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Supplier: Georgia-Pacific Chemicals LLC
Description: Adhesive resins for the manufacture of phenolic particleboard, medium density fiberboard and hardboard. These products can aid in complying with: California Air Resource Board (CARB) Airborne Toxic Control Measure (ATCM) for Composite Panels Phase 2 emission standards and defined
- Filler Material: Unfilled
- Industry: Industrial
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Supplier: Georgia-Pacific Corporation
Description: The phenolic resole resin systems designed by GP Chemicals are used in a wide variety of applications and industries. GP® resins are used in fiber-reinforced polymer (FRP) applications with fire safety concerns or high-temperature requirements such as mine ventilation and offshore
- Aldehydes: All Aldehydes, Formaldehyde
- Type: Base
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Supplier: Norplex-Micarta
Description: NP611 (NEMA XP) is a hot-punching, paper based phenolic grade. With mechanical properties approaching those of NP610, NP611 also offers improved electrical and punching characteristics. NP611 is a warm to hot punching grade, used for switch parts and other applications that need good
- Coeff. of Thermal Expansion (CTE): 7.22 to 9.44 µin/in-F
- Dielectric Strength: 600 kV/in
- Form / Shape: Film / Sheet
- Industry: Electronics
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Supplier: Norplex-Micarta
Description: NP600 is paper phenolic product designed for use as drill entry material for the manufacture of printed circuit boards. A non-NEMA economy grade, the product is used in jigs and templates. It has a hard, flat surface for good drill starts, as well as sufficient strength to maintain
- Form / Shape: Film / Sheet
- Industry: Electronics
- Material Type / Grade: Flame Retardant (e.g. UL 94 Rated), UL Approved
- Polymer Matrix Type: Phenolics
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Supplier: Norplex-Micarta
Description: NP629 (NEMA XX) is a paper based phenolic that is a machining grade with less robust electrical properties than those of NP630. This product meets the requirements of MIL-I-24768/11, Type PBG. Designed for electrical insulation, the product can be used in dry or high humidity conditions
- Form / Shape: Film / Sheet
- Industry: Electronics
- Material Type / Grade: Flame Retardant (e.g. UL 94 Rated), UL Approved
- Polymer Matrix Type: Phenolics
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Supplier: Norplex-Micarta
Description: NP610 (NEMA X) is a phenolic paper material for mechanical applications. Primarily a machining material, NP610 can be hot punched in thicknesses up to 0.093 inch. This mechanical grade offers good tensile, flexural, and compressive strength. Applications include panels, washers, switch
- Coeff. of Thermal Expansion (CTE): 7.22 to 9.44 µin/in-F
- Dielectric Strength: 600 kV/in
- Form / Shape: Film / Sheet
- Industry: Electronics
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Supplier: Accuris
Description: Copper-Clad Laminates for Printed Wiring Boards - Paper Base, Phenolic Resin
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Supplier: Georgia-Pacific Chemicals LLC
Description: Liquid phenol-formaldehyde adhesives specifically designed for the manufacturing of Oriented Strand Board (OSB) which include RESI-STRAN® 320C02 resin. GP Chemicals specializes in custom-formulating adhesives for your specific mill needs, conditions and certifications.
- Filler Material: Unfilled
- Industry: Industrial
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Supplier: Georgia-Pacific Chemicals LLC
Description: Powder phenol-formaldehyde adhesives specifically designed for the manufacturing of Oriented Strand Board (OSB). The product line includes WOODWELD® 145C30 resin, which has been successfully used as a fast-curing surface resin and intermediate-cure-sp eed core resin. It is not
- Filler Material: Unfilled
- Industry: Industrial
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Supplier: Georgia-Pacific Chemicals LLC
Description: Available for the manufacture of moisture-resistant particleboard, hardboard and medium density fiberboard (MDF). These products can aid in complying with: California Air Resource Board (CARB) Airborne Toxic Control Measure (ATCM) for Composite Panels Phase 2 and ANSI standard A208
- Filler Material: Unfilled
- Industry: Industrial
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Supplier: DigiKey
Description: "Round Spacer Unthreaded Phenolic 0.313"" (7.94mm)"
- Material: Phenolic
- Round: Yes
- Type & Shape: Spacer (Clear Hole / Unthreaded)
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Supplier: DigiKey
Description: "Round Spacer Unthreaded Phenolic 0.438"" (11.11mm)"
- Material: Phenolic
- Round: Yes
- Type & Shape: Spacer (Clear Hole / Unthreaded)
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Supplier: ASTM International
Description: This specification covers faced or unfaced rigid cellular phenolic thermal insulation. Insulations in the form of boards shall be faced or unfaced, while tubular forms shall be unfaced. This specification does not apply to field expanded cellular phenolic materials. Materials
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Supplier: ASTM International
Description: 1.1 This specification applies to faced or unfaced, rigid cellular phenolic thermal insulation in either board or tubular form. It does not apply to field expanded cellular phenolic materials. 1.2 Materials covered by this specification are used as roof insulation; sheathing or
