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Supplier: Advanced Energy Industries, Inc.
Description: Litmas is an all-in-one remote plasma source combining the power supply, LitmasMatch™ matching network, and plasma chamber into one compact chassis. Small-footprint point-of-use abatement solution Highly reliable, effective abatement with minimum utilities usage
- Applications: Specialty / Other
- Substrates / Surfaces: Semiconductors / Wafers
- Technology Type: RF Plasma (ICP)
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Supplier: Advanced Energy Industries, Inc.
Description: Litmas is an all-in-one remote plasma source combining the power supply, LitmasMatch™ matching network, and plasma chamber into one compact chassis. Small-footprint point-of-use abatement solution Highly reliable, effective abatement with minimum utilities usage
- Applications: Specialty / Other
- Substrates / Surfaces: Semiconductors / Wafers
- Technology Type: RF Plasma (ICP)
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Supplier: CoorsTek
Description: Semiconductor deposition processes use a combination of volatile precursor gases, plasma, and high temperature to layer high quality thin films onto wafers. Deposition chambers and wafer handling tools need durable ceramic components to stand up to these challenging environments. Coors
- Applications: Chemical / Materials Processing
- Material Type: Aluminum Nitride, Alumina / Aluminum Oxide, Carbide Materials, Silicon Carbide, Specialty Ceramic
- Shape / Form: Fabricated / Custom Shape
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Supplier: CoorsTek
Description: Rings cover the wafer edge and perimeter, protecting critical chamber components and extending their useful life. Since they are directly exposed to the deposition process, strong plasma durability and high purity are critical to final wafer yield. SEMICONDUCTOR DEPOSITION PROCESSING
- Applications: Chemical / Materials Processing
- Material Type: Aluminum Nitride, Alumina / Aluminum Oxide, Carbide Materials, Silicon Carbide, Specialty Ceramic
- Shape / Form: Fabricated / Custom Shape
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Supplier: Plasma Etch, Inc.
Description: The all aluminum chamber features over 240 square inches of active processing surface with the three level standard configuration. The clean design features an industrial powder coated frame to guard your processing environment from contamination.
- Applications & Materials Processed: Research / Surface Analysis, Other
- Coating System Type: Laboratory / Benchtop
- Integral Process Controller: Yes
- Materials Processed (Deposit or Substrate): Metal, Compound Semiconductors / GaAs, Tungsten / Refractory Metal, Other
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Supplier: Accuris
Description: Thermal spraying - Acceptance inspection of thermal spraying equipment - Part 5: Plasma spraying in chambers
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Supplier: Plasma Etch, Inc.
Description: Our welded aluminum vacuum chamber encloses a generous 500 square inches of active plasma processing surface. Surface modification with Plasma Etch yields increased bond strength and cleanliness of most any surface material.
- Applications & Materials Processed: Research / Surface Analysis, Other
- Coating System Type: Laboratory / Benchtop
- Gas Control Unit: Yes
- Integral Process Controller: Yes
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Supplier: Advanced Energy Industries, Inc.
Description: Litmas is an all-in-one remote plasma source combining the power supply, LitmasMatch™ matching network, and plasma chamber into one compact chassis. Small-footprint point-of-use abatement solution Highly reliable, effective abatement with minimum utilities usage
- Oxidizer Type: Other
- Temperature Range: 41 to 104 F
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Supplier: Plasma Etch, Inc.
Description: As in all Plasma Etch systems a capacitive parallel plate design is used for the most effective plasma generation. Competitive units with glass/quartz barrel chambers cannot penetrate the vacuum containment vessel and therefore are restricted to inductive coupling using an RF
- Coating System Type: Laboratory / Benchtop
- Features: Integral Process Controller?
- Materials Processed (Deposit or Substrate): Metal, Compound Semiconductors / GaAs, Tungsten / Refractory Metal, Other
- Technology / Process: Plasma Etching / Cleaning
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Supplier: Plasma Etch, Inc.
