Non Conductive Epoxy

Description: Skip cure non conductive epoxy adhesive used for the bonding of microchips on RFID antennas. The rheology of PROTAVIC ANE 10700 has been developed for application by micro-dispenser using automatic machines. It presents a one day pot life at 20-25C, a high reactivity at medium

• Use Temperature: -55 to 200 F
• Coeff. of Thermal Expansion (CTE): 36.11111111111111 to 38.888888888888886 µin/in-F
• Tensile Strength (Break): 2,000 psi
• Features: Ceramic / Glass, Electrical Insulation / Dielectric, Electrical Power / HV, Electronics, Liquid, Metal, Plastic, Thermal / Heat Conductive

Description: Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing.

• Viscosity: 20,000 to 30,000 cP
• Coeff. of Thermal Expansion (CTE): 13.88888888888889 µin/in-F
• Features: Ceramic / Glass, Electrical Insulation / Dielectric, Electrical Power / HV, Electronics, Gel, Other, Thermal / Heat Conductive
• Form / Shape: Die Bonding Adhesive / Compound

Description: Our G6E-TSHV™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the

• Viscosity: 400,000 to 450,000 cP
• Use Temperature: 77 to 302 F
• Thermal Conductivity: 2.9 W/m-K
• Industry: Aerospace, Automotive

Description: Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required.

• Applied Thickness / Gap Fill: 0.001 to 0.003 inch
• Viscosity: 80,000 to 100,000 cP
• Use Temperature: -100 to 300 F
• Thermal Conductivity: 1.16 to 1.6 W/m-K

Description: Our G6E-TSAL™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the

• Viscosity: 40,000 to 50,000 cP
• Use Temperature: 77 to 302 F
• Thermal Conductivity: 1.8 W/m-K
• Industry: Aerospace, Automotive

Description: DESCRIPTION: G6E-SG™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG™ is formulated with proprietary nanomaterials and fillers. G6E-SG™

• Viscosity: 110,000 to 120,000 cP
• Use Temperature: 77 to 302 F
• Industry: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial
• Features: EMI / RFI Shielding Material, Electrical Power / HV, Electronics, Other, Specialty / Other

Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market

• Viscosity: 1,400 to 2,200 cP
• Use Temperature: 572 F
• Thermal Conductivity: 1.3 W/m-K
• Coeff. of Thermal Expansion (CTE): 17.77777777777778 to 62.22222222222222 µin/in-F

Description: DESCRIPTION: G6E-FRP™ is a flexible version of our G6E-P™ general purpose epoxy. G6E-FRP™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive components or

• Viscosity: 285,000 to 295,000 cP
• Use Temperature: 77 to 248 F
• Industry: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial
• Features: EMI / RFI Shielding Material, Electrical Power / HV, Electronics, Flexible / Dampening, Other, Specialty / Other

Description: Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated

• Use Temperature: -100 to 400 F
• Thermal Conductivity: 1.442279 W/m-K
• Coeff. of Thermal Expansion (CTE): 0.00012222222222222221 to 0.000030555555555555554 µin/in-F
• Industry: Aerospace, Automotive, OEM / Industrial, Semiconductors / IC Packaging

Description: Moderate viscosity EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. It is a superior thermal conductor, while retaining first class electrical insulation properties. EP3RR-80 can cure in thicker sections up to and beyond a 1/2

• Viscosity: 60,000 to 120,000 cP
• Use Temperature: -100 to 350 F
• Thermal Conductivity: 0.72 to 0.87 W/m-K
• Tensile Strength (Break): 7,000 to 9,000 psi

Description: Master Bond EP21TPFL-1AO is an electrically insulative, two part epoxy polysulfide system with a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)]. As a polysulfide based system, it has very good chemical resistance, particularly to fuels, oils, hydraulic fluids and related

• Use Temperature: -60 to 250 F
• Thermal Conductivity: 1.31 to 1.44 W/m-K
• Coeff. of Thermal Expansion (CTE): 61.11 to 72.22 µin/in-F
• Tensile Strength (Break): 1,000 to 1,500 psi

Description: LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive LOCTITE® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive offers eight times the thermal

• Features: Electrical Insulation / Dielectric, Thermal / Heat Conductive
• Chemical System: Epoxy (EP)
• Cure / Technology: Single Component System

