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Supplier: Protavic America, Inc.
Description: Skip cure non conductive epoxy adhesive used for the bonding of microchips on RFID antennas. The rheology of PROTAVIC ANE 10700 has been developed for application by micro-dispenser using automatic machines. It presents a one day pot life at 20-25C, a high reactivity at medium
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 36.11 to 38.89 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Protavic America, Inc.
Description: Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 13.89 µin/in-F
- Composition: Unfilled
- Compound Type: Thermally Conductive
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive LOCTITE® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive offers eight times the thermal conductivity of
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Flexible Thixotropic High viscosity Long work life Easy handling High thermal conductivity Reduced stress
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Material Form: Specialty / Other
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Supplier: Epoxy Technology
Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. ?Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 17.78 to 62.22 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Epoxy Technology
Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. ?Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 32.22 to 154 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Graphene Laboratories, Inc.
Description: Our G6E-TSAL™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials . It is designed to provide efficient heat transfer between components or surfaces, while also providing the
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Graphene Laboratories, Inc.
Description: Our G6E-TSHV™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials . It is designed to provide efficient heat transfer between components or surfaces, while also providing the
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Master Bond, Inc.
Description: Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required.
- Applied Thickness / Gap Fill: 1.00E-3 to 0.0030 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 2.22E7 to 2.50E7 µin/in-F
- Compound Type: Thermally Conductive
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 27, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK 27 adhesive is designed for bonding dissimilar substrates for use in low temperature applications. It is designed to provide strong, resilient bonds even in cryogenic conditions. Please refer to the TDS for
- Cure Type / Technology: Two Component System
- Features: Electrical Insulating / Dielectric
- Industry: Optical Grade / Material
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
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Supplier: Henkel Corporation - Industrial
Description: , jet fuel, alcohol, salts, mild acids and alkalis. LOCTITE ABLESTIK 2116 passes NASA outgassing standards. Non-conductive Solvent-free Good physical strength Room temperature cure Provides environmental resistance Chemical resistant
- Coeff. of Thermal Expansion (CTE): 34.44 µin/in-F
- Cure Type / Technology: Two Component System
- Features: Electrical Insulating / Dielectric
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
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Supplier: Master Bond, Inc.
Description: Toughened, two part epoxy Supreme 11ANHT withstands thermal cycling and is both thermally conductive and electrically insulative.
- Applied Thickness / Gap Fill: 0.0020 to 0.0040 inch
- Coeff. of Thermal Expansion (CTE): 16.67 to 19.44 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 4.8
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 3.06E-5 to 1.22E-4 µin/in-F
- Composition: Unfilled
- Compound Type: Thermally Conductive
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: G6E-FRP™ is a flexible version of our G6E-P™ general purpose epoxy. G6E-FRP™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Techsil Limited
Description: Elecolit® 414 is a single component silver-filled, electrically conductive coating substance that hardens into a flexible, chemical resistant, expandable, non-deformable and friction resistant film. Grey in colour, Elecolit® 414 has a viscosity of 20,000 to 25,000 mPas and when
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Electrically Conductive
- Cure Type / Technology: Thermosetting / Crosslinking
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Master Bond, Inc.
Description: Master Bond EP35AOLV is a two component thermally conductive, electrically isolating epoxy for bonding, sealing and potting. Key features include its good flow properties, high temperature resistance, its ability to withstand aggressive chemicals, and high compressive strength.
- Applied Thickness / Gap Fill: 0.0020 to 0.0030 inch
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.6
- Dissimilar Substrates: Yes
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: G6E-HTNS™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS™ is developed
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Epoxies Etc...