Description: Based on our popular BT-1, it shares the same robust and reliable characteristics while providing yet another example of Plasma Etch surface modification innovation. The large all aluminum chamber accommodates a generously sized circular, rotating active processing surface has the
- Applications & Materials Processed: Research / Surface Analysis, Other
- Automated Loading: Yes
- Coating System Type: Factory / Free Standing
- Gas Control Unit: Yes
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Supplier: HORIBA Instruments, Inc.
Description: in a large-area, high-capacity chamber, plasma stabilization in a long sputtering process (stable deposition), and mixture optimization of compounds for reactive sputtering. Advantage Fast and highly reliable feedback control The RU-1000 plasma emission controller with its newly
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Supplier: Accuris
Description: Tracked Changes (Redline) \x96 Thermal spraying - Acceptance inspection of thermal spraying equipment Part 5: Plasma spraying in chambers
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Supplier: Accuris
Description: Thermal spraying \x96 Acceptance inspection of thermal spraying equipment \x96 Part 5: Plasma spraying in chambers
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Supplier: CoorsTek
Description: Windows are chamber lids designed to transmit RF (radio frequency) and microwave energy into the plasma etch chamber while resisting erosion from the harsh plasma etch environment. An effective window has a low loss tangent (high transmittance) across RF and microwave
- Applications: Chemical / Materials Processing
- Material Type: Aluminum Nitride, Alumina / Aluminum Oxide, Carbide Materials, Silicon Carbide, Yttria, Specialty Ceramic
- Shape / Form: Fabricated / Custom Shape
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Supplier: CoorsTek
Description: CoorsTek advanced, high-purity ceramic components are built to withstand the extreme environments in plasma etch (or "dry" etch) chambers — including vapor phase chemical etchants, high voltage RF (radio frequency) and microwave plasma, volatile byproducts, and aggressive
- Applications: Chemical / Materials Processing
- Material Type: Aluminum Nitride, Alumina / Aluminum Oxide, Carbide Materials, Silicon Carbide, Yttria, Specialty Ceramic
- Shape / Form: Fabricated / Custom Shape
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Supplier: SAE International
Description: , methane oligomerization, and methane aromatization. In the multimode plasma chamber methane pyrolysis experiments, we have observed the formation of a highly dendritic form of elemental carbon which may be beneficial in the minimization of potential problems associated with carbon
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Supplier: 3X Ceramic Parts Company Limited
Description: Ceramic Focus Ring for Plasma Etch Equipment When aluminum alloy is selected as the chamber material of the etcher, it is easy to cause metal particle pollution. Instead, a dense anodic aluminum oxide layer is coated on the aluminum alloy to improve the corrosion resistance of the
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Supplier: Littelfuse, Inc.
Description: RoHS compliant Ceramic chamber for ultimate reliability. Very high switching speed and high di/dt enable superior performance by ignition transformers
- Approvals: RoHS
- Capacitance Range: 2 pF
- DC Spark-over Voltage: 402 volts
- Discharge Current: 1 amps
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Supplier: SAE International
Description: This study clarified the influence of hot gas jet on combustion enhancement effect for lean mixture in the plasma jet ignition. The hot gas jet was generated by the high temperature plasma and was ejected from igniter after plasma jet finished issuing. In combustion tests,
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Supplier: Advanced Energy Industries, Inc.
Description: When space is limited, but performance is critical, streamlined APEX RF generators offer various mounting options and power you can rely on. Chamber-, rack-, or frame-mount options for convenience and reduced power losses Superb performance enhanced with arc management
- DC Output Power: 750 to 10000 watts
- Form Factor: Rack Mount
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Supplier: PTB Sales, Inc.
Description: $7,200 ASTeX ASTRONex Fl20620 generator. 400 kHz output, 208 3f input, 38 lbs. The MKS ASTeX ASTRONex reactive gas generator is a reactive source for chamber cleaning and other reactive gas applications. The ASTRONex uses low field toroidal plasma to dissociate input gas to
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Supplier: Littelfuse, Inc.