Description: 10-3003 NS is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non critical mix ratio and adjustable flexibility. 10-3003 NS is also very safe to use due to the absence of harmful solvents and toxic chemicals in

• Viscosity: 4,500 to 6,500 cP
• Thermal Conductivity: 0.4326837 W/m-K
• Tensile Strength (Break): 10,500 psi
• Dielectric Strength: 550.0000000000008 kV/in

Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market

• Viscosity: 2,200 to 3,200 cP
• Use Temperature: 707 F
• Coeff. of Thermal Expansion (CTE): 32.22222222222222 to 154.44444444444443 µin/in-F
• Form / Shape: Die Bonding Adhesive / Compound, Grease / Paste

Description: LiPOLY EP770 is a two-part epoxy material for gap filling. Extremely low viscosity and flowability. Good dispersion and no delamination. The high deformation material, which filling the gap closely, cover the tolerance, and has outstanding conductivity, makes is suitable for filling the

• Viscosity: 100,000 cP
• Use Temperature: -76 to 302 F
• Thermal Conductivity: 2.5 W/m-K
• Dielectric Strength: 350 kV/in

Description: Elecolit® 414 is a single component silver-filled, electrically conductive coating substance that hardens into a flexible, chemical resistant, expandable, non-deformable and friction resistant film. Grey in colour, Elecolit® 414 has a viscosity of 20,000 to 25,000 mPas and when used

• Features: Electrically Conductive Compound, Electronics
• Chemical System: Epoxy (EP)
• Cure / Technology: Thermosetting / Crosslinking

Description: 50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding

• Use Temperature: -76 to 392 F
• Thermal Conductivity: 2.1634185 W/m-K
• Coeff. of Thermal Expansion (CTE): 14 µin/in-F
• Tensile Strength (Break): 9,850 psi

Description: Henkel Loctite Ablestik 45 Clear, formerly Emerson and Cuming ECCOBOND, is a two component, heat curing, unfilled, epoxy adhesive system that is used for general purpose, assembly applications. It offers controlled flexibility, non-conductive properties, and is easy to use. 8 lb

• Viscosity: 36,000 to 37,000 cP
• Thermal Conductivity: 0.35 W/m-K
• Dielectric Strength: 355.60000000000076 kV/in
• Chemical System: Epoxy (EP)

Description: Henkel Loctite Ablestik 45 Clear, formerly Emerson and Cuming ECCOBOND, is a two component, heat curing, unfilled, epoxy adhesive system that is used for general purpose, assembly applications. It offers controlled flexibility, non-conductive properties, and is easy to use. 29

• Viscosity: 20,000 to 21,000 cP
• Dielectric Strength: 406.40000000000083 kV/in
• Chemical System: Epoxy (EP)
• Substrate Compatibility: Metal, Plastic

Description: 20-3001 NC is a low viscosity, unfilled epoxy potting and encapsulating system which forms a bubble free glass like finish when cured. This is a 100% solids resin system that does not contain any solvents. Its’ convenient 1:1 mix ratio and lack of fillers make it an ideal material for meter

• Use Temperature: -58 to 302 F
• Thermal Conductivity: 0.4326837 W/m-K
• Tensile Strength (Break): 5,700 psi
• Dielectric Strength: 557.9999999999993 kV/in

Description: Techsil® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure

• Features: Electronics, Encapsulating / Potting, Flame Retardant (e.g. UL 94 Rated), Liquid, Metal, Plastic, Thermal / Heat Conductive
• Chemical System: Epoxy (EP)
• Cure / Technology: Two Component System

Description: Abrisa Technologies’ Transparent Conductive Heaters incorporate coatings of Indium Tin Oxide (ITO), Index-Matched Indium Tin Oxide (IMITO) or Indium Molyb-denum Oxide (IMO) and are ideal window and display glass solutions when anti-fogging or de-icing, and high throughput and clarity are

• Features: Electric, Other

Description: Henkel Loctite Ablestik 104 White, formerly Emerson and Cuming ECCOBOND, is a two component, heat curing, powder epoxy adhesive that is used for the assembly of thermoset plastics, metal, ceramics, and glass. It offers a long pot life, high shear strength, non-conductive