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Supplier: ASTM International
Description: 1.1 This specification covers faced or unfaced, rigid cellular phenolic thermal insulation. Boards shall be faced or unfaced. Tubular forms covered by this standard shall be unfaced. It does not apply to field expanded cellular phenolic materials. Note 1-If a facer or vapor
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Description: This part of IEC 61249 gives requirements for properties of phenolic cellulose paper, reinforced copper-clad laminated sheets of high electrical grade in thicknesses of 0,8 mm to 3,2 mm. This standard covers materials with different requirements on flammability and are designated according to
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Supplier: DigiKey
Description: "Round Standoff Threaded #6-32 Phenolic 0.750"" (19.05mm) 3/4"" Natural"
- ANSI Nominal Size: 6-32 / No. 6
- Material: Phenolic
- Round: Yes
- Type & Shape: Standoff
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Supplier: DigiKey
Description: "Round Standoff Threaded #8-32 Phenolic 0.250"" (6.35mm) 1/4"" Natural"
- ANSI Nominal Size: 8-32 / No. 8
- Material: Phenolic
- Round: Yes
- Type & Shape: Standoff
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Description: This part of IEC 61249 gives requirements for properties of non-halogenated phenolic cellulose paper copper-clad laminated sheets, economic grade, in thicknesses of 0,8 mm up to 3,2 mm. This standard covers materials with different requirements on flammability and are designated according to
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Description: This part of IEC 61249 gives requirements for properties of phenolic cellulose paper reinforced copper-clad laminated sheets, economic grade in thicknesses of 0,8 mm up to 3,2 mm. This standard covers materials with different requirements on flammability, designated according to the following
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Supplier: Accuris
Description: Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Nonhalogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
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Supplier: Accuris
Description: Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad Phenolic cellulose paper reinforced laminate sheets, high electrical grade, copper-clad
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Supplier: CSA Group
Description: This part of IEC 61249 gives requirements for properties of phenolic cellulose paper, reinforced copper-clad laminated sheets of high electrical grade in thicknesses of 0,8 mm to 3,2 mm. This standard covers materials with different requirements on flammability and are designated according to
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Supplier: Powell Electronics, Inc.
Description: VECTORBORD,PHENOLIC, 6.0X 17.0
- Category: Development Board
- Function: Circuit Emulator
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Supplier: Keystone Electronics Corp.
Description: Part Number: 15035 # of Terminals: 50 Length: 13.125 Material: Phenolic, XP Terminal Type: Turret - 1503 Width: 3.000 [76.2]
- Number of Contacts: 50
- Termination Options: Other
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Supplier: RS Components, Ltd.
Description: SEG type is the optimum common earth type for high-frequency circuits. 2.54 mm pitch, board installation hole Ã? 4 â?? 3.2 Type = Universal Board Base Material = Phenol-Sided Paper Dimensions = 91 x 45 x 1.6mm FR Material Grade = FR4 Length = 91mm Thickness = 1.6mm Width = 45mm
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Supplier: Georgia-Pacific Corporation
Description: Wood Adhesives We supply the wood composites industry with an extensive line of adhesives including plywood adhesives; oriented strand board (OSB) resins; hardboard resins; particleboard & medium density fiberboard (MDF) resins; and laminated veneer lumber (LVL) adhesives
- Chemical / Polymer System Type: Phenolics / Formaldehyde Resin
- Industry: Building / Construction
- Substrate / Material Compatibility: Wood / Wood Product
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Supplier: TE Connectivity
Description: ] Housing Features Centerline (Pitch) : 3.96 MM [.156 INCH ] Housing Material : Phenolic GF Mechanical Attachment Connector Mounting Type : Board Mount
- Contact Pitch: 3.96 mm
- Current Rating: 5 amps
- Number of Contacts: 15 #
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Supplier: Daburn Electronics & Cable
Description: Material (Case B1): Nickel Coated Copper with Non-Conductive Base Case Material (Case C1): Black Phenolic Plastic with Plastic Base Dimensions Case B1: 2.00” x 2.00” x 0.40” Case C1: 2.00” x 2.00” x 0.875”
- DC Input Voltage: 12 to 24 volts
- DC Output Current: 0.0360 to 0.1870 amps
- DC Output Power: 5 watts
- DC Output Voltage: -125 to 125 volts
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Supplier: RS Components, Ltd.
Description: From Mean Well, the IRM-02 Series of encapsulated AC-DC power supplies are constructed from a phenolic case and fully potted silicone. The construction meets anti-vibration demand up to 5G and provides resistance to dust and moisture while enhancing heat dissipation. The IRM-02 series is a 2
- AC Input Voltage: 85 to 305 volts
- DC Input Voltage: 120 to 430 volts
- DC Output Power: 2 watts
- Form Factor: Board Mount
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Supplier: Budnick Converting, Inc.