Description: sensitive ICs from surges as defined in ITU K.20/21/45 Basic and Enhanced Recommendations, GR-1089-CORE first level lightning Port Type 1 and 3, and IEC 61000- 4-5 2nd edition. It is hermetically sealed using non-radioactive materials and is thus environmentally safe. Its 2.8mm diameter size makes
- Approvals: RoHS
- Capacitance Range: 0.5000 pF
- DC Spark-over Voltage: 276 volts
- Discharge Current: 1 amps
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Supplier: Littelfuse, Inc.
Description: Level 5 and below. It is hermetically sealed using non-radioactive materials and is thus environmentally safe. Its 3.5mm diameter size makes it the world’s smallest two-electrode single chamber GDT available. Up to 3 kA Surge Capability in Minimal Footprint Ultra-low capacitance Surface mount
- Approvals: RoHS
- Capacitance Range: 0.5000 pF
- DC Spark-over Voltage: 402 volts
- Discharge Current: 3 amps
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Supplier: Littelfuse, Inc.
Description: Level 5 and below. It is hermetically sealed using non-radioactive materials and is thus environmentally safe. Its 3.5mm diameter size makes it the world’s smallest two-electrode single chamber GDT available. Up to 3 kA Surge Capability in Minimal Footprint Ultra-low capacitance (< 0.3 pF)
- Approvals: RoHS
- Capacitance Range: 0.5000 pF
- DC Spark-over Voltage: 108 volts
- Discharge Current: 3 amps
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Description: this reference chamber was developed at the 1988 Gaseous Electronics Conference (GEC) for research projects utilizing 13.56 MHz radio-frequencies (RF). The reference cell concept grew out of a need to provide an experimental platform for comparing plasma measurements carried out in a
- Chamber / Component Type: Other
- Vacuum / Pressure Range: Ultra-high Vacuum (< 10-8 torr)
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Supplier: Hitachi High Technologies America, Inc.
Description: support these next-generation processes. The 9000 platform incorporates HHT’s new microwave ECR(Electron Cyclotron Resonance) plasma etching chamber that is proven in high volume manufacturing usage.
- Applications: Etching - Plasma / Wet
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: Hitachi High Technologies America, Inc.
Description: Next generation memories such as FeRAM (Ferroelectric Random Access Memory), ReRAM (Resistance Random Access Memory) and MRAM (Magnetoresistive Random Access Memory) require etching of novel non-volatile materials. However, by-product adhesion inside of etch chamber causes significant
- Applications: Etching - Plasma / Wet
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: Hitachi High Technologies America, Inc.
Description: makers and material / tool suppliers. Hitachi High-Tech's etch system provides superior profile controllability and CD uniformity within wafer with a new microwave ECR (Electron Cyclotron Resonance) plasma etching chamber, high speed wafer temperature control, and high vacuum exhaust
- Applications: Etching - Plasma / Wet
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: Plasmatech, Inc.
Description: Cleaning Applications Rather than modifying the existing surface of a material, polymerizable gases can be used to create a "new". Cross contamination is not an issue since the gases are continually refreshed and evacuated out of the process chamber. Applications for plasma cleaning
- Capabilities: Plasma Etching / Cleaning
- Industry: Electronics, Medical / Healthcare, OEM / Industrial
- Location: North America, United States Only, Southern US Only
- Services: New / OEM Parts, Used / Damaged Parts
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Supplier: AENOR
Description: Thermal spraying - Acceptance inspection of thermal spraying equipment - Part 5: Plasma spraying in chambers
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Supplier: AENOR
Description: Thermal spraying - Acceptance inspection of thermal spraying equipment - Part 5: Plasma spraying in chambers
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Supplier: Deposition Sciences, Inc.