• Dielectric Strength: 398.7800000000008 kV/in
• Substrate Compatibility: Ceramic / Glass, Metal, Plastic
• Chemical System: Epoxy (EP)
• Cure / Technology: Two Component System

Description: Henkel Loctite Ablestik 45 Black, formerly Emerson and Cuming ECCOBOND, is a two component, heat curing, unfilled, epoxy adhesive system that is used for general purpose, assembly applications. It offers controlled flexibility, non-conductive properties, and is easy to use. 1 lb

• Viscosity: 36,000 to 37,000 cP
• Thermal Conductivity: 0.35 W/m-K
• Dielectric Strength: 355.60000000000076 kV/in
• Chemical System: Epoxy (EP)

Description: LOCTITE ABLESTIK 539IA, Epoxy Film, Assembly, Non-conductive Adhesive LOCTITE® ABLESTIK 539IA non-conductive film adhesive is designed for assembly applications. This adhesive film may be die cut to customer specifications. Non-conductive Uniform

• Adhesive: Epoxy
• Features: Specialty / Other

Description: (Known as Hysol ECCOBOND CE3513 ) LOCTITE ABLESTIK CE 3513 is a one component, silver-filled, non-bleeding, electrically conductive epoxy adhesive with long shelf life at room temperature.

• Viscosity: 35,000 to 45,000 cP
• Type: Electrically Conductive
• Industry: Electronics (PCB / SMT Assembly)
• Cure / Technology: Single Component System

Description: Electrically conductive one-component, non-bleeding epoxy adhesive with low outgassing, eliminating wicking and bridging under small components.

• Viscosity: 70,000 cP
• Industry: Electronics
• Cure / Technology: Single Component System

Description: LOCTITE ECCOBOND DS 8027LV is a non-conductive epoxy perimeter sealant designed to be used in display applications, such as OLED and E-paper.

• Industry: Electronics

Description: Accelerometer mounting stud with base, 10-32 UNF each end, 0.625" hex diameter, isolated, stainless steel with non-conductive layer of epoxy prevents ground loops

Description: (Known as HYSOL XE80100 ) LOCTITE ABLESTIK XE 80100 is a solventless modified epoxy adhesive that combines low stress with good adhesion on nearly all surfaces and is flexible for mismatched CTE applications. XE80100 is the non-conductive version of ECCOBOND CE8500 adhesive.

• Industry: Electronics

Description: specifically developed for superior adhesion to metal lid surfaces, epoxy laminate, or solder mask-coated substrates. Product Features Non-conductive and Electrically Insulating Ensures no electrical interference in sensitive electronic components. Superior Adhesion Developed

• Features: Electrical Insulation / Dielectric Material, Electrically Conductive Compound (Adhesive, Grease), Electronics
• Industry: Semiconductors / IC Packaging
• Cure / Technology: Thermosetting / Crosslinking

Description: polyimide coated to protect from ambient contaminants, and to eliminate the need for conformal coating. Quartz substrates are rugged and reduce dielectric losses. Chips may be bonded using either conductive or non conductive epoxies, and wire bonded with gold wire or ribbon by

• DCR: 0.85 to 20 ohms
• Testing Frequency: 500,000 to 1,500,000 kHz
• Configuration: Fixed
• Application: High Frequency

Description: Plated Through Holes (PTH) type universal PCB with a 2.54mm hole-to-hole pitch. Inexpensive and economical PCB made using robust, heat-resistant and non-conductive glass epoxy. Easily mounted onto bosses or standoffs via the mounting holes at each corner. Environmentally

Description: availability is only limited by actual manufacturing time, processing of the order and time in the production queue. SELECTED UNIQUE FEATURES OF INTEREST FOR ALL ZEUS„¢ SENSOR CONFIGURATIONS: Best reference service lifetime in process industry through the proprietary and novel non-porous,

• pH Range: 0.5 to 14.5 ph
• Operating Temperature: 5 to 302 F
• Operating Pressure Range: 200 psi
• Body Material: Epoxy or Polymer

Description: electrically isolated voltage can be used to drive the gates of Metal Oxide Semiconductor (MOS) devices. Device mounting is achieved with non-conductive epoxies. Gold or aluminum wire bonding can be used to make electrical connections for maximum placement flexibility. Note: Certain

• Isolation Voltage: 1,500 volts