optical clarity Solventless, Very low viscosity, Quick curing, Long potlife, Good thermal resistance, Excellent dielectric performances " Properties Viscosity 4000 Hardness Sha 52 Description Potting of electronic,
- Thermal Conductivity: 0.16 W/m-K
- Tensile Strength (Break): 899.228404014621 psi
- Elongation: 115 %
- Viscosity: 750 to 4,000 cP
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Featured Products Top
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-component polyurethanes that assure consistent cure and performance even in small “shot-size” potting applications (Bectron® PK materials). Dielectric gels that provide outstanding electronic protection with very low stress on (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
Master Bond EP30LP-2 is an optically clear epoxy with superb light transmission properties. This low viscosity, electrical insulator also features outstanding dimensional stability. Featuring easy handling, this compound has a convenient two to one mix ratio by weight or (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
product line consists of advanced adhesives, sealants, coatings, potting/encapsulation compounds and impregnation resins. Each compound is designed to meet specific application needs and requirements. Master Bond manufactures over 3,000 grades of specially designed formulations. We also offer replacements for competitors’ discontinued products. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
MG Chemicals 832FXC is a clear, flexible epoxy potting compound designed to minimize physical stress on delicate components. Ideal for low-temperature, arctic, or temperature-cycling environments, it maintains flexibility and stability through rapid thermal changes. Its transparency allows easy (read more)
Browse Industrial Enclosures Datasheets for New Yorker Electronics Co., Inc. -
QSil-553 2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to (read more)
Browse Conductive Compounds Datasheets for CHT USA Inc. -
reliability is crucial. The material’s dielectric features include a low dielectric constant and a low loss tangent. These features reduce signal loss and promote clean RF transmission. It prevents unwanted energy loss and interference, helping to keep systems stable. This (read more)
Browse Electrical Insulation and Dielectric Materials Datasheets for General Plastics Manufacturing Co. -
dielectric properties. For power management systems, which are critical to the operation and safety of EVs, our potting materials provide robust encapsulation that safeguards against thermal cycling, vibration, and electrical interference. This ensures long-term reliability, even in the harshest (read more)
Browse Conformal Coatings Datasheets for ELANTAS North America LLC -
sections. This silicone has excellent flexibility, with an elongation of 150-250% at room temperature, a Shore A hardness of 35-45 and a low tensile modulus of 100-175 psi at 75°F for stress relief. It is capable of withstanding rigorous thermal cycling and shock without cracking or exerting stress on components. Additionally, MasterSil 323 has a low dielectric constant of 2.8 at 75°F, 1 MHz. (read more)
Browse Silicone Adhesives and Sealants Datasheets for Master Bond, Inc. -
from harsh conditions such as humidity, extreme temperatures, mechanical loads, vibration and corrosive chemicals. The ELANTAS family of conformal coatings, potting resins and encapsulants is specially formulated to provide optimum protection and (read more)
Browse Electrical and Electronic Resins Datasheets for ELANTAS North America LLC -
coatings (VOC-free; urethane, epoxy, silicone) Potting and encapsulation compounds (filled and unfilled; urethane, epoxy, silicone) Follow us on: (read more)
Browse Conformal Coatings Datasheets for ELANTAS North America LLC
Conduct Research Top
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Dielectric Materials for Use in Radomes
low dielectric constants, useful in radio and microwave frequencies. This makes them ideal for applications such as in conformal antennas, where the material must be applied around a radius. Microelectronics - Non-foamed polyurethanes are often used as "potting compounds" in electronics, where
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The uosatmma and u.h.f. data beacons and antenna system
The inner conductors of the cables were then soldered and, before assembly of the junction, a thin layer of low -loss dielectric potting compound was applied to the PTFE insert to ensure proper support.
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Filter design for modern communication systems
Fig 18 illustrates the best method for providing immunity from mechanical perturbations, and it shows a filter empty and also filled with a potting compound that has low loss and a low dielectric constant, consists essentially of air-cells and works …
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A MINIATURE BROAD‐BAND ELECTRIC FIELD PROBE
In an effort to further reduce the probe’s interaction with the fields under study, materials of lower dielectric constant will be used for the probe substrate and the potting compound in an attempt to more closely match the probe to free …
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The Mechanical and Electrical Properties of Polymers:An Elementary Molecular Approach
It is generally undersirable to throw away electrical energy as heat in electronic circuits, and materials where the dielectric loss factor is very low are therefore much sought after as materials for capacitor dielectrics , potting compounds , wire insulation, and the like.
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Reliable Electronics Through Protective Coating Techniques
Since this was a part of the antenna system, it was further required that any potting compound used in this package have an extremely low -loss characteristic with a dielectric constant approaching that of air.
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Journal of Spacecraft and Rockets > Thermodielectric radiometer.
Potting the film with a dielec- tric compound is necessary if the detector is to be used at low ambient pressures where shorting due to the ionization might occur.
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Prevention of Electrical Breakdown in Spacecraft
Gas pockets in insulation, in potting compounds , or conformal coatings are particularly hazardous because the boundary between a solid dielectric and a gas of lower dielectric constant gives rise to an increase in electrical stress on the gas.
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CR4 - Thread: High Voltage Potting Compounds and Related Machines
There are special low degassing potting compounds and you can also encapsulate and get the entire circuit welded in SS Case or other copper case leaving only exit points through ceramic high dielectric strength feed through.
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Ferric Hydrogensulfate Catalysed Schmidt Reaction of Ketones to Amides under Solvent‐Free Conditions
tion1 involves the one- pot reaction of hydrogen azide with electrophiles, such as carbonyl compounds in benzene con- taining an excess amount of strong acids … … inorganic azides, which are poorly soluble in organic solvents with low dielectric constants, causes an increase …