Description: EVAPORATION TECHNOLOGY In a typical evaporative coating chamber, one or more racks hold the substrate material to be coated. The first step in the process is to pump all the air out of the chamber to achieve a very high vacuum (10-6 Torr or better). A succession of coating materials is
- Functional / Performance: Abrasion Resistant, Antireflective, Chemical Resistant, Dielectric, Reflective
- Industry: Aerospace, Automotive, Electronics, Government, Medical / Healthcare, Military Specification, OEM / Industrial, Other
- Material / Substrate Capabilities: Metal, Precious Metals, Specialty / Other
- Material Selection / Design Assistance: Yes
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Supplier: Imego
Description: instrument, allowing the sensor to be for instance in a test chamber without any wires attached. The sensor can be read out through all non-metallic materials. The sensors are robust and easy to handle. In addition, the sensors are made of a low cost material, meaning that the sensors can be
- Applications: CVD / PVD Films, Polymers / Photoresists, Other
- Form Factor: Wafer Probing System, Sensor / Sensing Element
- Measurement Capability: Deposition Rate, Endpoint Detection / Plasma Diagnostics, Thickness - Film / Layer, Other
- Mounting / Loading: In-situ / System Mounted, Floor Mounted / Stand-alone
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Supplier: Deposition Sciences, Inc.
Description: MICRODYN TECHNOLOGY MicroDyn is DSI’s proprietary version of magnetron sputtering optimized for high throughput. MicroDyn utilizes an octagonally shaped chamber, where electrically conductive (metal or semiconductor) coating targets are arranged around the periphery, and the parts
- Functional / Performance: Abrasion Resistant, Antireflective, Chemical Resistant, Dielectric, Heat Resistant / High Temperature, Reflective
- Hard Coating / Treatment: Yes
- Industry: Aerospace, Automotive, Electronics, Government, Medical / Healthcare, Military Specification, OEM / Industrial, Other
- Material / Substrate Capabilities: Aluminum, Metal, Nickel / Nickel Alloys, Precious Metals, Titanium, Specialty / Other
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Supplier: MCA - Advanced Materials Division
Description: Semitron® MPR 1000 shapes possess excellent heat resistance and low rates of erosion in plasma chambers. Due to these characteristics, it is often chosen for vacuum chamber applications within etch, CVD, and ion implant sub segmentations in the semiconductor and electronics
- Industry: Electronics, Semiconductors / ICs, Other
- Tensile Modulus: 1000 ksi
- Tensile Strength (Break): 15000 psi
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Supplier: Nilfisk Industrial Vacuums
Description: Designed for the unique cleaning requirements of the semiconductor industry, the Nilfisk SS Vapor Industrial Vacuum captures toxic gases such as arsine, phosphine, and chlorinated solvents released during the cleaning of process equipment such as molecular beam epitaxy chambers, ion
- Airflow: 87 SCFM
- Applications: Cleanroom, General Cleaning, Toxic Media
- Capacity: 3.25 gallons
- Features: HEPA / ULPA Filter
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Supplier: Linde North America, Inc.
Description: Fluorine is an active element required for all dry chamber cleaning processes. Our Generation-F® on-site fluorine generators provide the lowest cost-per-clean for plasma-enhanced or thermal CVD tool dry-chamber cleaning. Fluorine is the ideal replacement for fluorine-bearing
- Generator Type: Specialty / Other
- Output Flow Rate: 1.33 to 26.67 SLM
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Supplier: Washington Alloy Co.
Description: Specifications AMS 5796B MIL-R-5031B Class 13 (AMS 5795B for Flux-Coated Electrode) Description Washington Alloy L605 is a cobalt base filler metal used for MIG, TIG and plasma arc welding of Haynes? No. 25 to itself or to nickel base or stainless steel
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Supplier: Comdel, Inc.
Description: characteristics during your process. Comdel engineers map the impedance of your active chamber to provide a customized matching network that meets your specific needs. Features: Automatic and manual modes with local and remote manual control of tuning capacitors
- Cooling: Forced Air, Water Cooling
- Modes of Operation: Manual, Automatic
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Supplier: Comdel, Inc.
Description: characteristics during your process. Comdel engineers map the impedance of your active chamber to provide a customized matching network that meets your specific needs. Features: Automatic and manual modes with local and remote manual control of tuning capacitors
- Cooling: Forced Air, Water Cooling
- Features: Remote Control Operation, Preset Capacitor Capability
- Frequency: 60 Hz, 50 Hz
- Frequency Range: 2 to 60 MHz
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Supplier: Comdel, Inc.