Description: 10-3003 NS is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non critical mix ratio and adjustable flexibility. 10-3003 NS is also very safe to use due to the absence of harmful solvents and toxic chemicals in
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 3.11
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY EP770 is a two-part epoxy material for gap filling. Extremely low viscosity and flowability. Good dispersion and no delamination. The high deformation material, which filling the gap closely, cover the tolerance, and has outstanding conductivity, makes is suitable for filling the
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
- Dielectric Strength: 350 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Techsil Limited
Description: Techsil® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure
- Cure Type / Technology: Two Component System
- Features: Encapsulating / Potting, Flame Retardant (e.g. UL 94 Rated), Thermal / Heat Conductive
- Industry: Electronics
- Substrate / Material Compatibility: Metal, Plastic
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 285 Black, formerly Emerson and Cuming ECCOBOND, is a two component, highly filled, epoxy adhesive paste that is used for applications exposed to cryogenic temperatures and for bonding heat sinks. It offers low coefficient of thermal expansion, low stress, versatility,
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 450 kV/in
- Thermal Conductivity: 1.22 to 1.44 W/m-K
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 45 Clear, formerly Emerson and Cuming ECCOBOND, is a two component, heat curing, unfilled, epoxy adhesive system that is used for general purpose, assembly applications. It offers controlled flexibility, non-conductive properties, and is easy to use. 8 lb Pail.
- Cure Type / Technology: Two Component System
- Dielectric Strength: 356 kV/in
- Substrate / Material Compatibility: Metal, Plastic
- Thermal Conductivity: 0.3500 W/m-K
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Supplier: Epoxies Etc...
Description: 50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 14 µin/in-F
- Composition: Two Component System, Unfilled
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
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Supplier: Abrisa Technologies
Description: , fabrication, HIE™ chemical strengthening or heat tempering, transparent conductive coatings, AR coatings, bus bars, electrical connectivity, wire bonding or soldering, connectors, screen printed ceramic frit or epoxy ink graphics, laser marking and applied gaskets.
- Fuel / Energy Source: Electric
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Featured Products Top
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Highly Conformable, Non-Flammable, Isolation and High Heat Conducting Gel materials. • Gap filler materials are supplied in a fully cured state and (read more)
Browse Conductive Compounds Datasheets for Fujipoly® America Corp. -
Master Bond EP5G-80 is a one component, NASA low outgassing rated epoxy, with a moderate temperature cure requirement of 80°C for 4 hours. This graphite filled compound is not premixed and frozen and has an unlimited working life at room temperature. It offers electrical conductivity with a (read more)
Browse Conductive Compounds Datasheets for Master Bond, Inc. -
non-toxic, meet flame-retardant requirements, withstand continuous 260 °C operation, and retain mechanical integrity without hardening, cracking, or turning into (read more)
Browse Conductive Compounds Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
Product Advantages Easy to use, non-critical one to one mix ratio by weight Low viscosity, flows evenly and smoothly Reliable thermal conductivity and electrical insulation Low shrinkage and excellent dimensional stability Resists thermal cycling, vibration and shock Well suited for moderate to large encapsulation applications (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill encapsulation applications. It can also be utilized for bonding and sealing, especially where no flow is needed since (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
delivers exceptional heat dissipation while remaining electrically non-conductive and compliant with ASTM E595 NASA low outgassing requirements. Formulated with a specialty filler featuring a particle size range of 5–30 microns, EP54TC supports thin bond lines and efficient void filling (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
Via Fill Create Space for Pads and Improve Reliability Via in pad with non-conductive epoxy improves signal performance for high speed digital and RF microwave applications. Summit also has (read more)
Browse Printed Circuit Board (PCB) Fabrication Services Datasheets for Summit Interconnect -
electronics because they are thermally conductive, chemically stable, non-flammable, and electrically insulating. To maintain system integrity in these liquid environments, electrical connections must be permanently sealed against both vacuum and positive pressure conditions. Unlike standard IP (read more)
Browse Feedthroughs Datasheets for Douglas Electrical Components -
Amperage rating: to 400 amp Seals a single electrode or element Supplied with or without conductors Easy to assemble and adjust in the field Stainless Steel reusable fitting for gas or non-conductive liquid Available without electrode (read more)
Browse Electrical Feedthroughs Datasheets for Conax Technologies -
effluent, as well as in sludge and slurries. The UltraLiner™ is an NSF-approved epoxy with a long history of reliability and is more robust than inserted liners. Debris and solids will not clog the line or cause excessive wear to the Ultra Mag, thanks to its non-intrusive sensing element (read more)
Browse Flow Meters Datasheets for McCrometer, Inc.