Description: 583 is a 2 mil, rubber (nitrile/phenolic) heat activated adhesive transfer used for bonding printed circuit boards.
- Thickness: 0.0020 inches
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Supplier: RS Components, Ltd.
Description: From Mean Well, the IRM-01 Series of encapsulated AC-DC power supplies are constructed from a phenolic case and fully potted silicone. The construction meets anti-vibration demand up to 5G and provides resistance to dust and moisture while enhancing heat dissipation. The IRM-01 series is a 1
- AC Input Voltage: 85 to 305 volts
- AC Output Current: 0.0 to 0.1110 amps
- DC Input Voltage: 120 to 430 volts
- DC Output Power: 1 watts
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Supplier: RS Components, Ltd.
Description: From Mean Well, the IRM-03 Series of encapsulated AC-DC power supplies are constructed from a phenolic case and fully potted silicone. The construction meets anti-vibration demand up to 5G and provides resistance to dust and moisture while enhancing heat dissipation. The IRM-03 series is a 3
- AC Input Voltage: 85 to 305 volts
- AC Output Current: 0.0 to 0.3330 amps
- DC Input Voltage: 120 to 430 volts
- DC Output Power: 3 watts
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Supplier: KPM Analytics
Description: universal separate racks for loading of samples, controls and calibrators, allowing up to 126 positions and 16 different reagents to be loaded. The instrument is supplied with a set of 12 wavelength filters, ranging from 340 – 880 nm, allowing 9 to be mounted on board simultaneously
- Application Software Included: Yes
- Computer Interface: Yes
- Instrument Type: Fixtured or Permanent
- Measured Parameter: Ammonia, Total Chlorine, Hexavalent Chromium, Cyanide, Fluoride, Hardness (Magnesium or Calcium), Iron, Manganese, Nitrate, Nitrite, Phenols, Phosphate, Phosphorus
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Supplier: AENOR
Description: Materials for printed boards and other interconnecting structures -- Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad (Endorsed by AENOR in July of 2005.)
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Standoffs are available in Aluminum, Brass, Stainless Steel, Nylon and Phenolic materials. Keystone’s standard Clear Hole Spacers are available in Aluminum, Brass, Nylon and Phenolic materials Aluminum Standoffs and Spacers feature a Clear Iridite finish (read more)
Browse Posts, Spacers, and Standoffs Datasheets for Keystone Electronics Corp. -
fiberglass that offers pressure and stiffness to the board. Moreover, they are not much expensive. Moreover, phenolic is useful as a base material for them. Due to this decomposition temperature of phenolic is just too low which affects in delamination of the layer if solder is located for a (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
and phenolic resins. All varnishes are offered in different organic solvents as well as waterbased systems, depending on technical demand and safety as well as environmental requirement. We are providing certified solutions for the use as binders and cross-linkers of paint systems as well as (read more)
Browse Resins and Compounds Datasheets for ELANTAS North America LLC
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Performance of Phenolic and Urea Resins in Particle-Board Binding
After 3 yr of exterior exposure, the phenolic boards have demonstrated more durability among untreated specimens.
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Durability of Structural Particleboard Evaluated by Repetitive Loading Tests
The superiority of phenolic board came in evidence by this repetitive loading test.
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Uniaxial Stress And Ultrasonic Anisotropy In a Layered Orthorhombic Medium
To study the effect of stress in a layered orthorhombic medium, a physical modeling study using intrinsically orthorhombic phenolic boards was conducted.
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Testing insulating materials for susceptibility to tracking
In view of the magnitude of the task of examining these variables at several levels, the authors have as yet almost com- pletely confined their attention to one material, one of relatively poor tracking resistance, namely an asbestos paper-filled phenolic board .
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Advanced Building Materials and Sustainable Architecture
For building external wall insulation, basically and polystyrene board, extruded plate and phenolic board construction technology, construction is convenient.
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EconPapers: Kinetics of the steam gasification of a phenolic circuit board in the presence of carbonates
Abstract: Steam gasification of a phenolic board in the presence of molten carbonate was studied as a means to recover useful metals effectively from electronic waste while also converting its plastic fraction into clean fuel gas.
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Design and Operation of Front-End Electronics for the HERA-B Muon
Detector
Inside each pad chamber are two copper clad phenolic boards .
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Photographic Applications Of Pulsed Semiconductor Lasers
Small steel sphere penetrating phenolic board , .
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A review of thickness swelling in particleboard
LnaI [1968] obtained similar swelling results under high humidity conditions for phenolic and urea resins (although phenolic boards gave better results in water immersion tests), t~.
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