Description: characteristics during your process. Comdel engineers map the impedance of your active chamber to provide a customized matching network that meets your specific needs. Features: Automatic and manual modes with local and remote manual control of tuning capacitors
- Cooling: Forced Air, Water Cooling
- Features: Remote Control Operation, Preset Capacitor Capability
- Frequency: 60 Hz, 50 Hz
- Frequency Range: 2 to 60 MHz
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Supplier: Comdel, Inc.
Description: Accommodates up to 8 Channels and a Wide Range of Frequencies Performance: Comdel's VF8 multi channel synthesizer modules provide phase adjustable output to avoid destructive arcing and cross-talk in multiple cathode plasma processing chambers. The VF8 can
- Features: Adjustable Phase
- Form Factor: Rack/Card Mounted
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Supplier: NBK America LLC
Description: Combine SCAPCover Cap and SNCPSSocket Head Cap Screw for Cover Cap. These caps prevent the corrosion of screw heads due to vacuum chamber processing gas and plasma. SCAPhas 2 material types as standard. SCAP-AL----Aluminum alloy SCAP-CE----Ceramic The
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Supplier: NBK America LLC
Description: Combine SCAPCover Cap and SNCPSSocket Head Cap Screw for Cover Cap. These caps prevent the corrosion of screw heads due to vacuum chamber processing gas and plasma. SCAPhas 2 material types as standard. SCAP-AL----Aluminum alloy SCAP-CE----Ceramic The
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Supplier: NBK America LLC
Description: Combine SCAPCover Cap and SNCPSSocket Head Cap Screw for Cover Cap. These caps prevent the corrosion of screw heads due to vacuum chamber processing gas and plasma. SCAPhas 2 material types as standard. SCAP-AL----Aluminum alloy SCAP-CE----Ceramic The
- Head Type: Socket Head Cap
- Length: 1.18 inch
- Metric: M8, M12
- Screw Type: Cap Screw
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Supplier: SAE International
Description: combustion chamber with this coating, which is ceramic based, influences the combustion process and hence the performance and exhaust emissions characteristics of the engines. In the scenario of fast rising oil prices, insulation technologies are gaining importance as they help in saving
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Ceramic Focus Ring for Plasma Etch Equipment When aluminum alloy is selected as the chamber material of the etcher, it is easy to cause metal particle pollution. Instead, a dense anodic aluminum oxide layer is coated on the aluminum alloy to improve the corrosion (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
Precision Polymer Engineering (PPE) has released Perlast® Helios G7HA, an FFKM sealing material for semiconductor applications proven to deliver superior plasma resistance. Precision Polymer Engineering (PPE), manufacturer of high-performance sealing technology, has (read more)
Browse O-rings Datasheets for Precision Polymer Engineering Ltd. -
-stable temperature characteristics and eliminate the piezoelectric effect. They are ideal for high-frequency power amplifiers, DC-DC converters, lighting ballasts, plasma chambers, and other demanding applications requiring robust and reliable components. FOR MORE INFORMATION: CALL: 1-800-536-1887 EMAIL: sales@newyorkerelectronics.com (read more)
Browse Ceramic Capacitors Datasheets for New Yorker Electronics Co., Inc. -
: – Semiconductor equipment – Vacuum chambers – High voltage testing systems – Ion beam / plasma systems – UHV systems Send us your drawing or requirements – get a fast quote within 24 hours by email of sales@innovacera.com. (read more)
Browse Electroceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
In semiconductor equipment manufacturing, engineers often face the challenge of finding materials that can withstand plasma corrosion, extreme temperatures, and demanding precision requirements. Traditional metals cannot deliver the necessary (read more)
Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
recommended for applications such as crucibles of melting metals, high temperature insulation components, high temperature electrode protection tube and insulators, and plasma chambers for hall effect thruster. BN-1700 99.7% purity boron nitride is the highest purity h (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
New Ultra-Clean AFLAS FFKM Fluoroelastomers with Higher Heat Resistance for Semiconductor Plasma Process Applications We recently added AFLAS® (read more)
Browse Elastomers and Rubber Compounds Datasheets for AGC Chemicals Americas, Inc. -
, preventing wafer deformation and localized vacuum leaks; even during high-speed scanning or thin-wafer processing. Its specialized structural material guarantees extreme dimensional stability under harsh operating environments (including high-vacuum and high-temperature chambers). This makes it an ideal (read more)
Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
also achieve a Shore A hardness of 70 without fillers, minimizing contamination risks in clean rooms where high purity is essential. Their plasma and heat resistance make them perfect for use in semiconductor etching processes and for manufacturing seals in chambers, windows, doors, and valves, as (read more)
Browse Polymers and Plastic Resins Datasheets for AGC Chemicals Americas, Inc. -
Hard Coatings While soft coatings are manufactured in inherently lower cost bell jar evaporation chambers, they also have much smaller batch sizes and are almost exclusively manual in operation, which adds cost and variability while decreasing yield. Alluxa processes are fully automated (read more)
Browse Optical Coating Services Datasheets for Alluxa, Inc.