Conduct Research Top
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Choosing the Right Non Conductive Epoxy For Electronics
Non conductive epoxy is a type of adhesive that is specifically designed for use in electronics. It is used to insulate and protect electronic components from electrical currents and environmental factors. Choosing the right non conductive epoxy is crucial to ensure the proper functioning
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How Non Conductive Epoxy for Electronics Can Improve Product Performance
and protection has become more important than ever. This is where non-conductive epoxy comes into play.
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An Overview of Non-Conductive Epoxy for Electronics
to assembling electronic goods and other similar products. When it comes to bonding electronics/electrical products, conductive and non-conductive glues are used to achieve special purposes.
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Best top 10 electronics assembly adhesives manufacturers in china with non conductive epoxy adhesive glue for electronics
The world is slowly changing. The way things were done a few years ago is not the same way they are being done today, thanks to innovations and advanced technology. Embracing the good and discarding the bad is the only way to move forward. One of the areas that have been greatly affected by
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All you need to know about Metal Bonding Epoxy Adhesives
DeepMaterial, as an industrial epoxy adhesive manufacturer, we do lost of research about underfill epoxy, non conductive glue for electronics, non conductive epoxy, adhesives for electronic assembly, underfill adhesive, high refractive index epoxy. Base on that, we have the latest technology
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Best Non Conductive One Component Epoxy Adhesive Glue For Automotive Plastic to Metal
Design engineers have the privilege to choose from a flurry of options when it comes to joining plastic to metal. Some of the options are easy to apply than others. Silicone, advanced epoxy, UV cure adhesive solutions, and cyanoacrylate are some of the best options engineers use in this regard
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Best Non Conductive One Component Epoxy Adhesive Glue For Automotive Plastic to Meta
Design engineers have the privilege to choose from a flurry of options when it comes to joining plastic to metal. Some of the options are easy to apply than others. Silicone, advanced epoxy, UV cure adhesive solutions, and cyanoacrylate are some of the best options engineers use in this regard
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Indicates content that may require registration and/or purchase.
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Characteristics of pulse electrodeposited PbS thin films
Transport properties were measured at room temperature on the films transferred from the conducting substrate to the non conducting epoxy as described under experimental.
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Finger Based Explorations
The uncoated surface of a 40 micron thick, piezoelectric PVF2 film is bonded to the cylindrical part of the fingertip, with a thin layer of non conductive epoxy .
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High frequency P(VDF-TrFE) copolymer broadband annular array ultrasound transducers using high density flexible circuit interconnect
The brass tube was filled with non conductive epoxy and cured.
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Improved depth-of-field photoacoustic microscopy with a custom
high-frequency annular array transducer
We mixed non conductive epoxy (301-2) part A with part B in a certain ratio and outgas it in a vacuum chamber to 1250-mTorr.
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High frequency copolymer annular array ultrasound transducer fabrication technology
The brass tube was filled with degassed non conductive epoxy (Epotek 301).
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Key Engineering Materials III
Non conductive epoxy polymer becomes conductor as addition of CNTs.
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Characteristics of ZnS films pulse plated using non-aqueous electrolytes
Surface morphology of the films deposited at different duty cycles and transferred to the non conducting epoxy used for electrical measurements is shown in Fig. 3.
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Small satellite thermal design, test, and analysis
By using non conductive epoxy on the batteries when .
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Micromachined chemical jet dispenser
The sides of the bimorph are now coated with a thin layer of clear, non conductive epoxy .