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MSilica Nanoparticles Treated by Cold Atmospheric-Pressure Plasmas Improve the Dielectric Performance of Organic-Inorganic Nanocomposites
chamber geometries by. imposing a dielectrophoresis (DEP) force on the beads. In cDEP the electrodes are not in. direct contact with the fluid sample but are instead capacitively coupled to the mixing. chamber through thin dielectric barriers, which eliminates many of the problems. encountered
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Analysis of Visible Light Images
is positioned with a lateral view into the chamber (Fig. 1) to collect high resolution 12-bit images of unfiltered plasma emission. Digitally stored images are used to establish shot-to-shot repeatability and resolve pinch velocities during reconnection. Images are processed with peak intensity fitting
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
the Enviro Advanced Dry Strip System, is a multi-chamber, single-wafer photoresist stripper and polymer-removal tool that incorporates both microwave downstream and low-energy plasma. Singapore's STATS lowers forecast for next two quarters SINGAPORE -- Citing a slowdown in its IC-packaging, assembly
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Introduction to Semiconductor Manufacturing Technology
The glows emitted from plasma due to their excitation and relaxation reliably measure optical endpoints for plasma etch and plasma chamber cleaning processes.
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Study of surface kinetics in PECVD chamber cleaning using remote plasma source
The volume of the plasma chamber is 360 cm 3 and for a power of 7.15kW, the power density is 20 W/cm 3.
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Fundamentals of Electric Propulsion: Ion and Hall Thrusters
Figure 4-9 also schematically shows the potential in the plasma chamber .
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An experimental study and modeling of Transformer-Coupled Toroidal Plasma processing of materials
The plasma chamber wall is made of aluminum with inner surface coated with a thick Al2O3 layer to prevent Al from being etched by strong fluorine plasma.
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Current fusion power plant design concepts
Time V a r i a t i o n o f N e u t r a l Gas Pressure i n Plasma Chamber o f t h e LASL Theta Pinch .
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Atmospheric Pressure Plasma for Surface Modification
By modifying key parameters such as high frequency power levels, plasma chamber pressure, gas mixtures, gas flow rates, and dwell (exposure) time, a prescribed plasma chemistry can introduce useful changes to a substrate surface.
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Design considerations for achieving high vacuum integrity in fusion devices
All tokamaks are characterized by a toroidal plasma chamber .
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INTOR critical issue D: maintainability. Tritium containment and personnel access vs remote maintenance, Chapter VI of the US INTOR report for Phase Two A, Pa...
It should be pointed out that for the personnel access case, personnel are never permitted in the reactor cell during or after the removal of a component which opens the plasma chamber (torus).
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New chamber walls conditioning and cleaning strategies to improve the stability of plasma processes
This requires a perfect control of the plasma chamber wall conditions.
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Scaling of microwave slot antenna (SLAN): a concept for efficient plasma generation
In slot antenna (SLAN) type plasma sources the microwave power is coupled from an annual waveguide (ring cavity) through equidistantly positioned resonant coupling slots into the plasma chamber made of quartz.